CN105958315A - Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner - Google Patents
Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner Download PDFInfo
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- CN105958315A CN105958315A CN201610464744.8A CN201610464744A CN105958315A CN 105958315 A CN105958315 A CN 105958315A CN 201610464744 A CN201610464744 A CN 201610464744A CN 105958315 A CN105958315 A CN 105958315A
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- Prior art keywords
- tube core
- groove
- sintering
- semiconductor laser
- heat sink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a sintering clamp and a sintering method for multiple tube cores of a semiconductor laser in an independent pressure-applying manner. The sintering clamp comprises a base, fixed blocks, baffle sheets and pressing blocks, wherein the longitudinal section of the base adopts a trapezoidal structure; the fixed blocks are fixed on the slope surface of the base through screw threads or welding; more than two grooves are formed in the fixed blocks; each groove is in contact with the slope surface of the base, and a clamping groove is formed in each groove; the baffle sheets are adapted in the grooves along the slope surface of the base, and are fixed through the clamping grooves; and each groove is corresponding to one pressing block. The sintering clamp is simple in structure, convenient to operate, low in cost, capable of sintering under nitrogen atmosphere protection, and capable of preventing soldering flux from being oxidized in high-temperature sintering; a mode of pressure applying through gravity is adopted, so that the condition of damage to the clamp caused by a spring or an elastic sheet is avoided; in addition, the each tube core can be applied with pressure independently in a batch manner; the tube cores are not affected each other; and therefore, the rapid and batch sintering for the tube cores and heat sinks of the semiconductor laser in the independent pressure-applying manner can be realized, and high production efficiency is achieved as well.
Description
Technical field
The present invention relates to the sintering fixture of a kind of semiconductor laser, particularly relate to a kind of semiconductor laser
Device Multi-core pressure sintering fixture and sintering method thereof respectively, belong to semiconductor laser sintering technology neck
Territory.
Background technology
Along with progress and the development of science and technology of society, the status of semiconductor laser will be more and more prominent
Go out, apply more and more extensive.Particularly its wave-length coverage width, volume is little, lightweight, the life-span is long
Deng many advantages, be widely used illuminating, projected, communicated, medical treatment, military and scientific research
In field.Such as fiber optic communication, laser ranging, materials processing, laser guidance etc..Owing to quasiconductor swashs
The feature that the die volume of light device is little, power is high, the heat radiation making tube core is slow.During energising, tube core produces
Raw used heat is not as discharged in time, and it is overheated to cause, the inefficacy of induction laser instrument.Therefore quasiconductor
The thermal diffusivity of laser instrument becomes the key factor affecting semiconductor laser life-span and stability, is also half
One of research direction that conductor laser field is important.The heat radiation of semiconductor laser needs by heat sink
Tube core is dispelled the heat, this just require the heat sink connection with tube core need to meet be connected firmly, resisting fatigue
The requirement such as property is strong, thermal conductivity is high, resistance is low, and the method using tube core to be sintered on heat sink solves just
Certainly one of method of this problem.
The agglomerating plants such as the most commonly used alloying furnace, be singulated dies is placed on heat sink upper after add
Thermal sintering, does not apply pressure to tube core.During due to solder fusing on heat sink, there is certain flowing
Property, can cause tube core and heat sink between occur sintering cavity, it is also possible to cause the skew of die site, make
Luminous position and direction produce deflection, qualification rate is relatively low, and can reduce laser instrument life-span and can
By property.Additionally, have employing spring or shell fragment to pressurize, it is put into the mode that sintering furnace is heated.But,
This mode, along with the increase of heating and cooling number of times repeatedly, its spring or the most impaired deformation of shell fragment, causes
Stress size changes, uncontrollable.It is positioned on heat sink it addition, there is employing suction nozzle to pick up tube core,
Carrying out the equipment sintered of heating again, the mode of used suction nozzle pressurization makes to sinter one every time and swashs
Light device tube core, to be sintered complete and cool down after change next group tube core and heat sink sintering again, inefficient,
And equipment is complex, it is unfavorable for sintering environment airtight so that solder is easily subject to oxidation.
Chinese patent literature CN101515702 propose a kind of semiconductor laser tube core sintering device and
Its using method, first the method will stick up depression bar and move away from the empty place of front apron；Will with suction spindle
At the heat sink front apron being drawn onto device, suction spindle pulls to dial after removing backward and pulls, and is put into stage clip post by heat sink
And between front apron, with suction spindle, tube core to be sintered is drawn onto heat sink edge under microscopic visualization and puts
It is rivals in a contest standard, after suction spindle is removed, mobile under microscopic visualization sticks up depression bar, by accurate for the pressing sticking up depression bar
Fall above tube core；Sintering is completed under vacuum and nitrogen are protected.The weak point of the method exists
In a laser instrument once can only be sintered, it is not suitable for batch sinter；And whole device feature is more,
Precise part needed for processing and assembling is the most difficult, and manufacturing cost is high.
CN201510291154.5 (utility model patent CN201520368289.2 of the same clan) proposes one
Kind of semiconductor laser tube core sintering fixture and sintering method thereof, the method is multiple tube cores and heat sink
On the base of magnetic material, the strip briquetting of magnetic material is being pressed in above, is putting in sintering furnace and burn
Knot.The method is disadvantageous in that, utilizes strip briquetting magnetic force to press together on multiple tube cores,
The stress size of each tube core can be affected by other tube core.Because depositing of tube core and heat sink thickness deviation
, when pressing the tube core of more than 2, its stress size must be different, has big
Have little.In the case of Ji Duan, some tube core does not stresses, and pressureless sintering occurs；Some tube core is subject to
Power can be excessive, causes damaging.
Summary of the invention
The purpose of the present invention: provide a kind of semiconductor laser multi-tube core pressure sintering fixture respectively and
Sintering method, be a kind of simplicity, low cost, efficiency height, can realize Multi-core, pressurize the most simultaneously
Semiconductor laser pressure sintering fixture, provides the sintering method of this fixture a kind of simultaneously.
To achieve these goals, the technical scheme is that
A kind of semiconductor laser multi-tube core pressure sintering fixture respectively, including base, fixed block, gear
Sheet and briquetting, the longitudinal section of described base is trapezium structure, and described fixed block passes through screw thread or weldering
Connect on the slope being fixed on described base；Open individual with upper groove, Mei Gesuo on described fixed block
The groove stated contact with the slope of described base and in set draw-in groove, described catch is along described
The slope adaptation of base be arranged in described groove, and fixed by described draw-in groove, each
The corresponding described briquetting of described groove.
Above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein, described base
Longitudinal section is ladder structure of right angle, and described fixed block is perpendicular to the slope of described base.
Above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein, described base is
Rustless steel or cuprio or aluminium based metal material, described fixed block is rustless steel or cuprio or aluminium based metal
Material.
Above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein, described fixed block
On texturearunaperpendicular in the slope of described base, the quantity of described groove is 2-20, institute
The groove stated to be shaped as rectangle square or trapezoidal.
Above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein, described catch is
Pottery or glass material make, described catch be shaped as cuboid or cube or cake.
Above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein, described briquetting is
Cuboid or cube or ladder body structure, the material of described briquetting is rustless steel or cuprio or aluminium based metal
Material.
The sintering method of a kind of semiconductor laser multi-tube core pressure sintering fixture respectively, the method is at least
Comprise the steps:
Step 1: described catch is placed on described fixed block along the slope of described base
In draw-in groove, make described catch against described base slope tilt be placed on described fixed block
Groove in.
Step 2: by adsorption machine, semiconductor laser tube core is placed on solder under the microscope
On heat sink, form laser tube core, solder and heat sink, by described laser tube core, solder and heat
Sinking, at the bottom portion of groove of described fixed block, makes laser tube core front facet against described catch.
Step 3: in each groove, along described catch, the briquetting described in the placement of inclination,
Under gravity, tube core is pressed by described briquetting.
Step 4: be put in sintering furnace by the fixture installed, is sintered under the protection of nitrogen.
The sintering method of above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein,
In described step 2, each groove puts a laser tube core, solder and heat sink, and described is fixing
Block has a 2-20 groove, and fixture puts 2-20 laser tube core, solder and heat sink simultaneously.
The sintering method of above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein,
In described step 2, described each fixed block opens 7-15 groove, and each groove puts 1 laser
Device tube core, solder and heat sink, fixture burns 7-15 laser tube core, solder and heat sink simultaneously.
The sintering method of above-mentioned semiconductor laser multi-tube core pressure sintering fixture respectively, wherein,
In described step 2, if solder is the form of weld tabs, first it is put into described bottom portion of groove heat sink,
Heat sink while against described catch, then weld tabs is placed on heat sink, weld tabs against described
Catch, is finally placed on laser tube core on weld tabs, and laser tube core ante-chamber is against described catch.
Present configuration is simple and convenient to operate, low cost, can be placed in the protection of nitrogen sintering,
When preventing high temperature sintering, solder oxidation.The gravity is utilized to press, it is to avoid because using spring or shell fragment to lead
Cause the most flimsy situation of fixture.And can respectively each tube core individually be pressed in batches, tube core
And be independent of each other between tube core, it is achieved noise spectra of semiconductor lasers tube core with heat sink quickly, batch individually adds
The sintering of pressure, production efficiency is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of semiconductor laser multi-tube core of the present invention pressure sintering fixture respectively.
Fig. 2 is the sectional view of semiconductor laser multi-tube core of the present invention pressure sintering fixture respectively.
Detailed description of the invention
Embodiments of the invention are further illustrated below in conjunction with accompanying drawing.
Refer to shown in accompanying drawing 1 and accompanying drawing 2, a kind of semiconductor laser multi-tube core pressure sintering respectively
Fixture, including base 1, fixed block 2, catch 3 and briquetting 5, the longitudinal section of described base 1 is
Trapezium structure, described fixed block 2 is fixed on described base 1 by the mode such as screw thread or welding
On slope；Can open on described fixed block 22 with upper groove, each described groove is with described
The slope of base 1 contact and in set draw-in groove, described catch 3 is along described base 1
Slope adaptation is arranged in described groove, and is fixed by described draw-in groove, each described recessed
The corresponding described briquetting 5 of groove.
The longitudinal section of described base 1 is ladder structure of right angle, and described fixed block 2 is perpendicular to described
The slope of base 1.
Described base 1 is rustless steel or cuprio or aluminium based metal material, and described fixed block 2 is not
Rust steel or cuprio or aluminium based metal material.
The described texturearunaperpendicular on fixed block 2 is in the slope of described base 1, described groove
Quantity be 2-20, described groove to be shaped as rectangle square or trapezoidal, be preferably long
Square.
Described catch 3 is made for pottery or glass material, described catch 3 be shaped as cuboid
Or cube or cake, preferably cuboid, catch 3 is because tube core to be contacted, so wanting polishing.
Described briquetting 5 is cuboid or cube or ladder body structure, preferably cuboid；Described pressure
The material of block 5 is rustless steel or cuprio or aluminium based metal material.
Being advisable opening 7-15 groove on fixed block 2, catch 3 is fixed by draw-in groove so that it is against
The slope of base 1, stands in groove at a slant.Each bottom portion of groove puts laser tube core, a weldering
Semiconductor laser tube core (is placed on solder by material and heat sink 4 under the microscope by adsorption machine
On heat sink 4, forming laser tube core, solder and heat sink 4, heat sink 4 refer to encapsulation and cooling laser
Fin used by device tube core.If solder is the form of weld tabs, the most first it is put in groove heat sink 4,
Wherein while against catch 3, then weld tabs is placed on heat sink 4, weld tabs against catch 3,
Finally tube core is placed on weld tabs), ensure that the ante-chamber of laser tube core is by catch 3 simultaneously.By briquetting
5 against catch 3, inclination stand in groove, press against laser tube core, solder and heat sink 4.
The size of briquetting 5 to match with the groove size in fixed block 2, it is ensured that briquetting 5, is placed on
Will not double swerve in groove.Because briquetting 5 is to be placed in groove at a slant, so shaking before and after will not
Dynamic.Briquetting 5 and die contact part also want polishing.During sintering, briquetting 5 to laser tube core,
Solder and the pressure of heat sink 4, can be adjusted by the size increasing briquetting 5.
Base 1, fixed block 2, briquetting 5 all use metal material (such as: rustless steel, cuprio or aluminum
Sill), with low cost.
The sintering method of a kind of semiconductor laser multi-tube core pressure sintering fixture respectively, the method is at least
Comprise the steps:
Step 1: catch 3 is placed in the draw-in groove of fixed block 2 along the slope of base 1, makes gear
In the groove being placed on fixed block 2 that sheet 3 tilts against the slope of base 1 (normal produce, this
Individual catch 3 can be consistently placed in draw-in groove, need not take out).
Step 2: by adsorption machine, semiconductor laser tube core is placed on solder under the microscope
On heat sink 4, form laser tube core, solder and heat sink 4, by laser tube core, solder and heat sink
4 bottom portion of groove being placed on fixed block 2, make laser tube core front facet against catch 3.
Each groove puts a laser tube core, solder and heat sink 4, and fixed block 2 has 2-20 individual recessed
Groove, therefore a fixture can put 2-20 laser tube core, solder and heat sink 4 simultaneously.If (weldering
Material is the form of weld tabs, is the most first put into bottom portion of groove heat sink 4, wherein against catch 3, then
Weld tabs is placed on heat sink 4, weld tabs against catch 3, finally laser tube core is placed on weldering
On sheet, it is ensured that laser tube core ante-chamber is against catch 3).
Step 3: in each groove, along catch 3, the placement briquetting 5 of inclination, in action of gravity
Under, tube core is pressed by briquetting 5.
Step 4: be put in sintering furnace by the fixture installed, is sintered under the protection of nitrogen.
Described each fixed block 2 opens 7-15 groove, and each groove puts 1 tube core, solder and heat
Heavy 4, therefore fixture once can burn 7-15 laser tube core, solder and heat sink.
Briquetting 5 tilts to be placed in the groove of fixed block 2 by catch 3, utilizes self gravitation, to pipe
Core pressure is sintered, and can effectively reduce the sintering cavity between tube core and heat sink 4, improving laser device
In the life-span, improve product quality；Briquetting 5 is put in a groove, and left and right directions is fixed by groove inner wall.
The briquetting 5 tilted, under gravity, leans against on catch 3 that (catch 3 leans against base 1
Slope on) so that it is will not move forward and backward.So when briquetting is pressed for 5 times, whole fixture moves
Time, whole sintering process is all not susceptible to displacement, improves sintering yield.Briquetting 5 can be upper and lower
Mobile, highly can regulate, thus meet that differing heights is heat sink 4, different-thickness solder and tube core
Sintering demand.
In sum, present configuration is simple and convenient to operate, low cost, can be placed on the guarantor of nitrogen
Protect middle sintering, when preventing high temperature sintering, solder oxidation.The gravity is utilized to press, it is to avoid because using bullet
Spring or shell fragment cause the most flimsy situation of fixture.And can be independent to each tube core respectively in batches
Pressure, is independent of each other between tube core and tube core, it is achieved noise spectra of semiconductor lasers tube core with heat sink quickly,
The sintering of batch individually pressurization, production efficiency is high.
The foregoing is only the preferred embodiments of the present invention, not thereby limit the patent model of the present invention
Enclose, every equivalent structure transformation utilizing description of the invention content to be made, or directly or indirectly use
It is attached to the technical field of other Related products, is the most in like manner included in the scope of patent protection of the present invention
In.
Claims (10)
1. semiconductor laser multi-tube core pressure sintering fixture respectively, it is characterised in that: include base,
Fixed block, catch and briquetting, the longitudinal section of described base is trapezium structure, and described fixed block leads to
Cross screw thread or be fixedly welded on the slope of described base；Open individual with fovea superior on described fixed block
Groove, each described groove contact with the slope of described base and in set draw-in groove, described gear
Sheet is arranged in described groove along the slope adaptation of described base, and by described draw-in groove
Fixing, the corresponding described briquetting of each described groove.
Semiconductor laser multi-tube core the most according to claim 1 pressure sintering fixture, its feature respectively
Being: the longitudinal section of described base is ladder structure of right angle, described fixed block is perpendicular to described
The slope of base.
Semiconductor laser multi-tube core the most according to claim 1 pressure sintering fixture, its feature respectively
It is: described base is rustless steel or cuprio or aluminium based metal material, and described fixed block is stainless
Steel or cuprio or aluminium based metal material.
Semiconductor laser multi-tube core the most according to claim 1 pressure sintering fixture, its feature respectively
Be: the described texturearunaperpendicular on fixed block in the slope of described base, described groove
Quantity is 2-20, described groove to be shaped as rectangle square or trapezoidal.
Semiconductor laser multi-tube core the most according to claim 1 pressure sintering fixture, its feature respectively
Be: described catch for pottery or glass material make, described catch be shaped as cuboid or
Cube or cake.
Semiconductor laser multi-tube core the most according to claim 1 pressure sintering fixture, its feature respectively
It is: described briquetting is cuboid or cube or ladder body structure, and the material of described briquetting is stainless
Steel or cuprio or aluminium based metal material.
7. the described semiconductor laser multi-tube core being applied to claim 1-6 any one adds respectively
The sintering method of pressure sintering fixture, it is characterised in that: the method at least comprises the steps:
Step 1: described catch is placed on along the slope of described base the draw-in groove of described fixed block
In, make described catch against described base slope tilt be placed on the recessed of described fixed block
In groove；
Step 2: under the microscope with adsorption machine semiconductor laser tube core is placed on solder heat sink
On, form laser tube core, solder and heat sink, by described laser tube core, solder with heat sink put
At the bottom portion of groove of described fixed block, make laser tube core front facet against described catch；
Step 3: in each groove, along described catch, the briquetting described in the placement of inclination, at weight
Under power effect, tube core is pressed by described briquetting；
Step 4: be put in sintering furnace by the fixture installed, is sintered under the protection of nitrogen.
The sintering side of semiconductor laser multi-tube core the most according to claim 7 pressure sintering fixture respectively
Method, it is characterised in that: in described step 2, each groove puts laser tube core, a solder
With heat sink, described fixed block has 2-20 groove, a fixture to put 2-20 laser instrument pipe simultaneously
Core, solder and heat sink.
The sintering side of semiconductor laser multi-tube core the most according to claim 7 pressure sintering fixture respectively
Method, it is characterised in that: in described step 2, described each fixed block opens 7-15 groove, often
Individual groove puts 1 laser tube core, solder and heat sink, and a fixture burns 7-15 laser instrument simultaneously
Tube core, solder and heat sink.
The sintering of semiconductor laser multi-tube core the most according to claim 7 pressure sintering fixture respectively
Method, it is characterised in that: in described step 2, if solder is the form of weld tabs, first heat sink
It is put into described bottom portion of groove, heat sink against described catch, then weld tabs is placed on heat sink,
Weld tabs while against described catch, finally laser tube core being placed on weld tabs, laser tube core
Ante-chamber is against described catch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610464744.8A CN105958315A (en) | 2016-06-20 | 2016-06-20 | Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610464744.8A CN105958315A (en) | 2016-06-20 | 2016-06-20 | Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner |
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| Publication Number | Publication Date |
|---|---|
| CN105958315A true CN105958315A (en) | 2016-09-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610464744.8A Pending CN105958315A (en) | 2016-06-20 | 2016-06-20 | Sintering clamp and sintering method for multiple tube cores of semiconductor laser in independent pressure-applying manner |
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| CN109326951A (en) * | 2017-07-31 | 2019-02-12 | 山东华光光电子股份有限公司 | A kind of multiple semiconductor laser tube cores sintering fixture and its sintering method |
| CN111092365A (en) * | 2018-10-23 | 2020-05-01 | 山东华光光电子股份有限公司 | Multi-tube-core sintering clamp and sintering method for semiconductor laser with uniform and adjustable pressure |
| CN113540961A (en) * | 2020-04-20 | 2021-10-22 | 山东华光光电子股份有限公司 | Laser fixing device and method for C-mount laser bonding wire |
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| CN113540961A (en) * | 2020-04-20 | 2021-10-22 | 山东华光光电子股份有限公司 | Laser fixing device and method for C-mount laser bonding wire |
| CN113540961B (en) * | 2020-04-20 | 2022-06-07 | 山东华光光电子股份有限公司 | Laser fixing device and method for welding wire of C-mount laser |
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