CN202816883U - Pressure plate for packaging semiconductor chips - Google Patents
Pressure plate for packaging semiconductor chips Download PDFInfo
- Publication number
- CN202816883U CN202816883U CN 201220440552 CN201220440552U CN202816883U CN 202816883 U CN202816883 U CN 202816883U CN 201220440552 CN201220440552 CN 201220440552 CN 201220440552 U CN201220440552 U CN 201220440552U CN 202816883 U CN202816883 U CN 202816883U
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- CN
- China
- Prior art keywords
- plate body
- hole
- pressure
- plate
- claws
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the technical field of semiconductor chip packaging, and specifically relates to a pressure plate for packaging semiconductor chips. The pressure plate comprises a plate body, locking blocks are arranged on both sides of the plate body, a through hole is arranged in the center of the plate body, and a plurality of pressure claws are arranged on inner edges of the trough hole of the plate body. A fine adjustment device is arranged on the pressure claws. The fine adjustment device comprises adjustment plates arranged in correspondence with each pressure claw, and the adjustment plates each is provided with adjusting holes having screws for fixed connection with the plate body. According to the utility model, a plurality of pressure claws are arranged all around the through hole of the plate body so as to hold pins of a lead frame in welding, so that compared with the prior art in which the pressure claws are arranged on edges of one side or two opposite sides of the through hole of the plate body, the structure of the pressure plate and the pressure claws is reasonable; and the pressure claws are dispersed, thereby facilitating the fixation and improving the pressure stability.
Description
Technical field
The utility model relates to the semiconductor packaging field, particularly relates to a kind of semiconductor die package pressing plate.
Background technology
Need in the encapsulation process of semi-conductor discrete device with wire rod power device chip to be connected with the pin of lead frame, this process is called bonding, general mode is that lead frame is put on the hot plate of 180oC～300oC, re-uses to carry out bonding wire after pressing plate is fixed lead frame or power device chip.
In the prior art, the structure of pressing plate comprises plate body, the both sides of plate body are provided with lock dog, be used for being connected with bonding apparatus, be provided with a square through hole at the middle part of plate body, during bonding, chip in the pin of lead frame and the slide glass district exposes in order to it is carried out bonding wire from through hole, side in through hole on the plate body stretches out a row or two several paws corresponding with the lead frame pin of row in through hole, be used for pushing down the pin of lead frame, prevent its springing, make bonding wire firm, these paws and plate body are formed in one fixed, can't regulate, as long as have fine difference between the lead frame, perhaps pressing plate produces certain deformation in long-time the use, pressing plate then occurs easily can not be fastened the pin of each lead frame, the springing of part pin occurs in bonding process, produce the problem that the pin solder joint is not reached the standard grade, the product defect rate is high, production efficiency is low, waste of manpower and raw material.
Summary of the invention
The purpose of this utility model be to avoid weak point of the prior art and provide a kind of rational in infrastructure, pressing firm semiconductor die package pressing plate.
The purpose of this utility model is achieved through the following technical solutions:
A kind of semiconductor die package pressing plate comprises plate body, and the both sides of described plate body are equipped with lock dog, and the middle part of described plate body is provided with through hole, and described plate body is provided with paw, and described plate body through hole inward flange is equipped with some described paws.
Further, described paw is provided with micromatic setting.
Further, described micromatic setting comprises the adjustable plate that corresponding each paw arranges, and described adjustable plate arranges adjustment hole, is provided with the screw affixed with described plate body in the described adjustment hole.
Further, described plate body through hole is square, and each side of described plate body through hole is equipped with some described paws, and the some paws that are positioned at a side are fixed on the micromatic setting.
Further, described micromatic setting comprises the adjusting transverse slat, and the some paws that are positioned at a side are fixed in described adjusting transverse slat, and the both sides of described adjusting transverse slat are equipped with adjustment hole, are provided with the screw affixed with described plate body in the described adjustment hole.
The beneficial effects of the utility model:
A kind of semiconductor die package pressing plate of the present utility model, be equipped with some paws around the plate body through hole, be used for when bonding wire, pushing down the pin of lead frame, through hole one side of plate body or the design that two opposite side are provided with some paws in the prior art, the structure of pressing plate and paw is more reasonable, paw distributes and comparatively disperses, and is convenient to fix, and is pressing more firm.
Description of drawings
Utilize accompanying drawing that the utility model is described further, but the content in the accompanying drawing does not consist of any restriction of the present utility model.
Fig. 1 is the working state schematic representation that a kind of semiconductor die package of the present utility model is used pressing plate;
Fig. 2 is another working state schematic representation that a kind of semiconductor die package of the present utility model is used pressing plate.
In Fig. 1, Fig. 2, include:
Wherein, 1---plate body;
2---lock dog;
3---through hole;
4---paw;
5---lead frame;
6---adjustable plate;
7---adjustment hole;
8---screw;
9---regulate transverse slat.
Embodiment
The utility model is described in further detail with the following Examples.
Embodiment 1:
A kind of semiconductor die package pressing plate described in the utility model, as shown in Figure 1, comprise plate body 1, the both sides of plate body 1 are equipped with lock dog 2, are used for being connected with bonding apparatus, and the middle part of plate body 1 is provided with through hole 3, through hole 3 on the plate body 1 is square, during bonding, the chip in the pin of lead frame 5 and the slide glass district exposes in order to it is carried out bonding wire from through hole 3, and through hole 3 inward flanges of plate body 1 are equipped with some paws 4.
In order to regulate the position of paw 4, make paw 4 better push down the pin of lead frame 5, prevent its springing, paw 4 is provided with micromatic setting, in the present embodiment, micromatic setting comprises the adjustable plate 6 that corresponding each paw 4 arranges, and each adjustable plate 6 arranges an adjustment hole 7, is provided with screw 8 in the adjustment hole 7, screw 8 is affixed with plate body 1, by transferring unscrew 8, then mobile paw 4 is behind correct position, and lock-screw 8 can be regulated the position of paw 4.Increase micromatic setting and can regulate the product that paw adapts to different structure.
Embodiment 2:
The technical scheme of present embodiment and embodiment 1 are basic identical, and its difference is:
As shown in Figure 2, each side of the through hole 3 of plate body 1 is provided with some paws 4, and wherein top some paws 4 of being positioned at a side are fixed in one and regulate on the transverse slat 9, and the both sides of regulating transverse slat 9 are equipped with adjustment hole 7, are provided with screw 8 in the adjustment hole 7.
Corresponding each paw 4 of through hole 3 other 3 sides of plate body 1 arranges an adjustable plate 6, and adjustment hole 7 is set on the adjustable plate 6, is provided with screw 8 in the adjustment hole 7, and screw 8 is affixed with plate body 1.
It should be noted that at last: above only is preferred embodiment of the present utility model, be not limited to the utility model, although with reference to embodiment the utility model is had been described in detail, for a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. a semiconductor die package pressing plate comprises plate body, and the both sides of described plate body are equipped with lock dog, and the middle part of described plate body is provided with through hole, and described plate body is provided with paw, it is characterized in that: described plate body through hole inward flange is equipped with some described paws.
2. a kind of semiconductor die package pressing plate according to claim 1, it is characterized in that: described paw is provided with micromatic setting.
3. a kind of semiconductor die package pressing plate according to claim 2, it is characterized in that: described micromatic setting comprises the adjustable plate that corresponding each paw arranges, described adjustable plate arranges adjustment hole, is provided with the screw affixed with described plate body in the described adjustment hole.
4. a kind of semiconductor die package pressing plate according to claim 2, it is characterized in that: described plate body through hole is square, and each side of described plate body through hole is equipped with some described paws, and the some paws that are positioned at a side are fixed on the micromatic setting.
5. a kind of semiconductor die package pressing plate according to claim 4, it is characterized in that: described micromatic setting comprises the adjusting transverse slat, the some paws that are positioned at a side are fixed in described adjusting transverse slat, the both sides of described adjusting transverse slat are equipped with adjustment hole, are provided with the screw affixed with described plate body in the described adjustment hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440552 CN202816883U (en) | 2012-08-31 | 2012-08-31 | Pressure plate for packaging semiconductor chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440552 CN202816883U (en) | 2012-08-31 | 2012-08-31 | Pressure plate for packaging semiconductor chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816883U true CN202816883U (en) | 2013-03-20 |
Family
ID=47875725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220440552 Expired - Fee Related CN202816883U (en) | 2012-08-31 | 2012-08-31 | Pressure plate for packaging semiconductor chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816883U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022045B (en) * | 2014-06-20 | 2016-08-17 | 成都先进功率半导体股份有限公司 | A kind of flatten the device of index hole on lead frame |
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
-
2012
- 2012-08-31 CN CN 201220440552 patent/CN202816883U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022045B (en) * | 2014-06-20 | 2016-08-17 | 成都先进功率半导体股份有限公司 | A kind of flatten the device of index hole on lead frame |
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20130831 |