DE202007007342U1 - Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating - Google Patents

Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating Download PDF

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Publication number
DE202007007342U1
DE202007007342U1 DE202007007342U DE202007007342U DE202007007342U1 DE 202007007342 U1 DE202007007342 U1 DE 202007007342U1 DE 202007007342 U DE202007007342 U DE 202007007342U DE 202007007342 U DE202007007342 U DE 202007007342U DE 202007007342 U1 DE202007007342 U1 DE 202007007342U1
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Germany
Prior art keywords
package
side walls
arrangement
arrangement according
cover
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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DE202007007342U
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German (de)
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Tsai Hua-Hsin Linnei
Tsai Hua Hsin
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Tsai Hua-Hsin Linnei
Tsai Hua Hsin
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Priority to DE202007007342U priority Critical patent/DE202007007342U1/en
Publication of DE202007007342U1 publication Critical patent/DE202007007342U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

The arrangement has a set of light emitting diodes (LED), (11) e.g. white LED, that is arranged on a substrate (1) in a cavity serving as reflector. A fluorescent package (2) is designed in form of a U-profile comprising a translucent cover and two side walls. The package is made of a yellow transparent material such as glass and quartz, where the cover is provided with a luminescent material layer (21) on an internal or external wall of the cover. The two side walls are provided with a high-reflecting coating (22) as reflecting surface on an internal or external wall of the side walls.

Description

[Technisches Gebiet][Technical area]

Die Erfindung betrifft eine Anordnung eines lichtemittierenden Elements, insbesondere von LED's, nach dem Oberbfgriff des Anspruchs 1.The Invention relates to an arrangement of a light-emitting element, in particular of LEDs, according to the Oberbfgriff of claim 1.

[Stand der Technik][State of the art]

Eine Anordnung eines lichtemittierenden Elements, insbesondere von LED's umfaßt als Lichtquelle mindestens einen LED-Chip, der auf einem Substrat befestigt ist, und eine lichtdurchlässige Verpackung, in der der Chip dicht eingepackt ist. Dabei kann die Verpackung entweder "klar", d.h. durchsichtig (clear package) oder "diffundierend", d.h. mattiert (diffused package) ausgebildet sein. Zur Begrenzung der Ausbreitung der Strahlung aus des Chips in einem engen Winkelbereich kann die Verpackung an ihrem oberen Ende als Linse halbsphärisch gewölbt ausgebildet sein. Darüber hinaus ist zur gerichteten Reflexion seiner Ausstrahlung der Chip in einer Vertiefung aufgenommen. Bei einigen LED's (z.B. einer weißer LED) wird das erzeugte sichtbare Licht nicht direkt vom Chip (d.h. in der eigener Frequenz des Chips) ausgestrahlt, sondern durch die energiereiche Strahlung des Chips angeregt. In diesem Falle sind als Leuchtstoff fluoreszierende Materialien in dem Werkstoff (z.B. einem Epoxyhärz) eingemischt, die durch die Erregung mit einer energiereichen Strahlung (z.B. einem Ultraviolett oder Blaulicht) ein sichtbares Spektrum ausgeben. Dabei wird der Leuchtstoff mit dem Härz zu einem Kuchen geknetet und in einem Formwerkzeug durch Wärme und Druck zu einer gewünschten Formgebung gebracht. Durch die Erregung des Leuchtstoffs kann das ausgestrahlte Licht in seiner Farbe geändert werden.A Arrangement of a light-emitting element, in particular of LED's comprises as a light source at least one LED chip mounted on a substrate, and a translucent Packaging in which the chip is tightly packed. It can the Packaging either "clear", i. transparent (clear package) or "diffusing", i. matted (diffused be formed). To limit the spread of radiation out of the chip in a narrow angular range, the packaging on her upper end as a lens semispherical arched trained be. About that In addition to the directional reflection of its radiation of the chip taken in a well. For some LEDs (e.g., a white LED), the generated visible light not directly from the chip (i.e., in its own frequency of the chip), but by the high-energy radiation of the chip. In this case, as fluorescent fluorescent Materials in the material (e.g., an epoxy resin) mixed by excitation with high energy radiation (e.g., an ultraviolet or blue light) output a visible spectrum. It is the Fluorescent with the resin kneaded into a cake and in a mold by heat and Pressure to a desired Shaping brought. The excitement of the phosphor can emitted light can be changed in its color.

Nachteilig ist bei einem solchen bekannten Verpackung, daß infolge des ungleichmäßige Knetens die Verteilung des Leuchtstoffs in der Verpackung und damit der Helligkeit über ihre Oberfläche nicht gleichmäßig. Darüber hinaus kann wegen der Vergelbung des Epoxyhärzes die Quarlität der LED-Anordnung verschlechtert werden.adversely is in such a known packaging that due to the uneven kneading the distribution of the phosphor in the package and thus the Brightness over their surface is not evenly. Furthermore Can because of the yellowing of the epoxy resin the quality of the LED array be worsened.

Der Erfindung liegt die Aufgabe zugrunde, eine LED-Anordnung der vorbeschrieben Gattung zu schaffen, mit der die o.g. Nachteile vermieden werden können.Of the Invention is based on the object, an LED arrangement of the above Genus to create the o.g. Disadvantages are avoided can.

Zur Vermeidung der Vergelbung wird die Verpackung aus einem unvergelbbaren Werkstoff wie Glas oder Quarz hergestellt.to Avoiding the yellowing will make the packaging of an unforgivable Material such as glass or quartz produced.

Zur Vermeidung der ungleichmäßigen Verteilung des Leuchtstoffs in der Verpackung wird dieser nicht in das Material derselben eingemischt, sondern auf seine Oberfläche beschichtet.to Avoidance of uneven distribution the phosphor in the packaging will not be in the material the same mixed but coated on its surface.

Die Erfindung wird nachfolgend anhand von in der Zeichnung dargestellten Ausführungsformen näher erläutert. Es zeigen:The Invention will now be described with reference to the drawing Embodiments explained in more detail. It demonstrate:

[Zeichnung][Drawing]

1 eine geschnitte perspektivische Ansicht einer ersten Ausführungsform der erfindungsgemäßen LED-Anordnung, 1 a sectional perspective view of a first embodiment of the LED arrangement according to the invention,

2 einen Querschnitt der ersten Ausführungsform in 1, 2 a cross section of the first embodiment in 1 .

3 bis 5 entsprechend 2 jeweils im Querschnitt eine zweite, dritte und vierte Ausführungsform der Erfindung, und 3 to 5 corresponding 2 each in cross-section a second, third and fourth embodiment of the invention, and

6 eine Draufsicht einer fünfte Ausführungsform der Erfindung. 6 a plan view of a fifth embodiment of the invention.

[Erläuterung der bevorzugten Ausführungsformen][Explanation of Preferred Embodiments]

1 illustriert eine erfindungsgemäße LED-Anordnung, die wie beim Stand der Technik eine Anzahl von LED's 11, die auf einem Substrat 1 in einer als Reflektor dienenden gemeinsamen Nut angeordnet sind, und einer fluoreszierenden Verpackung 2 umfaßt. Die Verpackung ist in Form eines U-Profils ausgebildet, welches aus einer als zylindrische Linse dienenden bogenförmigen Decke 2 und zwei Seitenwänden besteht. Die Besonderheiten bestehen darin, daß die Verpackung aus einem unvergelbbaren durchsichtigen Werkstoff wie Glas oder Quarz hergestellt ist, daß der Leuchtstoff nicht im Werkstoff der Verpackung eingemischt, sondern auf der Innenwand ihrer Decke 2 beschichtet ist (Leuchtstoffschicht 21), und daß die beiden Seitenwände als reflktierende Fläche auf ihren Innenwand oder Außenwand mit einer hochreflektierenden Beschichtung 22 versehen sind. Zur Verbesserung der Gleichmäßigkeit der Reflexion kann die Innen- oder Außenwand der beiden Seitenwände z.B. an ihrer Oberfläche durch eine Ätzung mit Hydrofluoresäure gerauht oder mattiert werden. Durch die Rauhung/Mattierung wird einauf der Seitenwand einfallendes Licht gestreut, wodurch eine gleichmäßige Reflexion erreicht wird. 1 illustrates an LED array according to the invention, which, as in the prior art, a number of LEDs 11 on a substrate 1 are arranged in a common groove serving as a reflector, and a fluorescent packaging 2 includes. The packaging is in the form of a U-profile, which consists of a cylindrical lens serving as an arcuate ceiling 2 and two side walls. The peculiarities are that the packaging is made of an unglamably transparent material such as glass or quartz, that the phosphor is not mixed in the material of the packaging, but on the inner wall of their ceiling 2 is coated (phosphor layer 21 ), and that the two side walls act as a reflecting surface on their inner wall or outer wall with a highly reflective coating 22 are provided. To improve the uniformity of the reflection, the inner or outer wall of the two side walls can be roughened or matted on its surface by etching with hydrofluoric acid, for example. The roughening / matting scatters incident light on the sidewall, thereby achieving uniform reflection.

3 zeigt eine zweite Ausführungsform, mit dem Unterschied, daß die Leuchtstoffschicht 21 und die reflektierende Bechichtung 22 nicht auf der Innenwand, sondern auf der Außenwand der Verpackung 2 beschichtet sind. 3 shows a second embodiment, with the difference that the phosphor layer 21 and the reflective coating 22 not on the inside wall, but on the outside wall of the packaging 2 are coated.

Wenn eine Fokusierung einer LED-Anordnung nicht erforderlich, kann die Decke ihrer Verpackung flach ausgebildet sein. So weist die Verpackung 3 in einer dritten (4) und einer vierten Ausführungsform (5) eine flache Decke mit einer Leuchtstoffschicht 31 und zwei Seitenwände mit einer reflektierenden Beschichtung 32 auf.If focusing of an LED assembly is not required, the top of its package may be flat. This is how the packaging points 3 in a third ( 4 ) and a fourth embodiment ( 5 ) a flat ceiling with a phosphor layer 31 and two side walls with a reflective coating 32 on.

6 zeigt eine fünfte Ausfuhrungsform der Erfindung, mit dem Unterschied, daß die LED's nicht in einer geraden Reihe, sondern in einem Kreis nebeneinander angeordnet sind. 6 shows a fifth embodiment of the invention, with the difference that the LEDs are not arranged in a straight line, but in a circle next to each other.

Claims (10)

Eine Anordnung eines lichtemittierenden Elements, insbesondere eine LED-Anordnung, die mindestens eine LED (11), die auf einem Substrat (1) in einer als Reflektor dienenden Vertiefung angeordnet ist, und einer fluoreszierenden Verpackung (2) umfaßt, die in Form eines U-Profils ausgebildet ist, welches aus einer lichtdurchlässigen Decke und zwei Seitenwänden besteht, dadurch gekennzeichnet, daß die Verpackung (1) aus einem unvergelbbaren durchsichtigen Werkstoff hergestellt ist, daß die Decke auf ihrer Innen-/oder Außenwand ihrer mit einer Leuchtstoffschicht (21)(31) versehen ist, und daß die beiden Seitenwände als reflktierende Fläche auf ihren Innen-/oder Außenwand mit einer hochreflektierenden Beschichtung (22)(32) versehen sind.An arrangement of a light-emitting element, in particular an LED arrangement, the at least one LED ( 11 ) on a substrate ( 1 ) is arranged in a serving as a reflector recess, and a fluorescent packaging ( 2 ), which is formed in the form of a U-profile, which consists of a translucent ceiling and two side walls, characterized in that the packaging ( 1 ) is made of an inviolable transparent material that the ceiling on its inner or outer wall of their with a phosphor layer ( 21 () 31 ), and that the two side walls are provided as a reflecting surface on their inner or outer wall with a highly reflective coating ( 22 () 32 ) are provided. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Verpackung (2) aus Glas besteht.Arrangement according to claim 1, characterized in that the packaging ( 2 ) consists of glass. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Verpackung (2) aus Quarz besteht.Arrangement according to claim 1, characterized in that the packaging ( 2 ) consists of quartz. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Leuchtstoffschicht (21)(31) auf der Innenwand der Decke beschichtet ist.Arrangement according to claim 1, characterized in that the phosphor layer ( 21 () 31 ) is coated on the inner wall of the ceiling. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Leuchtstoffschicht (21)(31) auf der Außenwand der Decke beschichtet ist.Arrangement according to claim 1, characterized in that the phosphor layer ( 21 () 31 ) is coated on the outer wall of the ceiling. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die reflektierende Beschichtung (22)(32) auf der Innenwand der beiden Seitenwände beschichtet ist.Arrangement according to claim 1, characterized in that the reflective coating ( 22 () 32 ) is coated on the inner wall of the two side walls. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die reflektierende Beschichtung (22)(32) auf der Außenwand der beiden Seitenwände beschichtet ist.Arrangement according to claim 1, characterized in that the reflective coating ( 22 () 32 ) is coated on the outer wall of the two side walls. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Verpackung auf ihrer Oberfläche durch eine Ätzungsbehandlung mit einer Hydrofluorsäure gerauht oder mattiert wird.Arrangement according to claim 1, characterized that the Packing on its surface an etching treatment with a hydrofluoric acid roughened or matted. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Decke halbsphärisch ausgebildet ist.Arrangement according to claim 1, characterized that the Ceiling hemispherical is trained. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Decke flach ausgebildet ist.Arrangement according to claim 1, characterized that the Ceiling is flat.
DE202007007342U 2007-05-23 2007-05-23 Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating Expired - Lifetime DE202007007342U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE202007007342U DE202007007342U1 (en) 2007-05-23 2007-05-23 Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating

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Application Number Priority Date Filing Date Title
DE202007007342U DE202007007342U1 (en) 2007-05-23 2007-05-23 Light emitting diode, e.g. white LED, arrangement, has package made of yellow transparent material, where cover of package is provided with luminescent material layer, and two side walls of package are provided with high-reflecting coating

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007046348A1 (en) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Radiation-emitting device with glass cover and method for its production
DE102008019084A1 (en) * 2008-04-15 2009-10-29 Schott Ag Linear lighting device for e.g. in optical examination of laminar glass substrate, has converter device converting lights rays coming parallel from LEDs into light rays whose angular distribution is mixed in imaginary plane
CN101614337A (en) * 2008-06-25 2009-12-30 奥斯兰姆施尔凡尼亚公司 Tubular blue LED lamp with remote phosphor
CN102244186A (en) * 2011-07-19 2011-11-16 彩虹集团公司 High-power LED (light emitting diode) light emitting device package structure
CN107013882A (en) * 2017-03-06 2017-08-04 华南农业大学 It is a kind of to turn photoreactivation diffuser and its plant lamp of application
EP3599414A1 (en) * 2018-07-23 2020-01-29 Shin-Etsu Chemical Co., Ltd. Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007046348A1 (en) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Radiation-emitting device with glass cover and method for its production
DE102008019084A1 (en) * 2008-04-15 2009-10-29 Schott Ag Linear lighting device for e.g. in optical examination of laminar glass substrate, has converter device converting lights rays coming parallel from LEDs into light rays whose angular distribution is mixed in imaginary plane
DE102008019084B4 (en) 2008-04-15 2020-01-09 Schott Ag Linear lighting device
CN101614337A (en) * 2008-06-25 2009-12-30 奥斯兰姆施尔凡尼亚公司 Tubular blue LED lamp with remote phosphor
CN102244186A (en) * 2011-07-19 2011-11-16 彩虹集团公司 High-power LED (light emitting diode) light emitting device package structure
CN102244186B (en) * 2011-07-19 2013-07-03 彩虹集团公司 High-power LED (light emitting diode) light emitting device package structure
CN107013882A (en) * 2017-03-06 2017-08-04 华南农业大学 It is a kind of to turn photoreactivation diffuser and its plant lamp of application
EP3599414A1 (en) * 2018-07-23 2020-01-29 Shin-Etsu Chemical Co., Ltd. Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods
US11424389B2 (en) 2018-07-23 2022-08-23 Shin-Etsu Chemical Co., Ltd. Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods
TWI805808B (en) * 2018-07-23 2023-06-21 日商信越化學工業股份有限公司 Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods
US11757067B2 (en) 2018-07-23 2023-09-12 Shin-Etsu Chemical Co., Ltd. Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods

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