CN104966987A - Semiconductor laser multi-chip sintering clamp and sintering method - Google Patents
Semiconductor laser multi-chip sintering clamp and sintering method Download PDFInfo
- Publication number
- CN104966987A CN104966987A CN201510366841.9A CN201510366841A CN104966987A CN 104966987 A CN104966987 A CN 104966987A CN 201510366841 A CN201510366841 A CN 201510366841A CN 104966987 A CN104966987 A CN 104966987A
- Authority
- CN
- China
- Prior art keywords
- laser
- jacking block
- press strip
- lower press
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to a semiconductor laser multi-chip sintering clamp and a sintering method. The sintering clamp comprises a main body, a lower pressing bar, an upper pressing bar, top blocks with pressing columns and springs. The lower pressing bar and the upper pressing bar are fixed on the main body through fixing screws; the lower pressing bar and the upper pressing bar are provided with holes which are evenly distributed and are used for limiting the top block pressing columns and feeding screws; a spring sleeves the top block pressing column; the bottom of the main body is provided with laser limitation grooves. The sintering method comprises steps of successively placing the tube casings containing heat sinks and COSs in the laser limitation grooves and the positions below the top block pressing columns, transmitting to feeding screws to enable the pressing columns to descend to the bottom and to contact with the COSs, clamping the chip by applying pressure, and performing sintering on the clamp, on which the laser is installed. The pressing column of the invention is of a square structure and maintains no rotation during the pressing down, preventing the displacement of the COS in the installation process and improving the consistency of sintering. At the meantime, the clamp is provided with a plurality of lasers according to the needs, which is high in sintering and easy to industrialization.
Description
Technical field
The present invention relates to a kind of sintering fixture of semiconductor laser, particularly relate to a kind of fixture realizing multi-chip pressure sintering simultaneously, belong to semiconductor laser sintering technology field.
Background technology
Semiconductor laser, due to advantages such as volume is little, lightweight, conversion efficiency is high, long service life, is widely used in fields such as medical treatment, display, pumping, industrial processes.In recent years, along with the develop rapidly of epitaxial growth of semiconductor material growing technology, semiconductor laser waveguiding structure optimisation technique, passivating cavity surface technology, high stability encapsulation technology, high efficiency and heat radiation technology, particularly under the promotion of direct semiconductor Laser industry processed and applied and high power fiber laser pumping demand, there is the semiconductor laser develop rapidly of high power, high light beam quality, providing light source basis for obtaining high-quality, high performance direct semiconductor laser process equipment and high-performance large-power optical fiber laser pumping source.
In order to obtain high-power output, reach good cooling requirements, current great majority are by one single chip individual packages is become junior unit, then the junior unit serial or parallel connection after test passes are assembled into high power module simultaneously.For this packing forms, one single chip is individual packages, chip sintering difficulty can be reduced on the one hand, the heat-sinking capability of chip can be improved on the other hand, avoid the heat enrichment that multiple chip package causes, and can packaged junior unit be screened, reject defective products, improve the rate of finished products of high power module.Therefore, this packing forms becomes the trend of high power, high light beam quality semiconductor laser main flow device package gradually.Be tens watts of laser modules even going up hectowatt for power output, generally need several or tens junior units to assemble, so this sintering quality to junior unit, efficiency and rate of finished products are had higher requirement.Sintering cavity can affect the heat radiation of chip, and reduce the reliability of device, packaging efficiency is low, the low demand that can not meet again production of rate of finished products.For ensureing sintering quality, must chip sintering and follow-up COS (COS refers to chip on submount, be encapsulated in secondary heat sink on laser) apply certain pressure in sintering process.
CN 101741011A discloses a kind of low-stress encapsulating device of semiconductor laser, wherein said encapsulation fixture is by the clamp base for heat sink location and form for spring pressuring plate two parts that chip is fixing, the upper surface fluting of clamp base, the shape of fluting is determined by heat sink shape, size is slightly larger than heat sink size, the two ends of spring pressuring plate are bolted to pedestal fluting both sides with adjustable for height, by changing the Level Change spring leaf at spring leaf two ends to the pressure of chip of laser.This fixture adopts the mode of exerting pressure of shell fragment to exert a force, and because shell fragment is yielding, can affect the uniformity of force after repeatedly using.
At present, the sintering for laser is generally completed by automation equipment, but automation equipment can only once produce one, and efficiency is low, be unsuitable for batch production, and automation equipment price is higher, deficiency in economic performance.
Summary of the invention
For the technical problem that current semiconductor laser sintering exists, the invention provides a kind of easy and simple to handle, the fixture of multiple laser element pressure sintering simultaneously can be realized.
The present invention also provides and utilizes this fixture noise spectra of semiconductor lasers to carry out the method sintered.
Term illustrates:
COS (chip on submount): be encapsulated in time heat sink on chip of laser; In order to make literal expression short and sweet, in the present invention, all use this general technical term of COS.
Technical solution of the present invention is as follows:
A kind of semiconductor laser multi-chip sintering fixture, comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described lower press strip and ceiling molding are fixed in main body by fixed screw, and lower press strip and ceiling molding all have the hole be evenly distributed, be respectively used to limit jacking block compression leg and feed screw; Spring housing is on jacking block compression leg.
More preferred scheme is as follows:
A kind of semiconductor laser multi-chip sintering fixture, comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described main body is made up of base plate and side plate, and backplate surface is provided with the laser stopper slot of evenly arrangement, and this laser stopper slot is for placing laser shell;
Described lower press strip and ceiling molding are separately fixed on the side plate of main body, and are parallel to or are arranged essentially parallel to main body backplate surface;
Described ceiling molding is provided with equally distributed silk hole, feeds screw and spacing for being screwed into;
Described lower press strip is provided with equally distributed post holes, extends there through and spacing for jacking block compression leg; Spring housing is on the jacking block compression leg between jacking block and lower press strip.
Preferred according to the present invention, described spring is placed in the spring retainer groove above lower press strip.Jacking block compression leg is enclosed within spring.Described lower press strip is provided with spring retainer groove, is subjected to displacement to prevent spring in pressure process.
Preferred according to the present invention, described jacking block upper surface feeds screw stopper slot, stressed irregular for preventing feeding jacking block in process at screw, causes below by the COS displacement clamped.
Hole on described lower press strip is post holes, and size and the jacking block compression leg of post holes match, and rotates pressing down in process to prevent compression leg.
Preferred according to the present invention, described jacking block compression leg is square structure; Press strip upper prop hole is correspondingly played also to be the suitable square opening of size; To prevent it from rotating pressing down in process, cause COS displacement.Compression leg upper end and jacking block are fixed as one.
The post holes of described lower press strip, the silk hole of ceiling molding are alignd up and down one by one, and on impetus on the laser COS that jacking block compression leg malleation is placed in laser stopper slot.The central point spacing in described laser stopper slot, post holes and silk hole is consistent.
Described lower press strip and ceiling molding are rectangle battens, or annular batten; Laser stopper slot corresponding to the latter need on main body base plate annular spread configuration.
Preferred according to the present invention, described lower press strip and ceiling molding are 1 rectangle batten respectively, corresponding, backplate surface is evenly distributed is provided with 1 row's laser stopper slot; Or described lower press strip and ceiling molding are 2 rectangle battens respectively, corresponding, backplate surface is evenly distributed is provided with 2 row's laser stopper slots.
Preferably, the number of the silk hole of the post holes of described lower press strip, ceiling molding, laser stopper slot is identical.One row's laser stopper slot is generally individual with 5-10 is good.
Described main body, lower press strip are that the copper product that thermal conductivity is higher is made.Be beneficial to the heat transfer in sintering process.
Described ceiling molding is that the stainless steel material that rigidity is higher is made, and is out of shape in high temperature sintering course of exerting pressure to prevent fixture.
The main body base plate of semiconductor laser multi-chip sintering fixture of the present invention there is the laser stopper slot be evenly distributed, to prevent from being shifted in laser shell process before sintering.This laser stopper slot is for placing laser shell; Described jacking block with compression leg for being pressed in COS to be sintered, the latter is clamped.
Utilize above-mentioned fixture noise spectra of semiconductor lasers of the present invention to carry out the method sintered, comprise the following steps:
(1) the heat sink of prefabricated for upper surface complete solder is placed in the laser shell of band solder;
(2) COS is placed on heat sink assigned address, ensures that exit positions reaches requirement;
(3) being placed into placing heat sink and laser shell that is COS one by one in the laser stopper slot of main body base plate, making on COS impetus immediately below jacking block compression leg;
(4) rotate and feed screw, by spring-compressed jacking block compression leg is depressed on the impetus on COS, will ensures when screw feeds that its top is arranged in and feed screw stopper slot;
(5) fixture installing laser is placed on sintering platform or sintering furnace in carry out heat-agglomerating;
(6) after reaching setting sintering time, directly taken out by fixture, after cooling, dismounting, takes out the laser sintered.
During dismounting, unclamp in the opposite direction and feed screw, jacking block moves up under the elastic force effect of spring, and correspondingly jacking block compression leg also moves up, and unclamps by the laser clamped.
Semiconductor laser multi-chip sintering clip lamps structure of the present invention is simple, and easy to operate, cost is low; Exert pressure to spring by feeding screw, by the size of the amount of feed adjustment pressure of screw; The once sintered number of chips of laser can be increased as required; In fixture of the present invention, compression leg is square structure, ensures not rotate pressing down in process.Easily whole fixture can be moved in sintering platform or sintering furnace and sinter, in sintering process, also there will not be sliding transfer, avoid COS to be shifted, increase optical power density and brightness, ensure the consistency of sintering, reduce the generation probability in cavity simultaneously.
Sintering method of the present invention requires low to agglomerating plant, and sintering efficiency is high; In sintering process, the applying of pressure can greatly reduce the generation in sintering cavity, improves the reliability of laser.
Accompanying drawing explanation
Fig. 1 is an example structure schematic diagram of semiconductor laser of the present invention sintering fixture.
Fig. 2 is the schematic diagram of lower press strip in fixture of the present invention.
Fig. 3 is the schematic diagram of jacking block in fixture of the present invention.
Fig. 4 can place the main body of 2 row's lasers and the schematic diagram of laser stopper slot in fixture of the present invention.Wherein, 1, main body, 2, laser stopper slot, 3, laser shell, 4, heat sink, 5, COS, 6, lower press strip, 7, ceiling molding, 8, spring, 9, spring retainer groove, 10, jacking block, 11, screw is fed, 12, feed screw stopper slot, 13, fixed screw, 14, jacking block compression leg, 15, post holes.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention will be further described, but be not limited thereto.
Embodiment 1,
Semiconductor laser multi-chip sintering fixture, structure as shown in Figure 1, comprise main body 1, lower press strip 6, ceiling molding 7, jacking block 10 and spring 8, main body 1 is made up of base plate and side plate, backplate surface is provided with 5 equal laser stopper slots 2 of a trestle column, for placing laser shell 3, be shifted before sintering and in process to prevent laser shell 3.Described lower press strip 6 and ceiling molding 7 are rectangle battens, and a lower press strip 6 and a ceiling molding 7 are fixed on the side plate of main body 1 by the fixed screw 13 at two ends, and are parallel to main body backplate surface; Described ceiling molding 7 is provided with equally distributed 5 silk holes and feeds screw 11 and spacing for being screwed into; Described lower press strip 6 is provided with equally distributed 5 post holes 15, and jacking block compression leg 14 passes to reach below from post holes; The post holes of lower press strip, the silk hole of ceiling molding are alignd up and down one by one, and with laser stopper slot in place laser COS impetus position rush together.Spring housing, on the jacking block compression leg 14 between jacking block 10 and lower press strip 6, is arranged in the spring retainer groove 9 that lower press strip 6 is provided with bottom this spring 8, be subjected to displacement to prevent spring 8 in pressure process.
Jacking block 10 upper surface feeds screw stopper slot 12, and for preventing feeding screw 11, to feed jacking block 10 in process stressed irregular, causes COS 5 displacement of below clamping.Described jacking block compression leg 14 is square structure, and the post holes 15 on lower press strip 6 is square opening, and its size and jacking block compression leg 14 match, with prevent jacking block compression leg 14 press down in process rotate cause by the COS5 displacement of pressing from both sides.
The copper product that described jig main body 1, lower press strip 6 are thermal conductivity higher is made.Ceiling molding 7 is the stainless steel material that rigidity is higher, is out of shape in high temperature course of exerting pressure to prevent fixture.
Embodiment 2,
Noise spectra of semiconductor lasers carries out a method for multi-chip sintering, and utilize the sintering fixture described in embodiment 1, step is as follows:
(1) be placed into heat sink 4 of prefabricated for upper surface complete solder in the laser shell 3 of band solder;
(2) COS 5 is placed above-mentioned heat sink 4 assigned addresses, ensure that exit positions reaches requirement;
(3) being placed in the laser stopper slot 2 of main body one by one by placing heat sink and laser shell that is COS, ensureing that on COS, impetus is immediately below jacking block compression leg 14;
(4) rotation feeds screw 11 one by one, by spring-compressed, jacking block compression leg 14 is moved down, makes to be pressed onto bottom jacking block compression leg 14 on the impetus on COS, will ensure that its top is arranged in and feed screw stopper slot 12 when screw feeds; To prevent feeding screw 11, to feed jacking block 10 in process stressed irregular, causes COS 5 displacement of below clamping;
(5) fixture installing laser is placed on sintering platform or sintering furnace in carry out heat-agglomerating;
(6), after reaching appointment sintering time, directly fixture is taken out, after cooling, dismounting.
(7), during dismounting, unclamp in the opposite direction and feed screw, jacking block moves up under the elastic force effect of spring 8, and correspondingly jacking block compression leg 14 also moves up, and unclamps by the laser clamped.
Embodiment 3,
A kind of semiconductor laser multi-chip sintering fixture, as described in Example 1, difference is that main body 1 backplate surface is provided with two row's laser stopper slots 2, and often arrange 5 laser stopper slots, structure as shown in Figure 4.Corresponding, described lower press strip is 2 rectangle battens side by side, and ceiling molding is also 2 rectangle battens side by side, and laser stopper slot 2 consistency from top to bottom is also all arranged with two of backplate surface in the hole on described lower press strip and ceiling molding.The core number that this fixture can sinter simultaneously is the twice of embodiment 1 fixture.
Claims (10)
1. a semiconductor laser multi-chip sintering fixture, comprise main body, lower press strip, ceiling molding, with the jacking block of compression leg and spring, described lower press strip and ceiling molding are fixed in main body by fixed screw, and lower press strip and ceiling molding all have the hole be evenly distributed, be respectively used to limit jacking block compression leg and feed screw; Spring housing is on jacking block compression leg.
2. semiconductor laser multi-chip sintering fixture as claimed in claim 1, it is characterized in that described main body is made up of base plate and side plate, backplate surface is provided with the laser stopper slot of evenly arrangement, and this laser stopper slot is for placing laser shell;
Described lower press strip and ceiling molding are separately fixed on the side plate of main body, and are parallel to or are arranged essentially parallel to main body backplate surface;
Described ceiling molding is provided with equally distributed silk hole, feeds screw and spacing for being screwed into;
Described lower press strip is provided with equally distributed post holes, extends there through and spacing for jacking block compression leg; Spring housing is on the jacking block compression leg between jacking block and lower press strip.
3. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that in the spring retainer groove that described spring is placed in above lower press strip.
4. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described jacking block upper surface feeds screw stopper slot, stressed irregular for preventing feeding jacking block in process at screw.
5. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described jacking block compression leg is square structure; Press strip upper prop hole is correspondingly played also to be the suitable square opening of size.
6. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that the post holes of described lower press strip, the silk hole of ceiling molding aligns up and down one by one.
7. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described lower press strip and ceiling molding are 1 rectangle batten respectively, corresponding, backplate surface is evenly distributed is provided with 1 row's laser stopper slot; Or described lower press strip and ceiling molding are 2 rectangle battens respectively, corresponding, backplate surface is evenly distributed is provided with 2 row's laser stopper slots.
8. semiconductor laser multi-chip sintering fixture as claimed in claim 1, is characterized in that described main body, lower press strip is that copper material is made.
9. semiconductor laser multi-chip sintering fixture as claimed in claim 2, it is characterized in that described main body backplate surface is provided with 5 equal laser stopper slots (2) of a trestle column, for placing laser shell (3), described lower press strip (6) and ceiling molding (7) are each 1 of rectangle battens, lower press strip (6) and ceiling molding (7) are fixed on the side plate of main body (1) by the fixed screw (13) at two ends, and are parallel to main body backplate surface; Described ceiling molding (7) is provided with equally distributed 5 silk holes and feeds screw (11) and spacing for being screwed into; Described lower press strip (6) is provided with equally distributed 5 post holes (15), and jacking block compression leg (14) passes to reach below from post holes (15); The post holes of lower press strip, the silk hole of ceiling molding are alignd up and down one by one, and rush together with the position that laser stopper slot places laser COS (5); Spring (8) is enclosed within the jacking block compression leg (14) that is positioned between jacking block (10) and lower press strip (6), and this spring (8) bottom is arranged in lower press strip (6) and is provided with spring retainer groove (9); Jacking block (10) upper surface feeds screw stopper slot (12), and described jacking block compression leg (14) is square structure, and post holes (15) is square opening, and its size and jacking block compression leg (14) match.
10. utilize fixture noise spectra of semiconductor lasers described in any one of claim 1-9 to carry out the method sintered, comprise the following steps:
(1) the heat sink of prefabricated for upper surface complete solder is placed in the laser shell of band solder;
(2) COS is placed on heat sink assigned address, ensures that exit positions reaches requirement;
(3) being placed into placing heat sink and laser shell that is COS one by one in the laser stopper slot of main body base plate, making on COS impetus immediately below jacking block compression leg;
(4) rotate and feed screw, by spring-compressed jacking block compression leg is depressed on the impetus on COS, will ensures when screw feeds that its top is arranged in and feed screw stopper slot;
(5) fixture installing laser is placed on sintering platform or sintering furnace in carry out heat-agglomerating;
(6) after reaching setting sintering time, directly taken out by fixture, after cooling, dismounting, takes out the laser sintered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510366841.9A CN104966987B (en) | 2015-06-27 | 2015-06-27 | A kind of semiconductor laser multi-chip sintering fixture and sintering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510366841.9A CN104966987B (en) | 2015-06-27 | 2015-06-27 | A kind of semiconductor laser multi-chip sintering fixture and sintering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104966987A true CN104966987A (en) | 2015-10-07 |
| CN104966987B CN104966987B (en) | 2018-03-13 |
Family
ID=54220987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510366841.9A Active CN104966987B (en) | 2015-06-27 | 2015-06-27 | A kind of semiconductor laser multi-chip sintering fixture and sintering method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104966987B (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255727A (en) * | 2015-11-24 | 2016-01-20 | 丁卜同 | Full-automatic fluorescence in-situ hybridization instrument |
| CN105428995A (en) * | 2015-12-29 | 2016-03-23 | 中国科学院半导体研究所 | Semiconductor laser array sintering device and sintering method |
| CN105576326A (en) * | 2015-12-30 | 2016-05-11 | 中国航天时代电子公司 | Transmission mechanism for non-limitation rod type satellite-bone microwave switch |
| CN105958315A (en) * | 2016-06-20 | 2016-09-21 | 海特光电有限责任公司 | Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner |
| CN107104358A (en) * | 2017-05-31 | 2017-08-29 | 中国电子科技集团公司第十三研究所 | The folded battle array sintering fixture of semiconductor laser encapsulation |
| CN107196185A (en) * | 2017-07-19 | 2017-09-22 | 深圳市杰普特光电股份有限公司 | Semiconductor laser sinters fixture |
| CN107681462A (en) * | 2017-09-12 | 2018-02-09 | 北京工业大学 | A kind of semiconductor chip autoregistration pendulum |
| CN107799457A (en) * | 2017-12-12 | 2018-03-13 | 江苏博普电子科技有限责任公司 | A kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load |
| CN108747172A (en) * | 2018-08-22 | 2018-11-06 | 重庆航伟光电科技有限公司 | A kind of multichannel COS welding toolings |
| CN109449749A (en) * | 2018-12-26 | 2019-03-08 | 苏州长光华芯半导体激光创新研究院有限公司 | TO packaging fixture and packaging technology |
| CN109920755A (en) * | 2019-02-25 | 2019-06-21 | 天津大学 | A kind of nano mattisolda low pressure assisted sintering fixture and method |
| CN110289547A (en) * | 2018-03-19 | 2019-09-27 | 山东华光光电子股份有限公司 | A kind of gravity clamping semiconductor laser chip sintering fixture |
| CN110690643A (en) * | 2019-10-11 | 2020-01-14 | 江苏天元激光科技有限公司 | Semiconductor laser chip welding jig |
| CN112775517A (en) * | 2020-12-28 | 2021-05-11 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
| CN114309864A (en) * | 2020-09-27 | 2022-04-12 | 潍坊华光光电子有限公司 | Reflow soldering clamp for semiconductor laser chip |
| CN114512891A (en) * | 2020-10-27 | 2022-05-17 | 山东华光光电子股份有限公司 | Sintering fixture and sintering method for improving quality of COS alloy of low-power semiconductor laser |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8340144B1 (en) * | 2011-08-29 | 2012-12-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| CN202685315U (en) * | 2012-05-23 | 2013-01-23 | 京信通信系统（中国）有限公司 | General clamp for integral weld of printed circuit boards |
| CN103311797A (en) * | 2012-03-16 | 2013-09-18 | 山东华光光电子有限公司 | Fixture for sintering semiconductor device and sintering method for plurality of tube cores of semiconductor laser |
| CN204680901U (en) * | 2015-06-27 | 2015-09-30 | 山东华光光电子有限公司 | A kind of semiconductor laser multi-chip sintering fixture |
-
2015
- 2015-06-27 CN CN201510366841.9A patent/CN104966987B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8340144B1 (en) * | 2011-08-29 | 2012-12-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| CN103311797A (en) * | 2012-03-16 | 2013-09-18 | 山东华光光电子有限公司 | Fixture for sintering semiconductor device and sintering method for plurality of tube cores of semiconductor laser |
| CN202685315U (en) * | 2012-05-23 | 2013-01-23 | 京信通信系统（中国）有限公司 | General clamp for integral weld of printed circuit boards |
| CN204680901U (en) * | 2015-06-27 | 2015-09-30 | 山东华光光电子有限公司 | A kind of semiconductor laser multi-chip sintering fixture |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255727A (en) * | 2015-11-24 | 2016-01-20 | 丁卜同 | Full-automatic fluorescence in-situ hybridization instrument |
| CN105255727B (en) * | 2015-11-24 | 2021-03-02 | 丁卜同 | Full-automatic fluorescence in situ hybridization appearance |
| CN105428995A (en) * | 2015-12-29 | 2016-03-23 | 中国科学院半导体研究所 | Semiconductor laser array sintering device and sintering method |
| CN105576326A (en) * | 2015-12-30 | 2016-05-11 | 中国航天时代电子公司 | Transmission mechanism for non-limitation rod type satellite-bone microwave switch |
| CN105958315A (en) * | 2016-06-20 | 2016-09-21 | 海特光电有限责任公司 | Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner |
| CN107104358A (en) * | 2017-05-31 | 2017-08-29 | 中国电子科技集团公司第十三研究所 | The folded battle array sintering fixture of semiconductor laser encapsulation |
| CN107104358B (en) * | 2017-05-31 | 2023-04-25 | 中国电子科技集团公司第十三研究所 | Semiconductor laser packaging stacked array sintering clamp |
| CN107196185A (en) * | 2017-07-19 | 2017-09-22 | 深圳市杰普特光电股份有限公司 | Semiconductor laser sinters fixture |
| CN107196185B (en) * | 2017-07-19 | 2023-11-03 | 深圳市杰普特光电股份有限公司 | Semiconductor laser sintering clamp |
| CN107681462B (en) * | 2017-09-12 | 2019-10-08 | 北京工业大学 | A kind of semiconductor chip autoregistration pendulum |
| CN107681462A (en) * | 2017-09-12 | 2018-02-09 | 北京工业大学 | A kind of semiconductor chip autoregistration pendulum |
| CN107799457A (en) * | 2017-12-12 | 2018-03-13 | 江苏博普电子科技有限责任公司 | A kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load |
| CN107799457B (en) * | 2017-12-12 | 2024-05-24 | 江苏博普电子科技有限责任公司 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
| CN110289547A (en) * | 2018-03-19 | 2019-09-27 | 山东华光光电子股份有限公司 | A kind of gravity clamping semiconductor laser chip sintering fixture |
| CN108747172B (en) * | 2018-08-22 | 2019-12-10 | 重庆航伟光电科技有限公司 | Multichannel COS welding frock |
| CN108747172A (en) * | 2018-08-22 | 2018-11-06 | 重庆航伟光电科技有限公司 | A kind of multichannel COS welding toolings |
| CN109449749B (en) * | 2018-12-26 | 2024-04-26 | 苏州长光华芯半导体激光创新研究院有限公司 | TO packaging clamp and packaging process |
| CN109449749A (en) * | 2018-12-26 | 2019-03-08 | 苏州长光华芯半导体激光创新研究院有限公司 | TO packaging fixture and packaging technology |
| CN109920755A (en) * | 2019-02-25 | 2019-06-21 | 天津大学 | A kind of nano mattisolda low pressure assisted sintering fixture and method |
| CN110690643A (en) * | 2019-10-11 | 2020-01-14 | 江苏天元激光科技有限公司 | Semiconductor laser chip welding jig |
| CN114309864A (en) * | 2020-09-27 | 2022-04-12 | 潍坊华光光电子有限公司 | Reflow soldering clamp for semiconductor laser chip |
| CN114512891A (en) * | 2020-10-27 | 2022-05-17 | 山东华光光电子股份有限公司 | Sintering fixture and sintering method for improving quality of COS alloy of low-power semiconductor laser |
| CN112775517A (en) * | 2020-12-28 | 2021-05-11 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
| CN112775517B (en) * | 2020-12-28 | 2023-10-31 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104966987B (en) | 2018-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104966987A (en) | Semiconductor laser multi-chip sintering clamp and sintering method | |
| CN104409964B (en) | A kind of semiconductor laser sintering fixture and its sintering method | |
| US20170365747A1 (en) | Led with high thermal conductivity particles in phosphor conversion layer | |
| CN204680901U (en) | A kind of semiconductor laser multi-chip sintering fixture | |
| US10249807B2 (en) | Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture | |
| CN109326951B (en) | Multiple semiconductor laser tube core sintering clamp and sintering method thereof | |
| US10158051B2 (en) | Process method for refining photoconverter to bond-package LED and refinement equipment system | |
| CN207282904U (en) | A kind of semiconductor laser encapsulates fixture | |
| CN102788945A (en) | Universal power semiconductor module fixture | |
| CN105244756A (en) | Sintering fixture for micro channel semiconductor laser and sintering method thereof | |
| CN210379764U (en) | Sintering clamp for multiple semiconductor lasers | |
| WO2010133772A1 (en) | A light source element and a method for manufacturing | |
| CN105845817A (en) | Large-power inverted-structure ultraviolet LED curing light source and preparation method thereof | |
| CN205452355U (en) | High -power flip -chip structure ultraviolet LED solidification light source | |
| CN111092365B (en) | Multi-tube-core sintering clamp and sintering method for semiconductor laser with uniform and adjustable pressure | |
| US9041019B2 (en) | Method of and device for manufacturing LED assembly using liquid molding technologies | |
| CN101546801B (en) | High-power LED packaging method | |
| US10103294B2 (en) | Equipment system using deformable organic silicone resin photoconverter to bond-package LED | |
| CN107180800B (en) | A kind of press-loading apparatus and pressing method of semiconductor devices | |
| CN106374333B (en) | A kind of diode-pumped nd yag laser module encapsulation method | |
| US20180233639A1 (en) | Process Method Using Deformable Organic Silicone Resin Photoconverter to Bond-Package Led | |
| WO2013152737A1 (en) | Cob packaged led plant lamp and method for manufacturing the same | |
| CN105428995A (en) | Semiconductor laser array sintering device and sintering method | |
| CN206163894U (en) | Diode pumping laser module packaging hardware | |
| US10141486B2 (en) | Process method using organic silicone resin photoconverter to bond-package LED by tandem rolling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Applicant after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: 250101 Shandong city of Ji'nan province high tech Zone Tianchen (Licheng Street No. 1835) Applicant before: Shandong Huaguang Photoelectronic Co., Ltd. |
|
| COR | Change of bibliographic data | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |