JP2008034188A - Lighting system - Google Patents

Lighting system Download PDF

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JP2008034188A
JP2008034188A JP2006204738A JP2006204738A JP2008034188A JP 2008034188 A JP2008034188 A JP 2008034188A JP 2006204738 A JP2006204738 A JP 2006204738A JP 2006204738 A JP2006204738 A JP 2006204738A JP 2008034188 A JP2008034188 A JP 2008034188A
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blue led
λp
emission peak
peak wavelength
led chip
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JP4989936B2 (en
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Mitsuharu Utsuki
光春 宇津木
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Asahi Rubber:Kk
株式会社朝日ラバー
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system which emits bright and stable light for a long period and has a high color rendering performance without color unevenness. <P>SOLUTION: The lighting device comprises a plurality of blue LED chips 30, 32 having an emission peak wavelength (λp) in a range of 350-500 nm, a fluorescent part 40 including a phosphor Y (yellow) which absorbs the light from the blue LED chip 30 and emits light, and a fluorescent part 42 including phosphors G (green) and R (red) which absorb the light from the blue LED chip 32 and emit light. The plurality of blue LED chips 30, 32 include a first blue LED chip 30 having a first emission peak wavelength (λp) and a second blue LED chip 32 having a second emission peak wavelength (λp). The first emission peak wavelength (λp) has a difference of 10 nm or more and 80 nm or less against the second emission wavelength (λp). The average color rendering evaluation index Ra of the illumination color is 85 or more. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an illumination device that emits light by exciting a phosphor with light from an LED.

  In recent years, LED (Light Emitting Diode) has attracted attention as a fluorescent lamp alternative technology, and research on lighting devices using LEDs has been advanced. Conventional LEDs have low color rendering properties when used as lighting devices. Therefore, a technique for improving color rendering properties by combining LEDs of three colors (RGB) of red, green, and blue has been proposed (see, for example, Patent Document 1). Hereinafter, red may be expressed as R, green as G, and blue as B.

  However, the three color (RGB) LEDs of red, green, and blue used in such an illumination device have different temporal changes in the three color LEDs. The color has changed over time.

In addition, a light emitting device having a white LED, a green LED, and a red LED and having a diffusion unit that mixes light emitted from each LED has been proposed (for example, see Patent Document 2). However, in such a light-emitting device, since three kinds of colors emitted from each LED are mixed, the obtained daylight color has uneven color.
JP 2005-203326 A JP 2002-270899 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a lighting device that emits bright and stable light for a long period of time and has no color unevenness.

Therefore, the lighting device according to the present invention is
A plurality of blue LED chips having an emission peak wavelength (λp) in the range of 350 nm to 500 nm;
A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
Have
The plurality of blue LED chips are:
A first blue LED chip having a first emission peak wavelength (λp);
A second blue LED chip having a second emission peak wavelength (λp);
Including
The first emission peak wavelength (λp) has a difference of 10 nm or more and 80 nm or less with respect to the second emission peak wavelength (λp),
The average color rendering index Ra of the illumination color is 85 or more.

  According to the illumination device of the present invention, by having a plurality of blue LED chips having a light emission peak wavelength (λp) in the range of 350 nm to 500 nm, it is possible to obtain light emission with higher output and brighter than LEDs that generate ultraviolet rays. it can. Moreover, according to the illuminating device concerning this invention, high color rendering property can be acquired by including the blue LED chip which has at least 2 or more types of different light emission peak wavelengths ((lambda) p). Furthermore, according to the illuminating device according to the present invention, there is almost no influence of color rendering due to a change with time, as compared with a conventional three-color (RGB) LED. Further, according to the illumination device of the present invention, a plurality of whites are mixed by a plurality of blue LED chips having different emission peak wavelengths (λp), and an illumination color with little color unevenness can be obtained.

In the lighting device according to the present invention,
The average color rendering index Ra of the illumination color can be 90 or more.

In the lighting device according to the present invention,
The fluorescent part may include a green phosphor and a red phosphor.

In the lighting device according to the present invention,
The fluorescent part may include a yellow phosphor, a green phosphor, and a red phosphor.

The lighting device according to the present invention is
A blue LED chip having an emission peak wavelength (λp) in the range of 350 nm to 500 nm;
A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
A plurality of white LEDs having
The plurality of white LEDs are:
A first white LED having a first blue LED chip of the first emission peak wavelength (λp);
A second white LED having a second blue LED chip of the second emission peak wavelength (λp);
Including
The first emission peak wavelength (λp) has a difference of 10 nm or more and 80 nm or less with respect to the second emission peak wavelength (λp),
The average color rendering index Ra of the illumination color is 85 or more.

  According to the illuminating device of the present invention, it is possible to obtain bright light emission with higher output than an LED that generates ultraviolet light by having a blue LED chip having an emission peak wavelength (λp) in a range of 350 nm to 500 nm. Further, according to the illumination device of the present invention, high color rendering can be obtained by at least two or more types of white LEDs using blue LED chips having different emission peak wavelengths (λp), and a plurality of different types of white LEDs. A desired color tone can be appropriately adjusted by a combination of LEDs. Furthermore, according to the illuminating device according to the present invention, there is almost no influence of color rendering due to a change with time, as compared with a conventional three-color (RGB) LED. Further, according to the illumination device of the present invention, a plurality of whites are mixed by a plurality of blue LED chips having different emission peak wavelengths (λp), and an illumination color with little color unevenness can be obtained.

In the lighting device according to the present invention,
The average color rendering index Ra of the illumination color can be 90 or more.

In the lighting device according to the present invention,
The first white LED has a first fluorescent part including a yellow phosphor,
Said 2nd white LED is an illuminating device which has a 2nd fluorescence part containing a green fluorescent substance and a red fluorescent substance.

In the lighting device according to the present invention,
The lighting device, wherein the first emission peak wavelength (λp) is longer than the second emission peak wavelength (λp).

In the lighting device according to the present invention,
The first white LED has a first fluorescent part including a green phosphor and a red phosphor,
Said 2nd white LED is an illuminating device which has a 2nd fluorescence part containing a green fluorescent substance and a red fluorescent substance.

In the lighting device according to the present invention,
The first white LED has a first fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor,
The second white LED is a lighting device having a second fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor.

In the lighting device according to the present invention,
The first blue LED chip is enclosed in a first resin molded body,
The second blue LED chip is enclosed in a second resin molded body,
The first fluorescent part and the second fluorescent part may be cap-shaped molded bodies placed on the outer sides of the first resin molded body and the second resin molded body.

In the lighting device according to the present invention,
The first fluorescent part is a sheet-like molded body that covers the first blue LED chip,
The second fluorescent part may be a sheet-like molded body that covers the second blue LED chip.

In the lighting device according to the present invention,
The first blue LED chip is enclosed in a first resin molded body including the first fluorescent part,
The second blue LED chip may be encapsulated in a second resin molded body including the second fluorescent part.

In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3274, 0.3673), (0.3282, 0.3297), (0.2998, 0.3396), It can be a daylight color tone in a quadrilateral connecting four points (0.3064, 0.3091).

In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3616, 0.3875), (0.3552, 0.3476), (0.3353, 0.3659), It can be a neutral white tone in a quadrilateral connecting four points (0.3345, 0.3314).

In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3938, 0.4097), (0.3805, 0.3642), (0.3656, 0.3905), It can be a white color tone in a quadrilateral connecting four points (0.3584, 0.3499).

In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4341, 0.4233), (0.4171, 0.3846), (0.4021, 0.4076), It can be a warm white color tone in a quadrilateral connecting four points (0.3903, 0.3719).

In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4775, 0.4283), (0.4594, 0.3971), (0.4348, 0.4185), It can be the color tone of the light bulb color in the quadrilateral connecting four points (0.4214, 0.3887).

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a partial longitudinal sectional view schematically showing a lighting device 1 according to the first embodiment. FIG. 2 is a partial longitudinal sectional view schematically showing the lighting device 2 according to the second embodiment. FIG. 3 is a partial longitudinal sectional view schematically showing the illumination device 3 according to the third embodiment. FIG. 4 is a partial longitudinal sectional view schematically showing the illumination device 4 according to the fourth embodiment. FIG. 5 is a partial vertical cross-sectional view schematically showing the illumination device 5 according to the fifth embodiment. FIG. 6 is a partial vertical cross-sectional view schematically showing the illumination device 6 according to the sixth embodiment. FIG. 7 is a partial longitudinal sectional view schematically showing a lighting device 7 according to the seventh embodiment.

  An illuminating device according to an embodiment of the present invention includes a plurality of blue LED chips having a light emission peak wavelength (λp) in a range of 350 nm to 500 nm, and a fluorescent part including a phosphor that absorbs and emits light from the blue LED chip. The plurality of blue LED chips include a first blue LED chip having a first emission peak wavelength (λp) and a second blue LED chip having a second emission peak wavelength (λp). The first emission peak wavelength (λp) has a difference of 10 nm to 80 nm with respect to the second emission peak wavelength (λp), and the average color rendering index Ra of illumination color is 85 or more It is.

  In addition, the illumination device according to the embodiment of the present invention includes a fluorescent part including a blue LED chip having a light emission peak wavelength (λp) in a range of 350 nm to 500 nm and a phosphor that absorbs and emits light from the blue LED chip. A plurality of white LEDs, wherein the plurality of white LEDs include a first white LED having a first blue LED chip having the first emission peak wavelength (λp), and the second emission peak. A second white LED having a second blue LED chip having a wavelength (λp), and the first emission peak wavelength (λp) is 10 nm to 80 nm with respect to the second emission peak wavelength (λp). The average color rendering index Ra of the illumination color is 85 or more with the following differences.

1. First Embodiment As shown in FIG. 1, a lighting device 1 according to a first embodiment has a plurality of, for example, two white LEDs 10 and 12. The first white LED 10 and the second white LED 12 are blue LED chips 30 and 32 having a light emission peak wavelength (λp) in the range of 350 nm to 500 nm, and a phosphor Y that emits light by absorbing light from the blue LED chip 30. A fluorescent portion 40 including (yellow) and a fluorescent portion 42 including phosphors G (green) and R (red) that absorb and emit light of the blue LED chip 32. The blue LED chips 30 and 32 have two or more different emission peak wavelengths (λp). The first white LED 10 and the second white LED 12 are fixedly arranged on the base 100. The first white LED 10 and the second white LED 12 have basically the same configuration, and are a first blue LED chip that emits light and is placed on a stem 22 provided substantially at the center of the base member 20. 30 and the second blue LED chip 32 are enclosed in a resin molded body 24, for example. A cap-shaped first fluorescent part 40 and a second fluorescent part 42 are covered outside the resin molded body 24 so as to cover the resin molded body 24. As a material of the resin molding 24, a silicone resin is preferable, but a translucent resin such as an acrylic resin, a polycarbonate resin, a polystyrene resin, a polyester resin, an epoxy resin, or the like can be used. In the explanatory diagrams of the respective embodiments, the resin molded body and a part of the fluorescent part are cross-sectional views, but hatching is omitted for easy understanding.

  The first white LED 10 includes a first blue LED chip 30 having a first emission peak wavelength (λp). The second white LED 12 includes a second blue LED chip 32 having a second emission peak wavelength (λp) different from the first emission peak wavelength (λp). The first emission peak wavelength (λp) and the second emission peak wavelength (λp) are different emission peak wavelengths (λp) appropriately selected from the range of 350 nm to 500 nm. In particular, the first emission peak wavelength (λp) and the second emission peak wavelength (λp) are preferably in the range of 400 nm to 500 nm, and more preferably 420 nm to 480 nm. By using such a blue LED chip, high output and bright light emission can be obtained. The first emission peak wavelength (λp) has a difference of 10 nm to 80 nm with respect to the second emission peak wavelength (λp). The first emission peak wavelength (λp) is preferably longer than the second emission peak wavelength (λp). Thus, high color rendering properties can be obtained by using two types of blue LED chips whose emission peak wavelengths (λp) are greatly shifted. Although there are two types of wavelength standards, λp, which is a peak wavelength, and λd, which is a dominant wavelength or a dominant wavelength, the emission peak wavelength in the present invention is λp. As the first and second blue LED chips 30 and 32, commercially available LEDs can be used. For example, GaN-based LEDs, SiC-based LEDs, ZnSe-based LEDs, InGaN-based LEDs, and the like can be used.

  The first white LED 10 has a first fluorescent part 40 including a yellow phosphor Y dispersed throughout, and the second white LED 12 includes a green phosphor G and a red phosphor R dispersed throughout. The second fluorescent part 42 is included. The first and second fluorescent portions 40 and 42 are cap-shaped molded bodies each made of a polymer material that is placed on the outside of the resin molded body 24. As the material of the first and second fluorescent portions 40 and 42, it is preferable to use a silicone resin. For example, an acrylic resin, a polycarbonate resin, a polystyrene resin, a polyester resin, and an epoxy resin, which are translucent polymer substances, are used. Polypropylene resin, polyethylene resin, silicone resin, cyclic olefin resin, silicone-based elastomer, polystyrene-based thermoplastic elastomer, polyolefin-based thermoplastic elastomer, polyurethane-based thermoplastic elastomer, and the like can also be used.

  As a combination with the phosphor, the first emission peak wavelength (λp) of the first blue LED chip 30 is longer than the second emission peak wavelength (λp) of the second blue LED chip 32. preferable. For example, the first emission peak wavelength (λp) of the first blue LED chip 30 can be set to 470 nm, and the second emission peak wavelength (λp) of the second blue LED chip 32 can be set to 430 nm. By setting the emission peak wavelength (λp) of the second blue LED chip 32 to the short wavelength side, for example, 430 nm, the emission characteristics of the green phosphor G and the red phosphor R are improved, and a brighter illumination device can be obtained. . In addition, by setting the emission peak wavelength (λp) of the second blue LED chip 30 to the long wavelength side, for example, 470 nm, the color rendering property can be dramatically improved without impairing the emission characteristics of the yellow phosphor Y. .

The light emitted from the first blue LED chip 30 is partially absorbed by the yellow phosphor Y in the cap-shaped first phosphor section 40, and the yellow phosphor Y is excited. When the yellow phosphor Y is excited, it emits fluorescence having a predetermined spectral distribution according to its property, and first white light is output. Further, the light emitted from the second blue LED chip 32 is partially absorbed by the green phosphor G and the red phosphor R in the cap-shaped second phosphor part 42, and each phosphor is excited. When the green phosphor G and the red phosphor R are excited, fluorescence having a predetermined spectral spectrum distribution is emitted according to the properties, and second white light is output. As described above, the blue light having the emission peak wavelength (λp) of 350 nm to 500 nm and the first white light using the yellow phosphor Y, the blue light emission having the emission peak wavelength (λp) of 350 nm to 500 nm, and the green phosphor G are used. In addition, by combining with the second white light using the red phosphor R, it is possible to obtain white light with high color rendering that cannot be obtained by the conventional LED. In addition, by combining two or more types of white light in this way, white light with no color unevenness can be obtained. Examples of the fluorescent material include inorganic fluorescent materials that emit fluorescence, pigments, organic fluorescent dyes, pseudo pigments, and the like. For example, (Ca, Sr, Ba) 2 SiO 4 : Eu, YAG, Sr (Ba) having a yellow emission color. ) Yellow phosphor Y such as SiO 4 , SrAl 2 O 4 : Eu 2+ , green emission color BaMg 2 Al 16 O 27 : Eu 2+ , Mn 2+ , ZnS: Cu, Al, Au, SrAl 2 O 4 : Eu 2+ , green phosphor G such as Zn 2 Si (Ge) O 4 : Eu 2+ , Y 2 O 2 S: Eu 3+ whose emission color is red, 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, LiEuW 2 A red phosphor R such as O 8 , BaO · Gd 2 O 3 · Ta 2 O 5 : Mn, K 5 Eu 2.5 (WO 4 ) 6.25 can be suitably used. The type and amount of these phosphors can be adjusted such that the color rendering property is higher and a desired color near white is obtained.

  The color of the illumination color of the illuminating device 1 thus obtained is a daylight color, a neutral white color, a white color, a warm white color or a light bulb color as defined in JIS Z 9112 “Classification by light source color and color rendering of fluorescent lamp”. The degree range. As for the color tone of the illumination color of the illumination device 1, (x, y) on the xy chromaticity diagram is (0.3274, 0.3673), (0.3282, 0.3297), (0.2998, 0.3396). ) And (0.3064, 0.3091) are preferably daylight colors in a quadrilateral connecting four points. The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.3616, 0.3875), (0.3552, 0.3476), (0.3353, 0.3659), It is preferable to have a neutral white tone in a quadrilateral connecting four points (0.3345, 0.3314). The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.3938, 0.4097), (0.3805, 0.3642), (0.3656, 0.3905), A white color tone in a quadrilateral connecting four points (0.3584, 0.3499) is preferable. The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.4341, 0.4233), (0.4171, 0.3846), (0.4021, 0.4076), It is preferably a warm white color tone in a quadrilateral connecting four points (0.3903, 0.3719). The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.4775, 0.4283), (0.4594, 0.3971), (0.4348, 0.4185), It is preferable that the color tone of the light bulb color in a quadrilateral connecting four points (0.4214, 0.3887). Moreover, the illumination color of the lighting device 1 has an average color rendering index Ra that is particularly important in general lighting among the color rendering properties, and the average color rendering index Ra is 85 or more. Moreover, the illumination color of the illuminating device 1 has little color unevenness by mixing a plurality of whites with a plurality of blue LED chips having different emission peak wavelengths (λp). Furthermore, when the illumination color of the illumination device 1 is daylight color, neutral white color, white color or warm white color defined in JIS Z 9112, the average color rendering index Ra is preferably 90 or more.

  In the first embodiment, the first white LED 10 having the first blue LED chip 30 having the first emission peak wavelength (λp) and the second blue color having the second emission peak wavelength (λp) are used. A second white LED 12 having an LED chip 32, and the first emission peak wavelength (λp) has a difference of 10 nm or more and 80 nm or less with respect to the second emission peak wavelength (λp), By appropriately setting the number and combination of LED chips to be used according to the requirements of the lighting device or the like, it is possible to obtain white light having an average color rendering index Ra of 85 or more suitable for applications requiring color rendering properties. For example, a plurality of blue LED chips may be included in the resin molded body, or three first white LEDs 10 and seven second white LEDs 12 may be arranged on the substrate 100. Moreover, when using 3 or more blue LED chips, you may use the blue LED chip which has 3 or more types of light emission peak wavelengths ((lambda) p). In that case, for example, the first blue LED chip 30 with an emission peak wavelength (λp) of 470 nm, the second blue LED chip 32 with an emission peak wavelength (λp) of 430 nm, and an emission peak wavelength (λp) of 450 nm A third blue LED chip can be used.

2. 2nd Embodiment As shown in FIG. 2, the illuminating device 2 concerning 2nd Embodiment has 1st white LED10a fixedly arrange | positioned on the base 100, and 2nd white LED12a. The white LED of the first embodiment is a so-called bullet-type LED, whereas the white LED of the second embodiment is an SMD type (Surface Mount) in which the package for mounting the LED chip is reduced in size and thickness. (Device: surface mount type) Although it is different in that an LED is used, the configuration is basically the same as that of the first embodiment, and the same components are denoted by the same reference numerals. The first white LED 10a and the second white LED 12a of the SMD type are composed of a wiring conductor (anode lead) 108 and a wiring conductor (cathode lead) 109 patterned on a ceramic base 100 with tungsten (W) or the like. And a main body 104 formed of a sintered body of, for example, an inorganic material, which is integrally formed with the base 100. The main body 104 has a substantially cylindrical shape, and an inner wall having a circular cross section is formed on a side wall portion 106 having a shape expanded in the direction in which light from the first blue LED chip 30 and the second blue LED chip 32 is emitted. Has been. The first blue LED chip 30 and the second blue LED chip 32 are electrically connected to the wiring conductors 108 and 109 exposed at the bottom of the main body 104 by bonding wires, and filled in the side wall portion 106 of the main body 104. It is sealed with a resin molded body 24 of translucent resin. Sheet-like, for example, thin, disk-shaped first fluorescent portions 40 s and second fluorescent portions 42 s that cover the first blue LED chip 30 and the second blue LED chip 32 are in close contact with the upper surface of each resin molded body 24. Has been placed.

  The first fluorescent part 40 s includes yellow phosphors Y that are excited by the light of the first blue LED chip 30 to emit light, and the second fluorescent part 42 s includes the second blue LED chip 32. The green phosphor G and the red phosphor R which are excited by the light and emit light are dispersed throughout. The material of the matrix material of the resin molded body 24, the phosphors Y, G, and R, the blue LED chips 30 and 32, the first fluorescent part 40s, and the second fluorescent part 42s is the same as that exemplified in the first embodiment. It can be used as appropriate. Therefore, in this case, two types of white light can be combined by using the first and second blue LED chips 30 and 32 having different emission peak wavelengths (λp) from the first white LED 10a and the second white LED 12a. The illuminating device 2 with high color rendering properties can be obtained. Also, in the second embodiment, two blue LED chips are used, but the number and combination of blue LED chips to be used can be appropriately set according to the demand of the lighting device or the like. Further, when three or more blue LED chips are used, the blue LED chips having not only two types but also three or more types of emission peak wavelengths (λp) may be combined.

3. 3rd Embodiment As shown in FIG. 3, the illuminating device 3 concerning 3rd Embodiment has 1st white LED10b fixedly arrange | positioned on the base 100, and 2nd white LED12. The first white LED 10b has a first fluorescent part 42 including a green phosphor G and a red phosphor R, and the second white LED 12 is a second fluorescence including a green phosphor G and a red phosphor R. It has a portion 42a. Except for the fact that the phosphors of the first fluorescent part are the green phosphor G and the red phosphor R, the configuration is basically the same as that of the first embodiment, and the same parts are denoted by the same reference numerals. . As the green phosphor G and the red phosphor R of the first phosphor 42 and the second phosphor 42a, the same phosphor may be used, or phosphors having different compositions may be used. Therefore, in this case, two types of white light can be combined using the blue LED chips 30 and 32 having different emission peak wavelengths (λp) from the first white LED 10b and the second white LED 12, and the color rendering property is high. The lighting device 3 is obtained. Also, in the third embodiment, two blue LED chips are used, but the number and combination of blue LED chips to be used can be set as appropriate according to the requirements of the lighting device or the like. Further, when three or more blue LED chips are used, not only two types but also three or more types of blue LEDs having emission peak wavelengths (λp) may be combined.

4). 4th Embodiment As shown in FIG. 4, the illuminating device 4 concerning 4th Embodiment has 1st white LED10c fixedly arrange | positioned on the base 100, and 2nd white LED12c. The first white LED 10c has a first fluorescent part 43a including a yellow phosphor Y, a green phosphor G, and a red phosphor R, and the second LED 12c includes a yellow phosphor Y and a green phosphor. The second fluorescent part 43 including the fluorescent substance G and the red fluorescent substance R is included. Except that the phosphors of the first and second fluorescent parts include all of the yellow phosphor Y, the green phosphor G, and the red phosphor R, the configuration is basically the same as that of the first embodiment. The same parts are denoted by the same reference numerals. As the yellow phosphor Y, the green phosphor G, and the red phosphor R of the first phosphor 43a and the second phosphor 43, the same phosphor may be used, or phosphors having different compositions may be used. . Therefore, in this case, two types of white light can be combined by using the first and second blue LEDs 30 and 32 having different emission peak wavelengths (λp) from the first white LED 10c and the second white LED 12c. The lighting device 4 has high color rendering properties. Also, in the fourth embodiment, two blue LED chips are used, but the number and combination of blue LED chips to be used can be set as appropriate according to the demand of the lighting device or the like. Further, when three or more blue LED chips are used, not only two types but also three or more types of blue LEDs having emission peak wavelengths (λp) may be combined.

  Moreover, not only the fluorescent part is a cap-shaped molded body as in the first to fourth embodiments, but the fluorescent part may be included in the resin molded body 24, for example. In that case, for example, the phosphor Y or the like may be dispersed throughout the resin molded body 24, or only a part of the resin molded body 24 may be used as the fluorescent portion. Specifically, the fluorescent part of the illumination device 7 shown in FIG.

5. Fifth Embodiment As shown in FIG. 5, the lighting device 5 according to the fifth embodiment includes a plurality of first and second monolithically connected in series on a substrate 102 disposed at the bottom of a housing 110. Blue LED chips 30 and 32, and a fluorescent portion 44 made of a sheet-like molded body covering the plurality of first and second blue LED chips 30 and 32. The fluorescent part 44 can use the same transparent polymer material as that of the fluorescent part of the first embodiment. For example, the fluorescent part 44 includes a green fluorescent substance G and a red fluorescent substance R in a silicone resin, and includes a plurality of first, The second blue LEDs 30 and 32 emit white light. The first and second blue LED chips 30 and 32 have an emission peak wavelength (λp) in the range of 350 nm to 500 nm, and the emission peak wavelength (λp) of the first blue LED chip 30 is the second blue color. The LED chip 32 has a difference of 10 nm or more and 80 nm or less with respect to the emission peak wavelength (λp). The first blue LED 30 and the second blue LED 32 are basically GaN-based LED chips having the same structure. For example, an n-type GaN layer 301, a p-type GaN layer 302, a p-electrode 303, and an n-electrode 304 are formed on the substrate 102. have. Adjacent first and second blue LED chips 30 and 32 have a p-electrode 303 and an n-electrode 304 connected by an air bridge wiring L. Thus, by forming a plurality of blue LED chips monolithically and connecting them in series, the currents flowing through the blue LED chips are the same, and a flat emission spectrum can be obtained even if the band gap energy is high or low. The inside of the housing 110 is sealed by the resin molded body 24, and the first blue LED 30 and the second blue LED 32 are in the resin molded body 24. Therefore, in the lighting device 5, after the substrate 102 and the plurality of first and second blue LED chips 30 and 32 are disposed at the bottom of the housing 110, the resin is opened in the housing 110 and the opening 112 of the housing 110. To form a resin molded body 24, and further, a sheet-like fluorescent part 44 is installed in the opening 112.

  In the fifth embodiment, blue LED chips having two types of emission peak wavelengths (λp) are used. However, the number of blue LED chips, the emission peak wavelengths (λp), and combinations thereof used depending on the requirements of the lighting device or the like. Can be set as appropriate. For example, a plurality of three types of blue LED chips having emission peak wavelengths (λp) of 430 nm, 450 nm, and 470 nm may be arranged. Moreover, although the fluorescent part 44 was made into the sheet-like molded object, what is necessary is just the form which covers the light emission of a blue LED chip | tip without omission, for example, may be a lid-shaped molded object which covers the opening part 112, or resin molding The phosphor 24 may be dispersed in the body 24 and the resin molded body 24 itself may be used as the fluorescent portion 44. The fluorescent portion 44 includes the green phosphor G and the red phosphor R, but may include a yellow phosphor Y in addition to the green phosphor G and the red phosphor R. In any case, by using a plurality of blue LED chips having different emission peak wavelengths (λp), it is possible to obtain a white light with good color rendering and no color unevenness by combining a plurality of white lights.

6). 6th Embodiment As shown in FIG. 6, the illuminating device 6 concerning 6th Embodiment is three 1st-3rd blue LED18a- fixedly arrange | positioned on the base 100 in the housing | casing 110-. 18c. The three first to third blue LEDs 18a to 18c have first to third blue LED chips 30, 32, and 34 having different emission peak wavelengths (λp), respectively, and the respective emission peak wavelengths (λp). Are different peak wavelengths appropriately selected from the range of 350 nm to 500 nm. The emission peak wavelengths (λp) of the first to third blue LED chips 30, 32, and 34 are more preferably 400 nm to 500 nm, and particularly preferably 420 nm to 480 nm. Moreover, the emission peak wavelength (λp) of any one blue LED chip has a difference of 10 nm or more and 80 nm or less with respect to the emission peak wavelength (λp) of the other one blue LED chip. Each blue LED chip 30, 32, 34 may have a different emission peak wavelength (λp), and the first blue LED chip 30 is connected to the other second and third blue LED chips 32, 43. On the other hand, it may have an emission peak wavelength (λp) having a difference of 10 nm to 80 nm. A fluorescent portion 48 formed in a thin sheet shape is fixed to the opening 112 of the housing 110 facing the base 100 so as to cover the opening 112. The fluorescent part 48 includes a yellow phosphor Y, a green phosphor G, and a red phosphor R. The fluorescent part 48 can employ the same material as the cap-shaped fluorescent part described in the first embodiment. Further, in the sixth embodiment, three LEDs are used. However, the number and combination of LEDs to be used can be set as appropriate according to a request from a lighting device or the like.

7). Seventh Embodiment As shown in FIG. 7, the illumination device 7 according to the seventh embodiment has a plurality of, for example, two first and second white LEDs 10d, 12d fixedly arranged on a base 100. . In the first white LED 10d of the illumination device 7, the first blue LED chip 30 is enclosed in the first resin molded body 24a including the first fluorescent part 40i. Further, the second white LED 12d of the lighting device 7 has the second blue LED chip 32 enclosed in the second resin molded body 24b including the second fluorescent part 42i. More specifically, the first and second fluorescent portions 40i and 42i are formed so as to cover only the concave portion 220 in which the first and second blue LED chips 30 and 32 are formed on the stem 22. Therefore, the seventh embodiment is the first implementation except for the first fluorescent part 40i including the phosphor Y (yellow) and the second fluorescent part 42i including the phosphors G (green) and R (red). It is the same as the illumination device 1 of the form.

  The first and second fluorescent portions 40i and 42i only need to be formed in regions that receive the radiation of light from the first and second blue LED chips 30 and 32, and the caps as in the first embodiment. It may be a sheet-like molded body, a sheet-like molded body as in the second embodiment, or the like, and may be disposed in a resin molded body as in this embodiment.

  The illumination colors of the illumination devices according to the first to seventh embodiments have an average color rendering index Ra of 85 or more, but the number of LED chips and the emission peak wavelength (λp) used depending on the use of the illumination device, etc. By appropriately setting the type and blending amount of the phosphor, the number of white LEDs, and combinations thereof, white light suitable for applications requiring color rendering can be obtained. For example, white light having an average color rendering index Ra of 90 or more can be obtained, and the illumination color can be a daylight color, a daylight white color, a white color, a warm white color or a light bulb color as defined in JIS Z 9112. Further, not only the average color rendering index Ra, but also the illumination color can be adjusted so that, for example, R9 is 85 or more in the special color rendering index.

An illuminating device 1a as shown in FIG. 8 was prototyped as Example 1, and the average color rendering index Ra, chromaticity coordinates, and luminance spectral spectrum distribution were measured with a spectral radiance meter 60. The configuration of the lighting device 1a prototyped in Example 1 was as follows.
First white LED 10: The first blue LED chip 30 is an InGaN-based blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation having an emission peak wavelength (λp) of about 470 nm. . The first fluorescent part 40 is obtained by dispersing 25 parts by mass of inorganic phosphor (Ca, Sr, Ba) 2 SiO 4 : Eu as a yellow fluorescent substance Y in 100 parts by mass of silicone rubber, and heating and pressing. A first cap-shaped molded body having a thickness of 0.5 mm was used.
Second white LED 12: The second blue LED chip 32 is an AlInGaN-based blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by JREP Corporation having an emission peak wavelength (λp) of about 430 nm. Was used. The second fluorescent part 42 is replaced with 100 parts by mass of silicone rubber instead of a cap-shaped molded body, and BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.) which is an inorganic fluorescent substance as a green fluorescent substance G. ) And 35 parts by mass of 3.5MgO.0.5MgF 2 .GeO 2 : Mn (manufactured by Nemoto Special Chemical Co., Ltd.), which is an inorganic phosphor as red phosphor R, are heated and pressed. A second cap-shaped molded body having a thickness of 0.5 mm was used.
Table 1 shows the measurement results of the spectral radiance meter 60 of the illumination device 1a of Example 1.

As a result of measurement of the first white LED 10 alone, the average color rendering index Ra was 73.2, and the chromaticity coordinates were x = 0.332 and y = 0.320. The spectral spectrum distribution of the light emission at this time is shown as a waveform A in FIG. The measurement results of the second white LED 12 alone were an average color rendering index Ra of 13.3, chromaticity coordinates of x = 0.330, and y = 0.336. The spectral spectrum distribution of light emission at this time is shown as a waveform B in FIG. The spectral spectrum distribution of the illuminating device 1a in which three first white LEDs 10 and seven second white LEDs 12 are combined is shown in FIG. The average color rendering index Ra of this lighting device was 93.3, and the chromaticity coordinates were x = 0.331 and y = 0.323. Neither the first white LED 10 nor the second white LED 12 has a high average color rendering index Ra, but by combining them optimally, the average color rendering index Ra is 93.3, which has a very high color rendering property of 93.3. The lighting device 1a could be obtained.

  Next, an illuminating device 6a as shown in FIG. 9 was prototyped as Examples 2 to 6, and the average color rendering index Ra, chromaticity coordinates, and luminance spectral spectrum distribution were measured with a spectral radiance meter 60.

The configuration of the illuminating device 6a prototyped in Example 2 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. Fluorescent portion 48, a silicone rubber 100 parts by weight of the green phosphor G as the inorganic phosphor at a BaMg 2 Al 16 O 27: Eu , Mn and (Nemoto Co., Ltd.) 9 parts by weight, the inorganic as a yellow phosphor Y 11 parts by mass of phosphor (Ca, Sr, Ba) 2 SiO 4 : Eu, and 3.5MgO · 0.5MgF 2 · GeO 2 : Mn (Nemoto Special Chemical Co., Ltd.) as an inorganic phosphor as red phosphor R 30 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 2.

The illuminating device 6a of Example 2 was a daylight color defined in JIS Z 9112 having an average color rendering index Ra of 94.3 and chromaticity coordinates of x = 0.324 and y = 0.331.

The configuration of the illuminating device 6a prototyped in Example 3 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is composed of 100 parts by mass of silicone rubber, 9 parts by mass of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.) which is an inorganic fluorescent substance as a green fluorescent substance G, and a yellow fluorescent substance Y. 12 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as a red phosphor R (root special chemistry) 35 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 3.
The illuminating device 6a of Example 3 was day white as defined in JIS Z 9112 having an average color rendering index Ra of 95.8 and chromaticity coordinates of x = 0.354 and y = 0.358. In addition, in the lighting device 6a of Example 3, the special color rendering index R9 was 87.5.

The configuration of the illuminating device 6a prototyped in Example 4 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is 10 parts by weight of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.), which is an inorganic fluorescent substance, as a green fluorescent substance G, and 100 parts by weight of silicone rubber. 12 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as a red phosphor R (root special chemistry) 40 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 4.
The illumination device 6a of Example 4 was white as defined in JIS Z 9112 having an average color rendering index Ra of 95.0 and chromaticity coordinates of x = 0.372 and y = 0.378. In addition, the lighting device 6a of Example 4 had a special color rendering index R9 of 85.1.

The configuration of the illuminating device 6a prototyped in Example 5 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is 10 parts by weight of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.), which is an inorganic fluorescent substance, as a green fluorescent substance G, and 100 parts by weight of silicone rubber. 15 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5 MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as red phosphor R 50 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 5.
The lighting device 6a of Example 5 was warm white as defined in JIS Z 9112 having an average color rendering index Ra of 92.0 and chromaticity coordinates of x = 0.404 and y = 0.404. In addition, the lighting device 6a of Example 5 had a special color rendering index R9 of 85.5.

The configuration of the illuminating device 6a prototyped in Example 6 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is composed of 100 parts by weight of silicone rubber, 12 parts by weight of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.) that is an inorganic fluorescent substance as a green fluorescent substance G, and a yellow fluorescent substance Y. 17 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5 MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as red phosphor R 70 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 6.
The lighting device 6a of Example 6 had a light bulb color defined in JIS Z 9112 having an average color rendering index Ra of 90.0, and chromaticity coordinates of x = 0.415 and y = 0.408.

  According to the illuminating devices 6a of Examples 2 to 6, the color tone is adjusted to the light source color of the fluorescent lamp for general illumination specified in JIS Z 9112, and the average color rendering index Ra is 90 or higher for each color tone. Realized color rendering. In Example 1, a plurality of white LEDs were combined so that the average color rendering index Ra was maximized, but the special color rendering index was adjusted by adjusting the blending amount of each phosphor as in Examples 3-5. R9 could be 85 or more.

It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 1st Embodiment. It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 2nd Embodiment. It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 3rd Embodiment. It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 4th Embodiment. It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 5th Embodiment. It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 6th Embodiment. It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 6th Embodiment. It is a figure which shows the measuring method of the illuminating device made as an experiment in Example 1. FIG. It is a figure which shows the measuring method of the illuminating device made as an experiment in Examples 2-6. FIG. 3 is a diagram showing a spectral spectrum distribution of light emission by the first white LED of Example 1. FIG. 3 is a diagram showing a spectral spectrum distribution of light emission by the second white LED of Example 1. It is a figure which shows the spectral spectrum distribution of light emission by the illuminating device of Example 1. FIG.

Explanation of symbols

1, 1a, 2, 3, 4, 5, 6, 6a, 7 Lighting device 10, 10a to 10d First white LED
12, 12a to 12d Second white LED
18a, 18b, 18c Blue LED
20 Base member 22 Stem 24 Resin molded body 30, 32, 34 Blue LED chips 40, 42, 43, 44, 46, 48 Fluorescent part 40a, 42a, 43a Fluorescent part 40b Fluorescent part 40s, 42s, 40i, 42i Fluorescent part 100 Base 102 Substrate 110 Housing 112 Opening 220 Recess 301 N-type GaN layer 302 p-type GaN layer 303 p-electrode 304 n-electrode Y Yellow phosphor G Green phosphor R Red phosphor L Air bridge wiring

Claims (18)

  1. A plurality of blue LED chips having an emission peak wavelength (λp) in the range of 350 nm to 500 nm;
    A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
    Have
    The plurality of blue LED chips are:
    A first blue LED chip having a first emission peak wavelength (λp);
    A second blue LED chip having a second emission peak wavelength (λp);
    Including
    The first emission peak wavelength (λp) has a difference of 10 nm or more and 80 nm or less with respect to the second emission peak wavelength (λp),
    An illumination device having an average color rendering index Ra of 85 or more for illumination colors.
  2. In claim 1,
    An illumination device having an average color rendering index Ra of 90 or more for the illumination color.
  3. In claim 1 or 2,
    The fluorescent unit is an illumination device including a green phosphor and a red phosphor.
  4. In claim 1 or 2,
    The fluorescent unit is an illumination device including a yellow phosphor, a green phosphor, and a red phosphor.
  5. A blue LED chip having an emission peak wavelength (λp) in the range of 350 nm to 500 nm;
    A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
    A plurality of white LEDs having
    The plurality of white LEDs are:
    A first white LED having a first blue LED chip of the first emission peak wavelength (λp);
    A second white LED having a second blue LED chip of the second emission peak wavelength (λp);
    Including
    The first emission peak wavelength (λp) has a difference of 10 nm or more and 80 nm or less with respect to the second emission peak wavelength (λp),
    An illumination device having an average color rendering index Ra of 85 or more for illumination colors.
  6. In claim 5,
    An illumination device having an average color rendering index Ra of 90 or more for the illumination color.
  7. In claim 5 or 6,
    The first white LED has a first fluorescent part including a yellow phosphor,
    The second white LED is a lighting device having a second fluorescent part including a green phosphor and a red phosphor.
  8. In claim 5 or 6,
    The lighting device in which the first emission peak wavelength (λp) is longer than the second emission peak wavelength (λp).
  9. In claim 5 or 6,
    The first white LED has a first fluorescent part including a green phosphor and a red phosphor,
    The second white LED is a lighting device having a second fluorescent part including a green phosphor and a red phosphor.
  10. In claim 5 or 6,
    The first white LED has a first fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor,
    The second white LED is an illumination device having a second fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor.
  11. In any one of Claims 6-10,
    The first blue LED chip is enclosed in a first resin molded body,
    The second blue LED chip is enclosed in a second resin molded body,
    The first fluorescent part and the second fluorescent part are lighting devices that are cap-shaped molded bodies placed on the outer sides of the first resin molded body and the second resin molded body.
  12. In any one of Claims 6-10,
    The first fluorescent part is a sheet-like molded body that covers the first blue LED chip,
    The second fluorescent section is a lighting device that is a sheet-like molded body that covers the second blue LED chip.
  13. In any one of Claims 6-10,
    The first blue LED chip is enclosed in a first resin molded body including the first fluorescent part,
    The lighting device in which the second blue LED chip is enclosed in a second resin molded body including the second fluorescent part.
  14. In any one of Claims 1-13,
    The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3274, 0.3673), (0.3282, 0.3297), (0.2998, 0.3396), An illumination device having a daylight color tone in a quadrilateral connecting four points (0.3064, 0.3091).
  15. In any one of Claims 1-13,
    The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3616, 0.3875), (0.3552, 0.3476), (0.3353, 0.3659), An illuminating device having a neutral white tone in a quadrilateral connecting four points (0.3345, 0.3314).
  16. In any one of Claims 1-13,
    The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3938, 0.4097), (0.3805, 0.3642), (0.3656, 0.3905), An illumination device having a white color tone in a quadrilateral connecting four points (0.3584, 0.3499).
  17. In any one of Claims 1-13,
    The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4341, 0.4233), (0.4171, 0.3846), (0.4021, 0.4076), An illumination device having a warm white color tone in a quadrilateral connecting four points (0.3903, 0.3719).
  18. In any one of Claims 1-13,
    The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4775, 0.4283), (0.4594, 0.3971), (0.4348, 0.4185), An illuminating device having a light bulb color tone in a quadrilateral connecting four points (0.4214, 0.3887).
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