CN101047217A - LED with color package casing - Google Patents
LED with color package casing Download PDFInfo
- Publication number
- CN101047217A CN101047217A CNA2007100048744A CN200710004874A CN101047217A CN 101047217 A CN101047217 A CN 101047217A CN A2007100048744 A CNA2007100048744 A CN A2007100048744A CN 200710004874 A CN200710004874 A CN 200710004874A CN 101047217 A CN101047217 A CN 101047217A
- Authority
- CN
- China
- Prior art keywords
- led
- package casing
- resin glue
- light
- pigment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
A LED with colored packaging shell consists of LED chip emitting light with wavelength of 430-480nm, yellow fluorescent powder to generate white light when it is excited by said chip and colored packaging shell prepared by mixing epoxy hardening agent and epoxy glue with pigment uniformly.
Description
Technical field
The invention belongs to the LED encapsulation field, refer in particular to a kind of LED of color package casing.
Background technology
Because the blue-ray LED wafer price is minimum on the existing market, therefore, make and to send the particularly LED of white light of other color of light, traditional process is to carry out mixed light again with the light that the multiple fluorescent material of blue light wafer deexcitation obtains different colours, and obtaining the light of required color, this scheme reaches the color of the control light that sends by the combination of selecting different fluorescent material for use, because the price of some fluorescent material is very high, increased cost of manufacture undoubtedly, such as red fluorescence powder etc.; Also having scheme is that a plurality of LED wafers combinations are carried out mixed light and obtained white light, and same cost is also very high.The resulting light colour temperature of such scheme is than higher in addition, and is very dazzling, expect low colour temperature, the illuminating ray of soft visual effect is arranged, and is difficult to achieve the goal by such scheme.The shell of existing light-emitting diode is a clear, colorless all in addition, does not have decorative effect when not working lamp at all.
Summary of the invention
The invention provides a kind of LED of color package casing, this LED cost is low, good decorating effect, and the light colour temperature that it sends is low, and light is soft.
The present invention realizes that the technical scheme that above-mentioned purpose adopts is: a kind of LED of color package casing is characterized in that this LED comprises: LED wafer, the component of its luminescent layer comprise one or more element combinations of gallium, indium, silicon, carbon and nitrogen; Yellow fluorescent powder covers on the above-mentioned LED wafer, be subjected to above-mentioned LED wafer the luminous light that sent of back that excites be white light with luminous the mixing of above-mentioned LED wafer again; Support carries above-mentioned LED wafer and fluorescent material and provides power supply to above-mentioned LED wafer; Coloured package casing seals above-mentioned LED wafer, yellow fluorescent powder and part support, and this above-mentioned white light of coloured package casing correction and obtain the light of predetermined color.Described coloured package casing composition comprises epoxide-resin glue curing agent, epoxy resin glue and pigment.
The present invention adopts cost low common LED wafer and yellow fluorescent powder, draw white light, re-use coloured package casing correction and send the color of light, promptly adopt cheap pigment to substitute expensive fluorescent material or wafer, reach same effect, the pigmentary colours of changing in the package casing just can change the color that finally emits beam, and therefore saved cost of manufacture greatly, and technology are simple.Because package casing has color, also can increase decorative effect.
First embodiment that uses this programme in addition can also obtain the very low light of colour temperature, becomes soft more, controls the colour temperature of light by changing above-mentioned composition ratio, can make error between light colour temperature and the desired value in ± 50K, the accuracy height.
Description of drawings
Fig. 1 is the cutaway view of product of the present invention.
Embodiment
With reference to Fig. 1, the present invention is the encapsulating structure of a kind of LED, comprise electrode suppor 1, LED wafer 2, fluorescent material 3, package casing 4 and lead 5, there is bowl cup 11 on electrode suppor 1 top, LED wafer 2 is placed in bowl cup interior 11, fluorescent material 3 covers on the LED wafer 2, and lead 5 connects LED wafer 2 and electrode suppor 1 by polarity, and the periphery is coloured package casing 4.
Know-why of the present invention is as follows: cooperate with fluorescent material by technical maturity, low-cost common LED wafer to obtain white light, white light is by outer field coloured package casing transmission, and obtains a kind of light of predetermined color.The luminescent layer of LED wafer is made up of one or more that comprise elements such as gallium, indium, silicon, carbon and nitrogen, and sending wavelength is the once light of 430～480nm, and color is blue substantially, and excitated fluorescent powder sends secondary light again, and both mix mutually and obtain white color.The fluorescent material that is adopted is yellow fluorescent powder, and the white light colour temperature that obtains is generally about 6500K.By after coloured package casing transmission, the light that is sent can change according to the color of coloured package casing above-mentioned white light again.
The present invention has enumerated a kind of a kind of product of using above-mentioned principle and making at this, is a kind of specific embodiment of the present invention, at present practical a kind of warm white light LED.The encapsulating structure of this embodiment is above being set forth, no longer repeats at this, only sets forth package casing of the present invention.The package casing of present embodiment is evenly mixed by epoxide-resin glue curing agent, epoxy resin glue and three kinds of materials of pigment and forms, and pigment is evenly mixed by red pigments and xanthein, and high more then its proportion of the purity of pigment is low more.The red pigments that is adopted in the present embodiment is that the sharp electronic material (Guangzhou) of favour Co., Ltd produces, and model is PC-003; And xanthein is the production of industry rising sun Ya Pengnuo (Foshan) electron recombination Materials Co., Ltd, model is ANOX FD-3, thereby the mixed proportion of epoxide-resin glue curing agent, epoxy resin glue, red pigments and xanthein is 100: 100: 0.1: 1, the package casing that is evenly mixed by above-mentioned various materials is amber, the light that sees through this package casing ejaculation is warm white, and its colour temperature is 2800K.By changing the ratio of red pigments and the shared composition of xanthein in the amber package casing, the light colour temperature of finally sending is changed about 2800K, and the error between light colour temperature and the desired value is in ± 50K.If improve the ratio of red pigments and xanthein composition, the light colour temperature of then sending is low more, and color is red more; Otherwise if reduce the ratio of red pigments and xanthein composition, the light colour temperature of then sending is high more, and color is yellow more.
The present invention has also enumerated another at this and has used above-mentioned principle and a kind of product of making, is another kind of specific embodiment of the present invention, can reach a kind of green light LED with the higher equal effect of green wafer of price at present.The encapsulating structure of this embodiment is same as described above, also no longer repeats at this, only sets forth package casing of the present invention.The package casing of present embodiment is evenly mixed by epoxide-resin glue curing agent, epoxy resin glue and three kinds of materials of green pigment and forms, and similarly, high more then its proportion of the purity of pigment is low more.The green pigment that is adopted in the present embodiment is that industry rising sun Ya Pengnuo (Foshan) electron recombination Materials Co., Ltd produces, model is ANOX FD-4, thereby the mixed proportion of epoxide-resin glue curing agent, epoxy resin glue and green pigment is 100: 100: 1～2, the package casing that is evenly mixed by above-mentioned various materials is green, the light that sees through this package casing ejaculation is green, and its wavelength of light has minor fluctuations about 520nm.
Claims (7)
1, a kind of LED of color package casing is characterized in that this LED comprises:
LED wafer, the component of its luminescent layer include but are not limited to one or more element combinations of gallium, indium, silicon, carbon and nitrogen;
Yellow fluorescent powder covers on the above-mentioned LED wafer, be subjected to above-mentioned LED wafer the luminous light that sent of back that excites be white light with luminous the mixing of above-mentioned LED wafer again;
Support carries above-mentioned LED wafer and fluorescent material and provides power supply to above-mentioned LED wafer;
Coloured package casing seals above-mentioned LED wafer, yellow fluorescent powder and part support, and this above-mentioned white light of coloured package casing correction and obtain the light of predetermined color.
2,, it is characterized in that described coloured package casing composition comprises epoxide-resin glue curing agent, epoxy resin glue and pigment according to the LED of the described color package casing of claim 1.
3,, it is characterized in that described pigment is amber according to the LED of the described color package casing of claim 2.
4,, it is characterized in that described amber pigment is uniformly mixed into by red pigments and xanthein according to the LED of the described color package casing of claim 3.
5, according to the LED of the described color package casing of claim 4, the composition proportion that it is characterized in that described epoxide-resin glue curing agent, epoxy resin glue, red pigments and xanthein is 100: 100: 0.1: 1.
6,, it is characterized in that described pigment is a green pigment according to the LED of the described color package casing of claim 2.
7, according to the LED of the described color package casing of claim 6, the composition proportion that it is characterized in that described epoxide-resin glue curing agent, epoxy resin glue, green pigment is 100: 100: 1～2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100048744A CN101047217A (en) | 2006-04-03 | 2007-02-08 | LED with color package casing |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610034858.5 | 2006-04-03 | ||
| CNA2006100348585A CN1862844A (en) | 2006-04-03 | 2006-04-03 | Method for making warm white light LED and light source made thereof |
| CNA2007100048744A CN101047217A (en) | 2006-04-03 | 2007-02-08 | LED with color package casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101047217A true CN101047217A (en) | 2007-10-03 |
Family
ID=38771598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100048744A Pending CN101047217A (en) | 2006-04-03 | 2007-02-08 | LED with color package casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101047217A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263190A (en) * | 2010-05-28 | 2011-11-30 | 采钰科技股份有限公司 | Light-emitting device |
| CN101813300B (en) * | 2009-02-19 | 2012-05-23 | 亿光电子工业股份有限公司 | Light-emitting assembly packaging structure and manufacture method thereof |
| CN101697654B (en) * | 2009-10-30 | 2013-02-27 | 中山大学 | Correlated color temperature and color rendering index self-calibration circuit of LED light source consisting of light of multiple colors |
| US8710529B2 (en) | 2009-01-23 | 2014-04-29 | Everlight Electronics Co., Ltd. | Light-emitting device package structure |
| CN107195760A (en) * | 2017-04-26 | 2017-09-22 | 安徽欧瑞特照明有限公司 | A kind of LED packaging technologies |
-
2007
- 2007-02-08 CN CNA2007100048744A patent/CN101047217A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8710529B2 (en) | 2009-01-23 | 2014-04-29 | Everlight Electronics Co., Ltd. | Light-emitting device package structure |
| CN101813300B (en) * | 2009-02-19 | 2012-05-23 | 亿光电子工业股份有限公司 | Light-emitting assembly packaging structure and manufacture method thereof |
| CN101697654B (en) * | 2009-10-30 | 2013-02-27 | 中山大学 | Correlated color temperature and color rendering index self-calibration circuit of LED light source consisting of light of multiple colors |
| CN102263190A (en) * | 2010-05-28 | 2011-11-30 | 采钰科技股份有限公司 | Light-emitting device |
| CN107195760A (en) * | 2017-04-26 | 2017-09-22 | 安徽欧瑞特照明有限公司 | A kind of LED packaging technologies |
| CN107195760B (en) * | 2017-04-26 | 2020-01-17 | 安徽欧瑞特照明有限公司 | LED packaging process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120161170A1 (en) | Generation of radiation conducive to plant growth using a combination of leds and phosphors | |
| CN103123950B (en) | A kind of encapsulating structure of LED light source and method for packing | |
| TW201010125A (en) | White light light-emitting diodes | |
| CN101915369A (en) | LED white light source module | |
| CN101093068A (en) | White light parts, and fabricating method | |
| CN102376857B (en) | Packaging method for light-emitting manner of LED (Light-Emitting Diode) with specific wavelength | |
| CN106796975A (en) | Using the LED device of neodymium fluorine material | |
| CN101704988A (en) | Method for preparing fluorescent powder colloid | |
| CN101047217A (en) | LED with color package casing | |
| CN101442087B (en) | Low power low light loss white light LED | |
| CN105042363B (en) | A kind of four primary LED light source | |
| CN202012778U (en) | Light mixing LED (light-emitting diode) white lamp with high color rendering index | |
| CN201133611Y (en) | LED and OLED cooperated tricolor device | |
| CN102231418A (en) | Method for manufacturing white-light LED (Light Emitting Diode) with high color rendering index | |
| US20070029926A1 (en) | Multi-wavelength LED construction & manufacturing process | |
| CN204829359U (en) | Four primary colours LED light sources | |
| CN201117655Y (en) | Led | |
| CN203787466U (en) | LED (light emitting diode) packaging structure | |
| CN202394970U (en) | Light-emitting diode (LED) chip and light source module using same | |
| CN101968169A (en) | Warm white LED lamp with high brightness and high color rendering index | |
| CN101901864A (en) | LED (Light-Emitting Diode) module and LED illumination device | |
| CN201126821Y (en) | Light emitting diode | |
| CN102097571A (en) | Yellow/green light diode, backlight, mobile phone and illumination indicating device | |
| CN202691647U (en) | Warm white LED (Light Emitting Diode) lamp with high brightness and high color rendering index | |
| CN203746905U (en) | White-light LED structure with high color-rendering index and high luminous efficiency |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |