CN106374333A - Package method of diode pumping laser module - Google Patents
Package method of diode pumping laser module Download PDFInfo
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- CN106374333A CN106374333A CN201610970077.0A CN201610970077A CN106374333A CN 106374333 A CN106374333 A CN 106374333A CN 201610970077 A CN201610970077 A CN 201610970077A CN 106374333 A CN106374333 A CN 106374333A
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- positive
- diode
- module
- lower lock
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention provides a package method of a diode pumping laser module. According to the package method, N triangular prisms are combined to form a regular N-polygonal device entity, the device entity is uniformly extended outwards by tightening an upper press block and a lower press block which are vertically symmetric and are in conical shapes, corresponding N diode modules outside the device entity are tightened, welding fluxes are added to adjacent positions of the N diode modules and are molten in a high-temperature furnace, and the device module is disassembled after normal-temperature cooling to obtain the diode pumping laser module. By the package method of the diode pumping laser module, the distribution uniformity of the diode modules on a cooler is improved, the pumping performance of a crystal rod is improved, the package step is simple and high-efficiency, the safety of the diode modules is improved, and the package of the diode pumping laser module in relatively small specification is achieved.
Description
Technical field
The invention belongs to semiconductor laser technique field is and in particular to a kind of diode-pumped nd yag laser module encapsulation method.
Background technology
Annular pump module is vital ingredient in diode-pumped solid laser system.In annular pump mould
In block, diode (led) module is directly connected to its pumping performance around the uniformity of crystal bar (gain medium) circle distribution.And
Crystal bar and cooler can be coaxial by machining guarantee, and therefore on the just interior tangent plane of cooler, diode (led) module encapsulation is equal
Even property directly affects the pumping performance of module.Early stage diode (led) module encapsulates completely by hand, is primarily present following Railway Project:
(1) heat sink in diode (led) module and potsherd fixation is insecure, fill solder is difficult；
(2) after welding, solder cannot separate with cooler；
(3) there is no diode (led) module safeguard procedures, diode (led) module is easily bruised；
(4) inconvenient operation, packaging efficiency is low；
(5) on cooler each diode (led) module discontinuity so as to distributing homogeneity cannot ensure；
(6) cannot encapsulate by hand for the pump module compared with small dimension.
Currently need the envelope of a kind of pumping diode (led) module and annular pump module cooler (hereinafter referred to as cooler) badly
Dress method.
Content of the invention
A technical problem to be solved by this invention is a kind of diode-pumped nd yag laser module encapsulation method.
Used in the diode-pumped nd yag laser module encapsulation method of the present invention, packaging system includes installation pedestal, cooling
Device, lower lock block, device entity, o type circle, silicone rubber pad, upper holder block and long spiro nail, diode (led) module；
Described cooler is placed on the upper surface of installation pedestal；
Described device entity is the positive n side body being made up of n identical triangular prism, and cooler inner chamber is to join with device entity
Dress positive n side shape cavity, have in installation pedestal with device entity be equipped with positive n side shape groove, positive n in shape cavity, positive n shape groove and
The center overlapping of axles of positive n side body, positive n body when shape cavity is with positive n has uniform gap l1, positive n shape when shape groove is with positive n
There are uniform gap l2, l1 ＞ l2 between body；Shape boss when positive n has positive n in shape groove, the height of positive n side shape boss is more than positive n
The height of side shape groove, positive n gap l1 between shape cavity and positive n side body when shape boss is inserted upwardly into positive n；n≥5；
The inner chamber of described device entity is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, and upper holder block is to be equipped with upper conical chamber
Circular cone, lower lock block be with inferior pyramidal chamber be equipped with circular cone, run through between upper holder block and lower lock block and have vertical long spiro nail,
Tighten long spiro nail, upper holder block and lower lock block are close in opposite directions；
The lower end of described lower lock block is cylinder, and the location hole with the shape groove insertion of positive n side is arranged at installation pedestal bottom, lower lock block
Cylinder and location hole are equipped with, after the cylinder of lower lock block sinks to location hole, the lower surface of device entity and positive n side shape boss
The EDGE CONTACT of upper surface；
The face symmetrical above and below of the outer surface of described device entity is wound around o type circle, the outer surface of each triangular prism of device entity
Horizontally and vertically direction symmetrical thickness identical silicone rubber pad, the vertically symmetrical center of the outer surface of each triangular prism is stayed
There is gap；
Described method for packing comprises the following steps:
A. cooler is arranged on the upper surface of installation pedestal；
B. with o type circle, device entity is bundled into a positive n side body；
C. upper holder block and lower lock block are arranged in the inner chamber of device entity, then by tightening long spiro nail, by device entity, on
Briquetting and lower lock block are fixed into an apparatus module；
D. apparatus module is vertically penetrated cooler and installation pedestal, the cylinder of lower lock block lower end and installation pedestal bottom
Location hole is equipped with positioning；
E. n diode (led) module is individually positioned in the upper surface of corresponding positive n side shape boss；
F. continue to tighten long spiro nail, upper holder block and lower lock block are close in opposite directions, by n identical triangular prism of component devices entity
Outwards push, until each triangular prism is corresponding compresses corresponding diode (led) module, form a diode assembly；
G. add solder at the position that n diode (led) module has a common boundary；
H. diode assembly is put into high temperature furnace, raise high temperature furnace furnace temperature, until solder melts；
I. take out diode assembly, after room temperature cooling, remove apparatus module, obtain diode-pumped nd yag laser module.
The material of described installation pedestal is oxygen-free copper.
The linear groove of vertical direction is carved with the vertically symmetrical center of each Rhizoma Sparganii outer surface of column of described device entity.
Described gap l1 and gap l2, meets 2 mm≤l1- l2≤3mm.
The diode-pumped nd yag laser module encapsulation method of the present invention improves being evenly distributed of diode (led) module on cooler
Property, improves the pumping performance of crystal bar, encapsulation step is simply efficient, improves the safety of diode (led) module it is achieved that relatively
The diode-pumped nd yag laser module encapsulation of small dimension.The diode-pumped nd yag laser module encapsulation method of the present invention is suitable in quasiconductor
Use in laser module manufacturing process.
Brief description
Fig. 1 is the packaging system front view in the diode-pumped nd yag laser module encapsulation method of the present invention；
Fig. 2 is the packaging system top view in the diode-pumped nd yag laser module encapsulation method of the present invention；
In figure, 1. installation pedestal 2. cooler 3. lower lock block 4. device entity 5.o type circle 6. silicone rubber pad 7.
Upper holder block 8. long spiro nail 9. diode (led) module.
Specific embodiment
Describe the present invention with reference to the accompanying drawings and examples in detail.
Following examples are merely to illustrate the present invention, and not limitation of the present invention.Relevant person skilled in the art exists
In the case of the spirit and scope of the present invention, can also make a variety of changes, replace and modification, therefore equal technology
Scheme falls within scope of the invention.
As shown in Figure 1, 2, used in the diode-pumped nd yag laser module encapsulation method of the present invention, packaging system includes pacifying
Dress pedestal 1, cooler 2, lower lock block 3, device entity 4, o type circle 5, silicone rubber pad 6, upper holder block 7 and long spiro nail 8, diode die
Block 9；
Described cooler 2 is placed on the upper surface of installation pedestal 1；
Described device entity 4 is the positive n side body being made up of n identical triangular prism, and cooler 2 inner chamber is and device entity
4 equipped positive n side shape cavitys, have the positive n side shape groove being equipped with device entity 4, positive n is in shape cavity, positive n in installation pedestal 1
Shape groove and the center overlapping of axles of positive n side body, positive n body in shape cavity and positive n has a uniform gap l1, positive n side shape groove with
There are uniform gap l2, l1 ＞ l2 between the body of positive n side；Shape boss when positive n has positive n in shape groove, the height of positive n side shape boss
More than the height of positive n side shape groove, positive n gap l1 between shape cavity and positive n side body when shape boss is inserted upwardly into positive n；n≥5；
The inner chamber of described device entity 4 is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, and upper holder block 7 is to join with upper conical chamber
The circular cone of dress, lower lock block 3 is the circular cone being equipped with inferior pyramidal chamber, and running through between upper holder block 7 and lower lock block 3 has vertical length
Screw 8, tightens long spiro nail 8, and upper holder block 7 and lower lock block 3 are close in opposite directions；
The lower end of described lower lock block 3 is cylinder, and the location hole with the shape groove insertion of positive n side, lower lock block are arranged at installation pedestal 1 bottom
3 cylinder and location hole are equipped with, after the cylinder of lower lock block 3 sinks to location hole, the lower surface of device entity 4 and positive n side shape
The EDGE CONTACT of the upper surface of boss；
The face symmetrical above and below of the described outer surface of device entity 4 is wound around o type circle 5, the appearance of each triangular prism of device entity 4
The horizontally and vertically direction symmetrical thickness identical silicone rubber pad 6 in face, the outer surface of each triangular prism vertically symmetrical in
The heart leaves gap；
Described method for packing comprises the following steps:
A. cooler 2 is arranged on the upper surface of installation pedestal 1；
B. with o type circle 5, device entity 4 is bundled into a positive n side body；
C. upper holder block 7 and lower lock block 3 are arranged in the inner chamber of device entity 4, then by tightening long spiro nail 8, by device entity
4th, upper holder block 7 and lower lock block 3 are fixed into an apparatus module；
D. apparatus module is vertically penetrated cooler 2 and installation pedestal 1, the cylinder of lower lock block 3 lower end and installation pedestal 1 bottom
The location hole in portion is equipped with positioning；
E. n diode (led) module 9 is individually positioned in the upper surface of corresponding positive n side shape boss；
F. continue to tighten long spiro nail 8, upper holder block 7 and lower lock block 3 are close in opposite directions, by the n identical three of component devices entity 4
Prism is outwards pushed, until each triangular prism is corresponding compresses corresponding diode (led) module 9, forms a diode assembly；
G. add solder at the position that n diode (led) module 9 has a common boundary；
H. diode assembly is put into high temperature furnace, raise high temperature furnace furnace temperature, until solder melts；
I. take out diode assembly, after room temperature cooling, remove apparatus module, obtain diode-pumped nd yag laser module.
The material of described installation pedestal 1 is oxygen-free copper.
The linear groove of vertical direction is carved with the vertically symmetrical center of each Rhizoma Sparganii outer surface of column of described device entity 4.
Described gap l1 and gap l2, meets 2 mm≤l1- l2≤3mm.
Embodiment 1
Cooler 2 is arranged on the upper surface of installation pedestal 1 by 1a.；
Device entity 4 is bundled into a regular pentagon body, n=5 with o type circle 5 by 1b.；
Upper holder block 7 and lower lock block 3 are arranged in the inner chamber of device entity 4 1c., then by tightening long spiro nail 8, device is real
Body 4, upper holder block 7 and lower lock block 3 are fixed into an apparatus module；
Apparatus module is vertically penetrated cooler 2 and installation pedestal 1, the cylinder of lower lock block 3 lower end and installation pedestal 1 bottom by 1d.
The location hole in portion is equipped with positioning, gap l1 and gap l2, meets l1-l2=2mm；
5 diode (led) modules 9 are individually positioned in the upper surface of corresponding regular pentagon boss by 1e.；
1f. continues to tighten long spiro nail 8, and upper holder block 7 and lower lock block 3 are close in opposite directions, by 5 identicals three of component devices entity 4
Prism is outwards pushed, until each triangular prism is corresponding compresses corresponding diode (led) module 9, forms a diode assembly；
1g. adds solder at the position that 5 diode (led) modules 9 have a common boundary, and solder is indium；
Diode assembly is put into high temperature furnace by 1h., raises high temperature furnace furnace temperature, until indium melts；
1i. takes out diode assembly, after room temperature cooling, removes apparatus module, obtains pentagon diode-pumped nd yag laser module.
Embodiment 2
Embodiment 2 is essentially identical with the embodiment of embodiment 1, differs primarily in that n=7, l1-l2=2.5mm, obtains heptagon
Diode-pumped nd yag laser module.
Embodiment 3
Embodiment 3 is essentially identical with the embodiment of embodiment 1, differs primarily in that n=9, l1-l2=3mm, obtains nonagon two
Pole pipe pumping laser module.
Embodiment 4
Embodiment 4 is essentially identical with the embodiment of embodiment 1, differs primarily in that n=11, l1-l2=3mm, obtains ten
Shape diode-pumped nd yag laser module.
Claims (4)
1. a kind of diode-pumped nd yag laser module encapsulation method it is characterised in that:
Used in described method for packing, packaging system includes installation pedestal (1), cooler (2), lower lock block (3), device in fact
Body (4), o type circle (5), silicone rubber pad (6), upper holder block (7) and long spiro nail (8), diode (led) module (9)；
Described cooler (2) is placed on the upper surface of installation pedestal (1)；
Described device entity (4) is the positive n side body being made up of n identical triangular prism, and cooler (2) inner chamber is and device
The positive n side shape cavity that entity (4) is equipped with, has the positive n side shape groove being equipped with device entity (4), positive n side shape in installation pedestal (1)
The center overlapping of axles of cavity, the positive n body in shape groove and positive n, positive n body when shape cavity is with positive n has uniform gap l1, just
N has uniform gap l2, l1 ＞ l2 in shape groove and positive n between body；Shape boss when positive n has positive n in shape groove, positive n side shape
The height of boss is more than the height of positive n side shape groove, positive n seam between shape cavity and positive n side body when shape boss is inserted upwardly into positive n
Gap l1；n≥5；
The inner chamber of described device entity (4) be laterally zygomorphic upper conical chamber and inferior pyramidal chamber, upper holder block (7) be with upper conical
The circular cone that chamber is equipped with, lower lock block (3) is the circular cone being equipped with inferior pyramidal chamber, runs through between upper holder block (7) and lower lock block (3)
There is vertical long spiro nail (8), tighten long spiro nail (8), upper holder block (7) and lower lock block (3) are close in opposite directions；
The lower end of described lower lock block (3) is cylinder, and the location hole with the shape groove insertion of positive n side is arranged at installation pedestal (1) bottom, under
The cylinder of briquetting (3) is equipped with location hole, after the cylinder of lower lock block (3) sinks to location hole, the lower surface of device entity (4)
EDGE CONTACT with the upper surface of positive n side shape boss；
The face symmetrical above and below of the described outer surface of device entity (4) is wound around o type circle (5), each triangular prism of device entity (4)
Outer surface horizontally and vertically direction symmetrical thickness identical silicone rubber pad (6), the outer surface of each triangular prism perpendicular
Straight symmetrical centre leaves gap；
Described method for packing comprises the following steps:
A. cooler (2) is arranged on the upper surface of installation pedestal (1)；
B. with o type circle (5), device entity (4) is bundled into a positive n side body；
C. upper holder block (7) and lower lock block (3) are arranged in the inner chamber of device entity (4), then by tightening long spiro nail (8), will
Device entity (4), upper holder block (7) and lower lock block (3) are fixed into an apparatus module；
D. apparatus module is vertically penetrated cooler (2) and installation pedestal (1), the cylinder of lower lock block (3) lower end and installation base
The location hole of seat (1) bottom is equipped with positioning；
E. n diode (led) module (9) is individually positioned in the upper surface of corresponding positive n side shape boss；
F. continue to tighten long spiro nail (8), upper holder block (7) and lower lock block (3) are close in opposite directions, by the n of component devices entity (4)
Identical triangular prism is outwards pushed, until each triangular prism is corresponding compresses corresponding diode (led) module (9), forms a diode
Assembly；
G. add solder at the position that n diode (led) module (9) has a common boundary；
H. diode assembly is put into high temperature furnace, raise high temperature furnace furnace temperature, until solder melts；
I. take out diode assembly, after room temperature cooling, remove apparatus module, obtain diode-pumped nd yag laser module.
2. diode-pumped nd yag laser module encapsulation method according to claim 1 it is characterised in that: described installation pedestal
(1) material is oxygen-free copper.
3. diode-pumped nd yag laser module encapsulation method according to claim 1 it is characterised in that: described device entity
(4) linear groove of vertical direction is carved with the vertically symmetrical center of each Rhizoma Sparganii outer surface of column.
4. diode-pumped nd yag laser module encapsulation method according to claim 1 it is characterised in that: described gap l1 and
Gap l2, meets 2 mm≤l1- l2≤3mm.
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| CN201610970077.0A CN106374333B (en) | 2016-11-07 | 2016-11-07 | A kind of diode-pumped nd yag laser module encapsulation method |
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| CN201610970077.0A CN106374333B (en) | 2016-11-07 | 2016-11-07 | A kind of diode-pumped nd yag laser module encapsulation method |
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| CN106374333A true CN106374333A (en) | 2017-02-01 |
| CN106374333B CN106374333B (en) | 2019-01-15 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107394571A (en) * | 2017-08-07 | 2017-11-24 | 中国电子科技集团公司第十研究所 | The method for packing and slab laser crystal of a kind of slab laser crystal |
| CN107453191A (en) * | 2017-07-18 | 2017-12-08 | 中国电子科技集团公司第十研究所 | A kind of lath gain media and its manufacture method with radiator structure |
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| CN107394571B (en) * | 2017-08-07 | 2019-07-16 | 中国电子科技集团公司第十一研究所 | A kind of packaging method and slab laser crystal of slab laser crystal |
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| CN106374333B (en) | 2019-01-15 |
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