CN217160121U - Circuit board combination - Google Patents
Circuit board combination Download PDFInfo
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- CN217160121U CN217160121U CN202220908126.9U CN202220908126U CN217160121U CN 217160121 U CN217160121 U CN 217160121U CN 202220908126 U CN202220908126 U CN 202220908126U CN 217160121 U CN217160121 U CN 217160121U
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- circuit board
- light emitting
- pad
- connecting pad
- light
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Abstract
The utility model provides a circuit board combination, it includes first circuit board and second circuit board. The first circuit board comprises a driving element connecting pad and a first light-emitting element connecting pad, wherein the first circuit board is a single-layer circuit board. The second circuit board comprises a virtual driving element connecting pad and a second light-emitting element connecting pad, and the second light-emitting element connecting pad is electrically connected with the light-emitting element. The driving element connecting pad of the first circuit board is jointed with the virtual driving element connecting pad of the second circuit board, and the first light-emitting element connecting pad of the first circuit board is jointed with the second light-emitting element connecting pad of the second circuit board. The utility model provides a novel circuit board combination, it has the advantage that the yield improves and manufacturing cost reduces.
Description
Technical Field
The present invention relates to a circuit board assembly, and more particularly, to a circuit board assembly including a single-layer circuit board.
Background
The conventional circuit board applied to the display is a double-layer circuit board, wherein the double-layer circuit board is a circuit board in which two opposite surfaces of a substrate are used for wiring, and the wirings on different surfaces are electrically connected to each other by using via holes penetrating through the substrate. However, if the via hole located in the bending region of the circuit board is bent, the nearby circuit pattern is easily broken by stress, which reduces the yield of the circuit board. In addition, it is one of the problems in the display field to reduce the manufacturing cost of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model provides a novel circuit board combination, it has the advantage that the yield improves and manufacturing cost reduces.
According to the utility model discloses an embodiment, solar energy touch panel includes first circuit board and second circuit board. The first circuit board comprises a driving element connecting pad and a first light-emitting element connecting pad, wherein the first circuit board is a single-layer circuit board. The second circuit board comprises a virtual driving element connecting pad and a second light-emitting element connecting pad, wherein the second light-emitting element connecting pad is electrically connected with the light-emitting element. The driving element connecting pad of the first circuit board is jointed with the virtual driving element connecting pad of the second circuit board, and the first light-emitting element connecting pad of the first circuit board is jointed with the second light-emitting element connecting pad of the second circuit board.
According to the utility model discloses an embodiment, first circuit board still includes drive signal connecting wire and first luminous signal connecting wire. The driving signal connecting line is connected with the driving element connecting pad, the first light-emitting signal connecting line is connected with the first light-emitting element connecting pad, and the driving signal connecting line and the first light-emitting signal connecting line extend towards the first direction.
According to the utility model discloses an embodiment, first light emitting component connecting pad extends towards the second direction, and second direction and first direction quadrature.
According to an embodiment of the present invention, the second light emitting element connection pad extends toward the second direction, and the second light emitting element connection pad and the virtual driving element connection pad are located on the same surface of the second circuit board.
According to the utility model discloses an embodiment, first light emitting element connecting pad extends towards first direction.
According to an embodiment of the present invention, the second light emitting element connection pad extends toward the first direction, and the second light emitting element connection pad and the virtual driving element connection pad are located on the opposite surface of the second circuit board.
According to the utility model discloses an embodiment, the second circuit board includes double-deck circuit board.
According to the utility model discloses an embodiment, first circuit board and liquid crystal display panel electric connection, and second circuit board and backlight unit electric connection.
According to an embodiment of the present invention, the first circuit board and the second circuit board are bonded to each other with solder.
According to the utility model discloses an embodiment, the virtual drive element connecting pad of second circuit board has the via hole.
Based on the foregoing, the embodiment of the utility model provides a novel circuit board combination borrows by for the individual layer circuit board with first circuit board design, when the circuit board combination when crooked, because first circuit board does not have the via hole, it can avoid being located near the circuit pattern of bending zone because stress breaks, makes the utility model provides a yield of circuit board combination promotes. Furthermore, the circuit board assembly provided by the embodiments of the present invention can reduce the manufacturing cost by replacing the existing multi-layer circuit board with the single-layer circuit board.
Drawings
Fig. 1A is a schematic top view of a first circuit board according to a first embodiment of the present invention;
fig. 1B is a schematic top view of a second circuit board according to a first embodiment of the present invention;
fig. 1C is an exploded view of a circuit board assembly according to a first embodiment of the present invention;
fig. 2A is a schematic top view of a first circuit board according to a second embodiment of the present invention;
fig. 2B is a schematic top view of a second circuit board according to a second embodiment of the present invention;
fig. 2C is an exploded view of a circuit board assembly according to a second embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The thickness of layers and regions in the drawings may be exaggerated for clarity. The same or similar reference numbers refer to the same or similar elements, and the following paragraphs will not be repeated. In addition, directional terms mentioned in the embodiments, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
Fig. 1A is a schematic top view of a first circuit board according to a first embodiment of the present invention, fig. 1B is a schematic top view of a second circuit board according to a first embodiment of the present invention, and fig. 1C is an exploded view of a circuit board assembly according to a first embodiment of the present invention.
Referring to fig. 1A to fig. 1C, in the present embodiment, the circuit board assembly 10 includes a first circuit board 100 and a second circuit board 200. In some embodiments, the circuit board assembly 10 may be applied to a common display module. For example, the circuit board assembly 10 of the present embodiment can be applied to a liquid crystal display module (not shown) using Light Emitting Diodes (LEDs) as a backlight source, wherein the liquid crystal display module includes a liquid crystal display panel and a backlight module, the first circuit board 100 is electrically connected to the liquid crystal display panel, and the second circuit board 200 is electrically connected to the backlight module, but the present invention is not limited thereto.
In some embodiments, the first circuit board 100 includes a first substrate 110 and a first circuit pattern 120 disposed on the first substrate 110. In the present embodiment, the first circuit board 100 is a single-layer circuit board. That is, the first circuit pattern 120 is disposed on one surface of the first substrate 110, so that the manufacturing cost of the circuit board assembly 10 of the present embodiment can be reduced. In some embodiments, the first substrate 110 is a flexible substrate, and the material of the flexible substrate may include Polyimide (PI), polymethyl methacrylate (PMMA), Polycarbonate (PC), polyethylene terephthalate (PET), or other suitable materials or combinations thereof, but the invention is not limited thereto. The first circuit pattern 120 is used for transmitting a potential signal from an external electronic device, for example. In the present embodiment, the first circuit pattern 120 includes a driving device connecting pad 122, a driving signal connecting line 124, a first light emitting device connecting pad 126 and a first light emitting device connecting line 128, wherein the driving signal connecting line 124 is connected to the driving device connecting pad 122, and the first light emitting device connecting line 128 is connected to the first light emitting device connecting pad 126. The driving device connecting pad 122 is, for example, used to electrically connect with a driving device (not shown), wherein the driving device may, for example, include a driving chip, another circuit board, or a combination thereof. In some embodiments, the driving chip may include a timing control unit, a data driving unit, a power driving unit, and other driving units, but the present invention is not limited thereto. The driving signal connection line 124 is used for transmitting signals from the driving elements. For example, the driving signal connection line 124 may at least include a clock signal line, for example, to drive a gate driver disposed in the liquid crystal display panel, but the present invention is not limited thereto. The first light emitting device connecting pad 126 is, for example, electrically connected to a light emitting device (not shown), wherein the anode of the light emitting device can be, for example, electrically connected to the anode pad 126A of the first light emitting device connecting pad 126, and the cathode of the light emitting device can be, for example, electrically connected to the cathode pad 126B of the first light emitting device connecting pad 126. The first light-emitting signal connection line 128 is used for transmitting a potential signal from the driving element (e.g., a power driving unit), wherein the first light-emitting signal connection line 128A of the first light-emitting signal connection lines 128 can be supplied with a positive power potential, and the first light-emitting signal connection line 128B of the first light-emitting signal connection lines 128 can be supplied with a negative power potential. The light emitting elements can emit light of various suitable colors (e.g., blue light) or UV light, and can include Organic Light Emitting Diodes (OLEDs), inorganic Light Emitting Diodes (LEDs). For example, the light emitting element may include a sub-millimeter light emitting diode (mini LED) or a micro light emitting diode (micro LED), a Quantum Dot (QD), a quantum dot light emitting diode (QLED, QDLED), a fluorescent light (fluorescence), a phosphorescent light (phosphor), other suitable materials or a combination thereof, which is not limited in the present disclosure.
In some embodiments, the driving signal connection lines 124 and the first light emitting signal connection lines 128 extend in the first direction D1. In the embodiment, the first light emitting device connecting pad 126 extends toward the second direction D2, wherein the second direction D2 is orthogonal to the first direction D1, but the invention is not limited thereto. The material of the first circuit pattern 120 may include, for example, copper, silver, gold, nickel, palladium, aluminum, other inorganic conductive materials or organic conductive materials that allow electrons to move freely, which is not limited by the present invention. In addition, it should be noted that the driving device connecting pads 122 and the first light emitting device connecting pads 126 of the present embodiment are disposed in the non-bending region of the first circuit board 100.
The second circuit board 200 includes, for example, a second substrate 210 and a second circuit pattern 220 disposed on the second substrate 210. In this embodiment, the second circuit board 200 is a double-layer circuit board, but the invention is not limited thereto. That is, the second circuit board 200 further includes a via hole. Although not shown in fig. 1B, the second circuit patterns 220 are disposed on the first surface 210S1 and the second surface 210S2 opposite thereto of the second substrate 210, and the second circuit patterns 220 disposed on the opposite surfaces may be electrically connected to each other through vias. In the present embodiment, the via hole includes a via hole 222h and a via hole 226h for connecting the first circuit board 100 and the second circuit board 200, wherein the first circuit board 100 and the second circuit board 200 are connected in a third direction D3, and the third direction D3 is orthogonal to the first direction D1 and the second direction D2. In some embodiments, the second substrate 210 is a flexible substrate, and the material thereof may include polyimide, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, or other suitable materials or combinations thereof, but the invention is not limited thereto. The second circuit pattern 220 is used for transmitting a potential signal from an external electronic device, for example. In the present embodiment, the second circuit pattern 220 includes a dummy driving device connecting pad 222, a second light emitting device connecting pad 226 and a second light emitting signal connecting line 228, wherein the dummy driving device connecting pad 222, the second light emitting device connecting pad 226 and the second light emitting signal connecting line 228 are disposed on the first surface 210S1 of the second substrate 210, and the second light emitting signal connecting line 228 is connected to the second light emitting device connecting pad 226. The dummy driving device connecting pads 222 are, for example, connected to the driving device connecting pads 122 disposed on the first circuit board 100 by soldering through the via holes 222h by using solder 322, so as to be electrically connected to the driving devices. Based on this, since the driving element connection pads 122 on the first circuit board 100 and the dummy driving element connection pads 222 on the second circuit board 200 are bonded to each other, the first circuit patterns 120 (e.g., the driving signal connection lines 124, etc.) on the first circuit board 100 may be further disposed on the second circuit board 200, thereby increasing the wiring area. The second light-emitting device connecting pad 226 is, for example, electrically connected to the light-emitting device disposed on the second circuit board 200, wherein the positive electrode of the light-emitting device can be, for example, electrically connected to the positive electrode pad 226A of the second light-emitting device connecting pad 226, and the negative electrode of the light-emitting device can be, for example, electrically connected to the negative electrode pad 226B of the second light-emitting device connecting pad 226. In addition, in the present embodiment, the first light emitting device connecting pad 126 on the first circuit board 100 and the second light emitting device connecting pad 226 on the second circuit board 200 are connected to each other by the solder 326 through the via hole 226h, and based on this, the second light emitting signal connecting line 228 can be used to transmit the electric potential signal from the driving device, wherein the second light emitting signal connecting line 228A of the second light emitting signal connecting lines 228 can be supplied with the positive power supply electric potential, and the second light emitting signal connecting line 228B of the second light emitting signal connecting lines 228 can be supplied with the negative power supply electric potential, thereby the light emitting device can supply the forward current through the electric potential difference between the positive power supply electric potential and the negative power supply electric potential to emit light.
Fig. 2A is a schematic top view of a first circuit board according to a second embodiment of the present invention, fig. 2B is a schematic top view of a second circuit board according to a second embodiment of the present invention, and fig. 2C is an exploded view of a circuit board assembly according to a second embodiment of the present invention. It should be noted that, the embodiments shown in fig. 2A to 2C respectively use the element numbers and part of the contents of the embodiments shown in fig. 1A to 1C, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted portions, reference may be made to the description and effects of the foregoing embodiments, and the following embodiments will not be repeated, and at least some of the omitted descriptions in the embodiments illustrated in fig. 2A to fig. 2C may refer to the following contents.
Referring to fig. 2A to 2C, the circuit board assembly 20 shown in fig. 2A to 2C includes the following differences from the circuit board assembly 10. First, the first light emitting device connection pads 126 of the first circuit board 100 extend toward the first direction D1. Then, the second light-emitting device connecting pads 226 of the second circuit board 200 also extend in the first direction D1, and can be soldered to the first light-emitting device connecting pads 126 via the vias 226h by using solder 326. Then, the second light-emitting device connecting pads 226 and the dummy driving device connecting pads 222 are disposed on the opposite surfaces of the second circuit board 200, i.e. on the first surface 210S1 and the second surface 210S2 of the second substrate 210 of the second circuit board 200, respectively, so that the dummy driving device connecting pads 222 are soldered to the driving device connecting pads 122 via the vias 222h by using the solder 322. It is noted that the solder 322 is not required to be disposed to interfere with signal transmission between the dummy driving components on the second circuit board 200 and the driving components on the first circuit board 100.
To sum up, the utility model provides a novel circuit board combination borrows by the first circuit board design that will be applied to liquid crystal display panel for the individual layer circuit board, when the circuit board combination when crooked, because first circuit board does not have the via hole, its circuit pattern that can avoid being located near bending region splits because of stress, makes the utility model provides a yield of circuit board combination promotes. Furthermore, the utility model provides a circuit board combination borrows by design on the second circuit board have with the virtual drive element connection pad of the drive element connection pad joint in the first circuit board, and it can make the first circuit pattern of being applied to first circuit board still lay on the second circuit board, borrows this to improve wiring area. In addition, the utility model provides a circuit board combination borrows to borrow and replaces the reducible manufacturing cost of current multilayer circuit board by utilizing the individual layer circuit board.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications or substitutions do not depart from the scope of the invention in its corresponding aspects. Features of the embodiments may be arbitrarily mixed and matched without departing from the spirit or conflict between the embodiments.
Claims (10)
1. A circuit board assembly, comprising:
the first circuit board comprises a driving element connecting pad and a first light-emitting element connecting pad, wherein the first circuit board is a single-layer circuit board; and
a second circuit board including a dummy driving device connecting pad and a second light emitting device connecting pad electrically connected to the light emitting device,
wherein the driving element connecting pad of the first circuit board is joined to the virtual driving element connecting pad of the second circuit board, and the first light emitting element connecting pad of the first circuit board is joined to the second light emitting element connecting pad of the second circuit board.
2. The circuit board assembly of claim 1, wherein the first circuit board further comprises a driving signal connection line and a first light emitting signal connection line, the driving signal connection line is connected to the driving element connection pad, the first light emitting signal connection line is connected to the first light emitting element connection pad, and the driving signal connection line and the first light emitting signal connection line extend in a first direction.
3. The circuit board assembly of claim 2, wherein the first light emitting element bonding pad extends in a second direction, and the second direction is orthogonal to the first direction.
4. The circuit board assembly of claim 3, wherein the second light emitting device connecting pads extend in the second direction, and the second light emitting device connecting pads and the dummy driving device connecting pads are located on the same surface of the second circuit board.
5. The circuit board assembly of claim 2, wherein the first light emitting element connection pad extends in the first direction.
6. The circuit board assembly of claim 5, wherein the second light emitting device connecting pads extend in the first direction, and the second light emitting device connecting pads and the dummy driving device connecting pads are located on opposite surfaces of the second circuit board.
7. The circuit board assembly of claim 1, wherein the second circuit board comprises a dual layer circuit board.
8. The circuit board assembly of claim 1, wherein the first circuit board is electrically connected to the liquid crystal display panel, and the second circuit board is electrically connected to the backlight module.
9. The circuit board assembly of claim 1, wherein the first circuit board and the second circuit board are joined to each other with solder.
10. The circuit board assembly of claim 1, wherein the virtual driving element connecting pad of the second circuit board has a via hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111202565U TWM629872U (en) | 2022-03-15 | 2022-03-15 | Circuit board assembly |
| TW111202565 | 2022-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217160121U true CN217160121U (en) | 2022-08-09 |
Family
ID=82661244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220908126.9U Active CN217160121U (en) | 2022-03-15 | 2022-04-19 | Circuit board combination |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN217160121U (en) |
| TW (1) | TWM629872U (en) |
-
2022
- 2022-03-15 TW TW111202565U patent/TWM629872U/en unknown
- 2022-04-19 CN CN202220908126.9U patent/CN217160121U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM629872U (en) | 2022-07-21 |
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