CN102097571A - Yellow/green light diode, backlight, mobile phone and illumination indicating device - Google Patents
Yellow/green light diode, backlight, mobile phone and illumination indicating device Download PDFInfo
- Publication number
- CN102097571A CN102097571A CN2010105456845A CN201010545684A CN102097571A CN 102097571 A CN102097571 A CN 102097571A CN 2010105456845 A CN2010105456845 A CN 2010105456845A CN 201010545684 A CN201010545684 A CN 201010545684A CN 102097571 A CN102097571 A CN 102097571A
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- Prior art keywords
- yellow
- light
- green
- diode
- light diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The invention is suitable for the field of illumination, and provides a yellow/green light diode, a backlight, a mobile phone and an illumination indicating device. The yellow/green light diode comprises a substrate for die attach and wire bonding of a blue light LED (Light Emitting Diode) chip and a reflecting cup which is fixedly arranged on the substrate and enables an packaging material to the formed, wherein the packaging material is transparent slurry doped with a light yellow fluorescent material, and the packaging material covers the blue light LED chip. According to the invention, the light yellow fluorescent material is doped in the transparent slurry to obtain the packaging material, the packaging material covers the blue light LED chip, the light emitted by the blue light LED chip excites the light yellow fluorescent material to generate high-brightness yellow/green light, and the yellow/green light diode prepared from such packaging has the advantages of high reliability, simple process and low cost. The yellow/green light diode can be used as the backlights of a variety of consumption products, such as a mobile phone, a PDA (Personal Digital Assistant) and the like or used for decoration, illumination indication and the like, and has the advantages of wide application, softer color and comfort and warm feeling to people.
Description
Technical field
The invention belongs to lighting field, relate in particular to a kind of green-yellow light diode, backlight, mobile phone and lighting indication device.
Background technology
Light-emitting diode (Light Emitting Diode, LED) have long, advantages such as power consumption is low, reaction speed is fast, reliability is high, environmental protection, safety of life-span, along with the market demand and development of technology, its applicable aspect more and more widely, the glow color of demand is also more and more various, the brightness that requires is also more and more higher, so how to promote brightness and research and develop the light-emitting diode of novel color, has become the important directions that LED researches and develops.
Traditional manufacture method has two kinds, a kind of is by adjusting the ratio of each component in the luminescent grain, thereby obtains green-yellow light, purplish red light, the color that pink light etc. are more special, but this technology is imperfection also, so the reliability of luminescent grain is not high and finished product brightness is lower; Another kind be luminescent grain mutual encapsulation by 2 above different colours in same packaging part the inside, but the packaging technology of the method is comparatively complicated, reliability is low, the finished product luminosity is not high.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of green-yellow light diode, and it is not high to be intended to solve existing green-yellow light diode reliability, the problem that luminosity is low.
The embodiment of the invention is to realize like this, a kind of green-yellow light diode, comprise for the substrate of the solid brilliant bonding wire of blue-light LED chip and be fixedly arranged on described substrate and make the reflector of encapsulating material moulding, described encapsulating material is the transparent slurry that is mixed with light yellow fluorescent material, covers described blue-light LED chip by described encapsulating material.
Another purpose of the embodiment of the invention is to provide a kind of backlight, and described backlight has above-mentioned green-yellow light diode.
Another purpose of the embodiment of the invention is to provide a kind of mobile phone, and described mobile phone adopts above-mentioned backlight.
Another purpose of the embodiment of the invention is to provide a kind of lighting indication device, and described lighting indication device comprises above-mentioned green-yellow light diode.
The embodiment of the invention is mixed light yellow fluorescent material in transparent slurry and is made encapsulating material, cover blue-light LED chip by this encapsulating material, the light yellow fluorescent material of the optical excitation that blue-light LED chip sends produces the green-yellow light of high brightness, so encapsulate the green-yellow light diode reliability height that makes, technology is simple, and cost is low.This green-yellow light diode can be used as the backlight of various consumer products such as mobile phone, PDA, or is used for decorating, throwing light on indication etc., be widely used, and color is softer, gives comfortable, the warm sensation of people.
Description of drawings
Fig. 1 is the structural representation of the green-yellow light diode that provides of the embodiment of the invention;
Fig. 2 is the spectral power distribution figure of the green-yellow light diode that provides of the embodiment of the invention;
Fig. 3 is the colourity distribution map of the green-yellow light diode that provides of the embodiment of the invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention is mixed light yellow fluorescent material in transparent slurry and is made encapsulating material, cover blue-light LED chip by this encapsulating material, the light yellow fluorescent material of the optical excitation that blue-light LED chip sends produces the green-yellow light of high brightness, so encapsulate the green-yellow light diode reliability height that makes, technology is simple, and cost is low.
The green-yellow light diode that the embodiment of the invention provides comprises for the substrate of the solid brilliant bonding wire of blue-light LED chip and is fixedly arranged on described substrate and makes the reflector of encapsulating material moulding, described encapsulating material is the transparent slurry that is mixed with light yellow fluorescent material, covers described blue-light LED chip by described encapsulating material.
The backlight that the embodiment of the invention provides has above-mentioned green-yellow light diode.
The mobile phone that the embodiment of the invention provides adopts above-mentioned backlight.
The lighting indication device that the embodiment of the invention provides comprises above-mentioned green-yellow light diode.
Below in conjunction with specific embodiment realization of the present invention is described in detail.
Shown in 1 figure, the green-yellow light diode that the embodiment of the invention provides comprises for the substrate 12 of the solid brilliant bonding wires of led chip 11 and is fixedly arranged on this substrate 12 and makes the reflector 14 of encapsulating material 13 moulding, covers these led chips 11 by this encapsulating material 14.Wherein led chip 11 is a blue-light LED chip, and encapsulating material 13 is for being mixed with the transparent slurry of light yellow fluorescent material.
Brightness and/or the colour temperature required according to the green-yellow light diode take by weighing an amount of light yellow fluorescent material and are mixed in transparent slurry, stir, and make encapsulating material.Then encapsulating material 13 is filled in reflector 14.Silica gel that wherein transparent slurry is silica gel, epoxy resin or modification or epoxy resin etc.
As shown in Figure 2, the light yellow fluorescent material of blue-light LED chip 11 optical excitation of sending produces the green-yellow light of high brightness.The upper right side that this green-yellow light is positioned at XYZ chromaticity diagram as shown in Figure 3 is the zone at quadrangle ABCD place.Compared to existing technology, the reliability height of this green-yellow light diode, technology is simple, and cost is low.
Usually, the light wavelength sent of blue-light LED chip is 425-460nm.Light yellow fluorescent material is commercially available fluorescent material, and chemical formula is AaBqO
4: Cx (0＜a≤1,0＜q≤1,0＜x≤1), emission peak wavelength is 555-575nm.Wherein A is one or more among Y, Lu, Ca, Mg, Sr, the Ba, and B is one or more among Si, Al, Gd, S, the N, and C is one or more among Eu, the Ce, and for example the chemical formula of this light yellow fluorescent material can be 1.5Y
2O
31.5Al
2O
33GdO:Ce, SrOSiO
2NO
b: Eu (0＜b≤2) or SrO2CaOSO
2: Eu.
In the embodiment of the invention, the concentration of light yellow fluorescent material is 5%-30% (mass percent), and the light yellow fluorescent material of this higher concentration has absorbed the blue light that led chip sends basically and has been converted into green-yellow light.Increase the concentration of light yellow fluorescent material as can be known by following table, the brightness of green-yellow light diode strengthens thereupon, and wherein the power of blue-light LED chip is 60mW.
Fail to surpass 500mcd by the luminosity of the green-yellow light diode of conventional method manufacturing or encapsulation, and the luminosity of this green-yellow light diode can reach 2000mcd, is more than 4 times of traditional light-emitting diode.
The embodiment of the invention is mixed light yellow fluorescent material in transparent slurry and is made encapsulating material, cover blue-light LED chip by this encapsulating material, the light yellow fluorescent material of the optical excitation that blue-light LED chip sends produces the green-yellow light of high brightness, so encapsulate the green-yellow light diode reliability height that makes, technology is simple, and cost is low.Simultaneously, increase the concentration of light yellow fluorescent material, the brightness of green-yellow light diode strengthens thereupon.Preferably, the chemical formula of light yellow fluorescent material is AaBqO
4: Cx (0＜a≤1,0＜q≤1,0＜x≤1) wherein A is one or more among Y, Lu, Ca, Mg, Sr, the Ba, and B is one or more among Si, Al, Gd, S, the N, and C is one or more among Eu, the Ce.This green-yellow light diode can be used as the backlight of various consumer products such as mobile phone, PDA, or is used for decorating, throwing light on indication etc., be widely used, and color is softer, gives comfortable, the warm sensation of people.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. green-yellow light diode, it is characterized in that, described green-yellow light diode comprises for the substrate of the solid brilliant bonding wire of blue-light LED chip and is fixedly arranged on described substrate and makes the reflector of encapsulating material moulding, described encapsulating material is the transparent slurry that is mixed with light yellow fluorescent material, covers described blue-light LED chip by described encapsulating material.
2. green-yellow light diode as claimed in claim 1 is characterized in that, described encapsulating material comprises the light yellow fluorescent material of 5%-30% (weight).
3. green-yellow light diode as claimed in claim 2 is characterized in that, increases the concentration of described light yellow fluorescent material, and the brightness of described green-yellow light diode is strengthened thereupon.
4. as claim 1,2 or 3 described green-yellow light diodes, it is characterized in that the chemical formula of described light yellow fluorescent material is AaBqO
4: Cx, wherein 0＜a≤1,0＜q≤1,0＜x≤1; Wherein A is one or more among Y, Lu, Ca, Mg, Sr, the Ba, and B is one or more among Si, Al, Gd, S, the N, and C is one or more among Eu, the Ce.
5. green-yellow light diode as claimed in claim 4 is characterized in that, the emission peak wavelength of described light yellow fluorescent material is 555-575nm.
6. green-yellow light diode as claimed in claim 5 is characterized in that, the light wavelength that described blue-light LED chip sends is 425-460nm.
7. green-yellow light diode as claimed in claim 4 is characterized in that, silica gel or epoxy resin that described transparent slurry is silica gel, epoxy resin or modification.
8. a backlight is characterized in that, described backlight has as each described green-yellow light diode in the claim 1～7.
9. a mobile phone is characterized in that, described mobile phone adopts the described backlight of claim 8.
10. a lighting indication device is characterized in that, described lighting indication device comprises as each described green-yellow light diode in the claim 1～7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105456845A CN102097571A (en) | 2010-11-16 | 2010-11-16 | Yellow/green light diode, backlight, mobile phone and illumination indicating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105456845A CN102097571A (en) | 2010-11-16 | 2010-11-16 | Yellow/green light diode, backlight, mobile phone and illumination indicating device |
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|---|---|
| CN102097571A true CN102097571A (en) | 2011-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105456845A Pending CN102097571A (en) | 2010-11-16 | 2010-11-16 | Yellow/green light diode, backlight, mobile phone and illumination indicating device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108548125A (en) * | 2018-06-01 | 2018-09-18 | 郑州森源新能源科技有限公司 | A kind of light source assembly of jungle lighting device |
| RU2673775C1 (en) * | 2014-12-09 | 2018-11-29 | По-Кан ЛИНЬ | Yellow lighting system and method of realization of yellow lighting |
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| CN1482208A (en) * | 2002-09-13 | 2004-03-17 | 北京有色金属研究总院 | Blue light-excitated white phosphor powder for LED and production method thereof |
| CN1495918A (en) * | 1996-07-29 | 2004-05-12 | ���ǻ�ѧ��ҵ��ʽ���� | Luminous device |
| CN1818012A (en) * | 2002-03-22 | 2006-08-16 | 日亚化学工业株式会社 | Nitride phosphor and production process thereof, and light emitting device |
| US20060232193A1 (en) * | 2005-04-15 | 2006-10-19 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlamplen Mbh | Blue to yellow-orange emitting phosphor, and light source having such a phosphor |
| CN101174663A (en) * | 2006-10-31 | 2008-05-07 | 东芝照明技术株式会社 | Lighting apparatus |
| CN101292009A (en) * | 2004-08-04 | 2008-10-22 | 英特曼帝克司公司 | Novel silicate-based yellow-green phosphors |
| CN101696353A (en) * | 2007-08-15 | 2010-04-21 | 大连路明发光科技股份有限公司 | Nitrogen-contained compound fluorescent material as well as preparation method thereof and lighting device using same |
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2010
- 2010-11-16 CN CN2010105456845A patent/CN102097571A/en active Pending
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| CN1495918A (en) * | 1996-07-29 | 2004-05-12 | ���ǻ�ѧ��ҵ��ʽ���� | Luminous device |
| CN1818012A (en) * | 2002-03-22 | 2006-08-16 | 日亚化学工业株式会社 | Nitride phosphor and production process thereof, and light emitting device |
| CN1482208A (en) * | 2002-09-13 | 2004-03-17 | 北京有色金属研究总院 | Blue light-excitated white phosphor powder for LED and production method thereof |
| CN101292009A (en) * | 2004-08-04 | 2008-10-22 | 英特曼帝克司公司 | Novel silicate-based yellow-green phosphors |
| US20060232193A1 (en) * | 2005-04-15 | 2006-10-19 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlamplen Mbh | Blue to yellow-orange emitting phosphor, and light source having such a phosphor |
| CN101174663A (en) * | 2006-10-31 | 2008-05-07 | 东芝照明技术株式会社 | Lighting apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2673775C1 (en) * | 2014-12-09 | 2018-11-29 | По-Кан ЛИНЬ | Yellow lighting system and method of realization of yellow lighting |
| CN108548125A (en) * | 2018-06-01 | 2018-09-18 | 郑州森源新能源科技有限公司 | A kind of light source assembly of jungle lighting device |
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Application publication date: 20110615 |