CN202394970U - Light-emitting diode (LED) chip and light source module using same - Google Patents

Light-emitting diode (LED) chip and light source module using same Download PDF

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Publication number
CN202394970U
CN202394970U CN2011205603172U CN201120560317U CN202394970U CN 202394970 U CN202394970 U CN 202394970U CN 2011205603172 U CN2011205603172 U CN 2011205603172U CN 201120560317 U CN201120560317 U CN 201120560317U CN 202394970 U CN202394970 U CN 202394970U
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CN
China
Prior art keywords
chip
led
blue
light
yellow
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Expired - Fee Related
Application number
CN2011205603172U
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Chinese (zh)
Inventor
王卫国
项延辉
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Zhejiang Qiaoming Optoelectronic Co., Ltd.
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项延辉
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Priority to CN2011205603172U priority Critical patent/CN202394970U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

The utility model discloses a light-emitting diode (LED) chip and a light source module using the same. The LED chip disclosed by the utility model comprises an LED substrate, a blue chip, yellow fluorescent powder, a yellow chip, a red chip and a silicon lens, wherein the blue chip is arranged at the center of the LED substrate, the yellow fluorescent powder is paved on the blue chip, the yellow chip and the red chip are arranged on the LED substrate and positioned at the edge of the blue chip, and the silicon lens packages the chips on the LED substrate. The blue chip excites the yellow fluorescent powder to emit a high-color-temperature white light; the yellow chip emits a yellow light and the red chip emits a red light, after the white light, the yellow light and the red light are mixed, a relatively good color rendering property is obtained; and simultaneously, in the LED chip, the yellow fluorescent powder is excited to emit light mainly by the blue chip, the yellow chip and the red chip mainly play a role in adjusting color temperatures and color rendering indexes, and therefore the whole light emitting efficiency of the LED chip is relatively high. The LED chip provided by the utility model achieves an aim that a relatively high whole light emitting efficiency is obtained while the color rendering property is improved. The utility model further discloses a light source module which uses the LED chip.

Description

A kind of led chip and the light source module of having used this led chip
Technical field
The utility model relates to technical field of semiconductors, more particularly, relates to a kind of led chip and the light source module of having used this led chip.
Background technology
LED is the english abbreviation of light-emitting diode, is a kind of solid-state semiconductor device, and it can directly be converted into light to electric energy.Luminous and the luminous principle of electricity-saving lamp tricolor powder than traditional incandescent lamp tungsten filament, what LED adopted is electroluminescence.Therefore, LED have the life-span long, light efficiency is high, radiationless and low in power consumption, thereby obtained widely using.
Yet at room lighting, particularly white light LEDs need be used in reading lighting, medical illumination field, but there is technical bottleneck in the color rendering of white light LEDs.Rare-earth garnet (YAG:Ce3+) yellow fluorescent powder that people adopt InGaN base blue-light LED chip and Ce3+ to activate makes up and prepares cold white light LEDs (Tc＞5; 000K); Can realize that color rendering index is higher than 80; But (Tc＜5 are in the time of 000K), because the unbalanced people of making of white light LEDs spectrum are difficult to realize simultaneously low colour temperature and high-color rendering technically for the preparation warm white LED.In order to make LED realize low colour temperature and high-color rendering simultaneously; Make at present adopt the blue-ray LED wafer to excite green emitting phosphor ((Ca-α-SiAlON:Eu) and red fluorescence powder (CaAlSiN3:Eu) have obtained colour temperature and from cold adjustable in vain to warming up in vain, color rendering index are 80 white light for β-SiAlON:Eu), yellow fluorescent powder.This method can obtain the adjustable color temperature of certain limit through the ratio of adjusting three kinds of fluorescent material.But the conversion efficiency that this method also exists fluorescent material is not high, and powder is difficult for shortcomings such as mixing.And red fluorescence powder (CaAlSiN3:Eu) easy ageing, luminous efficiency are low etc.
Therefore, how a kind of led chip is provided, can when improving the led chip color rendering, obtains higher whole lighting efficiency, become the technical problem that those skilled in the art need solution badly.
The utility model content
In view of this, the utility model provides a kind of led chip, obtains the purpose of higher whole lighting efficiency when improving the led chip color rendering with realization.
For realizing above-mentioned purpose, the utility model provides following technical scheme:
A kind of led chip utilizes silica-gel lens that blue chip and yellow fluorescent powder are encapsulated in the LED substrate center, also comprises:
The gold-tinted chip, the gold-tinted chip is arranged on the edge of blue chip; With
Red chip, red chip are arranged on the edge of blue chip, and are positioned at the offside of gold-tinted chip;
Gold-tinted chip and red light chips are encapsulated on the LED substrate by silica-gel lens.
Preferably, in above-mentioned led chip, the blue chip array that blue chip is formed for the multi-disc blue chip.
Preferably, in above-mentioned led chip, the quantity of blue chip is 9.
Preferably, in above-mentioned led chip, 9 blue chips are formed rectangular array.
Preferably, in above-mentioned led chip, the power of blue chip: the power of gold-tinted chip: the power of red light chips is 100: 30: 6.
Preferably, in above-mentioned led chip, the LED substrate is a concave surface minute surface substrate, and blue chip is integrated in the concave surface of concave surface minute surface substrate, and yellow fluorescent powder is tiled on the blue chip, and gold-tinted chip and red light chips are symmetricly set on the edge of concave surface;
Silica-gel lens is encapsulated in blue chip, yellow fluorescent powder, gold-tinted chip and red light chips on the concave surface minute surface substrate.
The utility model provides a kind of led chip and the light source module of having used this chip.Wherein, led chip comprises: the LED substrate; Be arranged at the blue chip of LED substrate center; Be tiled in the yellow fluorescent powder on the blue chip; Be arranged on the LED substrate and be positioned at the gold-tinted chip at blue chip edge; Be arranged on the LED substrate and be positioned at the red light chips of gold-tinted chip offside; With blue chip, yellow fluorescent powder, gold-tinted chip and red light chips are encapsulated into the silica-gel lens on the LED substrate.Wherein, blue chip excites the high color temperature white light of yellow fluorescent powder generation and the yellow light mix that the gold-tinted chip sends, and can obtain the mixed light of reference color temperature at 2750-7300K; The high color temperature white light that blue chip excites yellow fluorescent powder to produce mixes with the ruddiness that red light chips sends, can obtain color rendering index Ra greater than 90 and special colour rendering index R9 greater than 90 mixed light; Mix above-mentioned high color temperature white light, gold-tinted and ruddiness, can obtain colour temperature in the 2750-7300K scope, color rendering index Ra and special colour rendering index R9 greater than 90 mixed light, have obtained color rendering preferably; Simultaneously, led chip mainly relies on blue chip to excite yellow fluorescent powder luminous, and gold-tinted chip and red light chips mainly work to regulate colour temperature, regulate color rendering index, so its whole lighting efficiency is higher.Comprehensively above-mentioned, the led chip that the utility model provided has realized when improving color rendering, obtaining the purpose of higher whole lighting efficiency.
The utility model also provides a kind of light source module, and this light source module has used above-mentioned led chip, and therefore, this light source module has color rendering and higher whole lighting efficiency preferably.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiment of the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The structural representation of the led chip that Fig. 1 provides for the utility model embodiment;
The cutaway view of the led chip that Fig. 2 provides for the utility model embodiment;
The figure of the employing annular array led chip that Fig. 3 provides for another embodiment of the utility model;
The cutaway view of the led chip that Fig. 4 is provided for another embodiment of the utility model;
Fig. 5 adopts the structural representation of the embodiment of loop concave minute surface substrate for the utility model.
Embodiment
To combine the accompanying drawing among the utility model embodiment below, the technical scheme among the utility model embodiment is carried out clear, intactly description, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1 and Fig. 2, the utility model embodiment discloses a kind of led chip, obtains the purpose of higher whole lighting efficiency when improving the led chip color rendering with realization.
The led chip that the utility model embodiment is provided comprises:
LED substrate 1;
Blue chip 2, blue chip 2 is arranged on the central authorities of LED substrate 1;
Yellow fluorescent powder 3, yellow fluorescent powder 3 are tiled on the blue chip 2;
Gold-tinted chip 4, gold-tinted chip 4 is arranged on the LED substrate 1, is positioned at the edge of blue chip 2;
Red light chips 5, red light chips 5 is arranged on the LED substrate 1, is positioned at the edge of blue chip 2, the offside of gold-tinted chip 4;
Silica-gel lens 6, silica-gel lens 6 is encapsulated into blue chip 2, yellow fluorescent powder 3, gold-tinted chip 4 and red light chips 5 on the LED substrate 1.
When the led chip that uses the utility model embodiment to be provided, blue chip 2 excites the high color temperature white light of yellow fluorescent powder 3 generations and the yellow light mix that gold-tinted chip 4 sends, and has obtained the mixed light of reference color temperature at 2750-7300K; The high color temperature white light that blue chip 2 excites yellow fluorescent powder 3 to produce mixes with the ruddiness that red light chips 5 sends, obtained color rendering index Ra greater than 90 and special colour rendering index R9 greater than 90 mixed light; Mix above-mentioned high color temperature white light, gold-tinted and ruddiness, just obtained colour temperature in the 2750-7300K scope, color rendering index Ra and special colour rendering index R9 greater than 90 mixed light, have obtained color rendering preferably.Simultaneously, led chip mainly relies on blue chip 2 to excite yellow fluorescent powder 3 luminous, and gold-tinted chip 4 mainly plays a part with red light chips 5 to regulate colour temperature, regulate color rendering index, so its whole lighting efficiency is higher.Therefore, compare with led chip of the prior art, the led chip that the utility model provided has realized when improving color rendering, obtaining the purpose of higher whole lighting efficiency.
In the above-described embodiments, applied blue chip is the rectangle blue chip array that 9 blue chips are formed, and a plurality of lower powered blue chips are formed array, and its cost is lower than using monolithic high-power chip cost, has reduced the cost of product.
Preferably, in the above-described embodiments, the power of blue chip: the power of gold-tinted chip: the power of red light chips is 100: 30: 6.
On the basis of the foregoing description, the led chip that the utility model provided can also be for using the annular array that a plurality of blue chips are formed.
Please refer to Fig. 3, a plurality of blue chips surround annular, have formed annular blue chip array.
Concrete, in the above-described embodiments, the LED substrate is a concave surface minute surface substrate.Please refer to Fig. 4, blue chip 2 is integrated in the concave surface 111 of concave surface minute surface substrate 11, and yellow fluorescent powder 3 is tiled on the blue chip 2; Gold-tinted chip and red light chips offside are arranged on the edge of concave surface; Utilize silica-gel lens that blue chip, yellow fluorescent powder, gold-tinted chip and red light chips are encapsulated on the LED substrate again.
The concave surface minute surface substrate that is adopted in the present embodiment, the minute surface substrate increases the light reflection on the one hand, and concave design is made technological place mat for the tiling yellow fluorescent powder on the other hand, and fluorescent glue can not be overflowed, and has improved the rate of finished products of product.
Please refer to Fig. 5; On the basis of the foregoing description; The led chip that the utility model provided can also adopt the concave surface minute surface substrate of annular; Blue chip is arranged in the concave surface 112 of loop concave minute surface substrate, and yellow fluorescent powder is tiled on the blue chip, and gold-tinted chip 4 and red light chips 5 are arranged on the central authorities of loop concave.
The utility model also provides a kind of led light source module.This led light source module application above-mentioned led chip, therefore when having better color rendering, also have higher whole lighting efficiency.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation of spirit that does not break away from the utility model or scope in other embodiments among this paper.Therefore, the utility model will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.

Claims (7)

1. a led chip utilizes silica-gel lens that blue chip and yellow fluorescent powder are encapsulated in the LED substrate center, it is characterized in that, also comprises:
The gold-tinted chip, said gold-tinted chip is arranged on the edge of said blue chip; And red chip, said red chip is arranged on the edge of said blue chip, and is positioned at the offside of said gold-tinted chip;
Said gold-tinted chip and said red light chips are encapsulated on the said LED substrate by said silica-gel lens.
2. led chip according to claim 1 is characterized in that, the blue chip array that said blue chip is formed for the multi-disc blue chip.
3. led chip according to claim 2 is characterized in that, the quantity of said blue chip is 9.
4. led chip according to claim 3 is characterized in that, 9 said blue chips are formed rectangular array.
5. led chip according to claim 1 is characterized in that, the power of said blue chip: the power of said gold-tinted chip: the power of said red light chips is 100: 30: 6.
6. led chip according to claim 5; It is characterized in that; Said LED substrate is a concave surface minute surface substrate; Said blue chip is integrated in the concave surface of said concave surface minute surface substrate, and said yellow fluorescent powder is tiled on the said blue chip, and said gold-tinted chip and said red light chips are symmetricly set on the edge of said concave surface;
Said silica-gel lens is encapsulated in said blue chip, said yellow fluorescent powder, said gold-tinted chip and said red light chips on the said concave surface minute surface substrate.
7. a led light source module is characterized in that, has used each described led chip of claim 1-6.
CN2011205603172U 2011-12-28 2011-12-28 Light-emitting diode (LED) chip and light source module using same Expired - Fee Related CN202394970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011205603172U CN202394970U (en) 2011-12-28 2011-12-28 Light-emitting diode (LED) chip and light source module using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011205603172U CN202394970U (en) 2011-12-28 2011-12-28 Light-emitting diode (LED) chip and light source module using same

Publications (1)

Publication Number Publication Date
CN202394970U true CN202394970U (en) 2012-08-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799510A (en) * 2017-12-01 2018-03-13 广东省半导体产业技术研究院 A kind of micro- LED chip of full spectrum white-light
JP2019114762A (en) * 2017-12-22 2019-07-11 日亜化学工業株式会社 Light emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799510A (en) * 2017-12-01 2018-03-13 广东省半导体产业技术研究院 A kind of micro- LED chip of full spectrum white-light
JP2019114762A (en) * 2017-12-22 2019-07-11 日亜化学工業株式会社 Light emitting device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: ZHEJIANG QIAOMING OPTOELECTRONIC CO., LTD.

Free format text: FORMER OWNER: XIANG YANHUI

Effective date: 20130906

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20130906

Address after: 314200 No. 777 Changsheng Road, Pinghu Economic Development Zone, Pinghu, Zhejiang

Patentee after: Zhejiang Qiaoming Optoelectronic Co., Ltd.

Address before: 314200 Pinghu City, Zhejiang Province Economic Development Zone, Changsheng Road, No. 777, No.

Patentee before: Xiang Yanhui

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120822

Termination date: 20141228

EXPY Termination of patent right or utility model