CN101567323B - Method for producing three-color light-emitting diode for display screen - Google Patents
Method for producing three-color light-emitting diode for display screen Download PDFInfo
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- CN101567323B CN101567323B CN2009101077368A CN200910107736A CN101567323B CN 101567323 B CN101567323 B CN 101567323B CN 2009101077368 A CN2009101077368 A CN 2009101077368A CN 200910107736 A CN200910107736 A CN 200910107736A CN 101567323 B CN101567323 B CN 101567323B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention provides a method for producing thrcolor light-emitting diode for display screen, and relates to a production method of LED; including the following steps of: using a stand with a reflection cup body (6) of which the bottom is downward provided with a pit: that is the bottom surface of the reflection cup body (6) is downward provided with the pit capable of housing tricolor LED luminescence chips; thickening the frame composed of cup body (6), every electrode lead wire (7), (8), (9), (10) up to more than 1.2mm; fixing the tricolor LED luminescence chip with thicker thickness in the pit, and fixing the tricolor LED luminescence chip with thinner thickness on the bottom surface of the reflection cup body. The tricolor light-emitting diode provided by the invention has the advantages of long service life, energy conservation, green environment friendly pollution-free, color enrichment and high color purity, and the lightness and color of the diode can be adjusted arbitrarily used with control circuit and environment friendly clean energy.
Description
Technical field:
The present invention relates to manufacturing method for LED, especially display screen is with the manufacturing approach of three-color light-emitting diode.
Background technology:
Because the continual renovation progress of the technology of LED light-emitting diode, and applied to actual life in a large number, for example indoor outer display screen, various Landscape Lightings and industrial lighting, medical illumination etc.Along with advancing by leaps and bounds of LED technology, LED is approaching general lighting at present.Considerably beyond traditional incandescent lamp, even surpass fluorescent lamp with its high theoretical light efficiency.Since 08 Olympic Games, LED applies to various demonstrations field in a large number.Existing LED Display Technique has multiple implementation; Commonly used is that at least two monomer LED combine pixel of formation through certain luminous intensity distribution ratio in employing ruddiness, green glow, the blue light, obtains needed various Show Color through program controlled software.For example: make its smaller volume through at least two kinds of LED in three kinds of primary colours are changed over ellipse through packing forms, improve the mode of pixel, as: Chinese patent CN2786735; Also having in addition through surface-pasted method makes more than two kinds the primary-color LED luminous element insert on the same planar substrates; Make the luminous type LED such as 5050,5060 that carry out colour mixture such as existing SMD class of each luminous element, like Chinese patent CN2631048, because of its individuality little; Can surface mount; Mass automatic production is more convenient, and can high density, high pixel is integrated, by a large amount of with full-color display spares indoors.
The LED that is used for full-color display spare at present mainly contains two kinds of patterns: 1, form a pixel groups through oval red, green, at least two LED lamp bodies of blueness of monomer, through the adding up of pixel groups, reach the purpose of demonstration.2, through three-primary color LED luminescence chip (3), (4), (5) are integrated on the matrix, be encapsulated into a lamp body, and three kinds of primary colours of red, green, blue are controlled respectively; Form a pixel groups; Through adding up, reach the purpose of demonstration again, for example existing surface attaching type all-colour LED; 5050,5060 etc., like Fig. 1, shown in Figure 2.But this kind LED can only be widely used in indoor display device soon mainly due to the easy moisture absorption of its essential defective, decay.In addition because the LED of traditional SMD type adopts the PPA material to form cup through the MOLDING operation; Though and the PPA material has reflecting effect preferably; Reflectivity can reach 95%, and it does not possess light transmission, can only the non-cup bright dipping from the front; Thereby the lighting angle after LED is lighted is less, closely sees it is luminous point one by one.
Summary of the invention:
The objective of the invention is to: provide a kind of and make each primary lights mixing more even, effectively solve the manufacturing approach of a kind of three-color light-emitting diode for display screen of pixel poor repeatability defective.
The employing following steps are accomplished:
The bottom of adopting reflector cup (6) is to the support that has pit (20): promptly the base plane at reflector cup (6) is provided with the pit (20) that can insert the three-primary color LED luminescence chip downwards; The framework overstriking that each utmost point of cup (6) lead-in wire (7), (8), (9), (10) are formed is to more than the 1.2mm; Its making step is following:
A. three-primary color LED luminescence chip (11), (12), (13), (14) are individually fixed in the interior relevant position of cup (6), chip electrode and lead frame are coupled together with lead;
B. use whole transparent epoxy resin (15) to be packaged into different shape external form finished product according to different demands;
C. in the time of need adopting surface mount, then, mount as the surface then, cross Reflow Soldering again from the line that pre-bends (19) bending.
The three-primary color LED luminescence chip that thickness is thicker is fixed in the pit (20), and the three-primary color LED luminescence chip of thinner thickness is fixed on the reflector base plane.
The present invention has following advantage:
Full resin transparent encapsulation seems entirely lighting after LED is lighted, so more as a planar luminous body.
Antiultraviolet, protection against the tide simultaneously.Long service life, energy savings, environmental protection is pollution-free, and color is abundant and colorimetric purity is high, but cooperates control circuit its brightness of regulated at will and change color, also can cooperate the environment-protecting clean energy to use.
Can substitute existing all-colour LED, when using, have the effect that improves pixel resolution with the indoor display screen in open air.Can surface mount, large-scale application is in the open air.
Description of drawings:
Accompanying drawing 1 is the top plan view of traditional all-colour LED;
Accompanying drawing 2 is main pseudosections of traditional all-colour LED;
Accompanying drawing 3 is that the straight cutting of the three-primary color LED produced of the present invention uses vertical view;
Accompanying drawing 4 is that the straight cutting of the three-primary color LED produced of the present invention uses main pseudosection;
Accompanying drawing 5 is top plan view of the full-color surface mount LED that produces of the present invention;
Accompanying drawing 6 is main pseudosections of the full-color surface mount LED that produces of the present invention;
Accompanying drawing 7 is all-colour LED bright dipping mixed light sketch mapes that the present invention produces;
Accompanying drawing 8 is electrical schematic diagrams 1 of the present invention;
Accompanying drawing 9 is electrical schematic diagrams 2 of the present invention.
Embodiment:
The bottom of adopting reflector cup (6) is to the support that has pit (20): promptly the base plane at reflector cup (6) is provided with the pit (20) that can insert the three-primary color LED luminescence chip downwards; The framework overstriking that each utmost point of cup (6) lead-in wire (7), (8), (9), (10) are formed is to more than the 1.2mm; Again each three-primary color LED luminescence chip (11), (12), (13), (14) are individually fixed in relevant position in the cup, are about to the thicker LED luminescence chip of chip thickness and are fixed in the pit (20), the chip that chip thickness is thin is fixed on the reflector base plane.
With lead chip electrode and each utmost point lead-in wire (7), (8), (9), (10) are coupled together afterwards;
Use whole transparent epoxy resin (15) to be packaged into different shape external form finished product at last according to different demands;
If when adopting surface mount to use LED of the present invention, then, mount as the surface then, cross Reflow Soldering again from the line that pre-bends (19) bending.Like Fig. 5, shown in Figure 6.
After this adjustment, finally make the light-emitting area of three-primary color LED luminescence chip (11), (12), (13), (14) form same plane.
The connecting mode of triode is seen Fig. 8, Fig. 9.Outer pin (16), fin (17) folds light (18).
The tradition three-primary color LED, like Fig. 1, Fig. 2, its pin (1) is communicated with external circuit.Cup (2) mainly holds three-primary color LED luminescence chip (3), (4), (5), plays reflective optically focused effect, and the bottom of its cup (2) is a plane, does not have pit (20).
Claims (2)
1. the manufacturing approach of a three-color light-emitting diode for display screen is characterized in that: adopt following steps to accomplish:
The bottom of adopting reflector cup (6) is to the support that has pit (20): promptly the base plane at reflector cup (6) is provided with the pit (20) that can insert the three-primary color LED luminescence chip downwards; The framework overstriking that each utmost point of cup (6) lead-in wire (7), (8), (9), (10) are formed is to more than the 1.2mm; Its making step is following:
A. three-primary color LED luminescence chip (11), (12), (13), (14) are individually fixed in the interior relevant position of cup (6), chip electrode and lead frame are coupled together with lead;
B. use whole transparent epoxy resin (15) to be packaged into different shape external form finished product according to different demands;
C. in the time of need adopting surface mount, then, mount as the surface then, cross Reflow Soldering again from the line that pre-bends (19) bending.
2. the manufacturing approach of a kind of three-color light-emitting diode for display screen as claimed in claim 1; It is characterized in that: the three-primary color LED luminescence chip that thickness is thicker is fixed in the pit (20), and the three-primary color LED luminescence chip of thinner thickness is fixed on the reflector base plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101077368A CN101567323B (en) | 2009-05-27 | 2009-05-27 | Method for producing three-color light-emitting diode for display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101077368A CN101567323B (en) | 2009-05-27 | 2009-05-27 | Method for producing three-color light-emitting diode for display screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101567323A CN101567323A (en) | 2009-10-28 |
| CN101567323B true CN101567323B (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101077368A Active CN101567323B (en) | 2009-05-27 | 2009-05-27 | Method for producing three-color light-emitting diode for display screen |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102315376A (en) * | 2010-06-30 | 2012-01-11 | 一诠精密电子工业(中国)有限公司 | Method for making electric-heat separated light emitting diode support structure |
| CN104103748B (en) * | 2013-04-10 | 2016-12-07 | 重庆市路迪机械厂 | Package structure for LED and manufacture method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1755906A (en) * | 2004-09-28 | 2006-04-05 | 相互股份有限公司 | Packaging method for integrated circuit and LED |
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- 2009-05-27 CN CN2009101077368A patent/CN101567323B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1755906A (en) * | 2004-09-28 | 2006-04-05 | 相互股份有限公司 | Packaging method for integrated circuit and LED |
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| CN101567323A (en) | 2009-10-28 |
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Effective date of registration: 20220118 Address after: 332000 east side of floors 1 and 3, building 1, shuangchuang base, Jiujiang Economic and Technological Development Zone, Jiujiang City, Jiangxi Province Patentee after: Jiangxi Lanke Semiconductor Co.,Ltd. Address before: 518103 3 hi tech Industrial Zone, Fu Garden Road, Fuyong Town, Shenzhen, Guangdong, Baoan District Patentee before: SHENZHEN LANKE ELECTRONICS Co.,Ltd. |
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Addressee: Patent of Shenzhen Lanke Electronics Co.,Ltd. The person in charge Document name: Notification of qualified procedures |