CN205582899U - System level packaging is with parallel for seam welding anchor clamps of ceramic pin grid array shell - Google Patents
System level packaging is with parallel for seam welding anchor clamps of ceramic pin grid array shell Download PDFInfo
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- CN205582899U CN205582899U CN201620392454.2U CN201620392454U CN205582899U CN 205582899 U CN205582899 U CN 205582899U CN 201620392454 U CN201620392454 U CN 201620392454U CN 205582899 U CN205582899 U CN 205582899U
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Abstract
The utility model discloses a system level packaging is with parallel for seam welding anchor clamps of ceramic pin grid array shell relates to ceramic package shell technical field. The utility model discloses an anchor clamps base member is equipped with on the anchor clamps base member when being used for the grafting to place the ceramic package, makes the leaded pin hole that penetrates on the ceramic package, still is equipped with the locating hole with parallel seam sealing machine workstation location. With the shell cartridge in the seam welding anchor clamps, realize well contacting, at the seam welding in -process, fixed shell of usable seam welding anchor clamps and heat dissipation in time, the porcelain takes place and splits the gas leakage problem at ceramic lateral wall for thermal stress direct action when effectively avoiding seam welding.
Description
Technical field
This utility model relates to ceramic package skinning technique field, especially a kind of system in package ceramic pin grid array shell parallel seam welding fixture.
Background technology
System in package ceramic pin grid array shell has superior bearing capacity, is advantageously integrated multiple hydrid integrated circuit, is widely used in the military equipment control systems such as Aeronautics and Astronautics.This series products has shape chamber than the feature such as little, thin-walled, deep chamber, and conventional sealing mode is parallel seam welding.
Parallel seam welding is a kind of microelectronic device package technology grown up to adapt to the encapsulation of dual in line integrated circuit Can, and this air-tight packaging technique is compared with other sealing by fusing techniques, therefore it is a major advantage that encapsulating package localized hyperthermia.
Parallel seam welding belongs to resistance melting welding, and when two conical circular electrodes are applied on two opposite side edges of cover plate, pulse welding electric current by cover plate and welds frame from an electrode, then returns to source of welding current formation loop from another electrode.Owing to there is contact resistance between electrode and cover plate and cover plate and weldering frame, welding current will produce Joule energy at the two contact resistance.Result makes to be partially formed molten condition between cover plate and weldering frame, forms a solder joint after solidification.In welding process, welding current is pulsed, and each pulse current can form a solder joint, owing to shell is for linear motion, electrode on the cover board rolls, and therefore, two limits of cover plate of outer casing form two parallel continuous welds being made up of the solder joint overlapped each other.
Ceramic package can be caused thermal shock by the high heat that during parallel seam welding, moment produces, and when follow-up reliability test, is added up due to residual stress and finally discharge and cause bond strength to reduce after reliability test, finally occurs that layering or cracking leak gas.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of system in package ceramic pin grid array shell parallel seam welding fixture, shell is inserted in seam welding fixture, realize good contact, during seam welding, available seam welding fixture is fixed shell and dispels the heat in time, when being prevented effectively from seam welding, thermal stress acts directly on ceramic sidewalls, occurs porcelain to split leakage problem.
For solving above-mentioned technical problem, technical solution adopted in the utility model is: a kind of system in package ceramic pin grid array shell parallel seam welding fixture, including clip base, clip base is provided with when grafting placing ceramic shell, make on ceramic package the leaded fairlead penetrated, be additionally provided with the hole, location with parallel seam sealing machine table positions.
Further preferred technical scheme, is uniformly distributed on peripheries with some spacing holes in clip base, is used for connecting postive stop baffle.
Further preferred technical scheme, is additionally provided with deep gouge in the centre of clip base, and the width of this deep gouge and the degree of depth are heat sink with back side band boss or boss on dual-surface stereo formula system integration encapsulation class shell is adaptive.
Further preferred technical scheme, the hole centre-to-centre spacing of described fairlead is 1.27mm, 2.54mm.
Further preferred technical scheme, the arrangement mode of described fairlead is staggered network style or the network style of array arrangement.
Further preferred technical scheme, the material of clip base is aluminium alloy.
Further preferred technical scheme, the profile length and width size≤150.00mm × 150.00mm of clip base, the height≤20.00mm of clip base.
Further preferred technical scheme, the depth of parallelism of upper and lower two planes of clip base is 0.05mm.
Further preferred technical scheme, the depth of parallelism of clip base lower plane is 0.05mm.
Use and have the beneficial effects that produced by technique scheme:
(1) compatible strong, similar structures product can common fixture；
(2) meet seam welding cooling requirements, ceramic package structure directly with aluminium alloy holder contacts, heat is directly delivered on fixture through ceramic package, it is to avoid the most only by the situation of pin lead-in wire heat radiation deficiency before；
(3) there is spacing and positioning function, it is simple to use, beneficially bulk article processing；
(4) aluminum alloy materials is used, it is easy to processing；
(5) weight is compared with other heat sink materials, the gentliest；
(6) applied range: the plug-in mounting form shell products such as the similar encapsulation of PGA-Pin-Grid Array, DIP-dual-inline package, all can use clip-like method for designing and theory.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the A-A sectional view of Fig. 1；
Fig. 3 is use view of the present utility model；
In figure: 1, spacing hole；2, fairlead；3, hole, location；4, clip base；5, deep gouge；6, ceramic package；7, seal mouth ring；8, upper cover plate；9, lower cover.
Detailed description of the invention
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
System in package (SIP) is the focus of current packaging technology research, is also the inexorable trend of future electronic encapsulation technology development.This utility model can the reliability of powerful guarantee system in package (SIP) production.
Structure of the present utility model includes clip base 4, as shown in Figure 1 and Figure 2, clip base 4 is provided with when grafting placing ceramic shell 6, make on ceramic package 6 the leaded fairlead 2 penetrated, it is additionally provided with the hole, location 3 with parallel seam sealing machine table positions, this hole, location 3 is for being fixed on ceramic package the workbench of parallel seam sealing machine, and the hole, location 3 in the present embodiment is four, and the pore size in hole 3, location and distribution need according to parallel seam sealing machine design used.Wherein, fairlead 2 needs the outer lead spread pattern according to ceramic pin grid array shell and pore size design, in order to plug-in mounting.
Being uniformly distributed on peripheries with some spacing holes 1 in clip base, spacing hole can be through hole or screwed hole, supporting baffle plate pad, and can realize welding product is spacing, beneficially parallel seam welding operation.
It is additionally provided with deep gouge 5 in the centre of clip base 4 one side, the width of this deep gouge 5 and the degree of depth are heat sink with back side band boss or boss on dual-surface stereo formula system integration encapsulation class shell is adaptive, can be used for that back side band boss is heat sink or dual-surface stereo formula system integration encapsulation series products uses.
The material of this fixture is aluminium alloy, heat conductivity is good, can be used for discharging thermal stress, wherein, the hole that deep gouge position is provided with, also function to the effect of heat radiation, ensure product reliability, fairlead centre-to-centre spacing includes 1.27mm, 2.54mm etc., depending on the position of fairlead and fairlead centre-to-centre spacing are according to the lead-in wire of ceramic package, wherein, the quantity of the fairlead on fixture is more than or equal to the quantity needing seam welding ceramic package lead-in wire, the laying of its fairlead is as shown in Figure 1, fairlead is staggered-mesh or array grid arrangement, pin count≤1500, fixture profile length and width size≤150.00mm × 150.00mm, highly≤20.00mm, the arrangement output of multiple cord array can be met, embody the superiority of this fixture.
Wherein, the depth of parallelism of clip base about 4 two plane is 0.05mm.The depth of parallelism of clip base 4 lower plane is 0.05mm.The machining accuracy of clip base is higher, is beneficial to ensure the quality of encapsulating products.
Fig. 3 is the structure chart that this utility model uses state, the lead-in wire of this ceramic package 6 inserts in fairlead 2 of the present utility model, it is upper cover plate 8 above, upper cover plate 8 is seal mouth ring 7 below, ceramic package 6 lower cover is presented herein below, lower cover 9 is positioned in deep gouge 5, during upper and lower cover plates and ceramic package 6 are seam welding, heat can quick heat radiating by aluminium alloy fixture, it is to avoid defect that only lead-in wire heat radiation causes.
This utility model has the advantage that
(1) compatible strong, similar structures product can common fixture；
(2) meet seam welding cooling requirements, ceramic package body construction directly with aluminium alloy holder contacts, heat is directly delivered on fixture through ceramic body, it is to avoid the most only by the situation of pin lead-in wire heat radiation deficiency before；
(3) there is spacing and positioning function, it is simple to use, beneficially bulk article processing；
(4) aluminum alloy materials is used, it is easy to processing；
(5) weight is compared with other heat sink materials, the gentliest；
(6) applied range: the plug-in mounting form shell products such as similar PGA, DIP, all can use clip-like method for designing and theory.
Claims (9)
1. a system in package ceramic pin grid array shell parallel seam welding fixture, it is characterized in that, including clip base (4), clip base (4) is provided with when grafting placing ceramic shell (6), make the leaded penetrable fairlead (2) on ceramic package (6), be additionally provided with the hole, location (3) with parallel seam sealing machine table positions.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that be uniformly distributed on peripheries with some spacing holes (1) in clip base (4), is used for connecting postive stop baffle.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterized in that, it is additionally provided with in the centre of clip base (4) that deep gouge (5), the width of this deep gouge (5) and the degree of depth and back side band boss be heat sink or boss on dual-surface stereo formula system integration encapsulation class shell is adaptive.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that the hole centre-to-centre spacing of described fairlead (2) is 1.27mm, 2.54mm.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that the arrangement mode of described fairlead (2) is staggered network style or the network style of array arrangement.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that the material of clip base (4) is aluminium alloy.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that the profile length and width size≤150.00mm × 150.00mm of clip base (4), the height≤20.00mm of clip base (4).
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that the depth of parallelism of upper and lower two planes of clip base (4) is 0.05mm.
System in package ceramic pin grid array shell parallel seam welding fixture the most according to claim 1, it is characterised in that the depth of parallelism of clip base (4) lower plane is 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620392454.2U CN205582899U (en) | 2016-05-04 | 2016-05-04 | System level packaging is with parallel for seam welding anchor clamps of ceramic pin grid array shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620392454.2U CN205582899U (en) | 2016-05-04 | 2016-05-04 | System level packaging is with parallel for seam welding anchor clamps of ceramic pin grid array shell |
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| CN205582899U true CN205582899U (en) | 2016-09-14 |
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| CN201620392454.2U Active CN205582899U (en) | 2016-05-04 | 2016-05-04 | System level packaging is with parallel for seam welding anchor clamps of ceramic pin grid array shell |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789097A (en) * | 2016-05-04 | 2016-07-20 | 中国电子科技集团公司第十三研究所 | Clamp for ceramic pin grid array shell parallel seam welding for system level packaging |
-
2016
- 2016-05-04 CN CN201620392454.2U patent/CN205582899U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789097A (en) * | 2016-05-04 | 2016-07-20 | 中国电子科技集团公司第十三研究所 | Clamp for ceramic pin grid array shell parallel seam welding for system level packaging |
| CN105789097B (en) * | 2016-05-04 | 2019-03-26 | 中国电子科技集团公司第十三研究所 | The ceramic pin grid array shell parallel seam welding fixture of system in package |
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