CN202662240U - LED (light-emitting diode) packaging structure of high-brightness full-color display screen - Google Patents
LED (light-emitting diode) packaging structure of high-brightness full-color display screen Download PDFInfo
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- CN202662240U CN202662240U CN2012202490158U CN201220249015U CN202662240U CN 202662240 U CN202662240 U CN 202662240U CN 2012202490158 U CN2012202490158 U CN 2012202490158U CN 201220249015 U CN201220249015 U CN 201220249015U CN 202662240 U CN202662240 U CN 202662240U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model discloses an LED (light-emitting diode) packaging structure of a high-brightness full-color display screen, which comprises an insulating seat, a conductive pin, red-light LED chips, green-light LED chips and blue-light LED chips, wherein the insulating seat is arranged on the conductive pin, the red-light LED chips, the green-light LED chips and the blue-light LED chips are arranged on the conductive pin, at least a reinforced LED chip with the same emitted light color is increased in a mode of connecting at least one of the red-light LED chips, the green-light LED chips and the blue-light LED chips in parallel or in series. In the process of packaging LEDs of traditional full-color display screens, reinforced LED chip with selected colors can be increased as required so as to improve the brightness of emitted light of LED chips with different colors, thereby achieving the high-brightness effect of outdoor full-color display screens; and the increased number of the reinforced LED chip with different colors can be set freely, therefore, the product is agile and variable in design and has extremely strong practical values.
Description
Technical field
The utility model relates to the display screen art, refers in particular to a kind of high brightness full color display LED encapsulating structure.
Background technology
Along with developing rapidly of LED display, further show present LED screen display and show that brightness is not ideal, the contrast of picture does not reach the defective of requirement yet, and especially outdoor display screen is because the not high enough meeting of brightness causes display effect undesirable.
Existing 3528 full-color LED lamps are by the isosceles triangle support, the red, green, blue wafer, and glue, gold thread, silver slurry structure forms, and each wafer forms the pixel of each LED lamp; What adopted the bottom is round bottom, and the die bond position is " product " font, and outward appearance is the surface brush China ink.But there is certain drawback in this display mode, because the display mode of " product " font, from the left and right sides angle of display screen, can only see two kinds of colors, and the bright dipping mode of round bottom not very good, an outward appearance surface brush China ink, after the lamp pearl was made screen, contrast was bad, and brightness is not high enough.
In addition, 4 led supports that at present more common led light source also adopts usually, the made light source of this 4 led supports all comprises an insulating base, 4 pads that are fixedly mounted on the insulating base bottom, four pads are in the insulating base rectangular distribution in bottom, insulated part between four pads is " ten " font, and four pads are separately positioned on one jiao.During use, three LED wafers are separately positioned on the pad, are electrically connected with the 4th pad again.Because the insulating base inside on the led support of the prior art is truncated cone-shaped and because result's restriction of led support of the prior art can not well be penetrated so that the LED wafer is luminous, uses to be subject to certain limitation.
In view of this, the patent No. is 201120289105.5 to disclose a kind of full-color LED lamp, and it arranges versicolor LED wafer pitch and is " one " character form structure, makes the LED wafer be positioned at the medium position of insulating base, more be conducive to optically focused, light effect thereby improve.
High definition and high-contrast are the developing direction of display screen.The led light source technician has also been taken many time in the sharpness and the contrast that improve display screen at present, yet, in general, the development of above-mentioned three kinds of products just is placed in diverse location with versicolor LED wafer simply, the sidewall of recycling insulating base cooperates strengthens reflecting effect, it improves the degree that light effect is limited, and especially for the outdoor full color LED display screen, the emitting brightness of existing product is still strong not.
The utility model content
In view of this, the utility model is for the disappearance of prior art existence, its fundamental purpose provides a kind of high brightness full color display LED encapsulating structure, it can improve the emitting brightness of shades of colour LED wafer as required, reach the highlighted effect of outdoor full color display screen, thereby overcome the deficiencies in the prior art.
For achieving the above object, the utility model adopts following technical scheme:
A kind of high brightness full color display LED encapsulating structure, comprise insulating base, conductive feet and red-light LED wafer, green light LED wafer, blue-ray LED wafer, this conductive feet is installed on the insulating base, this red-light LED wafer, green light LED wafer, blue-ray LED wafer spread configuration on conductive feet, for this ruddiness, green glow, three kinds of LED wafers of blue light at least a also with series connection or and the mode that connects have additional out at least one reinforcement LED wafer corresponding to light color.
Preferably, described conductive feet comprises successively the first conductive feet group, the second conductive feet group and the 3rd conductive feet group of arranged with interval, and this first, second, third conductive feet group all has the first pin and second pin of opposed polarity; Aforementioned red-light LED wafer, green light LED wafer, blue-ray LED wafer and corresponding reinforcement LED wafer are separately fixed on first pin or the second pin of first, second, third conductive feet group separately.
Preferably, described red-light LED wafer is fixed on the first pin of the first conductive feet group, aforementioned green light LED wafer is fixed on the first pin of the second conductive feet group, aforementioned blue-ray LED wafer is fixed on the first pin of the 3rd conductive feet group, and is fixed with a green glow reinforcement LED wafer on the second pin of this second conductive feet group.
Preferably, described green light LED wafer and green glow reinforcement LED wafer are connected in parallel on first pin and the second pin of the second conductive feet group by gold thread.
Preferably, described green light LED wafer and green glow reinforcement LED wafer are connected on first pin and the second pin of the second conductive feet group by gold thread.
Preferably, described red-light LED wafer is fixed on the first pin of the first conductive feet group, and be fixed with a ruddiness reinforcement LED wafer on the second pin of this first conductive feet group, aforementioned green light LED wafer is fixed on the first pin of the second conductive feet group, aforementioned blue-ray LED wafer is fixed on the first pin of the 3rd conductive feet group, and is fixed with a blue light reinforcement LED wafer on the second pin of the 3rd conductive feet group.
Preferably, described red-light LED wafer and ruddiness reinforcement LED wafer are connected on by gold thread on first pin and the second pin of the first conductive feet group, and described blue-ray LED wafer and blue light reinforcement LED wafer are connected in parallel on first pin and the second pin of the 3rd conductive feet group by gold thread.
Preferably, described conductive feet comprises first conductive feet that is positioned at the middle part and five the second conductive feet that are arranged in the first conductive feet both sides, this first conductive feet and each the second conductive feet have included die bond section, holding parts and leg section, wherein, the die bond section of this first conductive feet is the schistose texture of a L font, and other five second conductions are centered around by the first conductive feet side with keeping spacing; Described red-light LED wafer, green light LED wafer, blue-ray LED wafer and corresponding reinforcement LED wafer all are fixed in the die bond section of this first conductive feet.
Preferably, the two poles of the earth of described red-light LED wafer are by on gold thread connection two the second conductive feet wherein, and these two second conductive feet are symmetricly set on the die bond section both sides of the first conductive feet; The two poles of the earth of described green light LED wafer are connected on two other second conductive feet by gold thread, and this two other conductive feet also is symmetricly set on the die bond section both sides of the first conductive feet; One end of described blue-ray LED wafer is connected on the first conductive feet by gold thread, and the other end is connected on last second conductive feet by gold thread; And, also having additional a green glow reinforcement LED wafer in the die bond section of this first conductive feet, this green glow reinforcement LED wafer is positioned at by the side of green light LED wafer, and this green glow reinforcement LED wafer and green light LED wafer are connected in parallel.
Preferably, also have additional a red-light LED reinforcement wafer in the die bond section of described the first conductive feet, this red-light LED reinforcement wafer is connected with original red-light LED wafer tandem.
The utility model compared with prior art has obvious advantage and beneficial effect, particularly, as shown from the above technical solution, it mainly is when the LED of the full color display of tradition encapsulation, can increase according to needs the reinforcement LED wafer of selected color, when the green light LED wafer emitting brightness of full color display is not enough, can increase one or more pieces green glow reinforcement LED wafer, to improve the emitting brightness of green color LED wafer; When the blue-ray LED wafer emitting brightness of full color display is not enough, can increase one or more pieces blue light reinforcement LED wafer, to improve the emitting brightness of blue color LED wafer; Certainly, if when the emitting brightness of the green light LED wafer of full color display and red-light LED wafer is all not enough, can increase simultaneously one or more pieces green glow reinforcement LED wafers and ruddiness reinforcement LED wafer, reach the highlighted effect of outdoor full color display screen.Hence one can see that, and the increase of the reinforcement LED wafer of different colours can be set according to needs, and the product design flexibility and changeability has extremely strong practical value.
For more clearly setting forth architectural feature of the present utility model and effect, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment.
Description of drawings
Fig. 1 is the package assembly front view of first embodiment of the utility model;
Fig. 2 is the package assembly front view of second embodiment of the utility model;
Fig. 3 is the package assembly front view of the 3rd embodiment of the utility model;
Fig. 4 is the package assembly front view of the 4th embodiment of the utility model;
Fig. 5 is the package assembly front view of the 5th embodiment of the utility model.
The accompanying drawing identifier declaration:
10, insulating base 11, reflector
20, conductive feet 21, the first conductive feet group
211, the first pin 212, the second pin
22, the second conductive feet group 221, the first pin
222, the second pin 23, the 3rd conductive feet group
231, the first pin 232, the second pin
24, die bond section 25, holding parts
26, leg section 27, the first conductive feet
271, die bond section 272, holding parts
273, leg section 28, the second conductive feet
281, die bond section 282, holding parts
283, leg section
31, red-light LED wafer 32, green light LED wafer
33, blue-ray LED wafer 34, ruddiness reinforcement LED wafer
35, green glow reinforcement LED wafer 36, blue light reinforcement LED wafer.
Embodiment
Please refer to shown in Figure 1, it has demonstrated the concrete structure of first embodiment of the utility model, include insulating base 10, be installed in insulating base 10 and outward extending several conductive feet 20 and be distributed in red-light LED wafer 31, green light LED wafer 32, blue-ray LED wafer 33 on the conductive feet 20, and, in order to increase light intensity, the utility model also increases reinforcement LED wafer on the basis of original LED wafer.
The recessed formation one of described insulating base 10 upper surfaces is the reflector 11 of bowl structure, aforementioned red-light LED wafer 31, green light LED wafer 32, blue-ray LED wafer 33 and corresponding reinforcement LED wafer all are positioned at this reflector 11, and the aperture efficiency of reflector 11 bottom is wide, make oblique outer the opening wide of opening of reflector 11, be conducive to the light reflex.In the present embodiment, this reflector 11 approximately has a rectangular shape, and can strengthen as much as possible on the one hand the area of reflector 11, with accommodating more LED wafer, can make on the other hand the wall thickness of insulating base thin, and the LED display resolution of producing improves.
Described conductive feet 20 comprises the first conductive feet group 21, the second conductive feet group 22 and the 3rd conductive feet group 23.This first, second, third conductive feet group 21,22,23 is arranged in parallel, and mutually keeps apart.Each conductive feet group 21,22,23 all has the first pin 211,212,213 and second pin 212,222,232 of opposed polarity, the positive pole of this first pin 211,212,213 connecting PCB boards, the negative pole of this second pin 212,222,232 connecting PCB boards.In the present embodiment, three conductive feet groups 21, each first pin 211 of 22,23,212,213 and each second pin 212,222,232 minutes three row, two row be embedded in the left and right sides of insulating base 10.
Particularly, each first pin 211, the 212,213 and second pin 212,222,232 have included die bond connected to one another section 24, holding parts 25 and leg section 26, the bottom surface at reflector 11 is exposed by this die bond section 24, this holding parts 25 is embedded in the insulating base 10, and this leg section 26 stretches out outside the two ends of insulating base 10.
The mode of described red-light LED wafer 31 by die bond scolding tin is fixed in the die bond section 24 of the first pin 211 of the first conductive feet group 21, the mode of aforementioned green light LED wafer 32 by die bond scolding tin is fixed in the die bond section 24 of the first pin 221 of the second conductive feet group 22, and the aforementioned blue-ray LED wafer 33 also mode by die bond scolding tin is fixed in the die bond section 24 of the first pin 231 of the 3rd conductive feet group 23.And, according to the required color that strengthens light, can arbitrarily increase one or more reinforcement LED wafers in reflector 11.In the present embodiment, die bond scolding tin has a green glow reinforcement LED wafer 35 in the die bond section 24 of the second pin 222 of this second conductive feet group 22, and aforementioned green light LED wafer 32 is connected in parallel on first pin 221 and the second pin 222 of the second conductive feet group 22 by gold thread with this green glow reinforcement LED wafer 35.
By said structure as can be known, present embodiment can strengthen the emitting brightness of green glow color LED wafer by increasing green glow reinforcement LED wafer 35.Certainly, the selected of reinforcement LED number of wafers and color is not limited to this, and producer can be according to client's needs free setting.
As shown in Figure 2, it has shown the concrete structure of second embodiment of the utility model, the structure of present embodiment and the first embodiment are basic identical, its difference is the connected mode of green light LED wafer 32 and green glow reinforcement LED wafer 35, in the first embodiment, this green light LED wafer 32 is to be connected in parallel with green glow reinforcement LED wafer 35, and in the present embodiment, this green light LED wafer 32 is to be connected in series with green glow reinforcement LED wafer 35.
As shown in Figure 3, it has shown the concrete structure of the 3rd embodiment of the utility model, the setting position of the red-light LED wafer 31 of present embodiment, green light LED wafer 32 and blue-ray LED wafer 33 is identical with the first embodiment, difference has been to increase the reinforcement LED wafer of different glow colors, and the connected mode between this reinforcement LED wafer and the original LED wafer.Herein, the second pin 212 in described the first conductive feet group 21 has a ruddiness reinforcement LED wafer 34 by the increase of die bond scolding tin; And, on the second pin 232 of described the 3rd conductive feet group 23, have additional blue light reinforcement LED wafer 36.Take this, by increasing ruddiness, blue light reinforcement LED wafer 34,36, can strengthen the luminosity of red color and blue color in the full color display.
Also have, in the present embodiment, described red-light LED wafer 31 is to be connected on first pin 211 and the second pin 212 of the first conductive feet group 21 by gold thread with ruddiness reinforcement LED wafer 34; Described blue-ray LED wafer 33 is to be connected in parallel on first pin 231 and the second pin 232 of the 3rd conductive feet group 23 by gold thread with blue light reinforcement LED wafer 36.Yet former the colorful one LED wafer is not limited to this with the connected mode of the reinforcement LED wafer that increases newly, also can use the mode of string and series-parallel connection combination, to locate not do restriction, in like manner, newly-increased reinforcement LED number of wafers can also be increased to two, more than three or three, do not establish the upper limit, only need to improve the emitting brightness of selected color, outdoor display screen reaches highlighted effect and gets final product.
As shown in Figure 4, it has shown the concrete structure of the 4th embodiment of the utility model, and present embodiment also includes insulating base 10, several conductive feet 20, red-light LED wafer 31, green light LED wafer 32, blue-ray LED wafer 33 and reinforcement LED wafer.
Among this embodiment, the structure of conductive feet 20 is changed, particularly, include altogether six conductive feet, be respectively first conductive feet 27 that is positioned at the middle part and five the second conductive feet 28 that are arranged in the first conductive feet 27 both sides.This first conductive feet 27 has included die bond section, holding parts and leg section with each second conductive feet 28, wherein, the die bond section 271 of this first conductive feet 27 is the schistose texture of a L font, it is positioned in the middle of the bottom surface of reflective evil idea 11, and the holding parts 272 of this first conductive feet 27 and leg section 273 extend outside the side of insulating base 10 from die bond section 271 tail ends of L font.Other five the second conductive feet 28 are centered around by the first conductive feet 27 sides equably, the bottom surface at reflector 11 is also exposed by the die bond section 281 of each the second conductive feet 28, and keep spacings with the die bond section 271 of the first conductive feet 27, the holding parts 282 of each second conductive feet 28 is mounted on the insulating base 10, and insulating base 10 both sides are stretched out by the leg section 283 of each second conductive feet 28.
Described red-light LED wafer 31, green light LED wafer 32 and blue-ray LED wafer 33 all are connected in the die bond section 271 of the first conductive feet 27 by the mode of die bond scolding tin, wherein, the two poles of the earth of this red-light LED wafer 31 are by on gold thread connection two the second conductive feet 28a, the 28b wherein, and these two the second conductive feet 28a, 28b are symmetricly set on die bond section 271 both sides of the first conductive feet 27.The two poles of the earth of this green light LED wafer 32 are connected on two other second conductive feet 28c, the 28d by gold thread, and this two second conductive feet 28c, 28d also are symmetricly set on die bond section 271 both sides of the first conductive feet 27.And an end of blue-ray LED wafer 33 is connected on the first conductive feet 27 by gold thread, and the other end is connected on last second conductive feet 28e by gold thread.
And, also having additional a green glow reinforcement LED wafer 35 in the die bond section 271 of this first conductive feet 27, this green glow reinforcement LED wafer 35 is positioned at by the side of green light LED wafer 32, and this green glow reinforcement LED wafer 35 is connected in parallel with green light LED wafer 32.
As shown in Figure 5, it has shown the concrete structure of the 5th embodiment of the utility model, the structure of present embodiment and the 4th embodiment is basic identical, its difference is that present embodiment also set up red-light LED reinforcement wafer 34, these red-light LED reinforcement wafer 34 modes by die bond scolding tin are fixed in the die bond section 271 of the first conductive feet 27, and this red-light LED reinforcement wafer 34 is connected in series with original red-light LED wafer 31.
In sum, design focal point of the present utility model is, it mainly is when the LED of the full color display of tradition encapsulation, can increase according to needs the reinforcement LED wafer of selected color, when the green light LED wafer emitting brightness of full color display is not enough, can increase one or more pieces green glow reinforcement LED wafer, to improve the emitting brightness of green color LED wafer; When the blue-ray LED wafer emitting brightness of full color display is not enough, can increase one or more pieces blue light reinforcement LED wafer, to improve the emitting brightness of blue color LED wafer; Certainly, if when the emitting brightness of the green light LED wafer of full color display and red-light LED wafer is all not enough, can increase simultaneously one or more pieces green glow reinforcement LED wafers and ruddiness reinforcement LED wafer, reach the highlighted effect of outdoor full color display screen.Hence one can see that, and the increase of the reinforcement LED wafer of different colours can be set according to needs, and the product design flexibility and changeability has extremely strong practical value.
The above, it only is preferred embodiment of the present utility model, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment does.
Claims (10)
1. high brightness full color display LED encapsulating structure, comprise insulating base, conductive feet and red-light LED wafer, green light LED wafer, blue-ray LED wafer, this conductive feet is installed on the insulating base, this red-light LED wafer, green light LED wafer, blue-ray LED wafer spread configuration is characterized in that on conductive feet: for this ruddiness, green glow, three kinds of LED wafers of blue light at least a also with series connection or and the mode that connects have additional out at least one reinforcement LED wafer corresponding to light color.
2. high brightness full color display LED encapsulating structure according to claim 1, it is characterized in that: described conductive feet comprises successively the first conductive feet group, the second conductive feet group and the 3rd conductive feet group of arranged with interval, and this first, second, third conductive feet group all has the first pin and second pin of opposed polarity; Aforementioned red-light LED wafer, green light LED wafer, blue-ray LED wafer and corresponding reinforcement LED wafer are separately fixed on first pin or the second pin of first, second, third conductive feet group separately.
3. high brightness full color display LED encapsulating structure according to claim 2, it is characterized in that: described red-light LED wafer is fixed on the first pin of the first conductive feet group, aforementioned green light LED wafer is fixed on the first pin of the second conductive feet group, aforementioned blue-ray LED wafer is fixed on the first pin of the 3rd conductive feet group, and is fixed with a green glow reinforcement LED wafer on the second pin of this second conductive feet group.
4. high brightness full color display LED encapsulating structure according to claim 3, it is characterized in that: described green light LED wafer and green glow reinforcement LED wafer are connected in parallel on first pin and the second pin of the second conductive feet group by gold thread.
5. high brightness full color display LED encapsulating structure according to claim 3, it is characterized in that: described green light LED wafer and green glow reinforcement LED wafer are connected on first pin and the second pin of the second conductive feet group by gold thread.
6. high brightness full color display LED encapsulating structure according to claim 1, it is characterized in that: described red-light LED wafer is fixed on the first pin of the first conductive feet group, and be fixed with a ruddiness reinforcement LED wafer on the second pin of this first conductive feet group, described green light LED wafer is fixed on the first pin of the second conductive feet group, described blue-ray LED wafer is fixed on the first pin of the 3rd conductive feet group, and is fixed with a blue light reinforcement LED wafer on the second pin of the 3rd conductive feet group.
7. high brightness full color display LED encapsulating structure according to claim 6, it is characterized in that: described red-light LED wafer and ruddiness reinforcement LED wafer are connected on by gold thread on first pin and the second pin of the first conductive feet group, and described blue-ray LED wafer and blue light reinforcement LED wafer are connected in parallel on first pin and the second pin of the 3rd conductive feet group by gold thread.
8. high brightness full color display LED encapsulating structure according to claim 1, it is characterized in that: described conductive feet comprises first conductive feet that is positioned at the middle part and five the second conductive feet that are arranged in the first conductive feet both sides, this first conductive feet and each the second conductive feet have included die bond section, holding parts and leg section, wherein, the die bond section of this first conductive feet is the schistose texture of a L font, and other five second conductions are centered around by the first conductive feet side with keeping spacing; Described red-light LED wafer, green light LED wafer, blue-ray LED wafer and corresponding reinforcement LED wafer all are fixed in the die bond section of this first conductive feet.
9. high brightness full color display LED encapsulating structure according to claim 8, it is characterized in that: the two poles of the earth of described red-light LED wafer are by on gold thread connection two the second conductive feet wherein, and these two second conductive feet are symmetricly set on the die bond section both sides of the first conductive feet; The two poles of the earth of described green light LED wafer are connected on two other second conductive feet by gold thread, and this two other conductive feet also is symmetricly set on the die bond section both sides of the first conductive feet; One end of described blue-ray LED wafer is connected on the first conductive feet by gold thread, and the other end is connected on last second conductive feet by gold thread; And, also having additional a green glow reinforcement LED wafer in the die bond section of this first conductive feet, this green glow reinforcement LED wafer is positioned at by the side of green light LED wafer, and this green glow reinforcement LED wafer and green light LED wafer are connected in parallel.
10. high brightness full color display LED encapsulating structure according to claim 9, it is characterized in that: also have additional a red-light LED reinforcement wafer in the die bond section of described the first conductive feet, this red-light LED reinforcement wafer is connected with original red-light LED wafer tandem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202490158U CN202662240U (en) | 2012-05-30 | 2012-05-30 | LED (light-emitting diode) packaging structure of high-brightness full-color display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202490158U CN202662240U (en) | 2012-05-30 | 2012-05-30 | LED (light-emitting diode) packaging structure of high-brightness full-color display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202662240U true CN202662240U (en) | 2013-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202490158U Expired - Fee Related CN202662240U (en) | 2012-05-30 | 2012-05-30 | LED (light-emitting diode) packaging structure of high-brightness full-color display screen |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709279A (en) * | 2012-05-30 | 2012-10-03 | 东莞市凯昶德电子科技股份有限公司 | LED (Light Emitting Diode) packaging structure of high brilliance full color display |
| CN103779485A (en) * | 2014-01-28 | 2014-05-07 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
-
2012
- 2012-05-30 CN CN2012202490158U patent/CN202662240U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709279A (en) * | 2012-05-30 | 2012-10-03 | 东莞市凯昶德电子科技股份有限公司 | LED (Light Emitting Diode) packaging structure of high brilliance full color display |
| CN103779485A (en) * | 2014-01-28 | 2014-05-07 | 深圳市蓝科电子有限公司 | Outdoor SMD full-color LED lamp bead and manufacturing method thereof |
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