CN105591017B - Two-section L ED packaging support with bendable head - Google Patents
Two-section L ED packaging support with bendable head Download PDFInfo
- Publication number
- CN105591017B CN105591017B CN201610080933.5A CN201610080933A CN105591017B CN 105591017 B CN105591017 B CN 105591017B CN 201610080933 A CN201610080933 A CN 201610080933A CN 105591017 B CN105591017 B CN 105591017B
- Authority
- CN
- China
- Prior art keywords
- font
- led
- bendable
- led package
- package supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010304 firing Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a two-section L ED packaging support with a bendable head, which comprises an input end, wherein the input end is in a shape of a convex sheet, an upper through hole is formed between a convex protruding part and a convex non-protruding part of the input end, an upper metal sheet matched with the shape of the upper through hole is arranged in the upper through hole, a lower through hole is formed from the lower part to the lower edge of the convex non-protruding part, a metal sheet output end matched with the shape of the lower through hole is arranged in the lower through hole, a head L ED lamp cup is formed after injection molding between the convex protruding part and the upper part of the upper metal sheet, and a tail L ED lamp cup is formed after injection molding between the lower part of the upper metal sheet and the lower metal sheet output end.
Description
Technical field
Becoming the LED package supports of LED light for installing LED chip and then encapsulating fluorescent powder again the present invention relates to a kind of,
More particularly to a kind of LED package supports of two-part punch head bendable.
Background technology
LED (Light Emitting Diode), light emitting diode is a kind of solid state semiconductor devices, it can be straight
It connects and converts electricity to light.The heart of LED is the chip of a semiconductor, and one end of chip is attached on a holder, and one end is negative
Pole, the other end connect the anode of power supply, make entire chip by epoxy encapsulation.Semiconductor wafer consists of two parts,
A part is P-type semiconductor, and hole is occupied an leading position inside it, and the other end is N-type semiconductor, is mainly electronics in this side.
But when both semiconductors connect, just formation one " P-N junction " between them.When electric current acts on this by conducting wire
When a chip, electronics will be pushed to the areas P, and in the areas P then electronics will be sent out with hole-recombination in the form of photon
Energy, here it is the principles that LED shines.And the wavelength of light i.e. the color of light, it is to be determined by the material of formation P-N junction.
The functionization and commercialization of high performance lED make lighting engineering face a new revolution.By multiple super brightness
The pixel lamp of red, blue, green three-color LED composition can not only send out the continuously adjustable various coloured light of wavelength, but also can be sent out
Brightness becomes lighting source, the incandescent lamp for identical light emission luminance and LED solids up to the white light of tens to one hundred candle light
For headlamp, the power consumption of the latter only accounts for the former 10%-20%.
The white light LEDs produced now are made of largely by covering one layer of faint yellow fluorescent coating on blue-ray LED
, this yellow phosphor is typically a kind of dense by being blended in after the yag crystal for having mixed cerium is clayed into power
It is manufactured in adhesive.When LED chip sends out blue light, some blue light will be efficiently converted into a light very much by this crystal
The light of the wider predominantly yellow of spectrum remixes the indigo plant of LED itself since yellow light can stimulate feux rouges and green light receptor in naked eyes
Light makes it appear like white light.
Existing LED light is usually to be mounted directly on a mounting board, and mounting plate is usually laminated structure, including three layers：With
Come the heat dissipating layer to radiate, the insulating layer, the line layer for being used for connecting up under insulating layer that are used for insulating under heat dissipating layer, wherein scattered
Thermosphere is generally aluminium foil or aluminum alloy sheet；Line layer is generally copper foil and is made, for doing configuration.
The manufacturing process flow of existing LED light is pressure welding, encapsulation and solidification.Pressure welding is that LED chip is bonded to electrode；
The encapsulation of LED is that the mixture of fluorescent powder and epoxy resin is encapsulated into the good LED chip of pressure welding；Solidification is by epoxy resin
Fully cure with the mixture of fluorescent powder.
Existing full firing angle LED bulb is also mostly the combination of multiple LED light, and multiple LED light are mounted on a frame, to
All angles emit light, to obtain the effect of full firing angle.The structure and shape of existing LED light limit existing complete
The shape of firing angle LED bulb.
Invention content
In order to overcome the deficiencies of the prior art, a kind of new LED light is provided for novel full firing angle LED bulb, the present invention carries
Go out a kind of LED package supports of two-part punch head bendable, including input terminal, the input terminal is described at " convex " font sheet
Input terminal has top through-hole, the top logical between the protrusion part of " convex " font and the non-protruding part of " convex " font
The upper metal piece to match with its shape is equipped in open-work；Lower part to the lower edge of the non-protruding part of " convex " font has
Lower part through-hole, the lower part through-hole is interior to be equipped with the sheet metal output end to match with its shape；" convex " font it is convex
Go out and constitutes head LED lamp cup, the lower part of the upper metal piece and institute between part and the top of upper metal piece after injection molding
It states and constitutes tail portion LED lamp cup after being molded between lower metal piece output end；Between the head LED lamp cup and tail portion LED lamp cup
Constitute bendable folding part so that head LED lamp cup can be bent at bendable folding part.
Further, the penetrating sky in the top is " I " fonts, and the upper metal piece is " I " fonts.
Further, the input terminal and output end all have the protrusion part in outside, and the protrusion part is for connecting
The LED package supports of power supply circuit or other two-part punch head bendables.
Further, the tail portion LED lamp cup length is longer than the head LED lamp cup length.
Further, two parts up and down of the " I " fonts through-hole are of same size.
Further, two parts are of same size up and down for the " I " fonts sheet metal.
Further, the lower metal piece output end be " T " font, " T " the font sheet metal output end it is upper
Portion is upper and lower two-part of same size with the " I " fonts sheet metal.
Further, described " T " font sheet metal output end lower end is extended downwardly to after the extension of the direction of input terminal,
So that " T " font sheet metal output end lower end is far from input terminal.
Further, the LED package supports of the two-part punch head bendable are that sheet metal rolls one-pass molding through wheel hub.
The beneficial effects of the present invention are provide a kind of LED package supports of two-part punch head bendable, on its head
It is welded in LED lamp cup and tail portion LED lamp cup and goes up LED chip, after the mixture for then encapsulating fluorescent powder and epoxy resin again
As LED light, head can be bent, it is possible to provide the light emitting angle of bigger, suitable for full firing angle LED bulb.
Description of the drawings
Fig. 1 is the structural schematic diagram of a specific embodiment of the invention；
Fig. 2 is embodiment internal circuit configuration figure in Fig. 1.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Refer to Fig. 1 and Fig. 2, a kind of LED package supports of two-part punch head bendable of the present invention, including input terminal 1, institute
Input terminal 1 is stated into " convex " font sheet, non-protruding part of the input terminal 1 in the protrusion part of " convex " font and " convex " font
Between there is top through-hole 2, the upper metal piece 3 to match with its shape is equipped in the top through-hole 2；" convex " font
Lower part to the lower edge of non-protruding part there is lower part through-hole 4, be equipped in the lower part through-hole 4 and its shape phase
The sheet metal output end 5 matched；Between the protrusion part of " convex " font and the top of upper metal piece 3 head is constituted after injection molding
Portion's LED lamp cup 6 constitutes tail portion LED after injection molding between the lower part of the upper metal piece and the lower metal piece output end
Lamp cup 7；Bendable folding part is constituted between the head LED lamp cup 6 and tail portion LED lamp cup 7 so that head LED lamp cup 6 can be in bendable
It is bent at folding part.
In the embodiment shown in fig. 1, the top penetrating empty 2 is " I " fonts, and 3 phase of upper metal piece should be " work "
Font, the lower metal piece output end 5 are " T " font.The input terminal 1 and " T " font sheet metal output end 5 all have outer
The protrusion part of side, the protrusion part can be used for connecting the LED encapsulation branch of power supply circuit or other two-part punch head bendables
Frame.The LED package supports of multiple two-part punch head bendables constitute series connection, are arranged in certain shape, such as round, then may make up
The diversified LED light combination of light emitting angle.
In general, 7 length of tail portion LED lamp cup is longer than the head LED lamp cup length 6.Tail portion LED lamp cup 7 is welded
After having connect LED chip, through injection molding, become LED lamp cup, encapsulates the mixture of fluorescent powder and epoxy resin inside it, at
For LED light, head LED lamp cup is also such.Tail portion LED lamp cup 7 is used for providing the light of horizontal direction, and head LED lamp cup 6 is used for
The light for providing other angles becomes the LED of full firing angle when the LED package supports of multiple two-part punch head bendables form a circle
When wick, multiple tail portion LED lamp cups 7 launch light around.
For the convenience of injection molding and the mixture of encapsulation LED fluorescent powder and epoxy resin, the " I " fonts are penetrating
The two parts up and down in hole are of same size.Similarly, two parts are of same size up and down for the " I " fonts sheet metal." T " word
Type sheet metal output end is upper and lower two-part of same size with the " I " fonts sheet metal.
In certain embodiments of the present invention, described " T " font sheet metal output end lower end is to the direction of Baily input terminal
It is extended downwardly after extension so that " T " font sheet metal output end lower end is far from input terminal.It is thus more convenient the welding in later stage,
And it is not easy short circuit.
The LED package supports of two-part punch head bendable of the present invention are that sheet metal rolls one-pass molding, processing letter through wheel hub
Single, operability is strong.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (9)
1. a kind of LED package supports of two-part punch head bendable, which is characterized in that including input terminal, the input terminal at
" convex " font sheet, the input terminal have top between the protrusion part of " convex " font and the non-protruding part of " convex " font
Through-hole is equipped with the upper metal piece to match with its shape in the top through-hole；The non-protruding part of " convex " font
Lower part to lower edge has lower part through-hole, and the sheet metal to match with its shape is equipped in the lower part through-hole and is exported
End；" convex " font protrusion part the top of upper metal piece between after injection molding constitute head LED lamp cup, it is described on
Tail portion LED lamp cup is constituted after being molded between the lower part of portion's sheet metal and the lower metal piece output end；The head LED lamp cup
Bendable folding part is constituted between the LED lamp cup of tail portion.
2. the LED package supports of two-part punch head bendable as described in claim 1, which is characterized in that the top is penetrating
Sky is " I " fonts, and the upper metal piece is " I " fonts.
3. the LED package supports of two-part punch head bendable as described in claim 1, which is characterized in that the input terminal and
Output end all has the protrusion part in outside, and the protrusion part is for connecting power supply circuit or other two-part punch head bendables
LED package supports.
4. the LED package supports of two-part punch head bendable as described in claim 1, which is characterized in that the tail portion LED light
Cup length is longer than the head LED lamp cup length.
5. the LED package supports of two-part punch head bendable as claimed in claim 2, which is characterized in that the " I " fonts
Two parts up and down of through-hole are of same size.
6. the LED package supports of two-part punch head bendable as claimed in claim 5, which is characterized in that the " I " fonts
Two parts are of same size up and down for sheet metal.
7. the LED package supports of two-part punch head bendable as claimed in claim 6, which is characterized in that the lower metal
Piece output end is " T " font, the top of " T " font and the upper and lower two-part width phase of the " I " fonts sheet metal
Together.
8. the LED package supports of two-part punch head bendable as claimed in claim 7, which is characterized in that " T " the font gold
Belong to piece output end lower end to extend downwardly to after the extension of the direction of input terminal so that " T " font sheet metal output end lower end is remote
From input terminal.
9. the LED package supports of two-part punch head bendable as described in claim 1, which is characterized in that the two-part head
The bent LED package supports in portion are that sheet metal rolls one-pass molding through wheel hub.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610080933.5A CN105591017B (en) | 2016-02-04 | 2016-02-04 | Two-section L ED packaging support with bendable head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610080933.5A CN105591017B (en) | 2016-02-04 | 2016-02-04 | Two-section L ED packaging support with bendable head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105591017A CN105591017A (en) | 2016-05-18 |
| CN105591017B true CN105591017B (en) | 2018-08-21 |
Family
ID=55930441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610080933.5A Active CN105591017B (en) | 2016-02-04 | 2016-02-04 | Two-section L ED packaging support with bendable head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105591017B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129236A (en) * | 2016-08-30 | 2016-11-16 | 王仕贵 | A kind of every section all can luminous bent multisection type LED line road support |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI387135B (en) * | 2008-03-28 | 2013-02-21 | Ind Tech Res Inst | Light emitting device and manufacturing method thereof |
| TWI488343B (en) * | 2013-01-17 | 2015-06-11 | Lextar Electronics Corp | Led package and light bar having the same |
| US9548261B2 (en) * | 2013-03-05 | 2017-01-17 | Nichia Corporation | Lead frame and semiconductor device |
-
2016
- 2016-02-04 CN CN201610080933.5A patent/CN105591017B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105591017A (en) | 2016-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200717 Address after: 102600 Unit 403, Unit 1, 15th Floor, Changfengyuan, Huangcun Town, Daxing District, Beijing Patentee after: Du Lihong Address before: 528400 Guangdong city of Zhongshan Province in Admiralty village Fu Zhen Shun King Industrial Park Industrial Avenue near Co-patentee before: Wu Shaojian Patentee before: ZHONGSHAN DINGRED PHOTOELECTRIC Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CP02 | Change in the address of a patent holder |
Address after: 241000 room 4 1001, service outsourcing park, high tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee after: Du Lihong Address before: 102600 Unit 403, Unit 1, 15th Floor, Changfengyuan, Huangcun Town, Daxing District, Beijing Patentee before: Du Lihong |
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| CP02 | Change in the address of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220427 Address after: 523109 floor 2, building C, Jinlong Road North, Jinchuan Second Road, Jinchuan Industrial Zone, Xiegang village, Xiegang Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN KAICHANG OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 241000 room 4 1001, service outsourcing park, high tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee before: Du Lihong |
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| TR01 | Transfer of patent right |