WO2013152737A1 - Lampe pour plante à led mise sous boîtier cob et son procédé de fabrication - Google Patents

Lampe pour plante à led mise sous boîtier cob et son procédé de fabrication Download PDF

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Publication number
WO2013152737A1
WO2013152737A1 PCT/CN2013/074135 CN2013074135W WO2013152737A1 WO 2013152737 A1 WO2013152737 A1 WO 2013152737A1 CN 2013074135 W CN2013074135 W CN 2013074135W WO 2013152737 A1 WO2013152737 A1 WO 2013152737A1
Authority
WO
WIPO (PCT)
Prior art keywords
led chips
red
cob
blue led
groove
Prior art date
Application number
PCT/CN2013/074135
Other languages
English (en)
Chinese (zh)
Inventor
周海兵
Original Assignee
深圳市蓝海盛照明科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市蓝海盛照明科技有限公司 filed Critical 深圳市蓝海盛照明科技有限公司
Publication of WO2013152737A1 publication Critical patent/WO2013152737A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G7/00—Botany in general
    • A01G7/04—Electric or magnetic or acoustic treatment of plants for promoting growth
    • A01G7/045—Electric or magnetic or acoustic treatment of plants for promoting growth with electric lighting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
    • Y02P60/14—Measures for saving energy, e.g. in green houses

Definitions

  • the present invention relates to the field of LED lighting technologies, and in particular, to a COB packaged LED plant lamp and a method of fabricating the same.
  • LEDs have developed rapidly due to their high efficiency, energy saving, long life and easy installation.
  • LED lamps are rich in wavelength types, which coincide with the spectral range of plant photosynthetic and book light forms. Pure monochromatic light and composite spectra can be combined as needed to concentrate the light of a specific wavelength to uniformly illuminate the crop.
  • LED plant lights not only regulate crop flowering and fruiting, enhance seedling quality, improve seedling rate, shorten seedling cycle, but also control plant height and plant nutrients.
  • the LED has less heat generation and a small footprint, and can be used in a multi-layer cultivation stereoscopic combination system, achieving low heat load and miniaturization of production space.
  • the extreme durability of LEDs also reduces operating costs. Due to these remarkable features, LEDs are well suited for plant cultivation in controlled facility environments such as plant tissue culture, facility horticulture and industrial seedlings, and aerospace ecological life insurance systems.
  • the wavelength of light required for plant growth and development is 400-700 nm, while the wavelengths of LED blue and red light are 400-500 nm and 61 0-720 nm, respectively.
  • Light is just the two kinds of 'light fertilizers' needed for plants.
  • the most suitable light for plant growth and development is red-blue combined light, while single red or blue light does not have much effect on promoting plant growth and development. Therefore, it is now done to fill the plants, promote the growth and development of plants, and change the photoperiod of the plants with red and blue combined light, and even add a small number of other colors. In actual tests, the degree of fusion of red and blue light is one of the important factors determining the photosynthetic effect of plants.
  • the existing LED plant lamp uses multiple red and blue LED lamp beads as the light source. There is a large distance between the lamp bead and the lamp bead, and some pure red light regions will inevitably appear, resulting in poor light fusion effect and partial light. It is wasted, reducing its utilization rate, increasing costs, and affecting the growth and development of some plants. Summary of the invention
  • the present invention provides a COB-packaged LED plant lamp, which has a good fusion effect of red and blue light lines, and can generate a condensed light required for plants to uniformly illuminate the crop.
  • the present invention provides a COB-packaged LED plant lamp, comprising a package substrate, a plurality of red LED chips, a plurality of blue LED chips, and a transparent silica gel, wherein the package substrate is provided with a groove or a substrate plane.
  • the plurality of red LED chips and the plurality of blue LED chips are closely spaced in the groove or on the substrate plane, and the transparent silicon dioxide fills the groove or surrounds the chip package on the substrate plane.
  • the light emitting surfaces of the plurality of red LED chips and the plurality of blue LED chips are all directed toward the transparent silicone rubber.
  • the package substrate is a circular, rectangular or polygonal package substrate.
  • the groove is a circular, rectangular or polygonal groove.
  • the ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.
  • the present invention provides a COB packaged LED plant lamp, comprising a package substrate, a plurality of red LED chips, a plurality of blue LED chips, and an epoxy resin, wherein the package substrate is provided with a groove or a substrate plane
  • the plurality of red LED chips and the plurality of blue LED chips are closely spaced in the 1HJ slot or on the substrate plane, and the epoxy fills the 1HJ slot or surrounds the chip package on the substrate plane.
  • the light emitting surfaces of the plurality of red LED chips and the plurality of blue LED chips are all facing the epoxy resin.
  • the package substrate is a circular, rectangular or polygonal package substrate.
  • the groove is a circular, rectangular or polygonal groove.
  • the ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.
  • the present invention also provides a COB packaged LED plant lamp manufacturing method, which comprises the following steps:
  • the ratio of the number of the red LED chip to the blue LED chip is 6 to 9:1.
  • the beneficial effects of the present invention are: Compared with the prior art, the COB packaged LED plant lamp provided by the invention and the manufacturing method thereof, the plurality of red and blue LED chips are packaged on the substrate according to a certain ratio by using transparent silica gel or epoxy resin. Since a plurality of red LED chips and a plurality of blue LED chips are closely spaced, the generated red light and blue light can be well fused, so that the fused light required by the plant can be uniformly irradiated to the crop, and the light utilization ratio is fused. High, cost saving. DRAWINGS
  • FIG. 1 is a structural view of an LED lamp bead according to a first embodiment of the present invention
  • FIG. 2 is a structural view of a package substrate according to a first embodiment of the present invention.
  • FIG. 3 is a structural diagram of the package of FIG. 1 and FIG. 2;
  • FIG. 4 is a structural view of a LED lamp bead according to a second embodiment of the present invention.
  • FIG. 5 is a structural diagram of a package substrate according to a second embodiment of the present invention.
  • Figure 6 is a structural view of the package of Figure 4 and Figure 5;
  • Figure 7 is a structural view showing a LED lamp bead according to a third embodiment of the present invention.
  • FIG. 8 is a structural view of a package substrate according to a third embodiment of the present invention.
  • Figure 9 is a structural diagram of the combined package of Figures 7 and 8.
  • the COB package involved in the present invention is a chi p On board, in which a chip is adhered to an interconnect substrate by a conductive or non-conductive glue, and then wire bonding is performed to realize electrical connection.
  • the plate 10 is provided with a recess 13 3 , and a plurality of red LED chips 11 and a plurality of blue LED chips 12 are arranged closely in the groove 13 , and the transparent silica gel fills the groove 1 3 , and the plurality of red LEDs
  • the light exiting surfaces of the chip 11 and the plurality of blue LED chips 12 are all oriented toward the transparent silicone.
  • the above transparent silica gel can also be replaced by an epoxy resin, as long as the transparent material encapsulating the plurality of red LED chips 11 and the plurality of blue LED chips 12 achieves the effect of COB encapsulation, Simple variations or modifications of the invention fall within the scope of the invention.
  • a plurality of red LED chips 11 and a plurality of blue LED chips 12 may be directly wrapped around the periphery of the chip on the plane of the package substrate, so that the plurality of red LED chips 11 and the plurality of blues are The light emitting surfaces of the LED chips 12 are all oriented toward transparent silicone or epoxy.
  • the COB packaged LED plant lamp provided by the invention encapsulates a plurality of red and blue LED chips on a substrate by a transparent silicone or epoxy resin, because of a plurality of red LED chips and a plurality of The blue LED chips are arranged closely spaced, and the generated red light and blue light can be well fused, so that the fused light required by the plant can be uniformly irradiated to the crop, and the fusion light utilization rate is high and the cost is saved.
  • the package substrate 10 is a circular, rectangular or polygonal package substrate. It can be understood that the present invention is not limited to the size and shape of the package substrate, and as long as it is used to package a plurality of red LED chips 11 and a plurality of blue LED chips 12 to achieve the effect of COB encapsulation, it is simple to the present invention. Deformation or transformation falls within the scope of protection of the present invention.
  • the groove 13 is a circular, rectangular or polygonal groove. It can be understood that the present invention is not limited to the size and shape of the groove 13. As long as it is used to package a plurality of red LED chips 11 and a plurality of blue LED chips 12, the effect of the COB package is achieved. Simple variations or modifications of the invention fall within the scope of the invention.
  • the number ratio of the red LED chip to the blue LED chip is 6 to 9:1. It can be understood that the present invention is not limited to the ratio of the number of the red LED chip and the blue LED chip, as long as the red LED chip 11 and the blue LED chip 12 are matched to achieve the effect of condensing light, depending on the actual plant, It is also possible to adjust the wavelength of the light by adding LED chips of other colors, such as adjusting the wavelength of the light in the form of adding a white LED chip, which is a simple deformation or transformation of the present invention, and falls within the protection scope of the present invention.
  • the method for manufacturing a COB packaged LED plant lamp of the present invention comprises the following steps:
  • Step 101 providing a groove or a substrate plane on the package substrate
  • Step 102 arranging a plurality of red LED chips and a plurality of blue LED chips in a tightly spaced manner in the plane of the groove or substrate;
  • Step 103 Filling the groove or surrounding chip with transparent silicone or epoxy to encapsulate a plurality of red LED chips and a plurality of blue LED chips.
  • the ratio of the number of red LED chips to blue LED chips is 6 to 9:1. It can be understood that the present invention is not limited to the ratio of the number of the red LED chip and the blue LED chip, as long as the red LED chip 11 and the blue LED chip 12 are matched to achieve the effect of condensing light, depending on the actual plant, It is also possible to adjust the wavelength of the light by adding LED chips of other colors, such as adjusting the wavelength of the light in the form of adding a white LED chip, which is a simple deformation or transformation of the present invention, and falls within the protection scope of the present invention.
  • the current production of plant tissue culture, greenhouse leafy vegetables, solanaceous fruit and flowers and trees is generally used to produce light by using 6001 1000W incandescent lamps, fluorescent lamps, sodium lamps, metal halide lamps and even xenon lamps.
  • 6001 1000W incandescent lamps, fluorescent lamps, sodium lamps, metal halide lamps and even xenon lamps are used to produce light by using 6001 1000W incandescent lamps, fluorescent lamps, sodium lamps, metal halide lamps and even xenon lamps.
  • Different plant growth requires different spectral sources, and the power conversion efficiency of these sources is only 0.1% to 1% of the spectrum required for plant growth. It contains many unwanted and even harmful wavelengths for plant growth. Their physiologically effective radiant energy is very low and energy consumption is high.
  • Plant absorption and utilization 70% of light energy is absorbed by plants. Less than 20% of light energy is absorbed by plants.
  • the LED plant lamp can replace the plant lamp in the form of sodium and gold lamps of 3-6 times power, and saves 80% of electric energy.
  • the COB package can directly package multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, which not only reduces the manufacturing process and cost of the bracket, but also reduces heat dissipation.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Botany (AREA)
  • Ecology (AREA)
  • Forests & Forestry (AREA)
  • Environmental Sciences (AREA)
  • Led Device Packages (AREA)
  • Cultivation Of Plants (AREA)

Abstract

La présente invention se rapporte à une lampe pour plante à LED mise sous boîtier COB et à son procédé de fabrication. Ladite lampe pour plante comprend une base de mise sous boîtier (10) possédant une rainure (13) ou un plan de substrat situé sur celle-ci, de multiples puces à LED rouge (11), de multiples puces à LED bleue (12) et un gel de silice transparent. Les multiples puces à LED rouge (11) et les multiples puces à LED bleue (12) sont agencées dans la rainure (13) à intervalle serré. Le gel de silice transparent est utilisé pour remplir la rainure (13) ou pour entourer les puces sur le plan de substrat. Les surfaces d'émission des multiples puces à LED rouge (11) et des multiples puces à LED bleue (12) font face au gel de silice transparent qui peut utiliser une résine époxy à la place. Les multiples puces à LED rouge et bleue sont mises sous boîtier sur la base selon un rapport donné, et étant donné que les multiples puces à LED rouge (11) et les multiples puces à LED bleue (12) sont agencées à intervalle serré, la lumière rouge et la lumière bleue peuvent être bien intégrées, si bien que la génération de faisceaux intégrés nécessitée par la plante illumine de façon régulière la culture, l'efficacité d'utilisation de la lumière intégrée est améliorée et les coûts sont réduits.
PCT/CN2013/074135 2012-04-12 2013-04-12 Lampe pour plante à led mise sous boîtier cob et son procédé de fabrication WO2013152737A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210106896.2 2012-04-12
CN2012101068962A CN103375691A (zh) 2012-04-12 2012-04-12 Cob封装led植物灯及其制作方法

Publications (1)

Publication Number Publication Date
WO2013152737A1 true WO2013152737A1 (fr) 2013-10-17

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CN (1) CN103375691A (fr)
WO (1) WO2013152737A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105737002B (zh) * 2014-12-10 2018-05-18 陕西旭田光电农业科技有限公司 一种混合光质的植物生长led矩形模组
CN104534403A (zh) * 2014-12-24 2015-04-22 重庆星联云科科技发展有限公司 一种植物生长灯集成光源设计方法
CN105841101A (zh) * 2015-01-15 2016-08-10 陕西旭田光电农业科技有限公司 一种rbw混色植物生长led灯
CN109461722A (zh) * 2018-10-16 2019-03-12 江苏稳润光电科技有限公司 一种双色植物灯照明led光源

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101852368A (zh) * 2010-01-28 2010-10-06 杭州汉徽光电科技有限公司 一种用于兰科植物组培的led混光灯具
CN102255035A (zh) * 2011-08-16 2011-11-23 易美芯光（北京）科技有限公司 一种基板上多led芯片封装结构
WO2011154522A1 (fr) * 2010-06-11 2011-12-15 Poltree & Crop Technologies Sp. Z O.O. Procédé et appareil pour la protection des plantes
CN102306699A (zh) * 2011-06-22 2012-01-04 浙江英特来光电科技有限公司 一种led集成封装结构
CN202629638U (zh) * 2012-04-12 2012-12-26 周海兵 Cob封装led植物灯

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201425206Y (zh) * 2009-05-26 2010-03-17 王俣韡 温室植物生长用的发光二极管模块

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101852368A (zh) * 2010-01-28 2010-10-06 杭州汉徽光电科技有限公司 一种用于兰科植物组培的led混光灯具
WO2011154522A1 (fr) * 2010-06-11 2011-12-15 Poltree & Crop Technologies Sp. Z O.O. Procédé et appareil pour la protection des plantes
CN102306699A (zh) * 2011-06-22 2012-01-04 浙江英特来光电科技有限公司 一种led集成封装结构
CN102255035A (zh) * 2011-08-16 2011-11-23 易美芯光（北京）科技有限公司 一种基板上多led芯片封装结构
CN202629638U (zh) * 2012-04-12 2012-12-26 周海兵 Cob封装led植物灯

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