WO2013152737A1

WO2013152737A1 - Cob packaged led plant lamp and method for manufacturing the same

Info

Publication number: WO2013152737A1
Application number: PCT/CN2013/074135
Authority: WO
Inventors: 周海兵
Original assignee: 深圳市蓝海盛照明科技有限公司
Priority date: 2012-04-12
Filing date: 2013-04-12
Publication date: 2013-10-17
Also published as: CN103375691A

Abstract

A COB packaged LED plant lamp and method for manufacturing the same, said plant lamp comprises a packaging base (10) having a groove (13) or substrate plane provided thereon, multiple red LED chips (11), multiple blue LED chips (12) and transparent silica gel. The multiple red LED chips (11) and multiple blue LED chips (12) are interval closely arranged in the groove (13). The transparent silica gel is provided for filling the groove (13) or surrounding the chips on the substrate plane. The emitting surfaces of the multiple red LED chips (11) and multiple blue LED chips (12) are faced to the transparent silica gel which may use epoxy resin instead. The multiple red and blue LED chips are being packaged on the base in a given ratio, and since the multiple red LED chips (11) and multiple blue LED chips (12) are interval closely arranged, the red light and blue light can be integrated well, so that generating integrated beams required by the plant evenly illuminating the crop, the utilization efficiency of the integrated light being improved and the costs being reduced.

Description

COB package LED plant lamp and manufacturing method thereof

The present invention relates to the field of LED lighting technologies, and in particular, to a COB packaged LED plant lamp and a method of fabricating the same.

Background technology

In the past decade, LEDs have developed rapidly due to their high efficiency, energy saving, long life and easy installation. LED lamps are rich in wavelength types, which coincide with the spectral range of plant photosynthetic and book light forms. Pure monochromatic light and composite spectra can be combined as needed to concentrate the light of a specific wavelength to uniformly illuminate the crop. LED plant lights not only regulate crop flowering and fruiting, enhance seedling quality, improve seedling rate, shorten seedling cycle, but also control plant height and plant nutrients. The LED has less heat generation and a small footprint, and can be used in a multi-layer cultivation stereoscopic combination system, achieving low heat load and miniaturization of production space. In addition, the extreme durability of LEDs also reduces operating costs. Due to these remarkable features, LEDs are well suited for plant cultivation in controlled facility environments such as plant tissue culture, facility horticulture and industrial seedlings, and aerospace ecological life insurance systems.

Studies have shown that light is an indispensable source of energy for plant growth. The wavelength of light required for plant growth and development is 400-700 nm, while the wavelengths of LED blue and red light are 400-500 nm and 61 0-720 nm, respectively. Light is just the two kinds of 'light fertilizers' needed for plants. The most suitable light for plant growth and development is red-blue combined light, while single red or blue light does not have much effect on promoting plant growth and development. Therefore, it is now done to fill the plants, promote the growth and development of plants, and change the photoperiod of the plants with red and blue combined light, and even add a small number of other colors. In actual tests, the degree of fusion of red and blue light is one of the important factors determining the photosynthetic effect of plants.

The existing LED plant lamp uses multiple red and blue LED lamp beads as the light source. There is a large distance between the lamp bead and the lamp bead, and some pure red light regions will inevitably appear, resulting in poor light fusion effect and partial light. It is wasted, reducing its utilization rate, increasing costs, and affecting the growth and development of some plants. Summary of the invention

In view of the deficiencies in the above technology, the present invention provides a COB-packaged LED plant lamp, which has a good fusion effect of red and blue light lines, and can generate a condensed light required for plants to uniformly illuminate the crop.

To achieve the above object, the present invention provides a COB-packaged LED plant lamp, comprising a package substrate, a plurality of red LED chips, a plurality of blue LED chips, and a transparent silica gel, wherein the package substrate is provided with a groove or a substrate plane. The plurality of red LED chips and the plurality of blue LED chips are closely spaced in the groove or on the substrate plane, and the transparent silicon dioxide fills the groove or surrounds the chip package on the substrate plane. The light emitting surfaces of the plurality of red LED chips and the plurality of blue LED chips are all directed toward the transparent silicone rubber.

The package substrate is a circular, rectangular or polygonal package substrate.

Wherein, the groove is a circular, rectangular or polygonal groove.

The ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.

To achieve the above object, the present invention provides a COB packaged LED plant lamp, comprising a package substrate, a plurality of red LED chips, a plurality of blue LED chips, and an epoxy resin, wherein the package substrate is provided with a groove or a substrate plane The plurality of red LED chips and the plurality of blue LED chips are closely spaced in the 1HJ slot or on the substrate plane, and the epoxy fills the 1HJ slot or surrounds the chip package on the substrate plane. The light emitting surfaces of the plurality of red LED chips and the plurality of blue LED chips are all facing the epoxy resin.

Wherein, the groove is a circular, rectangular or polygonal groove.

The ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.

To achieve the above object, the present invention also provides a COB packaged LED plant lamp manufacturing method, which comprises the following steps:

Providing a groove or a substrate plane on the package substrate;

Arranging a plurality of red LED chips and a plurality of blue LED chips in close proximity in the 1HJ slot or the substrate plane;

Filling the groove or surrounding the chip with transparent silicone or epoxy to place multiple red LED chips And a number of blue LED chips are packaged.

The ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.

The beneficial effects of the present invention are: Compared with the prior art, the COB packaged LED plant lamp provided by the invention and the manufacturing method thereof, the plurality of red and blue LED chips are packaged on the substrate according to a certain ratio by using transparent silica gel or epoxy resin. Since a plurality of red LED chips and a plurality of blue LED chips are closely spaced, the generated red light and blue light can be well fused, so that the fused light required by the plant can be uniformly irradiated to the crop, and the light utilization ratio is fused. High, cost saving. DRAWINGS

1 is a structural view of an LED lamp bead according to a first embodiment of the present invention;

2 is a structural view of a package substrate according to a first embodiment of the present invention;

3 is a structural diagram of the package of FIG. 1 and FIG. 2;

4 is a structural view of a LED lamp bead according to a second embodiment of the present invention;

FIG. 5 is a structural diagram of a package substrate according to a second embodiment of the present invention; FIG.

Figure 6 is a structural view of the package of Figure 4 and Figure 5;

Figure 7 is a structural view showing a LED lamp bead according to a third embodiment of the present invention;

8 is a structural view of a package substrate according to a third embodiment of the present invention;

Figure 9 is a structural diagram of the combined package of Figures 7 and 8.

The main component symbols are described below:

10, package substrate 11, red LED chip

12, blue LED chip 1 3, groove specific embodiment

In order to more clearly illustrate the invention, the invention is further described below in conjunction with the drawings. The COB package involved in the present invention is a chi p On board, in which a chip is adhered to an interconnect substrate by a conductive or non-conductive glue, and then wire bonding is performed to realize electrical connection.

Referring to FIG. 1-9, the COB packaged LED plant lamp provided by the present invention comprises a package substrate 10, a plurality of red LED chips 11, a plurality of blue LED chips 12, and a transparent silica gel (not shown), and a package base. The plate 10 is provided with a recess 13 3 , and a plurality of red LED chips 11 and a plurality of blue LED chips 12 are arranged closely in the groove 13 , and the transparent silica gel fills the groove 1 3 , and the plurality of red LEDs The light exiting surfaces of the chip 11 and the plurality of blue LED chips 12 are all oriented toward the transparent silicone.

It can be understood that the above transparent silica gel can also be replaced by an epoxy resin, as long as the transparent material encapsulating the plurality of red LED chips 11 and the plurality of blue LED chips 12 achieves the effect of COB encapsulation, Simple variations or modifications of the invention fall within the scope of the invention. Of course, instead of providing the recess 1 3 , a plurality of red LED chips 11 and a plurality of blue LED chips 12 may be directly wrapped around the periphery of the chip on the plane of the package substrate, so that the plurality of red LED chips 11 and the plurality of blues are The light emitting surfaces of the LED chips 12 are all oriented toward transparent silicone or epoxy.

Compared with the prior art, the COB packaged LED plant lamp provided by the invention encapsulates a plurality of red and blue LED chips on a substrate by a transparent silicone or epoxy resin, because of a plurality of red LED chips and a plurality of The blue LED chips are arranged closely spaced, and the generated red light and blue light can be well fused, so that the fused light required by the plant can be uniformly irradiated to the crop, and the fusion light utilization rate is high and the cost is saved.

In this embodiment, the package substrate 10 is a circular, rectangular or polygonal package substrate. It can be understood that the present invention is not limited to the size and shape of the package substrate, and as long as it is used to package a plurality of red LED chips 11 and a plurality of blue LED chips 12 to achieve the effect of COB encapsulation, it is simple to the present invention. Deformation or transformation falls within the scope of protection of the present invention.

In this embodiment, the groove 13 is a circular, rectangular or polygonal groove. It can be understood that the present invention is not limited to the size and shape of the groove 13. As long as it is used to package a plurality of red LED chips 11 and a plurality of blue LED chips 12, the effect of the COB package is achieved. Simple variations or modifications of the invention fall within the scope of the invention.

In this embodiment, the number ratio of the red LED chip to the blue LED chip is 6 to 9:1. It can be understood that the present invention is not limited to the ratio of the number of the red LED chip and the blue LED chip, as long as the red LED chip 11 and the blue LED chip 12 are matched to achieve the effect of condensing light, depending on the actual plant, It is also possible to adjust the wavelength of the light by adding LED chips of other colors, such as adjusting the wavelength of the light in the form of adding a white LED chip, which is a simple deformation or transformation of the present invention, and falls within the protection scope of the present invention. The method for manufacturing a COB packaged LED plant lamp of the present invention comprises the following steps:

Step 101: providing a groove or a substrate plane on the package substrate;

Step 102: arranging a plurality of red LED chips and a plurality of blue LED chips in a tightly spaced manner in the plane of the groove or substrate;

Step 103: Filling the groove or surrounding chip with transparent silicone or epoxy to encapsulate a plurality of red LED chips and a plurality of blue LED chips.

In step 102, the ratio of the number of red LED chips to blue LED chips is 6 to 9:1. It can be understood that the present invention is not limited to the ratio of the number of the red LED chip and the blue LED chip, as long as the red LED chip 11 and the blue LED chip 12 are matched to achieve the effect of condensing light, depending on the actual plant, It is also possible to adjust the wavelength of the light by adding LED chips of other colors, such as adjusting the wavelength of the light in the form of adding a white LED chip, which is a simple deformation or transformation of the present invention, and falls within the protection scope of the present invention.

According to the research of the inventors, the current production of plant tissue culture, greenhouse leafy vegetables, solanaceous fruit and flowers and trees is generally used to produce light by using 6001 1000W incandescent lamps, fluorescent lamps, sodium lamps, metal halide lamps and even xenon lamps. Different plant growth requires different spectral sources, and the power conversion efficiency of these sources is only 0.1% to 1% of the spectrum required for plant growth. It contains many unwanted and even harmful wavelengths for plant growth. Their physiologically effective radiant energy is very low and energy consumption is high.

The power conversion efficiency of different light sources is shown in the following table:

The comparison of the 100WLED plant lamp with the 400W high pressure sodium lamp is shown in the table below: 100W LED plant growth lamp 400W high pressure sodium lamp

Contrast Power 100W LED Plant Growth Light 400W High Pressure Sodium Lamp

Luminous flux (lm) 1800 40000

Effective radiant energy 198 200

One day use 12 small 100W* 12 * 365=438000 watts 400W* 12 * 365=1752000 watts One year of power consumption (438 kWh) (1752 kWh)

Plant absorption and utilization 70% of light energy is absorbed by plants. Less than 20% of light energy is absorbed by plants.

It can be seen that the LED plant lamp can replace the plant lamp in the form of sodium and gold lamps of 3-6 times power, and saves 80% of electric energy.

The comparison between the present invention and the prior art LED plant lamp is shown in the following table:

Compared with the current LED plant light source package, the COB package can directly package multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, which not only reduces the manufacturing process and cost of the bracket, but also reduces heat dissipation. Advantage. And easy to install and manufacture! ! The most important thing is that the mixed light emitted is more uniform and more efficient, making the plants easier to absorb and utilize. The above disclosure is only a few specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be made by those skilled in the art should fall within the protection scope of the present invention.

Claims

Claim

A COB-packaged LED plant lamp, comprising: a package substrate, a plurality of red LED chips, a plurality of blue LED chips, and a transparent silica gel, wherein the package substrate is provided with a groove or a substrate plane, a plurality of red LED chips and a plurality of blue LED chips are arranged closely in the 1HJ slot or on the substrate plane, and the transparent silicon dioxide fills the 1HJ slot or surrounds the chip package on the substrate plane, The light emitting surfaces of the red LED chip and the plurality of blue LED chips are all facing the transparent silica gel.

2. The COB packaged LED plant light according to claim 1, wherein the package substrate is a circular, rectangular or polygonal package substrate.

The COB-packaged LED plant lamp according to claim 1 or 2, wherein the 1HJ groove is a circular, rectangular or polygonal 1HJ groove.

4. The COB-packaged LED plant lamp according to claim 3, wherein the number ratio of the red LED chip to the blue LED chip is 6 to 9:1.

5 . A COB-packaged LED plant lamp, comprising: a package substrate, a plurality of red LED chips, a plurality of blue LED chips and an epoxy resin, wherein the package substrate is provided with a groove or a substrate plane; The plurality of red LED chips and the plurality of blue LED chips are arranged closely in the 1HJ slot or on the substrate plane, and the epoxy fills the 1HJ slot or surrounds the chip package on the substrate plane. The light emitting surfaces of the plurality of red LED chips and the plurality of blue LED chips are all oriented toward the epoxy resin.

The COB-packaged LED plant lamp according to claim 5, wherein the package substrate is a circular, rectangular or polygonal package substrate.

The COB-packaged LED plant lamp according to claim 5 or 6, wherein the 1HJ groove is a circular, rectangular or polygonal 1HJ groove.

8. The COB-packaged LED plant lamp according to claim 7, wherein the ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.

A COB-packaged LED plant lamp manufacturing method, comprising the steps of: providing a groove or a substrate plane on a package substrate;

Aligning a plurality of red LED chips and a plurality of blue LED chips in the 1HJ slot or In the plane of the substrate;

A plurality of red LED chips and a plurality of blue LED chips are packaged by filling the grooves or surrounding the chip with transparent silicone or epoxy.

The method for fabricating a COB-packaged LED plant lamp according to claim 9, wherein the ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.