JP6354607B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP6354607B2
JP6354607B2 JP2015011414A JP2015011414A JP6354607B2 JP 6354607 B2 JP6354607 B2 JP 6354607B2 JP 2015011414 A JP2015011414 A JP 2015011414A JP 2015011414 A JP2015011414 A JP 2015011414A JP 6354607 B2 JP6354607 B2 JP 6354607B2
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peak
light
light emitting
phosphor
emitting device
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JP2016136587A (en
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公博 宮本
公博 宮本
隆司 谷
隆司 谷
昌治 細川
昌治 細川
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Nichia Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

近年、白熱電球に変えて、省エネルギーに優れた発光ダイオード(Light Emitting Diode:以下「LED」ともいう。)が発光素子として広く利用されている。例えば、窒化ガリウムを用いた青色発光の発光素子と黄色発光の蛍光体を組み合わせた白色発光の発光装置が知られている。この白色発光の発光装置は、一般照明として主に使用されている。一般照明の分野での白色発光の発光装置は演色性が高いことが望まれている。そのため、白色発光の発光装置に、緑色蛍光体や赤色蛍光体を組み合わせている。   In recent years, instead of incandescent bulbs, light-emitting diodes (Light Emitting Diodes: hereinafter also referred to as “LEDs”) excellent in energy saving have been widely used as light-emitting elements. For example, a white light emitting device combining a blue light emitting element using gallium nitride and a yellow light emitting phosphor is known. This white light emitting device is mainly used as general illumination. A white light emitting device in the field of general lighting is desired to have high color rendering properties. Therefore, a green phosphor and a red phosphor are combined with a white light emitting device.

しかし、スーパーマーケット等での食肉の陳列棚の照明は、演色性以上に、実際の食肉商品の見た目がより鮮やかな赤味で見えることが望まれている。そのため、白色発光の発光装置に所定の波長の光の透過を減少させる光学フィルタを用いて、商品を鮮明に見せるために適した光を照射できるようにした照明器具が知られている(例えば、特許文献1、2参照)。また、照明光に含まれる黄色光成分を低減し、赤色の見え方を強調するように、青色光により励起されて、630nm〜680nmにピーク波長を有する光に変換する第1の蛍光体を有する第1の発光素子と、青色光により励起されて、500nm〜550nmにピーク波長を有する光に変換する第2の蛍光体を有する第2の発光素子と、を備える発光装置が知られている(例えば、特許文献3参照)。これらの発光装置は、食肉の赤味をより増して見せることができる。   However, it is desired that the lighting of meat display shelves in supermarkets and the like be more vivid reddish than the actual color rendering. Therefore, there is known a lighting fixture that can irradiate light suitable for making a product appear clear by using an optical filter that reduces transmission of light of a predetermined wavelength in a light emitting device that emits white light (for example, (See Patent Documents 1 and 2). Moreover, it has the 1st fluorescent substance which is excited by blue light and converts into the light which has a peak wavelength in 630nm-680nm so that the yellow light component contained in illumination light may be reduced and the appearance of red may be emphasized A light-emitting device including a first light-emitting element and a second light-emitting element having a second phosphor that is excited by blue light and converted into light having a peak wavelength of 500 nm to 550 nm is known ( For example, see Patent Document 3). These light emitting devices can make the meat appear more reddish.

特開2008−311532号公報JP 2008-311532 A 特開2012−109397号公報JP 2012-109397 A 特許2012−204413号公報Japanese Patent No. 2012-204413

しかしながら、従来の発光装置では、まだ各波長の成分比率の調整が不十分であり、更なる見た目の改善が望まれていた。   However, in the conventional light emitting device, the adjustment of the component ratio of each wavelength is still insufficient, and further improvement in appearance has been desired.

そこで、本発明は、より赤味を鮮やかに見せる発光装置を提供することである。   Therefore, the present invention is to provide a light-emitting device that makes the redness more vivid.

本発明に係る実施形態の発光装置は、発光素子と、前記発光素子からの光により励起されて蛍光を発する2種類以上の蛍光体と、を有し、前記発光素子と前記蛍光体との混色光の発光スペクトルにおいて、前記発光素子の発光を第1のピークとし、500nm〜600nmを第2のピークとし、600nm〜780nmを第3のピークとし、前記第1のピークの発光強度を1としたとき、前記第2のピークの発光強度が0.5〜0.6であり、前記第3のピークの発光強度が0.6〜1.0であり、前記第1のピークと前記第2のピーク間の最低強度が0.1〜0.3であり、前記第2のピークと前記第3のピーク間の最低強度が0.1〜0.3である。   A light-emitting device according to an embodiment of the present invention includes a light-emitting element and two or more kinds of phosphors that emit fluorescence when excited by light from the light-emitting element, and color mixture of the light-emitting element and the phosphor In the emission spectrum of light, the light emission of the light emitting element is a first peak, 500 nm to 600 nm is a second peak, 600 nm to 780 nm is a third peak, and the emission intensity of the first peak is 1. The emission intensity of the second peak is 0.5 to 0.6, the emission intensity of the third peak is 0.6 to 1.0, and the first peak and the second peak The minimum intensity between the peaks is 0.1 to 0.3, and the minimum intensity between the second peak and the third peak is 0.1 to 0.3.

本発明に係る実施形態の発光装置は、より赤味を鮮やかに見せる発光装置を提供することができる。   The light-emitting device of the embodiment according to the present invention can provide a light-emitting device that makes the redness appear more vividly.

実施の形態に係る発光装置を示す模式平面図である。It is a schematic plan view which shows the light-emitting device which concerns on embodiment. 実施の形態に係る発光装置のII−II線における模式断面図である。It is a schematic cross section in the II-II line of the light-emitting device which concerns on embodiment. 4種類の蛍光体の発光スペクトルを示す図である。It is a figure which shows the emission spectrum of four types of fluorescent substance. 実施例1〜4、比較例1に係る発光装置の発光スペクトルを示す図である。6 is a diagram showing emission spectra of light emitting devices according to Examples 1 to 4 and Comparative Example 1. FIG.

以下、実施の形態を図面に基づいて説明する。ただし、以下に示す実施の形態は、本発明の技術思想を具体化するための例示であって、本発明は以下のものに特定されない。また、本明細書は特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。特に実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は特に特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。さらに、本発明を構成する各要素は、複数の要素を同一の部材で構成して一の部材で複数の要素を兼用する態様としてもよいし、逆に一の部材の機能を複数の部材で分担して実現することもできる。   Hereinafter, embodiments will be described with reference to the drawings. However, the embodiment described below is an example for embodying the technical idea of the present invention, and the present invention is not limited to the following. Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, and are merely explanations. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

色名と色度座標との関係、光の波長範囲と単色光の色名との関係等は、JIS Z8110に従う。具体的には、380nm〜455nmが青紫色、455nm〜485nmが青色、485nm〜495nmが青緑色、495nm〜548nmが緑色、548nm〜573nmが黄緑色、573nm〜584nmが黄色、584nm〜610nmが黄赤色、610nm〜780nmが赤色である。   The relationship between the color name and chromaticity coordinates, the relationship between the wavelength range of light and the color name of monochromatic light, and the like comply with JIS Z8110. Specifically, 380 nm to 455 nm is blue purple, 455 nm to 485 nm is blue, 485 nm to 495 nm is blue green, 495 nm to 548 nm is green, 548 nm to 573 nm is yellow green, 573 nm to 584 nm is yellow, 584 nm to 610 nm is yellow red , 610 nm to 780 nm is red.

図1は、実施の形態に係る発光装置を示す模式平面図である。図2は、実施の形態に係る発光装置のII−II線における模式断面図である。実施の形態に係る発光装置は、表面実装型発光装置の一例である。   FIG. 1 is a schematic plan view showing a light emitting device according to an embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II of the light emitting device according to the embodiment. The light-emitting device according to the embodiment is an example of a surface-mounted light-emitting device.

発光装置は、発光素子と、発光素子を配置する成形体と、発光素子を覆う封止部材と、から構成されている。封止部材は、発光素子からの光により励起されて蛍光を発する蛍光体と、場合により拡散材を含有している。拡散材は、発光素子と蛍光体による混色光を散乱させ、光を拡散させるものである。   The light-emitting device includes a light-emitting element, a molded body on which the light-emitting element is disposed, and a sealing member that covers the light-emitting element. The sealing member contains a phosphor that emits fluorescence when excited by light from the light emitting element, and optionally a diffusing material. The diffusing material scatters mixed color light from the light emitting element and the phosphor to diffuse the light.

なお、発光素子を搭載した発光装置には、砲弾型や表面実装型など種々の形式がある。ここでいう砲弾型発光装置とは、外部への接続電極となるリードに発光素子を配置し、リード及び発光素子を被覆する封止部材とから構成されており、封止部材を砲弾のような形状に形成した発光装置を言う。また、表面実装型発光装置とは、リード電極を備えた成形体に発光素子及びその発光素子を覆う封止部材を配置して形成された発光装置を示す。さらに平板状の実装基板上に発光素子を実装し、その発光素子を覆うように、蛍光体を含有した封止部材をレンズ状等に形成した発光装置もある。   Note that there are various types of light emitting devices on which light emitting elements are mounted, such as a shell type and a surface mount type. The bullet-type light emitting device here includes a light emitting element disposed on a lead serving as an external connection electrode, and includes a lead and a sealing member that covers the light emitting element. A light-emitting device formed into a shape. The surface-mounted light emitting device refers to a light emitting device formed by arranging a light emitting element and a sealing member covering the light emitting element on a molded body provided with a lead electrode. Further, there is a light emitting device in which a light emitting element is mounted on a flat mounting substrate and a sealing member containing a phosphor is formed in a lens shape or the like so as to cover the light emitting element.

発光装置100は、可視光の短波長側の光を発する窒化ガリウム系化合物半導体の発光素子10と、発光素子10を載置する凹部を形成する成形体40とを有する。成形体40は、凹部の底面に一部が露出された第一リード20と第二リード30とを有しており、熱可塑性樹脂若しくは熱硬化性樹脂により一体成形されている。成形体40には底面と側面を持つ凹部が形成されており、その凹部の底面に発光素子10が載置されている。発光素子10は一対の正負の電極を有しており、その一対の正負の電極は第一リード20及び第二リード30とワイヤ60を介して電気的に接続されている。発光素子10は封止部材50により封止されている。封止部材50は、発光素子10からの光を波長変換する第1蛍光体70と、第2蛍光体80と、を有している。封止部材50中には、拡散材を含有しても良い。   The light emitting device 100 includes a gallium nitride compound semiconductor light emitting element 10 that emits light having a short wavelength side of visible light, and a molded body 40 that forms a recess on which the light emitting element 10 is placed. The molded body 40 has a first lead 20 and a second lead 30 that are partially exposed on the bottom surface of the recess, and is integrally formed of a thermoplastic resin or a thermosetting resin. A recess having a bottom surface and a side surface is formed in the molded body 40, and the light emitting element 10 is placed on the bottom surface of the recess. The light emitting element 10 has a pair of positive and negative electrodes, and the pair of positive and negative electrodes are electrically connected to the first lead 20 and the second lead 30 via the wire 60. The light emitting element 10 is sealed with a sealing member 50. The sealing member 50 includes a first phosphor 70 that converts the wavelength of light from the light emitting element 10 and a second phosphor 80. The sealing member 50 may contain a diffusing material.

発光素子10と第1蛍光体70、第2蛍光体80の混色光の発光スペクトルにおいて、発光素子10の発光を第1のピークとし、500nm〜600nmを第2のピークとし、600nm〜780nmを第3のピークとし、第1のピークの発光強度を1としたとき、第2のピークの発光強度が0.4〜0.7であり、第3のピークの発光強度が0.8〜1.2であり、第1のピークと第2のピーク間の最低強度が0.1〜0.3であり、第2のピークと第3のピーク間の最低強度が0.1〜0.3である。
発光装置は、混合色の相関色温度が4000K〜6000Kであり、相関色温度の偏差(Duv)が−0.03〜−0.02であることが好ましい。混合色の相関色温度が4500K〜5500Kが特に好ましい。
In the emission spectrum of the mixed color light of the light emitting element 10, the first phosphor 70, and the second phosphor 80, the light emission of the light emitting element 10 is the first peak, 500 nm to 600 nm is the second peak, and 600 nm to 780 nm is the first peak. 3 and the first peak emission intensity is 1, the second peak emission intensity is 0.4 to 0.7, and the third peak emission intensity is 0.8 to 1. 2, the minimum intensity between the first peak and the second peak is 0.1 to 0.3, and the minimum intensity between the second peak and the third peak is 0.1 to 0.3. is there.
In the light emitting device, the correlated color temperature of the mixed color is preferably 4000 K to 6000 K, and the deviation (Duv) of the correlated color temperature is preferably −0.03 to −0.02. The correlated color temperature of the mixed color is particularly preferably 4500K to 5500K.

色度はx=0.320〜0.350、y=0.280〜0.340が好ましい。
発光スペクトルにおいて、第1のピークの発光強度を1とした際に、第2のピークの発光強度を0.45〜0.55、第3のピークの発光強度を0.90〜1.04、第1のピークと第2のピーク間の最低強度を0.19〜0.21、第2のピークと第3のピーク間の最低強度を0.10〜0.17、Duvを−0.030〜−0.015にすることが特に好ましい。
また、第1のピークは440nm〜470nm、第2のピークは510nm〜530nm、第3のピークは650nm〜670nmにあることが特に好ましい。
従来の発光装置は、不足している赤味成分を増やすため、赤味成分の発光ピークのみを上げているが、食肉の脂身の白色や食肉以外のトレイの白色をも赤色に着色していまっている。これに対し、本実施形態の発光装置は、相関色温度が4000K〜6000K、好ましくは、相関色温度が4500K〜5500Kの白色において、食肉の脂身の白色や食肉以外のトレイの白色を白らしく見せる色温度を採用している。また、相対的に白色と赤味成分とを数字以上の赤味を強調する効果があり、白色と赤色とのコントラストを強調することができる。本実施形態の発光装置は赤色をより赤色として強調し、白色もより白色として強調するものである。
以下、各構成要素について説明する。
(発光素子10)
The chromaticity is preferably x = 0.320 to 0.350 and y = 0.280 to 0.340.
In the emission spectrum, when the emission intensity of the first peak is 1, the emission intensity of the second peak is 0.45 to 0.55, the emission intensity of the third peak is 0.90 to 1.04, The minimum intensity between the first peak and the second peak is 0.19 to 0.21, the minimum intensity between the second peak and the third peak is 0.10 to 0.17, and Duv is −0.030. It is especially preferable to set it to -0.015.
The first peak is particularly preferably 440 nm to 470 nm, the second peak is 510 nm to 530 nm, and the third peak is preferably 650 nm to 670 nm.
Conventional light-emitting devices increase only the red component's emission peak in order to increase the red component that is lacking, but the white color of meat fat and the white color of trays other than meat are also colored red. ing. On the other hand, in the light emitting device of the present embodiment, when the correlated color temperature is 4000K to 6000K, and preferably the correlated color temperature is 4500K to 5500K, the meat whiteness of the meat and the white color of the tray other than the meat appear white. Color temperature is adopted. In addition, there is an effect of relatively enhancing the redness of the white and reddish components more than numbers, and the contrast between white and red can be enhanced. The light emitting device of the present embodiment emphasizes red as red and white as white.
Hereinafter, each component will be described.
(Light emitting element 10)

発光素子10は、紫外線領域から可視光領域までの光を発することができる。発光素子10から発する光のピーク波長は、240nm乃至520nmが好ましく、440nm乃至470nmがさらに好ましい。 この発光素子10は、例えば、窒化物半導体素子(InAlGa1−X−YN、0≦X、0≦Y、X+Y≦1)を用いることができる。 The light emitting element 10 can emit light from the ultraviolet region to the visible light region. The peak wavelength of light emitted from the light emitting element 10 is preferably 240 nm to 520 nm, and more preferably 440 nm to 470 nm. For example, a nitride semiconductor element (In X Al Y Ga 1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) can be used for the light emitting element 10.

発光素子10は、サファイア基板上にそれぞれ窒化物半導体からなるn型層、活性層、p型層の順に積層されてなる半導体層を有している。互いに分離されてライン上に露出されたn型半導体にはnパッド電極が形成され、一方pオーミック電極の上にはpパッド電極が形成されている。さらに、発光素子10は、特に240nm〜520nm近傍に発光ピーク波長を有し、蛍光物質を効率よく励起可能な発光波長を有する光を発光できる活性層を有することが好ましい。   The light emitting element 10 has a semiconductor layer formed by sequentially laminating an n-type layer, an active layer, and a p-type layer made of a nitride semiconductor on a sapphire substrate. An n-pad electrode is formed on n-type semiconductors that are separated from each other and exposed on the line, while a p-pad electrode is formed on the p-ohmic electrode. Furthermore, the light emitting element 10 preferably has an active layer that has an emission peak wavelength particularly in the vicinity of 240 nm to 520 nm and can emit light having an emission wavelength capable of efficiently exciting the fluorescent material.

発光素子10は、近紫外から可視光の短上記の波長領域に発光ピーク波長を有する光を放出し、この発光素子10からの光により、第1蛍光体70、第2蛍光体80が励起され、所定の発光色を示す。また、この発光素子10は発光スペクトル幅を狭くさせることが可能であることから、蛍光体を効率よく励起することができる。
(第1蛍光体70、第2蛍光体80)
The light emitting element 10 emits light having an emission peak wavelength in the short wavelength range from near ultraviolet to visible light, and the first phosphor 70 and the second phosphor 80 are excited by the light from the light emitting element 10. Shows a predetermined emission color. In addition, since the light emitting element 10 can narrow the emission spectrum width, the phosphor can be excited efficiently.
(First phosphor 70, second phosphor 80)

2種以上の蛍光体として、第1蛍光体70と第2蛍光体80とを少なくとも含む。第1蛍光体70、第2蛍光体80は、発光素子10からの光により励起されて蛍光を発するものである。ここでは、第1蛍光体70は、500nm〜600nmに発光ピークを持ち、第2蛍光体80は、600nm〜780nmに発光ピークを持つ。特に、第1蛍光体70は、510nm〜550nmに発光ピークを持ち、第2蛍光体80は、630nm〜670nmに発光ピークを持つものが好ましい。また各波長の蛍光体は単体である必要はなく、複数の蛍光体を組み合わせることもできる。   As the two or more kinds of phosphors, at least a first phosphor 70 and a second phosphor 80 are included. The first phosphor 70 and the second phosphor 80 are excited by the light from the light emitting element 10 to emit fluorescence. Here, the first phosphor 70 has an emission peak at 500 nm to 600 nm, and the second phosphor 80 has an emission peak at 600 nm to 780 nm. In particular, it is preferable that the first phosphor 70 has an emission peak at 510 nm to 550 nm, and the second phosphor 80 has an emission peak at 630 nm to 670 nm. Moreover, the fluorescent substance of each wavelength does not need to be a single substance, and a plurality of fluorescent substances can be combined.

第1蛍光体70、第2蛍光体80は、封止部材50中で偏在するよう配合されている。このとき封止部材50は、発光素子10や第1蛍光体70、第2蛍光体80を外部環境から保護するための部材としてのみならず、発光素子からの光の一部を吸収して波長を変換する波長変換部材としても機能する。このように第1蛍光体70、第2蛍光体80を発光素子10に接近させて載置することにより、発光素子10からの光を効率よく波長変換することができ、発光効率の優れた発光装置とできる。なお第1蛍光体70、第2蛍光体80を含む封止部材50と、発光素子10との配置は、それらを接近して配置させる形態に限定されることなく、蛍光体への熱の影響を考慮して、発光素子10と第1蛍光体70、第2蛍光体80とを間隔を空けて配置することもできる。また、第1蛍光体70、第2蛍光体80を封止部材50中にほぼ略均一に分布するように混合することで、色むらのない光を得ることもできる。   The first phosphor 70 and the second phosphor 80 are blended so as to be unevenly distributed in the sealing member 50. At this time, the sealing member 50 not only serves as a member for protecting the light-emitting element 10, the first phosphor 70, and the second phosphor 80 from the external environment, but also absorbs a part of the light from the light-emitting element and has a wavelength. It also functions as a wavelength conversion member that converts. Thus, by placing the first phosphor 70 and the second phosphor 80 close to the light emitting element 10, the light from the light emitting element 10 can be efficiently wavelength-converted, and light emission with excellent light emission efficiency. Can with equipment. In addition, arrangement | positioning with the sealing member 50 containing the 1st fluorescent substance 70 and the 2nd fluorescent substance 80, and the light emitting element 10 is not limited to the form which arranges them closely, The influence of the heat | fever to a fluorescent substance In consideration of the above, the light emitting element 10, the first phosphor 70, and the second phosphor 80 may be arranged with a space therebetween. Further, by mixing the first phosphor 70 and the second phosphor 80 so as to be distributed substantially uniformly in the sealing member 50, it is also possible to obtain light without uneven color.

ここで第1蛍光体70としては、CaMgSi16Cl2−δ:Eu(δは0≦z≦1である)、または(Ba,Sr,Ca,Mg)SiO:Eu、Si6−zAl8−Z:Eu(Zは0<z<4.2である)、(Sr,Ca,Ba)Si:Eu、BaSi12:Eu、SrGa:Eで表される蛍光体、あるいはこれらの元素の一部置換した蛍光体を1種類以上使用する。括弧内はいずれかの元素を含んでいることを示す。 Here, as the first phosphor 70, Ca 8 MgSi 4 O 16 Cl 2-δ : Eu (δ is 0 ≦ z ≦ 1) or (Ba, Sr, Ca, Mg) 2 SiO 4 : Eu, Si 6-z Al z O z N 8-Z: Eu (Z is 0 <z <4.2), ( Sr, Ca, Ba) Si 2 O 2 N 2: Eu, Ba 3 Si 6 O 12 One or more phosphors represented by N 2 : Eu, SrGa 2 S 4 : E, or phosphors partially substituted with these elements are used. The parentheses indicate that any element is included.

また、第2蛍光体80としては、CaAlSiN:Eu、(Ca,Sr)AlSiN:Eu、(Ca,Sr,Ba)Si:Eu、Sr(Al,Si)10(O,N)14:Eu、(Sr,Ca)LiAl:Eu、(Ca,Sr,Ba)S:Eu、3.5MgO・0.5MgF・GeO:Mn、K(Si,Ti,Ge)F:Mnで表される蛍光体、あるいはこれらの元素の一部置換した蛍光体を1種類以上使用する。括弧内はいずれかの元素を含んでいることを示す。 Further, as the second phosphor 80, CaAlSiN 3 : Eu, (Ca, Sr) AlSiN 3 : Eu, (Ca, Sr, Ba) 2 Si 5 N 8 : Eu, Sr 2 (Al, Si) 10 (O , N) 14 : Eu, (Sr, Ca) LiAl 3 N 4 : Eu, (Ca, Sr, Ba) S: Eu, 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, K 2 (Si, Ti , Ge) F 6 : Mn or one or more phosphors partially substituted with these elements is used. The parentheses indicate that any element is included.

さらに青緑色〜黄赤色の蛍光を発する蛍光体である、(Y,Lu)(Al,Ga)12:Ce、(Y,Gd)(Al,Ga)12:Ce、(La、Y)Si11:Ce、(La,Ca)(Si,Al)(O,N)11:Ce、CaSc:Ce、CaScSi12:Ce、SrAl:Eu、SrAl1425:Eu、(Ca,Sr,Ba)Si:Eu、SrSi13Al21:Eu、(Ca,Sr)m/2Si12-m-nAlm+n16-n:Eu、(Sr,Ca)AlSiN3:Ce、(Sr,Ca,Ba)SiO:Euなどのも狙いの発光スペクトルになる範囲であれば少量添加して用いることもできる。 Furthermore, (Y, Lu) 3 (Al, Ga) 5 O 12 : Ce, (Y, Gd) 3 (Al, Ga) 5 O 12 : Ce, which are phosphors emitting blue-green to yellow-red fluorescence ( La, Y) 3 Si 6 N 11 : Ce, (La, Ca) 3 (Si, Al) 6 (O, N) 11 : Ce, CaSc 2 O 4 : Ce, Ca 3 Sc 2 Si 3 O 12 : Ce SrAl 2 O 4 : Eu, Sr 4 Al 14 O 25 : Eu, (Ca, Sr, Ba) 3 Si 6 O 9 N 4 : Eu, Sr 3 Si 13 Al 3 O 2 N 21 : Eu, (Ca, Sr) m / 2 Si 12- mn Al m + n O n n 16-n: Eu, (Sr, Ca) AlSiN 3: Ce, (Sr, Ca, Ba) 3 SiO 5: Eu also emitting aim of such A small amount can be added as long as it falls within the spectrum.

蛍光体の平均粒径は、光学特性と発光装置を製造するときの作業性を考慮すると、1μm以上50μm以下とすることが好ましい。さらに、拡散材の平均粒径は、2μm以上30μm以下とすることがより好ましい。
(封止部材50)
The average particle diameter of the phosphor is preferably 1 μm or more and 50 μm or less in consideration of optical characteristics and workability when manufacturing a light emitting device. Further, the average particle diameter of the diffusing material is more preferably 2 μm or more and 30 μm or less.
(Sealing member 50)

封止部材50は、発光装置100の凹部内に載置された発光素子10を覆うように透光性の樹脂やガラスで充填されて形成される。製造のし易さを考慮すると、封止部材50の材料は、透光性樹脂が好ましい。透光性樹脂は、耐光性を考慮してシリコーン樹脂組成物を使用することが好ましいが、エポキシ樹脂組成物、アクリル樹脂組成物等の絶縁樹脂組成物を用いることもできる。また、封止部材50には第1蛍光体70、第2蛍光体80が含有されているが、さらに適宜、その他の材料を添加することもできる。例えば、封止部材50には拡散材や遮光部材、紫外線吸収部材、顔料等を含有することもできる。また、封止部材50には2種以上の拡散材を含むことで、発光素子10からの指向性を緩和させ、視野角を増大させることができる。別の拡散材として、シリカやアルミナ、チタニア、イットリア、ジルコニアなどを材料とする粒子を挙げることができる。   The sealing member 50 is formed by being filled with a translucent resin or glass so as to cover the light emitting element 10 placed in the recess of the light emitting device 100. In consideration of ease of manufacture, the material of the sealing member 50 is preferably a translucent resin. The translucent resin is preferably a silicone resin composition in consideration of light resistance, but an insulating resin composition such as an epoxy resin composition or an acrylic resin composition can also be used. Moreover, although the 1st fluorescent substance 70 and the 2nd fluorescent substance 80 contain in the sealing member 50, another material can also be added suitably. For example, the sealing member 50 can contain a diffusing material, a light shielding member, an ultraviolet absorbing member, a pigment, and the like. Further, by including two or more kinds of diffusing materials in the sealing member 50, the directivity from the light emitting element 10 can be relaxed and the viewing angle can be increased. Examples of another diffusing material include particles made of silica, alumina, titania, yttria, zirconia, or the like.

実施例1〜4の発光装置について説明する。図3は4種類の蛍光体の発光スペクトルを示す図である。図4は実施例1〜4、比較例1に係る発光装置の発光スペクトルを示す図である。
実施例1〜4の発光装置は、450nm付近に発光ピークを持つ窒化ガリウムの発光素子10を用いる。実施例1〜4の第1蛍光体70として、516nm付近に発光ピークを持つクロロシリケートAを用い、クロロシリケートAの組成は、CaMgSi16Cl2−δ:Euである。実施例1〜4の第2蛍光体80として、663nm付近に発光ピークを持つ窒化物蛍光体Aであり、窒化物蛍光体Aの組成は、CaAlSiN:Euである。
比較例1の発光装置も、450nm付近に発光ピークを持つ窒化ガリウムの発光素子10を用いる。比較例1の第1蛍光体として、522nm付近に発光ピークを持つクロロシリケートBを用い、クロロシリケートBの組成は、CaMgSi16Cl2−δ:Euである。比較例1の第2蛍光体として、646nm付近に発光ピークを持つ窒化物蛍光体Bであり、窒化物蛍光体Bの組成は、CaAlSiN:Euである。
The light emitting devices of Examples 1 to 4 will be described. FIG. 3 is a diagram showing emission spectra of four types of phosphors. 4 is a diagram showing emission spectra of the light emitting devices according to Examples 1 to 4 and Comparative Example 1. FIG.
The light-emitting devices of Examples 1 to 4 use a gallium nitride light-emitting element 10 having a light emission peak near 450 nm. As the first phosphor 70 of Examples 1 to 4, chlorosilicate A having an emission peak in the vicinity of 516 nm is used, and the composition of chlorosilicate A is Ca 8 MgSi 4 O 16 Cl 2 -δ : Eu. The second phosphor 80 of Examples 1 to 4 is a nitride phosphor A having an emission peak near 663 nm, and the composition of the nitride phosphor A is CaAlSiN 3 : Eu.
The light emitting device of Comparative Example 1 also uses the gallium nitride light emitting element 10 having an emission peak near 450 nm. As the first phosphor of Comparative Example 1, chlorosilicate B having an emission peak in the vicinity of 522 nm is used, and the composition of chlorosilicate B is Ca 8 MgSi 4 O 16 Cl 2-δ : Eu. The second phosphor of Comparative Example 1 is a nitride phosphor B having an emission peak near 646 nm, and the composition of the nitride phosphor B is CaAlSiN 3 : Eu.

表1、2は実施例1〜4、比較例1の発光装置の測定結果を示す。
表1のxyは色度を、Tcpは色温度を、Duvは黒体放射からのずれを、見栄えは、実際に食肉を目視したときの見た目の良さを感覚的に判定した内容を表す。実施例、比較例はほぼ近い色度ではあるが、Duvが実施例3、4は小さい。
表2は、実施例1〜4、比較例1の発光スペクトルから得られる、440〜470nmの第1のピーク、500〜600nmの第2のピーク、600〜780nmの第3のピークの波長と、第1のピークの強度を1とした時の各ピークの発光強度と、それぞれの発光強度の間の最低強度を示す。
Tables 1 and 2 show the measurement results of the light emitting devices of Examples 1 to 4 and Comparative Example 1.
In Table 1, xy represents the chromaticity, Tcp represents the color temperature, Duv represents the deviation from the black body radiation, and the appearance represents the content that is sensibly determined when the meat is actually viewed visually. Although Examples and Comparative Examples have nearly similar chromaticities, Duv is small in Examples 3 and 4.
Table 2 shows the wavelengths of the first peak of 440 to 470 nm, the second peak of 500 to 600 nm, and the third peak of 600 to 780 nm obtained from the emission spectra of Examples 1 to 4 and Comparative Example 1. The emission intensity of each peak when the intensity of the first peak is 1, and the minimum intensity between the emission intensity are shown.

Figure 0006354607
Figure 0006354607

Figure 0006354607
Figure 0006354607

実施例1の発光スペクトルにおいて、第1のピークを1とした際に、第2のピークは0.67、第3のピークは1.13、第1のピークと第2のピーク間の最低強度は0.28、第2のピークと第3のピーク間の最低強度は0.28である。
実施例2の発光スペクトルにおいて、第1のピークを1とした際に、第2のピークは0.59、第3のピークは1.13、第1のピークと第2のピーク間の最低強度は0.28、第2のピークと第3のピーク間の最低強度は0.21である。
実施例3の発光スペクトルにおいて、第1のピークを1とした際に、第2のピークは0.53、第3のピークは1.02、第1のピークと第2のピーク間の最低強度は0.21、第2のピークと第3のピーク間の最低強度は0.17である。
実施例4の発光スペクトルにおいて、第1のピークを1とした際に、第2のピークは0.48、第3のピークは0.94、第1のピークと第2のピーク間の最低強度は0.20、第2のピークと第3のピーク間の最低強度は0.15である。
実施例3、4のように、発光スペクトルにおいて、第1のピークを1とした際に、第2のピークを0.45〜0.55、第3のピークを0.90〜1.04、第1のピークと第2のピーク間の最低強度を0.19〜0.21、第2のピークと第3のピーク間の最低強度を0.10〜0.17、Duvを−0.030〜−0.015にすることが好ましい。
In the emission spectrum of Example 1, when the first peak is 1, the second peak is 0.67, the third peak is 1.13, and the minimum intensity between the first peak and the second peak Is 0.28, and the minimum intensity between the second peak and the third peak is 0.28.
In the emission spectrum of Example 2, when the first peak is 1, the second peak is 0.59, the third peak is 1.13, and the minimum intensity between the first peak and the second peak Is 0.28, and the minimum intensity between the second peak and the third peak is 0.21.
In the emission spectrum of Example 3, when the first peak is 1, the second peak is 0.53, the third peak is 1.02, and the minimum intensity between the first peak and the second peak Is 0.21, and the minimum intensity between the second peak and the third peak is 0.17.
In the emission spectrum of Example 4, when the first peak is 1, the second peak is 0.48, the third peak is 0.94, and the minimum intensity between the first peak and the second peak Is 0.20, and the minimum intensity between the second peak and the third peak is 0.15.
As in Examples 3 and 4, in the emission spectrum, when the first peak is 1, the second peak is 0.45 to 0.55, the third peak is 0.90 to 1.04, The minimum intensity between the first peak and the second peak is 0.19 to 0.21, the minimum intensity between the second peak and the third peak is 0.10 to 0.17, and Duv is −0.030. It is preferable to set it to -0.015.

比較例1に対して実施例1〜4は蛍光体の波長を変更したものであり、実施例1〜4は見栄えが改善されており、実施例3の見栄えが良好、特に実施例4の見栄えが非常に良好であった。また、実施例3、4はDuvを低くしたものであるが、見栄えが良好となっている。   In comparison with Comparative Example 1, Examples 1 to 4 are obtained by changing the wavelength of the phosphor. Examples 1 to 4 have improved appearance, and Example 3 has good appearance, particularly Example 4 has good appearance. Was very good. In Examples 3 and 4, the Duv is lowered, but the appearance is good.

今回の実施例1〜4、特に実施例3、4で見栄えが良くなる要因として、青色、緑色、赤色成分をそれぞれ特定の波長域とし、更に各成分の谷間となる成分を抑えることによって、中間色となる、橙色などが抑えられて、食肉の赤味が良好に見えると考えられる。また、Duvを黒体放射より低くしている。つまり通常の色よりも赤味が増すように調整しており、これにより更に食肉がより良好に見えるようになっていると考えられる。   As a factor that improves the appearance in Examples 1 to 4, especially Examples 3 and 4, the blue, green, and red components are set to specific wavelength ranges, and further, by suppressing the components that are valleys of the respective components, intermediate colors It is thought that the red color of the meat looks good because the orange color is suppressed. Also, Duv is set lower than black body radiation. In other words, it is adjusted so that the reddish color is increased as compared with the normal color, and it is considered that the meat looks better.

本実施の形態の発光装置は、食肉用の照明として使用することができるが、手術用照明、一般照明としても使用することができる。   Although the light-emitting device of this Embodiment can be used as illumination for meat, it can also be used as surgical illumination and general illumination.

10 発光素子
20 第一リード
30 第二リード
40 成形体
50 封止部材
60 ワイヤ
70 第1蛍光体
80 第2蛍光体
DESCRIPTION OF SYMBOLS 10 Light emitting element 20 1st lead 30 2nd lead 40 Molding body 50 Sealing member 60 Wire 70 1st fluorescent substance 80 2nd fluorescent substance

Claims (7)

発光素子と、
前記発光素子からの光により励起されて蛍光を発する2種類以上の蛍光体と、を有し、
前記発光素子と前記蛍光体との混色光の発光スペクトルにおいて、前記発光素子の発光を第1のピークとし、500nm〜600nmを第2のピークとし、600nm〜780nmを第3のピークとし、前記第1のピークの発光強度を1としたとき、前記第2のピークの発光強度が0.4〜0.7であり、前記第3のピークの発光強度が0.8〜1.2であり、前記第1のピークと前記第2のピーク間の最低強度が0.1〜0.3であり、前記第2のピークと前記第3のピーク間の最低強度が0.1〜0.3である発光装置。
A light emitting element;
Two or more kinds of phosphors that emit fluorescence when excited by light from the light-emitting element,
In the emission spectrum of the mixed color light of the light emitting element and the phosphor, the light emission of the light emitting element is a first peak, 500 nm to 600 nm is a second peak, 600 nm to 780 nm is a third peak, When the emission intensity of the first peak is 1, the emission intensity of the second peak is 0.4 to 0.7, the emission intensity of the third peak is 0.8 to 1.2, The minimum intensity between the first peak and the second peak is 0.1 to 0.3, and the minimum intensity between the second peak and the third peak is 0.1 to 0.3. A light emitting device.
前記第1のピークは、440nm〜470nmにある請求項1に記載の発光装置。   The light emitting device according to claim 1, wherein the first peak is in a range of 440 nm to 470 nm. 前記第2のピークは、510nm〜530nmにある請求項1又は2に記載の発光装置。   The light emitting device according to claim 1, wherein the second peak is in a range of 510 nm to 530 nm. 前記第3のピークは、650nm〜670nmにある請求項1乃至3のいずれか一項に記載の発光装置。   The light emitting device according to any one of claims 1 to 3, wherein the third peak is in a range of 650 nm to 670 nm. 前記2種類以上の蛍光体の少なくとも1種は、CaMgSi16Cl2−δ:Eu(δは0≦z≦1である)、または(Ba,Sr,Ca,Mg)SiO:Eu、Si6−zAl8−Z:Eu(Zは0<z<4.2である)、(Sr,Ca,Ba)Si:Eu、BaSi12:Eu、SrGa:Euで表される蛍光体、あるいはこれらの元素の一部を置換した蛍光体である請求項1乃至4のいずれか一項に記載の発光装置。 At least one of the two or more kinds of phosphors is Ca 8 MgSi 4 O 16 Cl 2-δ : Eu (δ is 0 ≦ z ≦ 1) or (Ba, Sr, Ca, Mg) 2 SiO 4. : Eu, Si 6-z Al z O z N 8-Z : Eu (Z is 0 <z <4.2), (Sr, Ca, Ba) Si 2 O 2 N 2 : Eu, Ba 3 Si 5. The light-emitting device according to claim 1, which is a phosphor represented by 6 O 12 N 2 : Eu, SrGa 2 S 4 : Eu, or a phosphor obtained by substituting a part of these elements. . 前記2種類以上の蛍光体の少なくとも1種は、CaAlSiN:Eu、(Ca,Sr)AlSiN:Eu、(Ca,Sr,Ba)Si:Eu、Sr(Al,Si)10(O,N)14:Eu、(Sr,Ca)LiAl:Eu、(Ca,Sr,Ba)S:Eu、3.5MgO・0.5MgF・GeO2:Mn、K(Si,Ti,Ge)F:Mnで表される蛍光体、あるいはこれらの元素の一部を置換した蛍光体である請求項1乃至5のいずれか一項に記載の発光装置。 At least one of the two or more types of phosphors is CaAlSiN 3 : Eu, (Ca, Sr) AlSiN 3 : Eu, (Ca, Sr, Ba) 2 Si 5 N 8 : Eu, Sr 2 (Al, Si) 10 (O, N) 14 : Eu, (Sr, Ca) LiAl 3 N 4 : Eu, (Ca, Sr, Ba) S: Eu, 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, K 2 (Si , Ti, Ge) F 6 : Mn is a phosphor represented by Mn, or a phosphor obtained by substituting part of these elements. 6. The light emitting device according to claim 1. 前記発光装置は、混合色の相関色温度が4000K〜6000Kであり、相関色温度の偏差(Duv)が−0.03〜−0.02である請求項1乃至6のいずれか一項に記載の発光装置。   7. The light emitting device according to claim 1, wherein the correlated color temperature of the mixed color is 4000 K to 6000 K, and the deviation (Duv) of the correlated color temperature is −0.03 to −0.02. 8. Light-emitting device.
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