CN213815751U

CN213815751U - Inductance packaging body with improved heat dissipation performance

Info

Publication number: CN213815751U
Application number: CN202023299495.2U
Authority: CN
Inventors: 彭建军
Original assignee: Hefei Zuan Investment Partnership Enterprise
Current assignee: Hefei Zuan Investment Partnership Enterprise
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-07-27
Anticipated expiration: 2030-12-31

Abstract

The utility model provides an inductance packaging body with improve heat dispersion, including a packaging body and heat-conducting layer, an at least inductance has in the packaging body, two electrodes of inductance extend to the outside of packaging body, the heat-conducting layer with the surface laminating of inductance, the heat-conducting layer extends to the outside of packaging body. Through set up the one deck heat-conducting layer on the inductance, the heat-conducting layer with the surface laminating of inductance, and the heat-conducting layer extends to the outside of packaging body, the packaging body operation during operation in the inductance, the heat energy that the inductance produced wherein a small part conducts the outside through the plastic-sealed material of packaging body to distribute away, most heat energy wherein directly transmits to the outside of plastic-sealed body from inductance itself through the heat-conducting layer, do not receive blockking of plastic-sealed body, directly distribute away, the radiating efficiency is high, thereby can not make the inductance be in high temperature state for a long time and move down, reduce the damage inductance, and reduced the old speed of trading of inductance, prolonged its life.

Description

Inductance packaging body with improved heat dissipation performance

Technical Field

The utility model relates to a semiconductor package technical field especially relates to an inductance packaging body with improve heat dispersion.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: a wafer from a wafer previous process is cut into small chips (Die) through a scribing process, then the cut chips are pasted on small islands of corresponding substrate (Lead frame) frames through glue, and bonding pads (Bond pads) of the chips are connected to corresponding pins (Lead) of the substrate through superfine metal (gold tin copper aluminum) wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out procedures such as inspection, Test, packaging and the like, and finally warehousing and shipping.

Among the prior art, inductance components and parts after the encapsulation are when using for a long time, after letting in the electric current, the phenomenon that generates heat appears very easily, generally all adopt the radiator fan in the equipment to cool off and dispel the heat to it, but this kind of radiating effect, though it is fine to the surface heat radiating effect of packaging body, but the inside heat energy of inductance can not effectual transmission to the outside of packaging body, at the inductance that is in operating condition for a long time, high temperature makes the inductance damage very easily, perhaps aggravates its ageing speed, be unfavorable for the use of packaging body, the quality of packaging body has been reduced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a can increase of service life's inductance packaging body that has improvement heat dispersion.

The utility model discloses the technical scheme who takes as follows:

the inductor packaging body with the improved heat dissipation performance comprises a packaging body and a heat conduction layer, wherein at least one inductor is arranged in the packaging body, two electrodes of the inductor extend to the outside of the packaging body, the heat conduction layer is attached to the surface of the inductor, and the heat conduction layer extends to the outside of the packaging body.

Further, the heat conduction layer outside the packaging body is flush with the outer surface of the packaging body.

Further, the heat conduction layer is located between the two electrodes, and the heat conduction layer and the two electrodes are located on the same side of the package body.

Further, the heat conduction layer and the two electrodes are located on two opposite sides of the inductor.

Further, the heat conduction layer is made of one of Cu, Ni and Fe.

Compared with the prior art, the utility model, the beneficial effects are as follows: through set up the one deck heat-conducting layer on the inductance, the heat-conducting layer with the surface laminating of inductance, and the heat-conducting layer extends to the outside of packaging body, the packaging body operation during operation in the inductance, the heat energy that the inductance produced wherein a small part conducts the outside through the plastic-sealed material of packaging body to distribute away, most heat energy wherein directly transmits to the outside of plastic-sealed body from inductance itself through the heat-conducting layer, do not receive blockking of plastic-sealed body, directly distribute away, the radiating efficiency is high, thereby can not make the inductance be in high temperature state for a long time and move down, reduce the damage inductance, and reduced the old speed of trading of inductance, prolonged its life.

Drawings

Fig. 1 is a schematic structural view of an inductor package with improved heat dissipation performance according to the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the inductor package with improved heat dissipation performance according to the present invention.

Detailed Description

The present invention will now be described in connection with particular embodiments, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar components or components having the same or similar function throughout.

The utility model discloses directional phrase mentioned, for example: upper, lower, left, right, front, rear, inner, outer, front, back, side, etc., are merely directions with reference to the drawings, and the embodiments described below by referring to the drawings and directional terms used are exemplary and are only used for explaining the present invention, and are not to be construed as limiting the present invention. In addition, the present invention provides examples of various specific processes and materials that one of ordinary skill in the art would recognize for other processes and/or other materials to use.

Please refer to fig. 1 and fig. 2, in which fig. 1 is a schematic structural diagram of an inductor package with improved heat dissipation performance according to the present invention; fig. 2 is a schematic structural diagram of another embodiment of the inductor package with improved heat dissipation performance according to the present invention.

The inductor package with improved heat dissipation performance comprises a package 10 and a heat conduction layer 20, wherein the package 10 has at least one inductor 30 therein, and may also have a plurality of inductors 30, in this embodiment, the inductor 30 is implemented by having one inductor 30, two electrodes 31 of the inductor 30 extend to the outside of the package 10 for connecting with an external circuit, one surface of the heat conduction layer 20 is attached to the surface of the inductor 30, and the other surface of the heat conduction layer 20 extends to the outside of the package 10 and is flush with the outer surface of the package 10, so that the occupied space of the package 10 is not affected.

The heat conduction layer 20 is located between the two electrodes 31, and the heat conduction layer 20 and the two electrodes 31 are located on the same side of the package 10, when the two electrodes 31 are installed on the circuit board, the heat conduction layer 20 can be hidden, and the influence of external charged objects on the heat conduction layer 20 on the normal operation of the inductor 30 is avoided.

In other embodiments, as shown in fig. 2, the heat conducting layer 20 and the two electrodes 31 are located on two opposite sides of the inductor 30, and when the two electrodes 31 are mounted on the circuit board, the side where the heat conducting layer 20 is located has a larger space, so that the heat dissipation efficiency can be improved.

The heat conduction layer 20 is made of one of Cu, Ni or Fe, and the material is easy to obtain and convenient for process implementation.

Through set up the one deck heat-conducting layer on the inductance, the heat-conducting layer with the surface laminating of inductance, and the heat-conducting layer extends to the outside of packaging body, the packaging body operation during operation in the inductance, the heat energy that the inductance produced wherein a small part conducts the outside through the plastic-sealed material of packaging body to distribute away, most heat energy wherein directly transmits to the outside of plastic-sealed body from inductance itself through the heat-conducting layer, do not receive blockking of plastic-sealed body, directly distribute away, the radiating efficiency is high, thereby can not make the inductance be in high temperature state for a long time and move down, reduce the damage inductance, and reduced the old speed of trading of inductance, prolonged its life.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The inductor packaging body with the improved heat dissipation performance is characterized by comprising a packaging body (10) and a heat conduction layer (20), wherein at least one inductor (30) is arranged in the packaging body (10), two electrodes (31) of the inductor (30) extend to the outside of the packaging body (10), the heat conduction layer (20) is attached to the surface of the inductor (30), and the heat conduction layer (20) extends to the outside of the packaging body (10).

2. The inductor package with improved heat dissipation of claim 1, wherein the thermally conductive layer (20) outside the package (10) is flush with the outer surface of the package (10).

3. The package with improved heat dissipation of claim 1, wherein the thermally conductive layer (20) is between the two electrodes (31), and the thermally conductive layer (20) is on the same side of the package (10) as the two electrodes (31).

4. The inductor package with improved heat dissipation of claim 1, wherein the thermally conductive layer (20) and the two electrodes (31) are on opposite sides of the inductor (30).

5. The inductor package with improved heat dissipation performance of claim 1, wherein the material of the heat conductive layer (20) is one of Cu, Ni or Fe.