CN104241504A - High-color-rendering white-light LED manufacturing method based on phosphor conversion - Google Patents
High-color-rendering white-light LED manufacturing method based on phosphor conversion Download PDFInfo
- Publication number
- CN104241504A CN104241504A CN201310234723.3A CN201310234723A CN104241504A CN 104241504 A CN104241504 A CN 104241504A CN 201310234723 A CN201310234723 A CN 201310234723A CN 104241504 A CN104241504 A CN 104241504A
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- Prior art keywords
- fluorescent material
- phosphor
- silica gel
- white light
- light
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Links
- 238000009877 rendering Methods 0.000 title claims abstract description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 title abstract description 6
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000741 silica gel Substances 0.000 claims abstract description 21
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 21
- 150000004767 nitrides Chemical class 0.000 claims abstract description 10
- 150000004645 aluminates Chemical class 0.000 claims abstract description 9
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 34
- 239000000843 powder Substances 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 claims description 11
- 238000007711 solidification Methods 0.000 claims description 8
- 230000008023 solidification Effects 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- 238000000295 emission spectrum Methods 0.000 claims description 5
- 102000004144 Green Fluorescent Proteins Human genes 0.000 claims 1
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 230000005284 excitation Effects 0.000 abstract 2
- 238000012360 testing method Methods 0.000 description 11
- 238000004458 analytical method Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000005303 weighing Methods 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 5
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 238000004737 colorimetric analysis Methods 0.000 description 2
- 238000002284 excitation--emission spectrum Methods 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a high-color-rendering white-light LED manufacturing method based on mixed phosphor conversion. Mixed phosphor includes phosphor emitting green and yellowish orange light under excitation of blue light, and phosphor emitting red light, the phosphor emitting green yellowish orange light under excitation of blue light mainly comprises M(3-a)Si5:aEu<2+> (0<a<0.1, and M is one or two of Sr and Ba) in a silicate system, or Re(3-a)Al(5-b)GabO12:aCe<3+> (0<a<0.1, 0<=B<3, and Re is one or two of Ce and Lu) in an aluminate system, and the phosphor emitting red light mainly comprises M(2-a)Si5N8:aEu<2+> (0<a<0.2, and M is one or two of Sr and Ba). According to the specific scheme, the phosphor and silica gel are evenly mixed, by changing the different proportions between the green yellowish orange phosphor, red nitride phosphor and the silica gel for packaging, a white-light LED with the color temperature ranging from 2500 K to 6500 K, the color rendering index larger than 85 and luminous efficiency larger than 801 m/W can be made after the phosphor is packaged with a Ga(In)N blue light chip, and the method has extensive application prospects in the lighting industry.
Description
Technical field
The present invention relates to White-light LED illumination field, be specifically related to the manufacture method of the white light LEDs based on fluorescent material conversion specular removal high-color rendering.
Background technology
LED (light emitting diode), little owing to having volume, light efficiency is high, and the life-span is long, and light decay is little, energy-conservation, low-carbon (LC), the advantages such as environmental protection, rises rapidly as forth generation lighting source.The method of synthesize white light LED has three kinds: red, green, blue three kinds of chip combination type white lights, fluorescent conversion type white light LEDs and single-chip Multiple-quantum well-type white light LEDs.
Fluorescent conversion type white light LEDs method, the LED chip of blue light InGaN excites YAG:Ce
3+fluorescent material obtains the method that white light LEDs is current most popular encapsulation white light LEDs, and fluorescent material transformation approach is also one of method of the potential application of most.YAG:Ce
3+the luminous efficiency of fluorescent material is relatively high, and the luminous efficiency being packaged into lamp is also higher, but YAG:Ce
3+ruddiness is lacked, so only use YAG:Ce in phosphor emission spectrum
3+fluorescent material is the requirement that can not meet the upper high color rendering index (CRI) of illumination.And in White-light LED illumination field, specular removal, high color rendering index (CRI) are the inevitable development trend of white-light illuminating.
Summary of the invention
The present invention be by change different proportion green-orange fluorescent powder M
3-asiO
5: aEu
2+, (0 < a < 0.1, M be one in Sr, Ba or two kinds), or aluminates system Re
3-aal
5-bga
bo
12: aCe
3+(0 < a < 0.1; 0≤b < 3; One or both in Re=Ce, Lu) in one or two kinds; Nitride red fluorescent material M
2-asi
5n
8: aEu
2+(0 < a < 0.2, M is one in Sr, Ba or two kinds) and the ratio of encapsulation two component silica gel, can prepare within the scope of colour temperature 2500-6500K after encapsulating with Ga (In) N blue chip, color rendering index is greater than 85, light efficiency is greater than the white light LEDs of 80lm/W, and lighting industry has wide application prospect.
Thus, the scheme that the present invention adopts is: the excitation-emission spectrogram being tested selected fluorescent material by fluorescence spectrophotometer respectively, calculate its chromaticity coordinates under blue-light excited, then by sample in different ratios and silica gel Homogeneous phase mixing, encapsulate with blue chip.By the emission spectrum of the packaged white light LEDs of photoelectric analysis system test, the parameter such as color rendering index, colour temperature, light efficiency of fluorescent material and white light LEDs is analyzed, research fluorescent material ratio, arogel ratio and encapsulation white light LEDs optical color parameter Changing Pattern, finally obtain the high-color rendering, the specular removal white light LEDs optimization encapsulation condition that transform based on fluorescent material.
The preparation process of above-mentioned White LED with high color rendering property comprises the following steps:
Test the excitation-emission spectrum of fluorescent material used, according to colorimetry principle according to certain ratio mixed fluorescent powder.The excitation-emission spectrum of test mixing powder.Weigh two parts of organic silica gels and mixed fluorescent powder in proportion again, after stirring 30min, vacuumize de-soak, encapsulate with blue chip.Put into baking oven in 70 DEG C of baking 50-80min primary solidification, then in 130 DEG C through regelate 3-6h, namely obtain required white light LEDs sample.Photoelectric analysis system is used to carry out spectrum test to the white light LEDs sample encapsulated.By testing the spectrum of sample, colour temperature, light efficiency, aobviously referring to and the parameter such as chromaticity coordinates determines the encapsulation condition that is applicable to.
Compared with prior art, the present invention has following features:
(1) in the present invention, on the basis of conventional package with YAG class fluorescent material, by adding nitride red fluorescent powder and silicate green-orange fluorescent powder, widen emission spectrum region, thus improve white light LEDs color rendering index.
(2) according to variety classes and the requirement of LED chip, in conjunction with chromaticity diagram and colorimetry principle, design the kind of different fluorescent material, proportioning, and Ratio of filler bitumen, encapsulation colour temperature 2500-6500K, color rendering index is greater than 85, and light efficiency is greater than the white light LEDs of 80lm/W, all reaches lighting demand in these two aspects.
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the electroluminescent utilizing emitted light spectrogram being packaged into white light LEDs in the embodiment of the present invention 2;
Fig. 2 is the electroluminescent utilizing emitted light spectrogram being packaged into white light LEDs in the embodiment of the present invention 4;
Fig. 3 is the electroluminescent utilizing emitted light spectrogram being packaged into white light LEDs in the embodiment of the present invention 5;
Fig. 4 is the chromaticity coordinates figure encapsulating white light LEDs in the invention process example 1-6;
Embodiment
Embodiment 1
Raw materials weighing
Silica gel A:0.5g
Silica gel B:0.5g
Aluminate class fluorescent material: 0.056g
Nitride red fluorescent powder: 0.024g
After being mixed by A, B glue, in 40 DEG C, baking oven baking 10min, then add mixed fluorescent powder mixing and stirring, mechanical pump vacuumizes, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 50min carries out one-step solidification, 130 DEG C, and 4h carries out regelate.The white light LEDs sample of photoelectric analysis system to encapsulation is used to carry out spectrum test.Select constant-current type, setting voltage 3.6V, electric current 20mA.Chromaticity coordinates is (0.4071,0.3017), and colour temperature is about 2500K, and light efficiency is about 80.6lm/W, and color rendering index is 85.
Embodiment 2
Raw materials weighing
Silica gel A:0.5g
Silica gel B:0.5g
Aluminate class fluorescent material: 0.07g
Nitride red fluorescent powder: 0.02g
Silicates fluorescent material: 0.01g
After being mixed by A, B glue, at 40 DEG C, baking oven baking 10min, then add mixed fluorescent powder mixing and stirring, in mechanical pump vacuumizing and defoaming, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 70min carries out primary solidification, 130 DEG C, and 4h carries out regelate.The white light LEDs sample of photoelectric analysis system to encapsulation is used to test.Select constant-current type, setting voltage 3.6V, electric current 20mA.Chromaticity coordinates is (0.3886,0.3170), and colour temperature is about 3160K, and light efficiency is about 86lm/W, and color rendering index is 85.4.Fig. 1 is the electroluminescent utilizing emitted light spectrogram of white light LEDs encapsulated with blue chip in the embodiment of the present invention.
Embodiment 3
Raw materials weighing
Silica gel A:0.5g
Silica gel B:0.5g
Aluminate class fluorescent material: 0.06g
Nitride red fluorescent powder: 0.02g
Silicates fluorescent material: 0.02g
After being mixed by A, B glue, at 40 DEG C, baking oven baking 10min, then add mixed fluorescent powder mixing and stirring, in mechanical pump vacuumizing and defoaming, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 60min carries out primary solidification, 130 DEG C, and 5h carries out regelate.The white light LEDs sample of photoelectric analysis system to encapsulation is used to test.Select constant-current type, setting voltage 3.6V, electric current 20mA.Chromaticity coordinates is (0.3759,0.3220), and colour temperature is about 3600K, and light efficiency is about 85.8lm/W, and color rendering index is 86.5.
Embodiment 4
Raw materials weighing
Silica gel A:0.5g
Silica gel B:0.5g
Aluminate class fluorescent material: 0.064g
Nitride red fluorescent powder: 0.016g
After being mixed by A, B glue, at 40 DEG C, baking oven baking 10min, then add mixed fluorescent powder mixing and stirring, in mechanical pump vacuumizing and defoaming, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 50min carries out primary solidification, 130 DEG C, and 6h carries out regelate.The white light LEDs sample of photoelectric analysis system to encapsulation is used to test.Select constant-current type, setting voltage 3.6V, electric current 20mA.Chromaticity coordinates is (0.3682,0.3265), and colour temperature is about 3950K, and light efficiency is about 90lm/W, and color rendering index is 86.Fig. 2 is the electroluminescent utilizing emitted light spectrogram of white light LEDs encapsulated with blue chip in the embodiment of the present invention.
Embodiment 5
Raw materials weighing
Silica gel A:0.5g
Silica gel B:0.5g
Aluminate class fluorescent material: 0.012g
Nitride red fluorescent powder: 0.108g
After being mixed by A, B glue, in 40 DEG C, baking oven baking 10min, then add mixed fluorescent powder mixing and stirring, mechanical pump vacuumizes, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 50min carries out one-step solidification, 130 DEG C, and 6h carries out regelate.Distant place PMS-50 is used to carry out spectrum test to the white light LEDs sample encapsulated.Select constant-current type, setting voltage 3.6V, electric current 20mA.Fig. 3 is the electroluminescent utilizing emitted light spectrogram of the white light LEDs sample encapsulated in the embodiment of the present invention, and chromaticity coordinates is (0.3468,0.3018), and colour temperature is about 4700K, and light efficiency is about 90lm/W, and color rendering index is 86.
Embodiment 6
Raw materials weighing
Silica gel A:0.5g
Silica gel B:0.5g
HY-Y-4L fluorescent material: 0.0765g
R6733 fluorescent material: 0.085g
After being mixed by A, B glue, in 40 DEG C, baking oven baking 10min, then add mixed fluorescent powder mixing and stirring, mechanical pump vacuumizes, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 80min carries out one-step solidification, 130 DEG C, and 3h carries out regelate.Photoelectric analysis system is used to carry out spectrum test to the white light LEDs sample encapsulated.Select constant-current type, setting voltage 3.6V, electric current 20mA.Chromaticity coordinates is (0.3246,0.2742), and colour temperature is about 6400K, and light efficiency is about 95lm/W, and color rendering index is 86.
Claims (6)
1. a White LED with high color rendering property, it is characterized in that: mixed with two component silica gel by multiple fluorescent material, can prepare within the scope of colour temperature 2500-6500K after encapsulating with Ga (In) N blue chip, color rendering index is greater than 85, and light efficiency is greater than the white light LEDs of 80lm/W.
2. fluorescent material as used in claim 1, by laying respectively at the green-fluorescent material of yellow orange coloured light at blue-light excited lower glow color and the fluorescent material of red-emitting mixes according to different proportion.Wherein, be included in mixed fluorescent powder blue-light excited under launch the fluorescent material of green-yellow orange coloured light, be mainly silicate systems M
3-asiO
5: aEu
2+, (0 < a < 0.1, M be one in Sr, Ba or two kinds), or aluminates system Re
3-aal
5-bga
bo
12: aCe
3+(0 < a < 0.1; 0≤b < 3; One or both in Re=Ce, Lu) in one or two kinds, emission spectrum peak position is positioned at 505 ~ 580nm; Wherein, in mixed fluorescent powder, the fluorescent material of red-emitting is mainly M
2-asi
5n
8: aEu
2+(0 < a < 0.2, M be one in Sr, Ba or two kinds), emission spectrum main peak is positioned at 600 ~ 660nm.
3. the height colour developing white light LEDs prepared by claim 1, by change different proportion green-ratio of orange fluorescent powder, nitride red fluorescent material and encapsulation silica gel, can prepare within the scope of colour temperature 2500-6500K after encapsulating with Ga (In) N blue chip, color rendering index is greater than 85, and light efficiency is greater than the white light LEDs of 80lm/W.
4. high colour developing phosphor for white light LED as claimed in claim 1, it is characterized in that the part by weight of silicate systems fluorescent material used is 0-20%, the part by weight of aluminates system fluorescent material is 60-90%, and the ratio of nitride rouge and powder is 10-30%.
5. the height colour developing white light LEDs prepared by claim l, it is characterized in that packaging plastic used is two component silica gel, wherein fluorescent material and silica gel weight ratio are 1: 0.08-1: 0.12 scope.
6. the height colour developing white light LEDs prepared by claim 1, it is characterized in that after two component silica gel mixing, in 40 DEG C, baking oven baking about 10min, then add fluorescent material mixing and stirring, mechanical pump vacuumizes, substantially after there is no bubble, encapsulate with blue chip, in 70 DEG C, baking oven, 50-80min carries out one-step solidification, 130 DEG C, 3-6h carries out regelate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310234723.3A CN104241504A (en) | 2013-06-07 | 2013-06-07 | High-color-rendering white-light LED manufacturing method based on phosphor conversion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310234723.3A CN104241504A (en) | 2013-06-07 | 2013-06-07 | High-color-rendering white-light LED manufacturing method based on phosphor conversion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104241504A true CN104241504A (en) | 2014-12-24 |
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ID=52229226
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310234723.3A Pending CN104241504A (en) | 2013-06-07 | 2013-06-07 | High-color-rendering white-light LED manufacturing method based on phosphor conversion |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| CN106410017A (en) * | 2016-06-29 | 2017-02-15 | 青海青峰激光集成技术与应用研究院 | Manufacturing method and manufacturing equipment for fluorescent powder coating |
| CN107799509A (en) * | 2017-12-01 | 2018-03-13 | 广东省半导体产业技术研究院 | A kind of complete micro- LED chip of spectrum white-light and its fluorescent material painting method |
| CN111795307A (en) * | 2020-07-02 | 2020-10-20 | 中国计量大学 | LED device for realizing low blue light harm and high color rendering |
-
2013
- 2013-06-07 CN CN201310234723.3A patent/CN104241504A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| CN106410017A (en) * | 2016-06-29 | 2017-02-15 | 青海青峰激光集成技术与应用研究院 | Manufacturing method and manufacturing equipment for fluorescent powder coating |
| CN107799509A (en) * | 2017-12-01 | 2018-03-13 | 广东省半导体产业技术研究院 | A kind of complete micro- LED chip of spectrum white-light and its fluorescent material painting method |
| CN111795307A (en) * | 2020-07-02 | 2020-10-20 | 中国计量大学 | LED device for realizing low blue light harm and high color rendering |
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Application publication date: 20141224 |