CN204680901U - A kind of semiconductor laser multi-chip sintering fixture - Google Patents
A kind of semiconductor laser multi-chip sintering fixture Download PDFInfo
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- CN204680901U CN204680901U CN201520453486.4U CN201520453486U CN204680901U CN 204680901 U CN204680901 U CN 204680901U CN 201520453486 U CN201520453486 U CN 201520453486U CN 204680901 U CN204680901 U CN 204680901U
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- press strip
- lower press
- jacking block
- compression leg
- ceiling molding
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- 238000005245 sintering Methods 0.000 title claims abstract description 50
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 230000006835 compression Effects 0.000 claims abstract description 40
- 238000007906 compression Methods 0.000 claims abstract description 40
- 238000000465 moulding Methods 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000001788 irregular Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 8
- 238000003825 pressing Methods 0.000 abstract description 5
- 238000011900 installation process Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005086 pumping Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 101000964746 Homo sapiens Zinc finger protein 69 Proteins 0.000 description 1
- 102100040717 Zinc finger protein 69 Human genes 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The utility model relates to a kind of semiconductor laser multi-chip sintering fixture.This sintering fixture comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described lower press strip and ceiling molding are fixed in main body by fixed screw, and lower press strip and ceiling molding all have the hole be evenly distributed, be respectively used to limit jacking block compression leg and feed screw, spring housing is on jacking block compression leg, and body floor has laser stopper slot.Be placed in laser stopper slot immediately below jacking block compression leg successively by being equipped with heat sink and shell that is COS, jacking block compression leg presses on COS and is clamped by chip.In the utility model fixture, compression leg is square structure, does not rotate pressing down in process, avoids COS displacement in installation process, improves sintering consistency; This fixture can place multiple laser according to demand simultaneously, and sintering efficiency is high, is convenient to industrialization.
Description
Technical field
The utility model relates to a kind of sintering fixture of semiconductor laser, particularly relates to a kind of fixture realizing multi-chip pressure sintering simultaneously, belongs to semiconductor laser sintering technology field.
Background technology
Semiconductor laser, due to advantages such as volume is little, lightweight, conversion efficiency is high, long service life, is widely used in fields such as medical treatment, display, pumping, industrial processes.In recent years, along with the develop rapidly of epitaxial growth of semiconductor material growing technology, semiconductor laser waveguiding structure optimisation technique, passivating cavity surface technology, high stability encapsulation technology, high efficiency and heat radiation technology, particularly under the promotion of direct semiconductor Laser industry processed and applied and high power fiber laser pumping demand, there is the semiconductor laser develop rapidly of high power, high light beam quality, providing light source basis for obtaining high-quality, high performance direct semiconductor laser process equipment and high-performance large-power optical fiber laser pumping source.
In order to obtain high-power output, reach good cooling requirements, current great majority are by one single chip individual packages is become junior unit, then the junior unit serial or parallel connection after test passes are assembled into high power module simultaneously.For this packing forms, one single chip is individual packages, chip sintering difficulty can be reduced on the one hand, the heat-sinking capability of chip can be improved on the other hand, avoid the heat enrichment that multiple chip package causes, and can packaged junior unit be screened, reject defective products, improve the rate of finished products of high power module.Therefore, this packing forms becomes the trend of high power, high light beam quality semiconductor laser main flow device package gradually.Be tens watts of laser modules even going up hectowatt for power output, generally need several or tens junior units to assemble, so this sintering quality to junior unit, efficiency and rate of finished products are had higher requirement.Sintering cavity can affect the heat radiation of chip, and reduce the reliability of device, packaging efficiency is low, the low demand that can not meet again production of rate of finished products.For ensureing sintering quality, must chip sintering and follow-up COS (COS refers to chip on submount, be encapsulated in secondary heat sink on laser) apply certain pressure in sintering process.CN 101741011A discloses a kind of low-stress encapsulating device of semiconductor laser, the upper surface fluting of clamp base, the shape of fluting is determined by heat sink shape, the two ends of spring pressuring plate are bolted to pedestal fluting both sides with adjustable for height, by changing the Level Change spring leaf at spring leaf two ends to the pressure of chip of laser.This fixture adopts the mode of exerting pressure of shell fragment to exert a force, and because shell fragment is yielding, can affect the uniformity of force after repeatedly using.
At present, the sintering for laser is generally completed by automation equipment, but automation equipment can only once produce one, and efficiency is low, be unsuitable for batch production, and automation equipment price is higher, deficiency in economic performance.
Summary of the invention
For prior art Problems existing, the utility model provides a kind of easy and simple to handle, can realize the fixture of multiple laser element pressure sintering simultaneously.
Term illustrates:
COS (chip on submount): be encapsulated in time heat sink on chip of laser; In order to make literal expression short and sweet, in the utility model, all use this general technical term of COS.
Technical solutions of the utility model are as follows:
A kind of semiconductor laser multi-chip sintering fixture, comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described lower press strip and ceiling molding are fixed in main body by fixed screw, and lower press strip and ceiling molding all have the hole be evenly distributed, be respectively used to limit jacking block compression leg and feed screw; Spring housing is on jacking block compression leg.
More preferred scheme is as follows:
A kind of semiconductor laser multi-chip sintering fixture, comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described main body is made up of base plate and side plate, and backplate surface is provided with the laser stopper slot of evenly arrangement, and this laser stopper slot is for placing laser shell;
Described lower press strip and ceiling molding are separately fixed on the side plate of main body, and are parallel to or are arranged essentially parallel to main body backplate surface;
Described ceiling molding is provided with equally distributed silk hole, feeds screw and spacing for being screwed into;
Described lower press strip is provided with equally distributed post holes, extends there through and spacing for jacking block compression leg; Spring housing is on the jacking block compression leg between jacking block and lower press strip.
Preferred according to the utility model, described spring is placed in the spring retainer groove above lower press strip.Jacking block compression leg is enclosed within spring.Described lower press strip is provided with spring retainer groove, is subjected to displacement to prevent spring in pressure process.
Preferred according to the utility model, described jacking block upper surface feeds screw stopper slot, stressed irregular for preventing feeding jacking block in process at screw, causes below by the COS displacement clamped.
Hole on described lower press strip is post holes, and size and the jacking block compression leg of post holes match, and rotates pressing down in process to prevent compression leg.
Preferred according to the utility model, described jacking block compression leg is square structure; Press strip upper prop hole is correspondingly played also to be the suitable square opening of size; To prevent it from rotating pressing down in process, cause COS displacement.Compression leg upper end and jacking block are fixed as one.
The post holes of described lower press strip, the silk hole of ceiling molding are alignd up and down one by one, and on impetus on the laser COS that jacking block compression leg malleation is placed in laser stopper slot.The central point spacing in described laser stopper slot, post holes and silk hole is consistent.
Described lower press strip and ceiling molding are rectangle battens, or annular batten; Laser stopper slot corresponding to the latter need on main body base plate annular spread configuration.
Preferred according to the utility model, described lower press strip and ceiling molding are 1 rectangle batten respectively, corresponding, backplate surface is evenly distributed is provided with 1 row's laser stopper slot; Or described lower press strip and ceiling molding are 2 rectangle battens respectively, corresponding, backplate surface is evenly distributed is provided with 2 row's laser stopper slots.
Preferably, the number of the silk hole of the post holes of described lower press strip, ceiling molding, laser stopper slot is identical.One row's laser stopper slot is generally individual with 5-10 is good.
Described main body, lower press strip are that the copper product that thermal conductivity is higher is made.Be beneficial to the heat transfer in sintering process.
Described ceiling molding is that the stainless steel material that rigidity is higher is made, and is out of shape in high temperature sintering course of exerting pressure to prevent fixture.
The main body base plate of semiconductor laser multi-chip sintering fixture of the present utility model there is the laser stopper slot be evenly distributed, to prevent from being shifted in laser shell process before sintering.This laser stopper slot is for placing laser shell; Described jacking block with compression leg for being pressed in COS to be sintered, the latter is clamped.
The utility model semiconductor laser multi-chip sintering clip lamps structure is simple, and easy to operate, cost is low; Exert pressure to spring by feeding screw, by the size of the amount of feed adjustment pressure of screw; The once sintered number of chips of laser can be increased as required; In the utility model fixture, compression leg is square structure, ensures not rotate pressing down in process.Easily the whole fixture installing laser can be moved in sintering platform or sintering furnace and sinter, in sintering process, also there will not be sliding transfer, avoid COS to be shifted, increase optical power density and brightness, ensure the consistency of sintering, reduce the generation probability in cavity simultaneously.
Sintering method of the present utility model requires low to agglomerating plant, and sintering efficiency is high; In sintering process, the applying of pressure can greatly reduce the generation in sintering cavity, improves the reliability of laser.
Accompanying drawing explanation
Fig. 1 is an example structure schematic diagram of semiconductor laser of the present utility model sintering fixture.
Fig. 2 is the schematic diagram of lower press strip in the utility model fixture.
Fig. 3 is the schematic diagram of jacking block in the utility model fixture.
Fig. 4 can place the main body of 2 row's lasers and the schematic diagram of laser stopper slot in the utility model fixture.
Wherein, 1, main body, 2, laser stopper slot, 3, laser shell, 4, heat sink, 5, COS, 6, lower press strip, 7, ceiling molding, 8, spring, 9, spring retainer groove, 10, jacking block, 11, screw is fed, 12, feed screw stopper slot, 13, fixed screw, 14, jacking block compression leg, 15, post holes.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described further, but is not limited thereto.
Embodiment 1,
Semiconductor laser multi-chip sintering fixture, structure as shown in Figure 1, comprise main body 1, lower press strip 6, ceiling molding 7, jacking block 10 and spring 8, main body 1 is made up of base plate and side plate, backplate surface is provided with 5 equal laser stopper slots 2 of a trestle column, for placing laser shell 3, be shifted before sintering and in process to prevent laser shell 3.Described lower press strip 6 and ceiling molding 7 are rectangle battens, and a lower press strip 6 and a ceiling molding 7 are fixed on the side plate of main body 1 by the fixed screw 13 at two ends, and are parallel to main body backplate surface; Described ceiling molding 7 is provided with equally distributed 5 silk holes and feeds screw 11 and spacing for being screwed into; Described lower press strip 6 is provided with equally distributed 5 post holes 15, and jacking block compression leg 14 passes to reach below from post holes; The post holes of lower press strip, the silk hole of ceiling molding are alignd up and down one by one, and with laser stopper slot in place laser COS impetus position rush together.Spring housing, on the jacking block compression leg 14 between jacking block 10 and lower press strip 6, is arranged in the spring retainer groove 9 that lower press strip 6 is provided with bottom this spring 8, be subjected to displacement to prevent spring 8 in pressure process.
Jacking block 10 upper surface feeds screw stopper slot 12, and for preventing feeding screw 11, to feed jacking block 10 in process stressed irregular, causes COS 5 displacement of below clamping.Described jacking block compression leg 14 is square structure, and the post holes 15 on lower press strip 6 is square opening, and its size and jacking block compression leg 14 match, with prevent jacking block compression leg 14 press down in process rotate cause by the COS5 displacement of pressing from both sides.
The copper product that described jig main body 1, lower press strip 6 are thermal conductivity higher is made.Ceiling molding 7 is the stainless steel material that rigidity is higher, is out of shape in high temperature course of exerting pressure to prevent fixture.
When utilizing above-described sintering fixture noise spectra of semiconductor lasers to carry out multi-chip sintering, carry out according to the following steps:
(1) be placed into heat sink 4 of prefabricated for upper surface complete solder in the laser shell 3 of band solder;
(2) COS 5 is placed above-mentioned heat sink 4 assigned addresses, ensure that exit positions reaches requirement;
(3) being placed in the laser stopper slot 2 of main body one by one by placing heat sink and laser shell that is COS, ensureing that on COS, impetus is immediately below jacking block compression leg 14;
(4) rotation feeds screw 11 one by one, by spring-compressed, jacking block compression leg 14 is moved down, makes to be pressed onto bottom jacking block compression leg 14 on the impetus on COS, will ensure that its top is arranged in and feed screw stopper slot 12 when screw feeds; To prevent feeding screw 11, to feed jacking block 10 in process stressed irregular, causes COS 5 displacement of below clamping;
(5) fixture installing laser is placed on sintering platform or sintering furnace in carry out heat-agglomerating;
(6), after reaching appointment sintering time, directly fixture is taken out, after cooling, dismounting.
(7), during dismounting, unclamp in the opposite direction and feed screw, jacking block moves up under the elastic force effect of spring 8, and correspondingly jacking block compression leg 14 also moves up, and unclamps by the laser clamped.
Embodiment 3,
A kind of semiconductor laser multi-chip sintering fixture, as described in Example 1, difference is that main body 1 backplate surface is provided with two row's laser stopper slots 2, and often arrange 5 laser stopper slots, structure as shown in Figure 4.Corresponding, described lower press strip is 2 rectangle battens side by side, and ceiling molding is also 2 rectangle battens side by side, and laser stopper slot 2 consistency from top to bottom is also all arranged with two of backplate surface in the hole on described lower press strip and ceiling molding.The core number that this fixture can sinter simultaneously is the twice of embodiment 1 fixture.
Claims (10)
1. a semiconductor laser multi-chip sintering fixture, comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described lower press strip and ceiling molding are fixed in main body by fixed screw, and lower press strip and ceiling molding all have the hole be evenly distributed, be respectively used to limit jacking block compression leg and feed screw; Spring housing is on jacking block compression leg.
2. semiconductor laser multi-chip sintering fixture as claimed in claim 1, it is characterized in that described main body is made up of base plate and side plate, backplate surface is provided with the laser stopper slot of evenly arrangement, and this laser stopper slot is for placing laser shell;
Described lower press strip and ceiling molding are separately fixed on the side plate of main body, and are parallel to or are arranged essentially parallel to main body backplate surface;
Described ceiling molding is provided with equally distributed silk hole, feeds screw and spacing for being screwed into;
Described lower press strip is provided with equally distributed post holes, extends there through and spacing for jacking block compression leg; Spring housing is on the jacking block compression leg between jacking block and lower press strip.
3. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that in the spring retainer groove that described spring is placed in above lower press strip.
4. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described jacking block upper surface feeds screw stopper slot, stressed irregular for preventing feeding jacking block in process at screw.
5. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described jacking block compression leg is square structure; Press strip upper prop hole is correspondingly played also to be the suitable square opening of size.
6. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that the post holes of described lower press strip, the silk hole of ceiling molding aligns up and down one by one.
7. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described lower press strip and ceiling molding are 1 rectangle batten respectively, corresponding, backplate surface is evenly distributed is provided with 1 row's laser stopper slot; Or described lower press strip and ceiling molding are 2 rectangle battens respectively, corresponding, backplate surface is evenly distributed is provided with 2 row's laser stopper slots.
8. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described main body, lower press strip is that copper material is made.
9. semiconductor laser multi-chip sintering fixture as claimed in claim 2, it is characterized in that described main body backplate surface is provided with 5 equal laser stopper slots (2) of a trestle column, for placing laser shell (3), described lower press strip (6) and ceiling molding (7) are each 1 of rectangle battens, lower press strip (6) and ceiling molding (7) are fixed on the side plate of main body (1) by the fixed screw (13) at two ends, and are parallel to main body backplate surface; Described ceiling molding (7) is provided with equally distributed 5 silk holes and feeds screw (11) and spacing for being screwed into; Described lower press strip (6) is provided with equally distributed 5 post holes (15), and jacking block compression leg (14) passes to reach below from post holes (15); The post holes of lower press strip, the silk hole of ceiling molding are alignd up and down one by one, and rush together with the position that laser stopper slot places laser COS (5); Spring (8) is enclosed within the jacking block compression leg (14) that is positioned between jacking block (10) and lower press strip (6), and this spring (8) bottom is arranged in lower press strip (6) and is provided with spring retainer groove (9); Jacking block (10) upper surface feeds screw stopper slot (12), and described jacking block compression leg (14) is square structure, and post holes (15) is square opening, and its size and jacking block compression leg (14) match.
10. semiconductor laser multi-chip sintering fixture as claimed in claim 2, it is characterized in that main body backplate surface is provided with two row's laser stopper slots, often arrange 5 laser stopper slots, corresponding, described lower press strip is 2 rectangle battens side by side, ceiling molding is also 2 rectangle battens side by side, two row's laser stopper slot consistencies from top to bottom of the Kong Douyu backplate surface on described lower press strip and ceiling molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520453486.4U CN204680901U (en) | 2015-06-27 | 2015-06-27 | A kind of semiconductor laser multi-chip sintering fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520453486.4U CN204680901U (en) | 2015-06-27 | 2015-06-27 | A kind of semiconductor laser multi-chip sintering fixture |
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| CN204680901U true CN204680901U (en) | 2015-09-30 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN109326951A (en) * | 2017-07-31 | 2019-02-12 | 山东华光光电子股份有限公司 | A kind of multiple semiconductor laser tube cores sintering fixture and its sintering method |
| CN112688158A (en) * | 2020-12-30 | 2021-04-20 | 光为科技(广州)有限公司 | Optical device ceramic substrate paster positioning jig and optical device packaging method |
| CN115008113A (en) * | 2022-08-10 | 2022-09-06 | 苏州新镭激光科技有限公司 | Positioning device for laser packaging |
-
2015
- 2015-06-27 CN CN201520453486.4U patent/CN204680901U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN104966987B (en) * | 2015-06-27 | 2018-03-13 | 山东华光光电子股份有限公司 | A kind of semiconductor laser multi-chip sintering fixture and sintering method |
| CN109326951A (en) * | 2017-07-31 | 2019-02-12 | 山东华光光电子股份有限公司 | A kind of multiple semiconductor laser tube cores sintering fixture and its sintering method |
| CN109326951B (en) * | 2017-07-31 | 2020-05-12 | 山东华光光电子股份有限公司 | Multiple semiconductor laser tube core sintering clamp and sintering method thereof |
| CN112688158A (en) * | 2020-12-30 | 2021-04-20 | 光为科技(广州)有限公司 | Optical device ceramic substrate paster positioning jig and optical device packaging method |
| CN115008113A (en) * | 2022-08-10 | 2022-09-06 | 苏州新镭激光科技有限公司 | Positioning device for laser packaging |
| CN115008113B (en) * | 2022-08-10 | 2022-10-21 | 苏州新镭激光科技有限公司 | Positioning device for laser packaging |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: 250101 Shandong city of Ji'nan province high tech Zone Tianchen (Licheng Street No. 1835) Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20150930 Termination date: 20190627 |