CN102244186B - High-power LED (light emitting diode) light emitting device package structure - Google Patents
High-power LED (light emitting diode) light emitting device package structure Download PDFInfo
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- CN102244186B CN102244186B CN 201110201233 CN201110201233A CN102244186B CN 102244186 B CN102244186 B CN 102244186B CN 201110201233 CN201110201233 CN 201110201233 CN 201110201233 A CN201110201233 A CN 201110201233A CN 102244186 B CN102244186 B CN 102244186B
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Abstract
The invention aims to provide a high-power LED (light emitting diode) light emitting device package structure which is simple and easy to implement. The structure comprises a reflection cup and fluorescent glass which is packaged at the top part of the reflection cup; and an LED chip module is packaged in the bottom part of the reflection cup. The invention has the beneficial effect that the high-power LED light emitting device package structure adopts a light emitting mode which combines the LED chip module and the fluorescent glass; according to the invention, the process flow that LED chips do not need to be packaged into LEDs independently and then the LEDs are assembled into a light emitting device is omitted, therefore the problem of poor consistence caused by LED chips are packaged singly can be overcome, and the process and production flow of the light emitting device in the package process are simplified, and the packaging structure is simple and easy to implement.
Description
Technical field
The present invention relates to a kind of encapsulating structure of LED luminescent device, particularly a kind of great power LED luminescent device encapsulating structure.
Background technology
LED (Light Emitting Diode) is light emitting semiconductor device, because of have high light efficiency, energy-conservation, environmental protection, safe, the life-span long, response fast, operating cost are low etc., and advantage gets most of the attention, deficient day by day in resource, under the background that environment constantly worsens, the LED product of energy-conserving and environment-protective is expected to become light source of future generation, and huge market prospects are arranged.
At present, LED is widely used in fields such as Landscape Lighting, signal lamp, auto industry, module backlight, normal lighting, and its advantage progressively manifests.But the LED luminescent device encapsulates in the assembling process of optics the light efficiency loss again from the chip to LED serious, especially chip is packaged into the difficult control of process complexity, consistency of LED, the light efficiency decay is serious, therefore, be accompanied by the extensive use of LED luminescent device, it is most important to obtain a kind of simple packaged type.
Summary of the invention
The object of the present invention is to provide a kind of simple great power LED luminescent device encapsulating structure.
At above-mentioned technical problem, the present invention has adopted following technical scheme:
The fluorescent glass that comprises reflector and be packaged in the reflector top is packaged with the led chip module in the bottom of reflector.
Described led chip module is made up of blue-light LED chip.
Described led chip module comprises the led chip more than.
Described reflector is provided with screw thread, and fluorescent glass links to each other with reflector by screw thread.
Described fluorescent glass is the planar transparent glass that inside or inner surface are distributed with fluorescent material.
Described fluorescent material comprises at least a in yellow fluorescent substance, red fluorescent material and the green fluorescence material.
Beneficial effect of the present invention is embodied in: great power LED luminescent device encapsulating structure of the present invention adopts the light-emitting mode that is combined by led chip module and fluorescent glass, be assembled into luminescent device again after need not led chip is packaged into LED separately, both overcome the relatively poor problem of consistency that exists in single LEDs chip encapsulation process, simplified technology and the production procedure of luminescent device encapsulation process again, simple.
Description of drawings
Fig. 1 is one of structural representation of the present invention;
Fig. 2 is two of structural representation of the present invention.
Embodiment
The present invention will be further described below in conjunction with drawings and Examples.
Referring to Fig. 1 and Fig. 2, the fluorescent glass 2 that comprises reflector 1 and be packaged in reflector 1 top, described reflector 1 is provided with screw thread 4, fluorescent glass 2 links to each other with reflector 1 by screw thread 4, described fluorescent glass 2 is distributed with the planar transparent glass of fluorescent material 5 for inside or inner surface, described fluorescent material 5 comprises yellow fluorescent substance, at least a in red fluorescent material and the green fluorescence material, be packaged with led chip module 3 in the bottom of reflector 1, described led chip module 3 is made up of blue-light LED chip, and described led chip module comprises the led chip more than.
Embodiment 1: great power LED luminescent device encapsulating structure comprises blue chip module, reflector, fluorescent glass.The blue chip module adopts 33 integrated acquisitions of blue-light LED chip, reflector plays optimizes the light path effect, the inner evenly distribution yellow fluorescent substance of fluorescent glass, can realize white luminous by this packaged type, by the distance between threaded adjusting fluorescent glass and blue chip module, through integrating sphere this luminescent device is carried out comprehensive optic test and show that its colour temperature is at 3000K-8000K.
Embodiment 2: great power LED luminescent device encapsulating structure comprises blue chip module, reflector, fluorescent glass.The blue chip module adopts 1 integrated acquisition of blue-light LED chip, reflector plays optimizes the light path effect, fluorescent glass inner evenly distribution yellow and red fluorescent material, can realize the white luminous of high-color rendering by this packaged type, by the distance between threaded adjusting fluorescent glass and blue chip module, through integrating sphere this luminescent device is carried out comprehensive optic test and show that its colour temperature is at 3000K-8000K.
Embodiment 3: great power LED luminescent device encapsulating structure comprises blue chip module, reflector, fluorescent glass.The blue chip module adopts 55 integrated acquisitions of blue-light LED chip, reflector plays optimizes the light path effect, fluorescent glass inner evenly distribution green and red fluorescent material, can realize the white luminous of three primary colors by this packaged type, by the distance between threaded adjusting fluorescent glass and blue chip module, through integrating sphere this luminescent device is carried out comprehensive optic test and show that its colour temperature is at 3000K-8000K.
Embodiment 4: great power LED luminescent device encapsulating structure comprises blue chip module, reflector, fluorescent glass.The blue chip module adopts 55 integrated acquisitions of blue-light LED chip, reflector plays optimizes the light path effect, the fluorescent glass surface is yellow, red, the green fluorescence material of distribution evenly, can realize that by this packaged type high-color rendering is white luminous, by the distance between threaded adjusting fluorescent glass and blue chip module, through integrating sphere this luminescent device is carried out comprehensive optic test and show that its colour temperature is at 3000K-8000K.
The invention belongs to the optics production field, aim to provide a kind of simple great power LED luminescent device encapsulating structure, this structure comprises: LED blue chip module, reflector and the fluorescent glass be made up of an above blue-light LED chip.LED blue chip module is positioned at the bottom of reflector in this encapsulating structure, fluorescent glass is positioned at the top of reflector, directly blue-light LED chip is combined with fluorescent glass and is packaged into luminescent device, the elder generation that adopts with current great power LED luminescent device is packaged into the packaged type that LED is assembled into light fixture again with blue chip and compares, need not single chip is carried out a glue encapsulation, simplify production technology, simultaneously, also overcome blue-light LED chip uppity problem of consistency in being packaged into the process of LED.
Above-described embodiment only is explanation of the invention rather than restriction.
Claims (4)
1. great power LED luminescent device encapsulating structure, it is characterized in that: the fluorescent glass (2) that comprises reflector (1) and be packaged in reflector (1) top is packaged with led chip module (3) in the bottom of reflector (1); Described reflector (1) is provided with screw thread (4), fluorescent glass (2) links to each other with reflector (1) by screw thread (4), fluorescent glass (2) is distributed with the planar transparent glass of fluorescent material (5) for inside or inner surface, adjustment by distance between led chip module and fluorescent glass can be adjusted the ratio of the luminous light intensity of led chip and the luminous light intensity of fluorescent material, makes same luminescent device can send the light of different-colour.
2. according to the described a kind of great power LED luminescent device encapsulating structure of claim 1, it is characterized in that: described led chip module (3) is made up of blue-light LED chip.
3. according to the described a kind of great power LED luminescent device encapsulating structure of claim 1, it is characterized in that: described led chip module (3) comprises the led chip more than.
4. according to the described a kind of great power LED luminescent device encapsulating structure of claim 1, it is characterized in that: described fluorescent material (5) comprises at least a in yellow fluorescent substance, red fluorescent material and the green fluorescence material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110201233 CN102244186B (en) | 2011-07-19 | 2011-07-19 | High-power LED (light emitting diode) light emitting device package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110201233 CN102244186B (en) | 2011-07-19 | 2011-07-19 | High-power LED (light emitting diode) light emitting device package structure |
Publications (2)
| Publication Number | Publication Date |
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| CN102244186A CN102244186A (en) | 2011-11-16 |
| CN102244186B true CN102244186B (en) | 2013-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110201233 Expired - Fee Related CN102244186B (en) | 2011-07-19 | 2011-07-19 | High-power LED (light emitting diode) light emitting device package structure |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108447967A (en) * | 2018-05-28 | 2018-08-24 | 易美芯光（北京）科技有限公司 | A kind of encapsulating structure of high power LED device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202007007342U1 (en) * | 2007-05-23 | 2007-08-02 | Tsai, Hua-Hsin, Linnei | Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating |
| CN201181712Y (en) * | 2008-01-04 | 2009-01-14 | 河南理工大学 | Light emitting diode |
| CN101806404A (en) * | 2010-02-12 | 2010-08-18 | 李骋翔 | High-efficiency flexible surface light source |
| CN101839404A (en) * | 2009-12-18 | 2010-09-22 | 深圳市成光兴实业发展有限公司 | LED energy-saving lamp adopting overall fluorescence conversion technology |
| CN201838620U (en) * | 2010-08-12 | 2011-05-18 | 红蝶科技(深圳)有限公司 | High-efficiency monochromatic light source packaging structure with excitation cavity and projection optical engine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101988646A (en) * | 2009-08-05 | 2011-03-23 | 富士迈半导体精密工业（上海）有限公司 | Lamp |
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2011
- 2011-07-19 CN CN 201110201233 patent/CN102244186B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202007007342U1 (en) * | 2007-05-23 | 2007-08-02 | Tsai, Hua-Hsin, Linnei | Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating |
| CN201181712Y (en) * | 2008-01-04 | 2009-01-14 | 河南理工大学 | Light emitting diode |
| CN101839404A (en) * | 2009-12-18 | 2010-09-22 | 深圳市成光兴实业发展有限公司 | LED energy-saving lamp adopting overall fluorescence conversion technology |
| CN101806404A (en) * | 2010-02-12 | 2010-08-18 | 李骋翔 | High-efficiency flexible surface light source |
| CN201838620U (en) * | 2010-08-12 | 2011-05-18 | 红蝶科技(深圳)有限公司 | High-efficiency monochromatic light source packaging structure with excitation cavity and projection optical engine |
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| CN102244186A (en) | 2011-11-16 |
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