CN207250511U - A kind of super high power COB light source - Google Patents
A kind of super high power COB light source Download PDFInfo
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- CN207250511U CN207250511U CN201721238590.7U CN201721238590U CN207250511U CN 207250511 U CN207250511 U CN 207250511U CN 201721238590 U CN201721238590 U CN 201721238590U CN 207250511 U CN207250511 U CN 207250511U
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Abstract
The utility model discloses a kind of super high power COB light source, including copper base, aluminum nitride ceramic substrate and flip chip, aluminum nitride ceramic substrate includes ceramic substrate, the first layers of copper, metal layer and the second layers of copper, first layers of copper is overlying on the upper surface of ceramic substrate, metal layer is overlying on the upper surface of the first layers of copper, flip chip is arranged on the top of metal layer simultaneously and metal layer, the second layers of copper are overlying on the lower surface of ceramic substrate, and copper base is arranged on the lower section of the second layers of copper and is connected with the second layers of copper.Super high power COB light source provided by the utility model, its is simple in structure, the advantages of having played each structure heat conduction to greatest extent, good heat conductivility, superior thermal resistance structure are more suitable for the application of super-large current high intensity light source, so as to preferably be suitable for the demand of indoor and outdoor large-power lamp.
Description
Technical field
It the utility model is related to a kind of super high power COB light source.
Background technology
Super high power COB LED light sources are in the industry cycle usually presented in the form of COB LED at present.The substrate of existing market
Material is divided into two kinds of structures of metal substrate and ceramic substrate.Metal substrate, is divided into copper base and aluminum substrate, and formal dress substrate divides at present
For copper substrate structure and aluminum substrate, the current substrate of upside-down mounting COB substrates is preferably superconduction constructed of aluminium, and thermal conductivity factor is bad, thermal resistance
It is bigger than normal, cause the high-power COB LED light sources heat conduction of 100W and the above insufficient.When ceramic substrate is packaged, ceramic substrate is easy
It is broken and be not fixed easily, because punching difficulty is big；Excellent heat conductivility can cause ceramic substrate difficulty bonding wire, and the difficult upper tin of pad causes
The electric wire of big copper core cannot be welded, it is difficult to meet the high current application of super high power lamps and lanterns.
Above deficiency, it is to be improved.
Utility model content
In order to overcome the shortcomings of existing technology, the utility model provides a kind of super high power COB light source.
Technical solutions of the utility model are as described below：
A kind of super high power COB light source, including copper base, aluminum nitride ceramic substrate and flip chip, the aluminium nitride pottery
Porcelain substrate includes ceramic substrate, the first layers of copper, metal layer and the second layers of copper, and first layers of copper is overlying on the upper of the ceramic substrate
Surface, the metal layer are overlying on the upper surface of first layers of copper, the flip chip be arranged on the top of the metal layer and with
The metal layer, second layers of copper are overlying on the lower surface of the ceramic substrate, and the copper base is arranged on second layers of copper
Lower section is simultaneously connected with second layers of copper.
Further, the metal layer is made of nickel, palladium and gold.
Further, second layers of copper is welded with the copper base by tin cream.
Further, the flip chip is connected with the metal layer by the way of eutectic.
Further, the copper base separates copper base for thermoelectricity, and both sides are respectively electric channel, and centre is the passage of heat.
Further, the thickness of the aluminum nitride ceramic substrate is 0.38mm~2mm, the thickness of copper base for 1.0mm~
3.0mm。
According to the utility model of such scheme, its advantage is, super high power COB light provided by the utility model
Source, its is simple in structure, the advantages of having played each structure heat conduction to greatest extent, good heat conductivility, superior thermal resistance structure
The application of super-large current high intensity light source is more suitable for, so as to preferably be suitable for the demand of indoor and outdoor large-power lamp.
Brief description of the drawings
Fig. 1 is that the aluminum nitride ceramic substrate eutectic structure of the utility model is intended to.
Fig. 2 is the electrically separated copper substrate structure schematic diagram of the utility model.
Fig. 3 is the COB light source structure diagram of the utility model.
Fig. 4 is the structural side view of the utility model.
Fig. 5 is the production process charts of the COB light source of the utility model.
In figure, reference numeral is as follows：
1- copper bases；11- electric channels；The 12- passage of heats；13- location holes；2- aluminum nitride ceramic substrates；21- ceramic substrates；
The first layers of copper of 22-；23- metal layers；The second layers of copper of 24-；3- flip chips.
Embodiment
Below in conjunction with the accompanying drawings and the utility model is further described in embodiment：
Term " first ", " second " be only used for description purpose, and it is not intended that instruction or imply relative importance or
The implicit quantity for indicating indicated technical characteristic.
As shown in Figures 1 to 4, a kind of super high power COB light source, including copper base 1, aluminum nitride ceramic substrate 2 and upside-down mounting
Chip 3, aluminum nitride ceramic substrate 2 include ceramic substrate 21, the first layers of copper 22,23 and second layers of copper 24 of metal layer, the first layers of copper
22 are overlying on the upper surface of ceramic substrate 21, and metal layer 23 is overlying on the upper surface of the first layers of copper 22, and flip chip 3 is arranged on metal layer 23
Top and be connected with metal layer 23, the second layers of copper 24 is overlying on the lower surface of ceramic substrate 21, and copper base 1 is arranged on the second layers of copper 24
Lower section and be connected with the second layers of copper 24.
The super high power COB light source of the offer of the present embodiment has the beneficial effect that：High-power COB provided by the utility model
Light source, its is simple in structure, the advantages of having played each structure heat conduction to greatest extent, and aluminum nitride ceramic substrate 2 has good heat conduction
Performance, superior low-thermal-resistance structure are more suitable for the application of high current high intensity light source, so as to preferably be suitable for indoor and family
The demand of outer large-power lamp.
Further, metal layer 23 is made of nickel, palladium and gold.
Further, flip chip 3 is connected with metal layer 23 by the way of eutectic.Since aluminium nitride is made pottery in eutectic technology
Porcelain substrate temperature reaches 320 DEG C of even more highs, and the first layers of copper 22 and metal layer 23 of 2 upper surface of ceramic substrate can be good at protecting
The quality and stability of eutectic technology are demonstrate,proved, flip chip 3 is gold-tin alloy substrate, and positive and negative anodes are gold-tin alloy, are being nitrogenized
It is aided with weld-aiding cream between aluminium ceramic substrate 2 and flip chip 3, both is reached perfect fixed and combine, by thermal conductivity
Lifted ultimate attainment, thermal resistance is low have been arrived ultimate attainment, is reduced with voidage after eutectic technology, is ensured 2 surface of aluminum nitride ceramic substrate not
Discoloration, stay in grade.
Further, the second layers of copper 24 is welded with copper base 1 by tin cream.Tin cream is high temperature tin cream, fusing point at 217 DEG C,
The thermal conductivity factor of high temperature tin cream reaches 50W/ (mK), and thermal conductivity factor is good, and has good electric conductivity, stability, resistance to again
The features such as time property, therefore the integrated electrical and thermal conductivity performance that not only ensure that light source is welded using tin cream, it also ensure that aluminium nitride
The good conjugation with copper base.
Further, copper base 1 separates copper base for thermoelectricity, and both sides are respectively electric channel 11, and centre is the passage of heat 12.Copper
Substrate 1 is boss structure, and heat dissipation is introduced directly into copper base 1 by boss, and positive and negative anodes pad is set in insulating layer, thermoelectricity separated structure
Meter conjugation is good, and voidage is low, ensure that the stability and uniformity of whole COB light source structure.
In the present embodiment, the circuit of the lower surface of aluminum nitride ceramic substrate 2 is also thermoelectricity separated structure, is made pottery in aluminium nitride
When porcelain substrate 2 carries out Reflow Soldering operation with copper base 1, it ensure that copper base 1 and the tin cream Reflow Soldering of aluminum nitride ceramic substrate 2 are imitated
Fruit.
In the present embodiment, the thickness of aluminum nitride ceramic substrate 2 is 0.38mm~2mm, and the thickness of copper base 1 is 1.0mm
~3.0mm.The thickness that aluminum nitride ceramic substrate 2 is set is 0.38mm~2mm scopes, ensure that low thermal resistance, while processes also side
Just；The setting of 1 thickness of copper base, the mainly rigidity from fixed light source, the too thin 1 easy warpage of copper base of thickness, therefore set
The size of the thickness and copper base 1 of determining copper base 1 has relation, and 1 area of copper base is larger, then thickness is bigger, 1 face of copper base
Product is smaller, then thickness can be reduced slightly, and for convenience of supplier's operation, the thickness of copper base 1 is arranged on 1.0mm~3.0mm scopes
It is interior.
In the present embodiment, the corner of copper base 1 is equipped with location hole 13, for copper base 1 to be fixed on large-power lamp
On, ensure perfect adaptation of the COB light source on lamps and lanterns.
As shown in figure 5, another purpose of the utility model is to provide a kind of making work of super high power COB light source
Skill, including：
S1：Prepare material, be specially：The material of preparation includes aluminum nitride ceramic substrate, copper base and flip chip；
S2：Expand crystalline substance, be specially：Flip chip is expanded, easy to die bond；
S3：Point eutectic weld-aiding cream, is specially：Weld-aiding cream is squeezed into the point lacquer disk(-sc) of bonder, the most small size die bond dispensing of use
Pin is by weld-aiding cream point on aluminum nitride ceramic substrate；
S4：Die bond, is specially：Flip chip is placed on to the top of weld-aiding cream；
S5：Eutectic operation, is specially：Eutectic weld job is carried out using eutectic furnace, makes flip chip and aluminium nitride ceramics
Substrates into intimate combines；
S6：Test for the first time, be specially：Whether qualified test each photoelectric parameter of eutectic COB light source；
S7：Sprayed with fluorescent powder；Specially：The COB light source that eutectic weldering operation is handled is sprayed fluorescence with fluorescent powder jet printing machine
Powder, carries out test monitoring in spraying process, ensures the accuracy in colour temperature color area；
S8：Baking, is specially：The baking condition of COB light source need to be generally 120 depending on the baking condition of fluorescent powder
Degree/2h turns or 150 degree/2h；
S9：Second of test, is specially：Whether qualified test each photoelectric parameter of COB light source；
S10：Cut COB light source：Specially：Aluminum nitride ceramic substrate is that in flakes, COB light source need to be carried out using cutting machine
Cutting；
S11：Aluminum nitride ceramic substrate is pasted, is specially：The print solder paste on copper base, then by the COB light of well cutting
Source semi-finished product are attached on copper base；
S12：Reflow Soldering operation, is specially：COB light source semi-finished product and copper base are fixed using Reflow Soldering operation；
S13：Third time is tested, and is specially：Whether qualified test each photoelectric parameter of COB light source；
S14：Packaging and storage, is specially：It is vacuum-packed with vacuum formed box, refills case storage.
The manufacture craft of super high power COB light source provided by the utility model, its structure, technique are simple, to greatest extent
The advantages of having played each structure heat conduction, good heat conductivility, superior thermal resistance structure are more suitable for super-large current high density light
The application in source, so as to preferably be suitable for the demand of indoor and outdoor large-power lamp.
Further, in step sl, aluminum nitride ceramic substrate is made of DPC techniques, and the technique of DPC is in ceramic base
The first layers of copper is covered in the upper surface of plate, in the upper surface metal-clad of the first layers of copper, covers the second layers of copper in the lower surface of ceramic substrate.
Further, metal layer is made of heavy NiPdAu technique.
Further, in step sl, the pad of copper base upper surface using turmeric technique or uses anti-oxidation processing.
It should be appreciated that for those of ordinary skills, can according to the above description be improved or converted,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Exemplary description is carried out to the utility model patent above in conjunction with attached drawing, it is clear that the reality of the utility model patent
Now be not subject to the restrictions described above, if employ the utility model patent methodology and technical solution carry out it is various
Improve, or it is not improved the design of the utility model patent and technical solution are directly applied into other occasions, in this reality
With in new protection domain.
Claims (6)
1. a kind of super high power COB light source, it is characterised in that described including copper base, aluminum nitride ceramic substrate and flip chip
Aluminum nitride ceramic substrate includes ceramic substrate, the first layers of copper, metal layer and the second layers of copper, and first layers of copper is overlying on the ceramics
The upper surface of substrate, the metal layer are overlying on the upper surface of first layers of copper, and the flip chip is arranged on the metal layer
Top is simultaneously overlying on the lower surface of the ceramic substrate with the metal layer, second layers of copper, and the copper base is arranged on described the
The lower section of two layers of copper is simultaneously connected with second layers of copper.
2. super high power COB light source according to claim 1, it is characterised in that the metal layer is by nickel, palladium and golden structure
Into.
3. super high power COB light source according to claim 1, it is characterised in that second layers of copper and the copper base
Welded by tin cream.
4. super high power COB light source according to claim 1, it is characterised in that the flip chip and the metal layer
Connected by the way of eutectic.
5. super high power COB light source according to claim 1, it is characterised in that the copper base separates copper-based for thermoelectricity
Plate, both sides are respectively electric channel, and centre is the passage of heat.
6. super high power COB light source according to claim 1, it is characterised in that the thickness of the aluminum nitride ceramic substrate
For 0.38mm~2mm, the thickness of copper base is 1.0mm~3.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721238590.7U CN207250511U (en) | 2017-09-26 | 2017-09-26 | A kind of super high power COB light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721238590.7U CN207250511U (en) | 2017-09-26 | 2017-09-26 | A kind of super high power COB light source |
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| Publication Number | Publication Date |
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| CN207250511U true CN207250511U (en) | 2018-04-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482001A (en) * | 2017-09-26 | 2017-12-15 | 深圳市立洋光电子股份有限公司 | A kind of super high power COB light source and its manufacture craft |
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2017
- 2017-09-26 CN CN201721238590.7U patent/CN207250511U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482001A (en) * | 2017-09-26 | 2017-12-15 | 深圳市立洋光电子股份有限公司 | A kind of super high power COB light source and its manufacture craft |
| WO2019062200A1 (en) * | 2017-09-26 | 2019-04-04 | 深圳市立洋光电子股份有限公司 | Super-power cob light source and manufacturing process therefor |
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