CN101937965A - Induced white light LED - Google Patents

Induced white light LED Download PDF

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Publication number
CN101937965A
CN101937965A CN2010102667647A CN201010266764A CN101937965A CN 101937965 A CN101937965 A CN 101937965A CN 2010102667647 A CN2010102667647 A CN 2010102667647A CN 201010266764 A CN201010266764 A CN 201010266764A CN 101937965 A CN101937965 A CN 101937965A
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CN
China
Prior art keywords
light source
source module
thin slice
led
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102667647A
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Chinese (zh)
Inventor
苏遵惠
冯俊
陈波
李菲
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SHENZHEN ET LIGHTING CO Ltd
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SHENZHEN ET LIGHTING CO Ltd
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Publication date
Application filed by SHENZHEN ET LIGHTING CO Ltd filed Critical SHENZHEN ET LIGHTING CO Ltd
Priority to CN2010102667647A priority Critical patent/CN101937965A/en
Publication of CN101937965A publication Critical patent/CN101937965A/en
Pending legal-status Critical Current

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Abstract

The invention relates to an induced white light LED. The induced white light LED is of a split type and comprises a connecting piece, a light source module and a sheet comprising fluorescent powder and a colloid mixture at the front end of the light emission direction of the light source module; the connecting piece is arranged on the edge of the light source module and the sheet, and the two ends of the connecting piece are connected with the light source module and the sheet respectively; and the light source module, the sheet and the connecting piece form a cavity. The induced white light LED is designed in a way that the light source module and the sheet comprising the fluorescent powder and the colloid mixture are separated, the sheet can be replaced according to the light attenuation degree of the LED and the light transmittance of the sheet, and therefore the service life of the LED light source is prolonged; moreover, the cavity formed by the light source module, the sheet and the connecting piece contributes to the heat dissipation of a chip and prevents the heat of the chip from being transferred to the sheet comprising the fluorescent powder and the colloid mixture, and thus the aging of the sheet is greatly slowed down and the service life of the LED is prolonged.

Description

A kind of white light LEDs that brings out
Technical field
The invention belongs to the LED lighting field, concrete relate to a kind of white light LEDs that brings out.
Background technology
The develop rapidly of LED industry, white light LEDs has obtained using widely at lighting field and demonstration field, and this series products becomes the synonym of " energy-saving and environmental protection, long-life ".Because the price of this series products is generally relatively more expensive, so the user wishes and can lower cost by other approach, and " energy-conservation " and " long-life " to be this series products can allow only approach of user's cost recovery is the target that each manufacturer is pursued so produce the product of " high energy-conservation, long-life ".Yet the product of only producing " high light efficiency " could really reach the effect of " energy-conservation ", and the light efficiency that therefore how to improve product also is the problem that each manufacturer paid attention to.
White light is that a kind of mixing of multi-color spectrum is photochromic, thus there is not the white chip of monocrepid in the led chip, generally synthetic by the monochromatic light more than 2 kinds or 2 kinds.The LED white chip generally has 2 kinds of methods: the first is synthesized redness (R), green (G), blue (B) three primary colors chip, is commonly referred to as " synthesize white light "; Another kind of way is the fluorescent material that adds other primary colours with a kind of monochromatic chip, brings out the generation white light.Because blue excitation energy is the strongest, so generally adopt blue chip to apply one deck yellow fluorescent powder (or red mixture that adds green emitting phosphor) again, after stirring with glue, be coated on the blue chip, induce white light.This synthetic or bring out white light LEDs and generally be referred to as " paster ".
As shown in Figure 1, what existing LED paster all adopted is that chip 12 is placed on the support 11, applies the packaged type that the mixture 2 of fluorescent material and glue is integrated again.Our experiments show that the life-span of chip was more than 2,000,000 hours, the life-span of fluorescent material then has only several ten thousand hours, and the three is packaged together, and the life-span of fluorescent material will determine the life-span of LED paster; This packaged type, the heat of chip can only be by the conduction of two gold thread lead-in wires, the heat that can not produce chip is very rapidly derived and is gone, heat will pass on the fluorescent colloid, thereby cause the life-span of fluorescent colloid to shorten significantly, also mean that the life-span of whole LEDs paster will shorten simultaneously; " support, the mixture of chip and fluorescent material and colloid " if encapsulation all-in-one-piece paster is made light fixture or backlight assembly, the processing that must pass through diffusion barrier or ground glass once more just can become area source, has so just had a strong impact on the luminous efficiency of product.Adding the influence of external power source, if do product with the paster of existing encapsulated LED, is the product that is difficult to accomplish " high energy-conservation, the long-life " that the user wants.
Summary of the invention
The objective of the invention is to overcome the above-mentioned deficiency of prior art, a kind of white light LEDs that brings out is provided, it is long that this brings out white light LEDs light efficiency height, life-span.
In order to realize the foregoing invention purpose, technical scheme of the present invention is as follows:
A kind of white light LEDs that brings out, the described white light LEDs that brings out is split type, comprise connector, light source module and be arranged on the thin slice that contains fluorescent material and colloid admixture of light source module light exit direction front end, described connector is arranged on light source module and thin slice edge and two ends and joins with described light source module and thin slice respectively, and described light source module, thin slice and connector constitute a cavity.
The present invention compared with prior art has following technique effect at least:
The above-mentioned white light LEDs that brings out adopts light source module and the thin slice split design that contains fluorescent material and colloid admixture, can change thin slice according to the light transmission efficiency of LED light decay degree and thin slice, thereby prolong the life-span of this led light source; The cavity that is made of described light source module, thin slice and connector helps the heat radiation of chip, has prevented that also the heat of chip is transmitted on the thin slice that contains fluorescent material and colloid admixture, makes that the aging of this thin slice delayed greatly, makes the LED life-span prolong.
Description of drawings
Fig. 1 is the structural representation of existing LED paster;
Fig. 2 is that the embodiment of the invention is brought out the white-light LED structure schematic diagram;
Fig. 3 brings out a kind of preferred implementation structural representation of white light LEDs among Fig. 2;
Fig. 4 brings out the another kind of preferred implementation structural representation of white light LEDs among Fig. 3;
Fig. 5 brings out another preferred implementation structural representation of white light LEDs among Fig. 4.
Embodiment
In order to make the technical problem to be solved in the present invention, technical scheme and beneficial effect clearer,, the present invention is further elaborated below in conjunction with embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention provides a kind of white light LEDs that brings out, see Fig. 2, the described white light LEDs that brings out is split type, comprise connector 3, light source module 1 and be arranged on the thin slice that contains fluorescent material and colloid admixture 2 of light source module 1 smooth exit direction front end, described connector is arranged on light source module 1 and thin slice 2 edges and two ends and joins with described light source module 1 and thin slice 2 respectively, and described light source module 1, thin slice 2 and connector 3 constitute a cavity 4.This brings out the thin slice 2 splits design that white light LEDs adopts light source module 1 and contains fluorescent material and colloid admixture, can change thin slice 2 according to the light transmission efficiency of LED light decay degree and thin slice 2, thereby prolong the life-span of this led light source; The cavity 4 that is made of described light source module 1, thin slice 2 and connector 3 helps the heat radiation of led chip, the heat that has also prevented chip is transmitted on the thin slice 2 that contains fluorescent material and colloid admixture, make that the aging of this thin slice 2 delayed greatly, make the LED life-span prolong, really accomplish " high light efficiency, long-life ".
Further, the spacing distance of above-mentioned light source module 1 and thin slice 2 is preferably more than zero, is less than or equal to this preferred distance and can makes illumination effect optimum when bringing out white light LEDs work.
Further, above-mentioned light source module 1 comprises circuit board 11 and at least one led chip 12 that is fixed on the circuit board 11.See Fig. 2, in the present embodiment, be connected with a led chip 12 on circuit board 11, circuit board 11 is used for fixing led chip 12, and led chip 12 provides light source.Certainly, in order to strengthen the luminous intensity of light source module 1, can connect a plurality of led chips 12 at circuit board 11, the mode that led chip 12 is fixed on circuit board 11 can adopt welding, can certainly adopt other fixed forms of present technique field.
What Fig. 3 showed is the preferred embodiment that Fig. 2 brings out white-light LED structure, and identical label is represented components identical among Fig. 2 and Fig. 3, does not repeat them here.In the embodiment that Fig. 3 shows, on the one side of the close light source module 1 of the thin slice 2 that contains fluorescent material and colloid admixture, also be combined with a substrate 5.This substrate 5 can effectively improve the intensity of thin slice 2, thereby protects not sensitive for damages of thin slice 2.Certainly substrate 5 can also be arranged on the one side that deviates from light source module 1 on the thin slice 2, certainly, in order further to strengthen the intensity of thin slice 2, also can be on two surfaces of thin slice 2 all in conjunction with substrate 5.
Concrete, the material of aforesaid substrate 5 is preferably a kind of in glass, acrylic, diffusion barrier or the brightness enhancement film.These substrate 5 thickness are preferably more than zero, are less than or equal to 4mm.
What Fig. 4 showed is the preferred embodiment that Fig. 3 brings out white-light LED structure; the same; cutting on the thin slice 2 that contains fluorescent material and colloid admixture near being combined with a substrate 5 on the one side of light source module 1, on the thin slice 2 and deviate from the another side of light source module 1 and also be combined with a protection diaphragm 6.This protection diaphragm 6 can effectively further improve the intensity of thin slice 2, thereby protection thin slice 2 can also realize that the difference of LED goes out light effect, as atomizing light source effect that realizes LED or the effect that improves brightness not sensitive for damages the time.Certainly, this protection thin slice 2 also can be combined in the outer surface of substrate 5, can also be combined in the outer surface of substrate 5 simultaneously and on the thin slice 2 and deviate from the another side of light source module 1, thereby is realizing identical effect.
Concrete, the material of said protection film sheet 6 is preferably a kind of in glass, acrylic, diffusion barrier, brightness enhancement film or the stretched film.These protection diaphragm 6 thickness are preferably more than zero, are less than or equal to 2mm.
What Fig. 5 showed is the preferred embodiment that Fig. 4 brings out white-light LED structure; be combined with a substrate 5 on the thin slice 2 that contains fluorescent material and colloid admixture and near on the one side of light source module 1; on the thin slice 2 and deviate from and be combined with a protection diaphragm 6 on the another side of light source module 1, also be combined with an annex lamina membranacea 7 at the outer surface of protection diaphragm 6.This annex lamina membranacea 7 also can effectively further improve the intensity of thin slice 2, thereby protection thin slice 2 can also realize further that the difference of LED goes out light effect, as the atomizing light source effect of realization LED or the effect of raising brightness not sensitive for damages the time.
Concrete, the material of above-mentioned annex lamina membranacea 7 is preferably at least a in glass, acrylic, diffusion barrier or the brightness enhancement film.
The above only is the utility model preferred embodiment; its structure is not limited to the above-mentioned shape of enumerating; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims (9)

1. one kind is brought out white light LEDs, it is characterized in that, the described white light LEDs that brings out is split type, comprise connector, light source module and be arranged on the thin slice that contains fluorescent material and colloid admixture of light source module light exit direction front end, described connector is arranged on light source module and thin slice edge and two ends and joins with described light source module and thin slice respectively, and described light source module, thin slice and connector constitute a cavity.
2. LED according to claim 1 is characterized in that, the spacing distance of described light source module and thin slice is greater than zero, is less than or equal to 100mm.
3. LED according to claim 1 and 2 is characterized in that, described light source module comprises circuit board and at least one led chip that is arranged on the circuit board.
4. LED according to claim 1 and 2 is characterized in that, also comprises substrate, and the described thin slice that contains fluorescent material and colloid admixture is combined in the surface of described substrate.
5. LED according to claim 4 is characterized in that, described substrate material is a kind of in glass, acrylic, diffusion barrier or the brightness enhancement film.
6. LED according to claim 4 is characterized in that, also comprises the protection diaphragm, and described protection diaphragm is combined on the thin slice and the substrate facing surfaces.
7. LED according to claim 6 is characterized in that, the material of described protection diaphragm is a kind of in glass, acrylic, diffusion barrier, brightness enhancement film or the stretched film.
8. LED according to claim 6 is characterized in that, also comprises the annex lamina membranacea, and described annex lamina membranacea places protection diaphragm outer surface or places the outer surface of substrate.
9. LED according to claim 8 is characterized in that, the material of described annex lamina membranacea is at least a in glass, acrylic, diffusion barrier or the brightness enhancement film.
CN2010102667647A 2010-08-30 2010-08-30 Induced white light LED Pending CN101937965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102667647A CN101937965A (en) 2010-08-30 2010-08-30 Induced white light LED

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Application Number Priority Date Filing Date Title
CN2010102667647A CN101937965A (en) 2010-08-30 2010-08-30 Induced white light LED

Publications (1)

Publication Number Publication Date
CN101937965A true CN101937965A (en) 2011-01-05

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104953003A (en) * 2014-03-25 2015-09-30 亿光电子工业股份有限公司 Light emitting device and light emitting module including same
CN105070216A (en) * 2015-08-19 2015-11-18 绍兴光彩显示技术有限公司 Lattice module without reflection cover
WO2017024572A1 (en) * 2015-08-10 2017-02-16 深圳市华星光电技术有限公司 Led light source structure and packaging method therefor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08122589A (en) * 1994-10-27 1996-05-17 Hitachi Ltd Optical element submount structure
US20070108461A1 (en) * 2005-11-14 2007-05-17 Shinko Electric Industries Co., Ltd. Semiconductor device and manufacturing method of semiconductor device
US20070145404A1 (en) * 2005-12-27 2007-06-28 Shinko Electric Industries Co., Ltd. Semicondcutor device and manufacturing method of semiconductor device
US20070173165A1 (en) * 2006-01-24 2007-07-26 Yuichi Taguchi Method of producing light emitting apparatus
CN101661979A (en) * 2008-08-28 2010-03-03 采钰科技股份有限公司 Semiconductor device and method for fabricating same
US20100148193A1 (en) * 2008-12-11 2010-06-17 Illumitex, Inc. Systems and methods for packaging light-emitting diode devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08122589A (en) * 1994-10-27 1996-05-17 Hitachi Ltd Optical element submount structure
US20070108461A1 (en) * 2005-11-14 2007-05-17 Shinko Electric Industries Co., Ltd. Semiconductor device and manufacturing method of semiconductor device
US20070145404A1 (en) * 2005-12-27 2007-06-28 Shinko Electric Industries Co., Ltd. Semicondcutor device and manufacturing method of semiconductor device
US20070173165A1 (en) * 2006-01-24 2007-07-26 Yuichi Taguchi Method of producing light emitting apparatus
CN101661979A (en) * 2008-08-28 2010-03-03 采钰科技股份有限公司 Semiconductor device and method for fabricating same
US20100148193A1 (en) * 2008-12-11 2010-06-17 Illumitex, Inc. Systems and methods for packaging light-emitting diode devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104953003A (en) * 2014-03-25 2015-09-30 亿光电子工业股份有限公司 Light emitting device and light emitting module including same
WO2017024572A1 (en) * 2015-08-10 2017-02-16 深圳市华星光电技术有限公司 Led light source structure and packaging method therefor
CN105070216A (en) * 2015-08-19 2015-11-18 绍兴光彩显示技术有限公司 Lattice module without reflection cover

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Application publication date: 20110105