201104165 六、發明說明： 【發明所屬之技術領域】 • 本發明係關於一種應用光束發射半導體裝置之光源，更詳 . 細而言係以光束發射二極LED作為主要發光元件。本發明係關 於該光源之製備方法。 【先前技術】 市面上存在有多種需要特定輸出光束形狀及散度之光源 之不同類型之照明及光應用。對特定光束性質之需求亦關係着 ' 不同類型建築物之一般室内照明及極為精確之特定輸出光性質 之特定汽車應用。 在任何光源之核心中，在產生該類型光束之發光體中會有 一主要發光元件。傳統之白熾燈及排氣燈已佔所有主要發光元 件之大多數，尤其在對光束性質及整體照光效率與長期穩定性 之要求較為次要之應用。然而，眾所周知該類型之發光元件具 有多種缺失，包括使用壽命短，維護成本高，諸如在排氣燈中 存在水銀等生態相關問題，對照明效率及動態轉換之平穩調節 方面之困難等。尤其在生態相關及能源消耗課題方面之缺失已 被長期議論。舉例而言，已知高達15至20%之電氣能源總生 產量係被消耗在照明上。欲持續改良傳統技術以克服所涉問題 需要付出巨大努力。總結而言，該項技術實際上已臻極限。事 實上已在部份經濟領域採用調整措施，例如逐步抑止使用白熾 燈。 ' 目前諸如LED等半導體光束發射裝置係未來照明之最有 希望之替代品。市面上已有多種不同之LED型方案提供不同應 201104165 用。 除了主要發光元件及能源供應裝備之外，最常用之光源裝 置亦需要絲分配，即用以根據光源之預期導引圖以收集及重 新導引最初產生之光能源。在__般等級，不論任何類型之主要 發光元件之所有光源均為普遍。然而，應用等級之細目將隨着 發光元件’諸如介於白熾燈與LED之間之整體不同性質而有極 大差異。一般上在所需之光重新分配有二項可識別之主要觀 點。首先，適當之光散射對尤其在室内客廳或工作室之均勻照 明條件極為重要。另—方面，沿着__或多個主軸之光集結對室 外照明及特殊照明設備及應用方面則極為重要。 光散射課題涉及產生足夠亮度及均勻照明於照明目標物』 之數項挑戰，其中主要發光元件係設置於視野範圍内。尤其在 室内照明應用上，由於亮度及照明非均勻性係處於照明區者經 歷不適及疲倦之原因，目標區與發光元件之短距離將設定發光 元件之亮度之強烈限制。發光元件之亮度可以下式利用光亮度 L表示： τ I Φ ,201104165 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a light source using a beam-emitting semiconductor device, more specifically, a beam-emitting diode LED as a main light-emitting element. The present invention relates to a method of preparing the light source. [Prior Art] There are various types of illumination and light applications on the market that require a variety of light sources that have a specific output beam shape and divergence. The need for specific beam properties is also related to the specific automotive applications of the general indoor lighting of different types of buildings and the extremely precise specific output light properties. In the core of any source, there is a primary illuminating element in the illuminator that produces this type of beam. Conventional incandescent and exhaust lamps have accounted for the majority of all major illuminating components, especially in applications where beam properties and overall illumination efficiency and long-term stability are less important. However, it is well known that this type of light-emitting element has various drawbacks, including short service life, high maintenance cost, such as ecological problems such as mercury in the exhaust lamp, difficulty in smooth adjustment of lighting efficiency and dynamic conversion, and the like. In particular, the lack of ecological relevance and energy consumption issues has been discussed for a long time. For example, it is known that up to 15 to 20% of the total electrical energy production is consumed in lighting. It takes a lot of effort to continuously improve traditional technologies to overcome the problems involved. In summary, the technology has actually reached its limits. In fact, adjustment measures have been adopted in some economic sectors, such as the gradual suppression of the use of incandescent lamps. At present, semiconductor beam emitters such as LEDs are the most promising alternative to future lighting. There are many different LED-type solutions available on the market that are available for 201104165. In addition to the primary lighting components and energy supply equipment, the most commonly used light source devices also require wire distribution, i.e., to collect and re-direct the originally generated light energy source based on the intended guidance of the light source. At the __ level, all light sources of any type of primary illuminating element are common. However, the breakdown of the application level will vary greatly depending on the overall different nature of the illuminating element, such as between an incandescent lamp and an LED. Generally, there are two main identities that can be identified in the required light redistribution. First, proper light scattering is extremely important for uniform illumination conditions, especially in indoor living rooms or studios. On the other hand, light gathering along __ or multiple main axes is extremely important for outdoor lighting and special lighting equipment and applications. The problem of light scattering involves several challenges in generating sufficient brightness and uniform illumination of the illumination target, with the primary illumination element being placed within the field of view. Especially in indoor lighting applications, since brightness and illumination non-uniformity are the cause of discomfort and fatigue in the illumination area, the short distance between the target area and the illuminating element will set a strong limit on the brightness of the illuminating element. The brightness of the illuminating element can be expressed by the following formula: τ I Φ ,
S coS 其中I係光源之輻射強度，s係發光元件之光照射表面 積，Φ係來自光源之輻射光通量，而ω係照射光束之角度。由此 式可知發光元件之亮度不僅只取決於表面積，亦取決於散射光 通量之角度大小。與白熾燈及排氣燈相比較之下，半導體元件 具有更小照射表面積及以比傳統元件者之一半更小之角度傳送 光通量。因此在生產半導體型照明體時，必須比白熾燈及排氣 燈光源擴大散射光之面積β此舉將導致照明裝置之整體尺寸變 201104165 大，使生產程序複雜化，及增加額外成本，將廢止半導體光源 之較低能源所取得之效益。因此有需要一種可達至由諸如LED 等半導體型光束發射元件所照射之均勻輻射光亮度之成本效益 方案。 另一方面，在照明遠程物件之場合，主要挑戰在於難以達 至均勻照明強度。根據輻照度E之方程式，表面元件之照明強 度之測量示如下： R2 其中照明強度隨着光源之距離R及隨着入射光束之視角oc 之增加而減弱。較大角度之光散射將導致顯著之光學損失而造 成能源消耗增加。 有鑑於上述考量而為了達至預期輸出性能，需要藉助外界 鏡片以矯飾由諸如LED芯片等半導體光束照射元件所發射之 光束。通常係將小型標準透鏡結合於LED配件中。其中一種典 型方式係矽酮塗佈於芯片上後將透鏡附着其上以將先行產製透 鏡安裝於LED芯片。此類型之逐次程序雖係由全自動化裝置予 以執行，但極為耗時及成本昂貴。 作為進一步發展，己引進矽酮液成型作為一項更直接方式 以將透鏡成型及附着在LED芯片上。在液態矽酮成型法中，首 先係將一具有預期透鏡形狀之排列模孔之特製模具安裝於成型 機上。繼之將液態矽酮引入模孔中同時將模具壓制於附着LED 芯片之載體上。矽酮隨即硬化。录終藉此成型作業在各個LED 芯片上將形成一透鏡。 矽酮作為高亮度(HB)LED之適用材料之主要特質包括其 201104165 在UV可見區域内之高度透明性，控制性折射率（RI)，及穩定 之熱-光學機械性質。 尤其在光源中需要超過一種LED芯片以生產所需光能之 場合，亦有需要部份次要光源光以根據預期光形及分散度以矯 飾包含個別LED之光束之組合光束。 現時有許多習用建築工程係以簡化LED型光源配備為目 標，其中大多數係與表面安裝程序相容。不同方法之共同點在 於除了預期光學性能之外，亦需將下述各項列入適當考量： 光束照射芯片必須連接於電氣供源； 必須確保芯片至基材之有效熱傳遞以防止半導體裝置過 熱； 光學構造應最適化以取得最高光回收而由複數光反射及 光介質内部吸收所致損失減為最低； 尤其在消耗應用上，使LED型照明之整體生產成本減為 最低係極其重要。 先前技術之表面安裝LED配套通常係根據由一塑膠罩殼 及附接其上之一焊接框架以提供電源予光束照射芯片及予以導 電所組成之構造。實際之LED芯片係附設於罩殼及通過結合芯 片觸墊之金絲連接於焊接框架。該芯片係舖設在罩殼之腔室， 芯片上之腔室體積係填充着諸如磷光物質等光學封裝材料。芯 片之整體尺寸及精確形狀係隨着不同製備商及裝配類型而改 變。 多重LED光源之基本元件一般係由數個該種LED組件結 合成單一合併光源單元所構成。表面安裝LED組件係被焊接或 201104165 附接於印刷電路板或其他載體上。此載體另外附接於通過載體 作LED組件至外界之有效熱傳遞之輻射元件。將透鏡附接於各 該LED組件之頂部。利用一同時作為附加透鏡之玻璃防護蓋以 覆蓋整體元件。 上述習用方法存在多項缺失。部份構造中之元件係互相複 製以致所需功能係執行兩次。舉例而言，芯片之電氣連接係由 二段式構造予以實施，首先將芯片連接至焊接框架，再將烊接 框架連接至PCB。相對情形係關注芯片與外界環境之熱傳遞路 徑。此項方法使裝置及製程複雜化，同時增加成本。各LED之 螺接透鏡亦使成本提高及因附加反射介面之存在而減低有效光 提取作用。一般上此項技術係根據前期製備分離LED模組然後 將其併入光源元件中。 綜合而言，為了避免完成光源元件所需之過多步驟及組 件，以及使成本減低，業界需要一種半導體光束照射裝置型照 明裝置製備方法之新穎解決方案。 【發明内容】 本發明之目的係提供一種新穎及具成本效益之光源元 件，及該光源元件之新穎及具成本效益之製備方法。 本發明之光源元件及其製備方法之特徵係分別見述於申 請專利範圍第1項及第6項。 本發明之光源元件具有特定光束性質並包括多個半導體 光束照射裝置作為其主要發光元件。各該半導體光束照射裝置 具有透鏡以改變半導體光束照射裝置之光輸出。 在此所 '謂光源元件係指一種可產生該種預定光輸出光束 201104165 之-體成合併之"模組或該裝置 體成i之其中-部份。可利用諸如光源元件所產 之形狀、財、及Μ性等光束㈣叫 2 ，係適用於多項用途之部份標準性質，或可藉二;=光 途予以特別測定》 将殊用 在此所謂半導體光束照射裝置係指主要利用由一或多種 半導體材料構成之結構體中之裝韻之㈣重组以產之 何裝置。該㈣之裝置之典财㈣發光二極體咖及 鐘射’前者係大多數照明應用之最㈣組件4導體 係，為在單-基材晶圓上之大量組件之陣列製成。最、^係將包 含完整組件之晶圓分成個別組件之分離式晶片。此即所謂 片”。一般上未經加工之半導體芯片並未成為工作裝置，但有= 要外界能源供應及適當包裝防護芯片和提供發自芯片之執傳遞 路徑。 … 開始時，半導體裝置内產生之光係通過芯片之一或多面從 芯片中提取i取光束之性質主要係從芯片内部結構測出，因 此通常係不適用作其他用途。有繁於此，需要藉助—透鏡以改 變該輸出。丨同半導體光束照射裝置之透鏡可為分離式元件。 另一方面，亦可一體成型為單一物體，分離式透鏡將作為其不 同部份。 根據本發明，透鏡係設計成可產生半導體光束照射裝置之 改變光輸出，藉此根據光源元件之預定光束性質同時形成半導 體光束照射裝置之改變光輸出之組合。 換言之，各透鏡係設計使個別半導體光束照射裝置之改變 201104165 光輸出之組合係根據整體井 多數場合，各透鏡具有預定=質，時在 能係指構成透鏡之光學性固別光予性能。所w光學性 照射裝置之材料、形狀及位 &參數。包括透鏡相對於光束 鏡以作初步改變發光芯片^傳統方案係採用第—標準主透 最終組合輸出，而本發明係=：/然後將個別改變光束轉換成 -個透鏡階段。此舉明—階段光學方法°僅只需要 係設計結合形成光源元件之最二^降低u成^。不同透鏡 改變發光元件之輸出，包括有' 11，可被視為平—光學模組 學性能之整體光學模組之透=照射點/面。具有所需光 处規了稭—般光學工程利用習知設計 原理予以設計，例如—㈣用光學設計程式等》 最好各個半導體光束照射裝置之芯片係直接舖設在一共 同基材上’而所連接之透鏡係呈固體構造直接舖設在共同基材 上’於疋可密封芯片。該共同基材係諸如印刷電路板。直接舖 設在基材上係妓）ί本身係直接安裝在基材上而未經任何輔助 安裝。舉例而言，LED芯片通常係以構成機械外殼及芯片電子 連接之組裝包裝形式出售。本發明之實施例採用另一方法以利 用LED芯片而不需任何中間包裝。此舉再次簡化製程及導致半 導體芯片型光源元件之成本降低。此外，當芯片與基材有直接 接觸之場合’從芯片傳遞出來的熱能將被利用。於此實施例中 芯片之必需防護封裝係以固體透鏡結構予以實施，亦直接舖設 在共同基材上以密封芯片。此種類型之封裝經由適當選擇材 料’除了可呈現出預期光學功能’同時亦可有效防護芯片免受 機械及化學應力。 201104165 於一較可取實施例中，至少二個透鏡甚或所有透鏡係構成 一體成型之單體。換言之，本實施例中除了分離式透鏡組件， 不同光束照射裝置之透鏡係作為單透鏡本體之無法分離之一部 份。此舉可簡化光源元件構造，同時亦可提供光束照射裝置芯 片在共同基材上之較密實包封。 尤其在共同基材上之固體密封透鏡結構之場合，可構成透 鏡之較可取材料族群係由不同透明聚合物化合物所構成，尤其 係包含矽酮複合物者。此類型之材料可取得較低合理成本之高 性能光學組件。該材料，特別係矽酮，具備對廣泛波長範圍之 高透明度及極其穩定之光、熱與機械性質。除此之外，亦可於 初期以液態方式塗佈然後硬化，可提供極為有效之成型大量生 產透鏡。一般上由透明聚合化合物所構成之透鏡亦可包含其他 物質。 根據所述方法，本發明係專注於一種可產生具有預定光束 性質之輸出光束之光源元件之製備方法。該方法之步驟包括在 各個半導體光束照射裝置形成具有多個半導體光束照射裝置之 發光配備，及連接半導體光束照射裝置之透鏡以改變其光輸出。 本發明之方法之步驟包括： -測定光源元件之輸出光束之預期光束性質； -設計透鏡以產生半導體光束照射裝置之改變光輸出，根據 光源元件之預定光束性質而連同產生半導體光束照射裝 置之改變光輸出之組合；及 -製造透鏡及將透鏡安裝於光源元件。 以上所述關於本發明之光源係有關光源元件、半導體光束 10 201104165 照射装置、透鏡及光輸出以及製備方法等方面之詳情。同樣亦 有關本發明之方法及其實施例之說明。舉例而言，如前所述該 透鏡可被設計及製造為完全獨立物件’亦可作為一體之光學模. 組。另一方面，一透鏡可經設計以接收及導引來自超過一個以 上半導體光束照射裝置之光線。 本發明之方法之主要特徵係設計及製備透鏡為分離式及 個別或作為標準形式組件，於是各個透鏡係適當貢獻整體光源 元件之最終光輸出。換言之，各個半導體裝置-透鏡配對，尤其 係以操作角度而言，將形成整體光源元件之一體成型部份。因 此與標準半導體裝置包裝及標準成型主透鏡之傳統方案相比較 之下，本發明之光學系統之第一階段係根據預期光源性能予以 設計。此項方法可提供大致單一階段之光學系統。一般上亦可 需要一防護玻璃蓋，但其光學性能實際上益不顯著。 預期光束性質可由在多項不同應用中所用之部份標準性 質予以測定。亦可由一些特定照明用途之特定需求予以測定。 此類型測定之相關參數包括輸出光束之尺寸、形狀、分散性、 及方向性圖等。 可根據已經確立之設計原理及採用諸如適當光學設計軟 體以設計透鏡。精於此藝者當知，透鏡之性能係取決於諸如透 鏡材料之光學性質，透鏡表面之形狀及發光元件之間距等，在 此發光元件係指半導體光束照射裝置。 隶好在製備光束照射配備之步驟中將各個半導體光束昭 射裝置之芯片直接附接於一共同基材上，而相連接之透鏡係^ 接作成共同基材上之固體結構以包封芯片β共同基材代表芯片 11 201104165S coS is the radiation intensity of the I-based light source, s is the light-emitting surface area of the light-emitting element, Φ is the radiation flux from the light source, and the angle of the ω-ray is the beam. From this formula, it is understood that the brightness of the light-emitting element depends not only on the surface area but also on the angle of the scattered light flux. In contrast to incandescent and exhaust lamps, semiconductor components have a smaller illumination surface area and transmit light flux at an angle smaller than one-half of conventional components. Therefore, when producing a semiconductor-type illuminating body, it is necessary to enlarge the area of the scattered light β than the incandescent lamp and the illuminating light source. This will cause the overall size of the illuminating device to be changed to 201,104,165, complicating the production process, and adding additional cost, and will be abolished. The benefits of lower energy sources for semiconductor light sources. There is therefore a need for a cost effective solution that achieves uniform brightness of light emitted by a semiconductor beam emitting element such as an LED. On the other hand, in the case of illuminating remote objects, the main challenge is that it is difficult to achieve uniform illumination intensity. According to the equation of irradiance E, the measurement of the illumination intensity of the surface element is as follows: R2 where the illumination intensity decreases with the distance R of the source and as the angle of view oc of the incident beam increases. Larger angles of light scattering will result in significant optical losses resulting in increased energy consumption. In order to achieve the desired output performance in view of the above considerations, it is necessary to use an external lens to correct the light beam emitted from the semiconductor beam illuminating element such as an LED chip. A small standard lens is usually incorporated into the LED accessory. One of the typical methods is to apply a fluorenone to the chip and attach the lens to the LED chip. This type of sequential procedure is performed by a fully automated device, which is extremely time consuming and costly. As a further development, oxime liquid formation has been introduced as a more direct way to shape and attach lenses to LED chips. In the liquid fluorenone molding method, a special mold having an aligned die hole having an intended lens shape is first mounted on a molding machine. The liquid fluorenone is then introduced into the die orifice while the mold is pressed onto the carrier to which the LED chip is attached. The anthrone is then hardened. At the end of the recording, a lens will be formed on each of the LED chips. The main characteristics of anthrone as a suitable material for high-brightness (HB) LEDs include its high transparency in the visible region of UV, the controlled refractive index (RI), and the stable thermo-optical properties in 201104165. In particular where more than one LED chip is required in the light source to produce the desired light energy, some secondary source light is required to tailor the combined beam of light comprising individual LEDs depending on the desired shape and dispersion. There are many conventional construction projects that aim to simplify the installation of LED-type light sources, most of which are compatible with surface mount procedures. The commonality of the different methods is that in addition to the expected optical properties, the following items should be considered as appropriate: The beam-illuminating chip must be connected to an electrical supply; the effective heat transfer from the chip to the substrate must be ensured to prevent overheating of the semiconductor device. The optical structure should be optimized to achieve the highest light recovery with minimal loss due to complex light reflection and internal absorption of the optical medium; especially in consumer applications, it is extremely important to minimize the overall production cost of LED lighting. Prior art surface mount LED packages are typically constructed from a plastic housing and a soldering frame attached thereto to provide power to the beam to illuminate the chip and conduct electrical conduction. The actual LED chip is attached to the casing and connected to the welding frame by a gold wire bonded to the chip pad. The chip is placed in a chamber of the casing, and the chamber volume on the chip is filled with an optical encapsulating material such as a phosphor. The overall size and precise shape of the chip varies with different manufacturers and assembly types. The basic components of a multiple LED light source are typically formed by combining a plurality of such LED components into a single combined light source unit. Surface mount LED components are soldered or attached to a printed circuit board or other carrier. This carrier is additionally attached to a radiating element that passes the carrier as an effective heat transfer to the outside of the LED assembly. A lens is attached to the top of each of the LED assemblies. A monolithic cover is used as an additional lens to cover the integral component. There are a number of deletions in the above conventional methods. The components in the partial construction are copied to each other so that the desired function is performed twice. For example, the electrical connection of the chip is implemented in a two-stage configuration by first attaching the chip to the soldering frame and then attaching the splicing frame to the PCB. The relative situation is concerned with the heat transfer path between the chip and the external environment. This approach complicates the device and process while increasing costs. The screwed lens of each LED also increases cost and reduces effective light extraction due to the presence of additional reflective interfaces. Generally, this technology separates the LED module according to the preliminary preparation and then incorporates it into the light source component. In summary, in order to avoid the numerous steps and components required to complete the light source components, and to reduce costs, there is a need in the art for a novel solution for the fabrication of semiconductor beam illumination device type illumination devices. SUMMARY OF THE INVENTION It is an object of the present invention to provide a novel and cost effective light source component and a novel and cost effective method of making the light source component. The features of the light source component of the present invention and the method of preparing the same are described in items 1 and 6 of the scope of the patent application, respectively. The light source element of the present invention has specific beam properties and includes a plurality of semiconductor beam irradiation devices as its main light-emitting elements. Each of the semiconductor beam irradiation devices has a lens to change the light output of the semiconductor beam irradiation device. Herein, the term "light source component" refers to a portion of the module or the device body that produces the predetermined light output beam 201104165. The beam (4), such as the shape, finance, and sturdiness produced by the light source element, can be used as part of the standard nature of a plurality of uses, or can be borrowed by two; = special measurement by light path. A semiconductor beam illumination device refers to a device that is primarily produced by recombination (4) in a structure composed of one or more semiconductor materials. The (4) device's code (4) LEDs and clocks. The former is the most (4) component 4 conductor system for most lighting applications. It is made up of an array of a large number of components on a single-substrate wafer. The most is a separate wafer that divides the wafer containing the complete component into individual components. This is the so-called film. Generally, the unprocessed semiconductor chip does not become a working device, but there are = external energy supply and proper packaging of the protection chip and the delivery path from the chip. ... At the beginning, the semiconductor device is generated. The light is extracted from the chip by one or more sides of the chip. The nature of the beam is mainly measured from the internal structure of the chip, and therefore is generally not suitable for other uses. In this case, a lens is needed to change the output. The lens of the semiconductor beam irradiation device may be a separate component. On the other hand, it may be integrally formed as a single object, and the separate lens will be a different part thereof. According to the invention, the lens system is designed to generate a semiconductor beam irradiation device. Varying the light output, thereby simultaneously forming a combination of varying light outputs of the semiconductor beam illumination device based on the predetermined beam properties of the source elements. In other words, each lens system is designed such that the individual semiconductor beam illumination device changes the combination of the light output of the 201104165 based on the overall well In most cases, each lens has a predetermined quality, and the energy is The optically fixed light of the lens gives the performance. The material, shape and position of the optical illumination device include the lens relative to the beam mirror for the initial change of the light-emitting chip. The conventional scheme adopts the first-standard final combination. Output, while the present invention =: / then converts the individual changed beam into a lens stage. This shows that the stage optical method only requires the combination of the design to form the light source element to reduce the amount of U to ^. Different lenses change the light. The output of the component, including the '11, can be regarded as flat-optical module's overall optical module's penetration = illumination point / surface. With the required light rules for straw - general optical engineering using conventional design principles Designed, for example—(4) using an optical design program, etc. Preferably, the chip of each semiconductor beam irradiation device is directly laid on a common substrate' and the connected lens is laid directly on a common substrate in a solid structure. The chip can be sealed. The common substrate is such as a printed circuit board. It is directly laid on the substrate.) The system itself is directly mounted on the substrate without any auxiliary installation. For example, LED chips are typically sold in assembled packages that make up the mechanical housing and chip electronics. Embodiments of the present invention employ another method to utilize LED chips without any intermediate packaging. This simplifies the process and leads to The cost of the semiconductor chip type light source element is reduced. In addition, when the chip is in direct contact with the substrate, the heat energy transferred from the chip will be utilized. In this embodiment, the necessary protective package of the chip is implemented by a solid lens structure. It is also laid directly on a common substrate to seal the chip. This type of package can also effectively protect the chip from mechanical and chemical stresses by appropriately selecting the material 'in addition to exhibiting the desired optical function'. 201104165 A preferred embodiment At least two lenses or even all of the lens systems constitute an integrally formed single body. In other words, in this embodiment, in addition to the split lens assembly, the lens of the different beam irradiation device is a part of the single lens body that cannot be separated. This simplifies the construction of the light source components while also providing a denser encapsulation of the beam illuminator chip on a common substrate. Particularly in the case of a solid sealed lens structure on a common substrate, the preferred group of materials that may constitute the lens are composed of different transparent polymer compounds, especially those comprising an anthrone complex. This type of material provides high performance optical components at a lower cost. This material, especially fluorenone, has high transparency and extremely stable light, thermal and mechanical properties over a wide range of wavelengths. In addition, it can be applied in a liquid form and then hardened at an early stage, providing an extremely efficient molding of a large number of production lenses. Generally, a lens composed of a transparent polymeric compound may contain other substances. In accordance with the described method, the present invention is directed to a method of fabricating a light source component that produces an output beam having a predetermined beam property. The method includes the steps of forming a light-emitting device having a plurality of semiconductor beam irradiation devices at each of the semiconductor beam irradiation devices, and connecting the lenses of the semiconductor beam irradiation device to change the light output thereof. The steps of the method of the invention comprise: - determining the expected beam properties of the output beam of the source element; - designing the lens to produce a varying light output of the semiconductor beam illumination means, along with a change in the predetermined beam properties of the source element along with the generation of the semiconductor beam illumination means a combination of light outputs; and - manufacturing the lens and mounting the lens to the light source component. The light source of the present invention described above is related to the light source element, the semiconductor beam 10 201104165 illumination device, the lens and the light output, and the preparation method. Also described is a description of the method of the invention and its embodiments. For example, the lens can be designed and fabricated as a completely separate object as previously described. It can also be an integral optical module. Alternatively, a lens can be designed to receive and direct light from more than one semiconductor beam illumination device. The main feature of the method of the present invention is the design and fabrication of lenses that are separate and individual or as standard form components, such that each lens suitably contributes to the final light output of the overall source element. In other words, the individual semiconductor device-lens pairings, particularly in terms of operating angles, will form a body shaped portion of the overall light source element. Therefore, the first stage of the optical system of the present invention is designed in accordance with the desired light source performance in comparison with conventional semiconductor device packaging and conventional methods of standard forming the main lens. This method provides an optical system that is roughly single stage. Generally, a protective glass cover may be required, but its optical performance is actually not significant. The expected beam properties can be determined from some of the standard properties used in a number of different applications. It can also be determined by the specific needs of some specific lighting applications. The relevant parameters for this type of measurement include the size, shape, dispersion, and directional pattern of the output beam. The lens can be designed according to established design principles and using software such as appropriate optical design. It is known to those skilled in the art that the performance of the lens depends on, for example, the optical properties of the lens material, the shape of the lens surface, and the distance between the light-emitting elements, etc., where the light-emitting element refers to a semiconductor beam illumination device. The chip of each semiconductor beam illuminating device is directly attached to a common substrate in the step of preparing the beam irradiation device, and the connected lens system is connected to form a solid structure on the common substrate to encapsulate the chip β. Common substrate representative chip 11 201104165
，可採用電子工業中習用之程序及裝置 與透鏡係附接於相同之單一基材上。 安裝，但芯片係大致直接附接於基材 最好在製備透鏡及將其安裝於光源元件之步驟中，至少二 個透鏡係-體成型為單—娜。將數個透鏡結合為單—透鏡單 元體將可簡化製程及降低成本。 在一較可取實施例中，係將透明聚合物化合物（最好係珞 酮）舖設於共同基材（最好係初始呈液體狀態）上構成透鏡。如士 所述，液態基材可供使用成型方法以有效大量生產成型程序予 以實施。可將液態透鏡材料注入模具中連同具有半導體光東照 射裝置芯片之共同基材。固化後對透鏡實施加熱或諸如紫外線 照射，將模具移除。因此在此類型之程序中之透鏡製備及安裝 並非分開實施而是在單一程序内實施。成型作業係作為高容量 程序予以實施，其中係在同時間製備大量光源元件之透鏡或光 學模組。矽酮成型係一項已獲肯定之技術領域，因此在此不需 予以詳細說明。 除了成型作業’亦可利用適當改良印刷程序將液態透鏡物 質塗佈於共同基材上。印刷技術之不同變化可進一步增進製備 程序之生產效率及成本效益。 【實施方式】 圖1之LED配備1具有一焊接框架2用以提供電力至led 12 201104165 芯片3及將過量之熱能傳遞離開該配備。該焊接框架係利用連 結芯片上之接觸墊之金絲4連接於芯片。芯片係設在構成配備 本體之塑膠外殼6内之中空部5内。該中空部係填充以一些包 封材料，一般係磷光體以將芯片初始產生之光波長轉換為白色 光。 圖2所示之多LED光源元件7中，係將LED配備1附接 於一印刷電路板（PCB)8上再安裝於一適用以將光源元件之熱 能傳遞至空氣中之散熱器9。各個LED配備具有安裝在前側以 收集及重新導引從LED配備提取之光線之主透鏡10。利用一 防護玻璃外殼11之調整以關閉整個光源單元。基於主透鏡之標 準光學性能及玻璃外殼係設計具有特殊光學性能以根據預期光 學性能取得光源元件之組合輸出。另一方面，可實施由設在光 源元件外側之一或多個透鏡之第二光學階段以對所產生之光束 進行最後成形。 圖3顯示圖2之基本構造之變更態樣。散熱器9具有朝向 不同方向之表面藉以增進自光源元件之組合光輸出。換言之， 係利用光源元件之更複雜機械以調f卩光學性能。此外，於此場 合’各個LED芯片具有其本身之PCB載體。 圖1 -3所示之先前技術構造具有一些缺失及限制。首先， 光源元件内之部份元件係重複兩次展示相同功能。舉例而言， LED芯片與PCB之間之電子連接係作成二段式構造。首先led 芯片3係利用連結線4連接於焊接框架2。焊接框架再通過焊 接接頭連接於PCB8。有數種接觸介面將增加芯片與pcB上電 路之間之總電阻。同理，從芯片至大氣之熱傳遞路徑具有數種 13 201104165 介面，於是可減低總熱傳導性。從芯片至大氣之光學路徑具有 高達六種材料介面，各介面將導致反射性減損。除了上述問題 之外，此項方法亦具有非必需性之多種製備步驟及在最終光源 元件中之個別組件，以上兩者均將增加製造成本。 圖4所示之光源元件12係本發明之新穎方法。係將LED 芯片3直接附着在PCB8上後利用連結金絲線4予以連接。再 將PCB附接在類似2及圖3所示之散熱器9上。一般上這並非 所需電子連接之唯一實施方法，亦可採用例如芯片之倒裝芯片 法。利用少量含磷光體材料13以包封芯片以呈現白光轉換。由 矽酮形成之固體透鏡14係被舖設於PCB上緊密包封芯片。含 磷光體材料用量及透鏡之形狀係經過調節以呈現一種光學功能 使光源元件内不同LED之組合輸出將聯合產生具有預定輸出 光束性質之光源元件之光輸出。 圖4之光源元件提供比圖1-3之先前技術者更優之數項主 要優點。首先，光源之整體製備程序係更直接及減少個別步驟。 當不需要LED之中間包裝時，可減少個別組件之總數。舉例而 言，含磷光體材料用量與其上之矽酮之組合連同芯片之包封將 呈現所需之光學功能。前述先前技術中，芯片之包封係在LED 配備外殼中之中空體内之包封材料予以進行。而光學功能係以 標準形式LED透鏡及防護玻璃外殼予以實施。圖4所示之光源 元件中，防護玻璃外殼係標準類型，因不需在光源之光學性能 中。一般上在光學性能上之可能效應應納入透鏡設計之考量。 該構造比先前技術方法具有較低反射性材料介面，及較簡化電 子與熱傳導路徑》 14 201104165 八圖5顯示本發明比先前技術如何更簡化光源元件之光輸 之分散調節。LED之光轴15對準調節係僅以透鏡之形狀及 ίΓ實施。冑5中附接LED芯片3及透鏡之载板㈣以Ϊ “圖式巾之PCB額之陰影凸顯pCB僅為可用基材 之其中一種實例。 圖6之製備程序始於測定光源元件之預期光輸出性質然 依據該性該計LED透鏡1際製_序開科係將咖、芯 片3附接於單一載板上，例如PCB8(圖中步驟A所示可藉^ 何習知方法進行附接作業，例如利用先塗佈膠_於咖上缺 後將芯片置於其上。繼之，採用諸如金絲4連結（步驟β)進行 芯片與載板之間之電子連接。然後將少量含縣體材料13設^ 於LED芯片3上（步驟〇。與此同時，在載板上製備一具有設 計透鏡形狀及芯片定位之中空部之模具17(步驟D)。在中空部 填充液態石周…然後將模具與設有芯片t載板連接在一起(步 驟E)。讓石夕綱硬化後’將模具分開。於是LED芯片3將緊密 包封於固體透鏡内，即沒有任何間隙（步驟F)。芯片與透鏡之 間之無空氣間隙將有助於從芯片提取之光之增強作用。 與圖4-6中各LED之個別及分離式透鏡相比較之下，圖 7-8顯示之另一方法中由數個LED芯片3之透鏡4係作成一體 成型透鏡單元之非分離部份。一體成型透鏡單元可提供數個 LED芯片之有效光集作用而減少透鏡材料耗用。同時亦可允許 心片在載板16上更拍、實之包裝β圖8顯示一實施例，其中係採 用一體成型透鏡單元之原理以在LED芯片陣列上槿丨透 鏡結構，型之設計可產生長型輸出光：亡 15 201104165 變單一透鏡單元所覆蓋之芯片之數目即可比使用各芯片之分離 式透鏡取得更有效率之預期光源方向性圖式。 須知本發明之上述實施例係僅作為說明用途。本發明不擬受限 於該實施例。實施例可在申請專利範圍内作自由變更。更詳細 而言，所示圖式不應被視為技術有效及可行性之設計，而僅作 為示意用途。 【圖式簡單說明】 以下將參照附圖詳細說明本發明及其較可取實施例。 圖1顯示一種典型先前技術之LED配備； 圖2及圖3顯示先前技術之LED型光源元件； 圖4及圖5顯示本發明之LED型光源元件之實施例； 圖6顯示本發明之製備程序之一實施例之流程圖；及 圖7及圖8顯示本發明之LED型光源元件之另一實施例。 【主要元件符號說明】 1 LED配備 2 焊接框架 3 忠片 4 金絲 5 中空部 6 塑膠外殼 7 光源元件 8 印刷電路板 9 散熱器 10 主透鏡 11 防護玻璃外殼 12 光源元件 13 含磷光體材料 14 固體透鏡 16 載板 17 模具 18 液態矽酮 16The procedures and devices conventionally used in the electronics industry can be attached to the same single substrate as the lens system. Mounting, but the chip is attached directly to the substrate. Preferably, in the step of preparing the lens and mounting it to the light source element, at least two lens bodies are formed into a single-nano. Combining several lenses into a single-lens unit will simplify the process and reduce cost. In a preferred embodiment, a transparent polymeric compound (preferably an fluorenone) is applied to a common substrate (preferably in an initially liquid state) to form a lens. As stated by the syllabus, the liquid substrate can be implemented by using a molding method to efficiently mass-produce the molding process. The liquid lens material can be injected into the mold along with a common substrate having a semiconductor photo-illuminator chip. After curing, the lens is heated or irradiated, such as by ultraviolet light, to remove the mold. Lens preparation and installation in this type of procedure is therefore not implemented separately but in a single program. The molding operation is carried out as a high-capacity program in which a lens or an optical module in which a large number of light source elements are simultaneously prepared. Anthrone molding is an affirmed technical field and therefore need not be described in detail here. In addition to the molding operation, the liquid lens material can be applied to a common substrate by a suitably modified printing process. Different variations in printing technology can further increase the productivity and cost effectiveness of the preparation process. [Embodiment] The LED device 1 of Fig. 1 has a soldering frame 2 for supplying power to the LED 12 201104165 chip 3 and transferring excess thermal energy away from the device. The solder frame is attached to the chip using gold wires 4 that connect the contact pads on the chip. The chip is housed in a hollow portion 5 constituting a plastic case 6 provided with a body. The hollow portion is filled with some encapsulating material, typically a phosphor to convert the wavelength of light originally produced by the chip into white light. In the multi-LED light source element 7 shown in Fig. 2, the LED device 1 is attached to a printed circuit board (PCB) 8 and mounted to a heat sink 9 adapted to transfer the thermal energy of the light source element to the air. Each LED is equipped with a main lens 10 mounted on the front side to collect and redirect light extracted from the LED assembly. The adjustment of a cover glass housing 11 is utilized to close the entire light source unit. The standard optical performance based on the main lens and the glass housing design have special optical properties to achieve a combined output of the source elements based on the desired optical performance. Alternatively, a second optical stage of one or more of the lenses disposed outside of the light source element can be implemented to effect final shaping of the resulting beam. Fig. 3 shows a modification of the basic configuration of Fig. 2. The heat sink 9 has surfaces facing in different directions to enhance the combined light output from the light source elements. In other words, a more complex machine of the light source elements is utilized to adjust the optical performance. Moreover, in this case, each LED chip has its own PCB carrier. The prior art construction shown in Figures 1-3 has some limitations and limitations. First, some of the components in the light source component repeat the same function twice. For example, the electronic connection between the LED chip and the PCB is constructed in a two-stage configuration. First, the led chip 3 is connected to the solder frame 2 by a bonding wire 4. The soldering frame is then connected to the PCB 8 via a solder joint. There are several contact interfaces that will increase the total resistance between the chip and the circuit on the pcB. Similarly, the heat transfer path from the chip to the atmosphere has several 13 201104165 interfaces, which can reduce the total thermal conductivity. The optical path from the chip to the atmosphere has up to six material interfaces, each of which will result in a reflective impairment. In addition to the above problems, this method also has a variety of preparation steps that are non-essential and individual components in the final light source component, both of which will increase manufacturing costs. The light source element 12 shown in Fig. 4 is a novel method of the present invention. The LED chip 3 is directly attached to the PCB 8 and then connected by a connecting gold wire 4. The PCB is then attached to a heat sink 9 similar to 2 and FIG. In general, this is not the only implementation of the required electronic connection, but a flip chip method such as a chip can also be used. A small amount of phosphor-containing material 13 is utilized to encapsulate the chip to exhibit white light conversion. A solid lens 14 formed of anthrone is laid on the PCB to tightly encapsulate the chip. The amount of phosphor-containing material and the shape of the lens are adjusted to exhibit an optical function such that the combined output of the different LEDs within the source component will jointly produce a light output of the source component having a predetermined output beam property. The light source component of Figure 4 provides several major advantages over the prior art of Figures 1-3. First, the overall preparation of the light source is more straightforward and reduces individual steps. When the intermediate package of LEDs is not required, the total number of individual components can be reduced. For example, the combination of the amount of phosphor-containing material and the fluorenone on it, together with the encapsulation of the chip, will exhibit the desired optical function. In the foregoing prior art, the encapsulation of the chip is performed by an encapsulating material in the hollow body of the LED equipped housing. The optical function is implemented in standard form LED lenses and protective glass housings. In the light source component shown in Fig. 4, the cover glass casing is of a standard type because it does not need to be in the optical properties of the light source. Generally, the possible effects on optical performance should be included in the lens design considerations. This configuration has a lower reflective material interface than prior art methods, and a more simplified electron and heat conduction path. Figure 14 shows how the present invention simplifies the dispersion adjustment of the light source of the light source elements more than the prior art. The alignment of the optical axis 15 of the LED is performed only in the shape of the lens and the lens.胄5 Attached to the LED chip 3 and the carrier plate of the lens (4) Ϊ “The shadow of the PCB surface of the pattern towel highlights pCB as only one example of a usable substrate. The preparation procedure of Figure 6 begins with the determination of the expected light of the light source component. According to the nature of the output, the LED lens 1 is attached to a single carrier board, such as the PCB 8 (the step A shown in the figure can be attached by any conventional method. For example, by using a glue first, the chip is placed on the chip after it is absent. Then, an electronic connection between the chip and the carrier is carried out by using a wire bonding such as gold wire 4 (step β). 13 is disposed on the LED chip 3 (step 〇. At the same time, a mold 17 having a hollow portion designing a lens shape and chip positioning is prepared on the carrier plate (step D). The liquid portion is filled in the hollow portion... and then The mold is connected with the chip carrier plate (step E). After the stone is hardened, the mold is separated. Then the LED chip 3 is tightly enclosed in the solid lens, that is, without any gap (step F). An air gap between the lens and the lens will help to extract from the chip The enhancement of the light. Compared with the individual and separate lenses of the LEDs in Figures 4-6, the lens of the LED chip 3 is formed into an integrally formed lens unit in another method shown in Figures 7-8. The non-separating part. The integrally formed lens unit can provide effective light collection of several LED chips to reduce the consumption of the lens material. At the same time, it can also allow the core piece to be more photographed on the carrier board 16 and packaged in the actual form. In the embodiment, the principle of integrally forming the lens unit is adopted to slap the lens structure on the LED chip array, and the design of the type can generate long output light: the number of chips covered by the single lens unit can be compared with the use of each The split-lens of the chip achieves a more efficient desired directional pattern of the light source. It is to be understood that the above-described embodiments of the present invention are for illustrative purposes only. The present invention is not intended to be limited to the embodiment. Freely changed. In more detail, the illustrated drawings should not be considered as technically effective and feasible designs, but only for illustrative purposes. [Simple description of the drawings] The invention and its preferred embodiments are illustrated. Figure 1 shows a typical prior art LED arrangement; Figures 2 and 3 show prior art LED-type light source elements; Figures 4 and 5 show the implementation of the LED-type light source elements of the present invention Figure 6 is a flow chart showing an embodiment of the preparation procedure of the present invention; and Figures 7 and 8 show another embodiment of the LED-type light source component of the present invention. [Main component symbol description] 1 LED equipped with 2 soldering frame 3 loyalty sheet 4 gold wire 5 hollow part 6 plastic case 7 light source element 8 printed circuit board 9 heat sink 10 main lens 11 protective glass casing 12 light source element 13 phosphor material 14 solid lens 16 carrier 17 mold 18 liquid fluorenone 16