FI20095567A0 - Manufacture of a light source - Google Patents

Manufacture of a light source

Info

Publication number
FI20095567A0
FI20095567A0 FI20095567A FI20095567A FI20095567A0 FI 20095567 A0 FI20095567 A0 FI 20095567A0 FI 20095567 A FI20095567 A FI 20095567A FI 20095567 A FI20095567 A FI 20095567A FI 20095567 A0 FI20095567 A0 FI 20095567A0
Authority
FI
Finland
Prior art keywords
manufacture
light source
source
light
Prior art date
Application number
FI20095567A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Vladislav E Bougrov
Maxim A Odnoblyudov
Original Assignee
Ooo Optogan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ooo Optogan filed Critical Ooo Optogan
Priority to FI20095567A priority Critical patent/FI20095567A0/en
Publication of FI20095567A0 publication Critical patent/FI20095567A0/en
Priority to PCT/FI2010/050411 priority patent/WO2010133772A1/en
Priority to TW99116437A priority patent/TW201104165A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
FI20095567A 2009-05-22 2009-05-22 Manufacture of a light source FI20095567A0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20095567A FI20095567A0 (en) 2009-05-22 2009-05-22 Manufacture of a light source
PCT/FI2010/050411 WO2010133772A1 (en) 2009-05-22 2010-05-21 A light source element and a method for manufacturing
TW99116437A TW201104165A (en) 2009-05-22 2010-05-24 A light source element and a method for manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20095567A FI20095567A0 (en) 2009-05-22 2009-05-22 Manufacture of a light source

Publications (1)

Publication Number Publication Date
FI20095567A0 true FI20095567A0 (en) 2009-05-22

Family

ID=40680747

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095567A FI20095567A0 (en) 2009-05-22 2009-05-22 Manufacture of a light source

Country Status (3)

Country Link
FI (1) FI20095567A0 (en)
TW (1) TW201104165A (en)
WO (1) WO2010133772A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
KR101661263B1 (en) 2011-09-26 2016-09-29 무스코 코포레이션 Lighting system having a multi-light source collimator and method of operating such
CN103791252B (en) * 2012-10-30 2017-05-03 欧司朗股份有限公司 Light-emitting module and illuminating apparatus and lamp box including light-emitting module
CN103807627B (en) * 2012-11-13 2017-05-10 欧司朗有限公司 Light emitting module and illumination device with light emitting module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1693904B1 (en) * 2005-02-18 2020-03-25 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
EP1861876A1 (en) * 2005-03-24 2007-12-05 Tir Systems Ltd. Solid-state lighting device package
US20080278954A1 (en) * 2005-04-05 2008-11-13 Tir Systems Ltd. Mounting Assembly for Optoelectronic Devices
CA2620144A1 (en) * 2005-04-06 2006-10-12 Tir Technology Lp Lighting module with compact colour mixing and collimating optics
JP5357379B2 (en) * 2006-02-23 2013-12-04 パナソニック株式会社 Light emitting device
JP2008294309A (en) * 2007-05-25 2008-12-04 Showa Denko Kk Light emitting device and display device

Also Published As

Publication number Publication date
TW201104165A (en) 2011-02-01
WO2010133772A1 (en) 2010-11-25

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Legal Events

Date Code Title Description
FD Application lapsed