CN202839733U - 白光led - Google Patents

白光led Download PDF

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Publication number
CN202839733U
CN202839733U CN2012204044217U CN201220404421U CN202839733U CN 202839733 U CN202839733 U CN 202839733U CN 2012204044217 U CN2012204044217 U CN 2012204044217U CN 201220404421 U CN201220404421 U CN 201220404421U CN 202839733 U CN202839733 U CN 202839733U
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white light
blue
blue chip
fluorescent material
light
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吉爱华
汪英杰
王凯敏
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INNER MONGOLIA HUAYAN XINGUANG TECHNOLOGY Co Ltd
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INNER MONGOLIA HUAYAN XINGUANG TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Abstract

一种白光LED,涉及半导体封装技术领域,包括支架,所述支架上部设有散热杯,所述散热杯底部设有铜块和电极,所述铜块上设有蓝光芯片,所述蓝光芯片与所述电极之间连接有导线,所述蓝光芯片尺寸为20mil*40mil,所述散热杯内涂覆有用于将所述蓝光芯片发出的蓝光调整为白光的荧光胶。本实用新型所述白光LED与现有的白光LED相比,具在生产成本低,封装工艺步骤简便,可靠性高,使用寿命长的优点。

Description

白光LED技术领域[0001] 本实用新型涉及半导体封装技术领域,特别涉及一种白光LED。背景技术[0002] LED (发光二级管)是一种能够将电能转化为光能的半导体,它改变了白炽灯钨丝发光与节能灯三基色粉发光的原理,而采用电场发光。白光LED的光谱几乎全部集中于可见光频段,将白光LED与普通的白炽灯、螺旋节能灯及三基色荧光灯进行对比,LED的特点非常明显:寿命长、光效高、低辐射及低功耗,正是因为LED的这些优点,使得白光LED照明已进入了高速发展时期。白光LED通常采用两种方法来形成:一是采用多种单色光混合的方法形成白光;二是利用蓝光芯片与荧光粉配合形成白光。目前,用于液晶电视背光的白光 LED均是采用两个20mil*20mil (Imil=O. 001英寸=0. 0254mm)的蓝光芯片封装而成的,这种封装方式成本高,工艺步骤繁琐,而且封装出的白光LED的可靠性低。实用新型内容[0003] 本实用新型所要解决的技术问题是提供一种白光LED,此白光LED生产成本低,工艺简单,且可靠性高。[0004] 为解决上述技术问题,本实用新型的技术方案是:一种白光LED,包括支架,所述支架上部设有散热杯,所述散热杯底部设有铜块和电极,所述铜块上设有蓝光芯片,所述蓝光芯片与所述电极之间连接有导线,所述蓝光芯片尺寸为20mil*40mil,所述散热杯内涂覆有用于将所述蓝光芯片发出的蓝光调整为白光的荧光胶。[0005] 作为一种改进,所述蓝光芯片的波长为440nm〜450nm。 [0006] 作为进一步的改进,所述铜块上还设有与所述蓝光芯片并联的齐纳管,所述齐纳管与所述电极之间连接有导线。[0007] 本实用新型的有益效果在于:由于本实用新型所述的蓝光芯片的尺寸为 20mil*40mil ;故可用一片蓝光芯片代替两片尺寸为20mil*20mil的蓝光芯片,降低了成本,减少了工艺步骤,且由于蓝光芯片减少,则焊接导线的数量减少,故提高了封装后白光 LED灯管的可靠性。[0008] 由于铜块上还设有与蓝光芯片并联的齐纳管,齐纳管可起到稳压作用,对蓝光芯片起到了保护作用,延长了蓝光芯片的使用寿命。[0009] 综上所述,本实用新型所述白光LED与现有的白光LED相比,具在生产成本低,封装工艺步骤简便,可靠性高,使用寿命长的优点。附图说明[0010] 图1是本实用新型固晶后的结构示意图;[0011] 图2是本实用新型键合后的结构示意图;[0012] 图3是本实用新型点荧光胶后的结构示意图;[0013] 图中:1、支架,10、铜块,11、散热杯,2、蓝光芯片,3、齐纳管,4、绝缘胶,5、银胶,6、电极,7、导线,8、荧光胶。具体实施方式[0014] 下面结合附图和实施例,进一步阐述本实用新型。[0015] 实施例一:[0016] 如图1、图2和图3共同所示,一种白光LED,这种白光LED为SMD5630灯管,包括支架I,支架I上部设有散热杯11,散热杯11底部设有铜块10和电极6,铜块10设于散热杯11底部的中心位置,铜块10上设有蓝光芯片2,蓝光芯片2与电极6之间连接有导线7, 导线7为金丝,蓝光芯片2尺寸为20mil*40mil,蓝光芯片2的波长为440nm〜450nm,亮度为4000mcd(mcd为光能量单位,代表光源本身单位面积内的发光强度),散热杯11内涂覆有用于将蓝光芯片2发出的蓝光调整为白光的突光胶8。用一片蓝光芯片2代替两片尺寸为 20mil*20mil的蓝光芯片,降低了成本,减少了工艺步骤,且由于蓝光芯片减少,则焊接导线的数量减少,故提高了 SMD5630灯管的可靠性。[0017] 荧光胶8是由下列原料配制而成的,TMR-200647-380490荧光粉(深圳市图盟机电科技有限公司) :娃酸盐05742突光粉(英特美光电(深圳)有限公司):娃酸盐、氮化物 BLT-2500-AB荧光粉(英特美光电(深圳)有限公司):硅胶6551AB (道康宁6551硅胶,A 胶和B胶的比例为1:1)=X:Y:Z:100,其中X=O. 1,Υ=3. 7,Ζ=3. 7。与单一的YAG荧光粉相比,三种荧光粉的组合具有组份比例调配灵活的特点,可灵活的调整各色光的比例,弥补各色光的不足,提高了光的还原性。通过加150mA电流的老化测试,可做出色坐标(x=0. 2488, y=0. 2188)的液晶电视用的白光,且适合大批量生产,可广泛应用于液晶电视。[0018] 铜块10上还设有与蓝光芯片2并联的齐纳管3,齐纳管3与电极6之间设有导线 7,齐纳管3的型号为SD-00866 (台湾光磊科技股份有限公司);齐纳管3是一个稳压二极管,可对蓝光芯片2起到保护作用。[0019] 对本实用新型所述的SMD5630灯管进行加150mA电流的老化测试,可做出色坐标 (x=0. 2488,y=0. 2188)的液晶电视用的LED白光。[0020] 一种SMD5630灯管的封装方法,包括以下步骤:[0021] 固晶:在铜块10的左上角先点上银胶5,银胶5的型号为SMP-2800 (日本信越), 再将齐纳管3放在银胶5上固定,送入170〜190°C的烘箱内烘烤I小时;取出固好齐纳管 3的支架1,然后在铜块10的中心点上点上绝缘胶4,绝缘胶4的型号为KER-3000 (日本信越),将蓝光芯片2放在绝缘胶4上固定,送入140〜160°C的烘箱内烘烤120±5分钟;[0022] 键合:用金丝球焊机从蓝光芯片2和齐纳管3上引出导线7,将导线7与电极6焊合,并保证蓝光芯片2与齐纳管3并联;[0023] 点荧光胶:将TMR-200647-380490荧光粉,硅酸盐05742荧光粉,硅酸盐、氮化物 BLT-2500-AB荧光粉和硅胶6551AB按照O. 1:3. 7:3. 7:100的重量份数比配制好荧光胶,将配制好的荧光胶进行脱泡抽真空,用点胶机均匀的涂在键合步骤完成的SMD5630灯管半成品的散热杯11中,荧光胶的量应正好与散热杯11的杯口持平为宜,然后送入140〜160°C 的烘箱内烘烤I小时;[0024] 剥离:将点荧光胶步骤完成的SMD5630灯管从整板上剥离下来;[0025] 分光分色:将剥尚步骤完成的SMD5630灯管进行分光分色;[0026] 编带包装:将分光分色步骤完成的SMD5630灯管进行包装,并根据需要盘带,即完成了 SMD5630灯管的整个封装过程。[0027] 实施例二 :[0028] 如图1、图2和图3共同所不,一种白光LED,其结构与实施例一基本相同,不同之处在于荧光胶8中TMR-200647-380490荧光粉,硅酸盐05742荧光粉,硅酸盐、氮化物 BLT-2500-AB荧光粉和硅胶6551AB的重量份比为:TMR-200647_380490荧光粉:硅酸盐 05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:娃胶6551AB=X:Y:Z: 100,其中X=O. 4, Y=2, Ζ=5。[0029] 实施例三:[0030] 如图1、图2和图3共同所不,一种白光LED,其结构与实施例一基本相同,不同之处在于荧光胶8中TMR-200647-380490荧光粉,硅酸盐05742荧光粉,硅酸盐、氮化物 BLT-2500-AB荧光粉和硅胶6551AB的重量份比为:TMR-200647_380490荧光粉:硅酸盐 05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:娃胶6551AB=X: Y: Z: 100,其中X=O. 4, Y=5, Ζ=2。[0031] 实施例四:[0032] 如图1、图2和图3共同所不,一种白光LED,其结构与实施例一基本相同,不同之处在于荧光胶8中TMR-200647-380490荧光粉,硅酸盐05742荧光粉,硅酸盐、氮化物 BLT-2500-AB荧光粉和硅胶6551AB的重量份比为:TMR-200647_380490荧光粉:硅酸盐 05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:娃胶6551AB=X:Y:Z: 100,其中X=I, Y=5, Ζ=5。[0033] 实施例五: [0034] 如图1、图2和图3共同所不,一种白光LED,其结构与实施例一基本相同,不同之处在于荧光胶8中TMR-200647-380490荧光粉,硅酸盐05742荧光粉,硅酸盐、氮化物 BLT-2500-AB荧光粉和硅胶6551AB的重量份比为:TMR-200647_380490荧光粉:硅酸盐 05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:娃胶6551AB=X:Y:Z: 100,其中X=O. 1, Y=I, Z=IO0[0035] 实施例六:[0036] 如图1、图2和图3共同所不,一种白光LED,其结构与实施例一基本相同,不同之处在于荧光胶8中TMR-200647-380490荧光粉,硅酸盐05742荧光粉,硅酸盐、氮化物 BLT-2500-AB荧光粉和硅胶6551AB的重量份比为:TMR-200647_380490荧光粉:硅酸盐 05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:娃胶6551AB=X:Y:Z: 100,其中X=O. 1, Y=IO, Z=I0[0037] 本实用新型不局限于上述具体的实施方式,本领域的普通技术人员从上述构思出发,不经过创造性的劳动,所作出的种种变换,均落在本实用新型的保护范围之内。

Claims (3)

1.白光LED,其特征在于,包括支架,所述支架上部设有散热杯,所述散热杯底部设有铜块和电极,所述铜块上设有蓝光芯片,所述蓝光芯片与所述电极之间连接有导线,所述蓝光芯片尺寸为20mil*40mil,所述散热杯内涂覆有用于将所述蓝光芯片发出的蓝光调整为白光的突光胶。
2.根据权利要求1所述的白光LED,其特征在于,所述蓝光芯片的波长为440nm〜450nmo
3.根据权利要求1所述的白光LED,其特征在于,所述铜块上还设有与所述蓝光芯片并联的齐纳管,所述齐纳管与所述电极之间连接有导线。
CN2012204044217U 2012-08-15 2012-08-15 白光led Expired - Lifetime CN202839733U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108155106A (zh) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 一种长爬电光电耦合器的制备工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108155106A (zh) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 一种长爬电光电耦合器的制备工艺

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