CN206163894U - Diode pumping laser module packaging hardware - Google Patents
Diode pumping laser module packaging hardware Download PDFInfo
- Publication number
- CN206163894U CN206163894U CN201621193931.9U CN201621193931U CN206163894U CN 206163894 U CN206163894 U CN 206163894U CN 201621193931 U CN201621193931 U CN 201621193931U CN 206163894 U CN206163894 U CN 206163894U
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- diode
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- device entity
- laser module
- module
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Abstract
The utility model provides a diode pumping laser module packaging hardware, packaging hardware form positive N limit shape device entity with N triangular prism, go up briquetting and briquetting down through longitudinal symmetry in the straining device entity conical, the outside even extension of device entity has compressed tightly the outer N diode module that corresponds of device entity, adds the solder and melt the solder in the high temperature furnace in the position department that a N diode module is had a common boundary, the device module is removed after cooling off to normal atmospheric temperature, has obtained the diode pumping laser module. The utility model discloses a diode pumping laser module packaging hardware has improved the spray deposition uniformity of diode module on the cooler, has improved crystal rod's pumping performance, and simple to operate is swift, and is simple high -efficient, has promoted the security of diode module, has realized the diode pumping laser module encapsulation of less specification.
Description
Technical field
The utility model belongs to semiconductor laser technique field, and in particular to a kind of diode-pumped nd yag laser module encapsulation dress
Put.
Background technology
Annular pump module is vital part in diode-pumped solid laser system.In annular pump mould
In block, diode (led) module is around crystal bar（Gain medium）The uniformity of circle distribution is directly connected to its pumping performance.And
Crystal bar and cooler can ensure coaxial by machining, thus on the just interior tangent plane of cooler diode (led) module encapsulate it is equal
Even property directly affects the pumping performance of module.Early stage diode (led) module is encapsulated by hand completely, is primarily present following Railway Project：
（1）The insecure, fill solder of heat sink and potsherd fixation is difficult in diode (led) module；
（2）Solder cannot be separated with cooler after welding；
（3）Without diode (led) module safeguard procedures, diode (led) module is easily bruised；
（4）Inconvenient operation, packaging efficiency is low；
（5）Each diode (led) module discontinuity on cooler so as to which distributing homogeneity cannot ensure；
（6）For the pump module compared with small dimension cannot be encapsulated by hand.
Currently need a kind of pumping diode (led) module and annular pump module cooler badly（Hereinafter referred to as cooler）Envelope
Assembling device.
The content of the invention
A technical problem to be solved in the utility model is to provide a kind of diode-pumped nd yag laser module packaging system.
Diode-pumped nd yag laser module packaging system of the present utility model, is characterized in：The device includes installation pedestal, cold
But device, lower lock block, device entity, O-ring, silicone rubber pad, upper holder block and long spiro nail, diode (led) module；
Described cooler is placed on the upper surface of installation pedestal；
Described device entity is the n-shaped body being made up of N number of identical triangular prism, and cooler inner chamber is and device reality
The equipped n-shaped cavity of body, there is the n-shaped groove being equipped with device entity, n-shaped cavity, n-shaped in installation pedestal
The center overlapping of axles of groove and n-shaped body, n-shaped cavity has uniform gap L1, n-shaped groove and positive N with n-shaped body
There are uniform gap L2, L1 ＞ L2 between the body of side；There is n-shaped boss in n-shaped groove, the height of n-shaped boss is big
In the height of n-shaped groove, n-shaped boss is inserted upwardly into the gap L1 between n-shaped cavity and n-shaped body；N≥5；
The inner chamber of described device entity is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, and upper holder block is and upper conical chamber
Equipped circular cone, lower lock block is the circular cone being equipped with inferior pyramidal chamber, and running through between upper holder block and lower lock block has vertical length
Screw, tightens long spiro nail, and upper holder block and lower lock block are close in opposite directions；
The lower end of described lower lock block is cylinder, and there is the location hole with n-shaped groove insertion installation pedestal bottom, pushes
The cylinder of block is equipped with location hole, and the cylinder of lower lock block is sunk to after location hole, and the lower surface of device entity is convex with n-shaped
The EDGE CONTACT of the upper surface of platform；
The face symmetrical above and below winding O-ring of the outer surface of described device entity, outside each triangular prism of device entity
The symmetrical thickness identical silicone rubber pad in horizontally and vertically direction on surface, the outer surface of each triangular prism it is vertically symmetrical in
The heart leaves gap.
The material of described installation pedestal is oxygen-free copper.
It is carved with the linear groove of vertical direction in the vertically symmetrical center of each Rhizoma Sparganii outer surface of column of described device entity.
Described gap L1 and gap L2, meets 2 mm≤L1- L2≤4 mm.
Diode-pumped nd yag laser module packaging system of the present utility model improves the distribution of diode (led) module on cooler
Uniformity, improves the pumping performance of crystal bar, quick and easy for installation, simple efficiently to improve the security of diode (led) module,
Realize and encapsulated compared with the diode-pumped nd yag laser module of small dimension.Diode-pumped nd yag laser module packaging system of the present utility model
It is adapted to used in semiconductor laser module manufacturing process.
Description of the drawings
Fig. 1 is diode-pumped nd yag laser module packaging system front view of the present utility model；
Fig. 2 is diode-pumped nd yag laser module packaging system top view of the present utility model；
In figure, 1. on the silicone rubber pad 7. of 2. cooler of installation pedestal, 3. lower lock block, 4. device entity 5.O type circle 6.
The diode (led) module of 8. long spiro nail of briquetting 9..
Specific embodiment
Describe the utility model in detail with reference to the accompanying drawings and examples.
Following examples are merely to illustrate the utility model, and are not limitation of the utility model.Relevant technical field
Personnel in the case of without departing from spirit and scope of the present utility model, can also make a variety of changes, replace and modification, because
This equal technical scheme falls within category of the present utility model.
As shown in Figure 1, 2, diode-pumped nd yag laser module packaging system of the present utility model includes installation pedestal 1, cooling
Device 2, lower lock block 3, device entity 4, O-ring 5, silicone rubber pad 6, upper holder block 7 and long spiro nail 8, diode (led) module 9；
Described cooler 2 is placed on the upper surface of installation pedestal 1；
Described device entity 4 is the n-shaped body being made up of N number of identical triangular prism, and the inner chamber of cooler 2 is and device
The equipped n-shaped cavity of entity 4, there is a n-shaped groove being equipped with device entity 4 in installation pedestal 1, n-shaped cavity, just
The center overlapping of axles of N sides shape groove and n-shaped body, n-shaped cavity has uniform gap L1, n-shaped groove with n-shaped body
There are uniform gap L2, L1 ＞ L2 between n-shaped body；There are n-shaped boss, the height of n-shaped boss in n-shaped groove
Degree is more than the height of n-shaped groove, and n-shaped boss is inserted upwardly into the gap L1 between n-shaped cavity and n-shaped body；N≥
5；
The inner chamber of described device entity 4 is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, upper holder block 7 be with it is upper conical
The equipped circular cone in chamber, lower lock block 3 is the circular cone being equipped with inferior pyramidal chamber, vertical through having between upper holder block 7 and lower lock block 3
Long spiro nail 8, tighten long spiro nail 8, upper holder block 7 and lower lock block 3 are opposite close；
The lower end of described lower lock block 3 is cylinder, and the location hole with n-shaped groove insertion is arranged at the bottom of installation pedestal 1, under
The cylinder of briquetting 3 is equipped with location hole, and the cylinder of lower lock block 3 is sunk to after location hole, the lower surface of device entity 4 and positive N
The EDGE CONTACT of the upper surface of side shape boss；
The face symmetrical above and below winding O-ring 5 of the outer surface of described device entity 4, each triangular prism of device entity 4
The symmetrical thickness identical silicone rubber pad 6 in horizontally and vertically direction of outer surface, the outer surface of each triangular prism it is vertical right
Leave gap in title center.
The material of described installation pedestal 1 is oxygen-free copper.
It is carved with the linear groove of vertical direction in the vertically symmetrical center of each Rhizoma Sparganii outer surface of column of described device entity 4.
Described gap L1 and gap L2, meets 2 mm≤L1- L2≤4 mm.
Embodiment 1
Cooler 2 is arranged on 1a. the upper surface of installation pedestal 1；
Device entity 4 is bundled into a regular pentagon body, N=5 by 1b. O-rings 5；
1c. is arranged on upper holder block 7 and lower lock block 3 in the inner chamber of device entity 4, then by tightening long spiro nail 8, will fill
Put entity 4, upper holder block 7 and lower lock block 3 and be fixed into an apparatus module；
Apparatus module is vertically penetrated 1d. cooler 2 and installation pedestal 1, cylinder and the installation base of the lower end of lower lock block 3
The equipped positioning of location hole of 1 bottom of seat, gap L1 and gap L2 meets L1-L2=2mm；
5 diode (led) modules 9 are individually positioned in 1e. the upper surface of corresponding regular pentagon boss；
1f. continues to tighten long spiro nail 8, and upper holder block 7 and lower lock block 3 are opposite close, identical by 5 of component devices entity 4
Triangular prism outwards push, until each triangular prism correspondence compresses corresponding diode (led) module 9, form a diode assembly；
1g. adds solder at the position that 5 diode (led) modules 9 have a common boundary, and solder is indium；
Diode assembly is put into high temperature furnace by 1h., raises high temperature furnace furnace temperature, until indium melts；
1i. takes out diode assembly, after normal temperature cooling, removes apparatus module, obtains pentagon diode-pumped nd yag laser mould
Block.
Embodiment 2
Embodiment 2 is essentially identical with the embodiment of embodiment 1, differs primarily in that N=7, L1-L2=2.5mm, obtains seven
Side shape diode-pumped nd yag laser module.
Embodiment 3
Embodiment 3 is essentially identical with the embodiment of embodiment 1, differs primarily in that N=9, L1-L2=3mm, obtains nine sides
Shape diode-pumped nd yag laser module.
Embodiment 4
Embodiment 4 is essentially identical with the embodiment of embodiment 1, differs primarily in that N=11, L1-L2=3mm, obtains ten
Monogon diode-pumped nd yag laser module.
Claims (4)
1. a kind of diode-pumped nd yag laser module packaging system, it is characterised in that：The device includes installation pedestal（1）, cooler
（2）, lower lock block（3）, device entity（4）, O-ring（5）, silicone rubber pad（6）, upper holder block（7）And long spiro nail（8）, diode die
Block（9）；
Described cooler（2）It is placed on installation pedestal（1）Upper surface；
Described device entity（4）It is the n-shaped body being made up of N number of identical triangular prism, cooler（2）Inner chamber is and device
Entity（4）Equipped n-shaped cavity, installation pedestal（1）Inside have and device entity（4）Equipped n-shaped groove, n-shaped
The center overlapping of axles of cavity, n-shaped groove and n-shaped body, n-shaped cavity has uniform gap L1 with n-shaped body, just
There are uniform gap L2, L1 ＞ L2 between N sides shape groove and n-shaped body；There are n-shaped boss, n-shaped in n-shaped groove
The height of boss is more than the height of n-shaped groove, and n-shaped boss is inserted upwardly into the seam between n-shaped cavity and n-shaped body
Gap L1；N≥5；
Described device entity（4）Inner chamber be laterally zygomorphic upper conical chamber and inferior pyramidal chamber, upper holder block（7）Be with it is upper conical
The equipped circular cone in chamber, lower lock block（3）Be with inferior pyramidal chamber be equipped with circular cone, upper holder block（7）And lower lock block（3）Between run through
There is vertical long spiro nail（8）, tighten long spiro nail（8）, upper holder block（7）And lower lock block（3）It is opposite close；
Described lower lock block（3）Lower end be cylinder, installation pedestal（1）Location hole with n-shaped groove insertion is arranged at bottom, under
Briquetting（3）Cylinder and location hole be equipped with, lower lock block（3）Cylinder sink to after location hole, device entity（4）Lower surface
With the EDGE CONTACT of the upper surface of n-shaped boss；
Described device entity（4）Outer surface face symmetrical above and below winding O-ring（5）, device entity（4）Each triangular prism
Outer surface the symmetrical thickness identical silicone rubber pad in horizontally and vertically direction（6）, the outer surface of each triangular prism it is perpendicular
Straight symmetrical centre leaves gap.
2. diode-pumped nd yag laser module packaging system according to claim 1, it is characterised in that：Described installation pedestal
（1）Material be oxygen-free copper.
3. diode-pumped nd yag laser module packaging system according to claim 1, it is characterised in that：Described device entity
（4）The vertically symmetrical center of each Rhizoma Sparganii outer surface of column be carved with the linear groove of vertical direction.
4. diode-pumped nd yag laser module packaging system according to claim 1, it is characterised in that：Described gap L1 and
Gap L2, meets 2 mm≤L1- L2≤3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621193931.9U CN206163894U (en) | 2016-11-07 | 2016-11-07 | Diode pumping laser module packaging hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621193931.9U CN206163894U (en) | 2016-11-07 | 2016-11-07 | Diode pumping laser module packaging hardware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206163894U true CN206163894U (en) | 2017-05-10 |
Family
ID=58656680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621193931.9U Withdrawn - After Issue CN206163894U (en) | 2016-11-07 | 2016-11-07 | Diode pumping laser module packaging hardware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206163894U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106300003A (en) * | 2016-11-07 | 2017-01-04 | 中国工程物理研究院应用电子学研究所 | A kind of diode-pumped nd yag laser module packaging system |
| CN110994354A (en) * | 2019-11-13 | 2020-04-10 | 海南师范大学 | Pressure applying device and packaging method for semiconductor laser array |
-
2016
- 2016-11-07 CN CN201621193931.9U patent/CN206163894U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106300003A (en) * | 2016-11-07 | 2017-01-04 | 中国工程物理研究院应用电子学研究所 | A kind of diode-pumped nd yag laser module packaging system |
| CN110994354A (en) * | 2019-11-13 | 2020-04-10 | 海南师范大学 | Pressure applying device and packaging method for semiconductor laser array |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170510 Effective date of abandoning: 20230407 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20170510 Effective date of abandoning: 20230407 |