CN202523767U - Big power LED heat radiation device - Google Patents
Big power LED heat radiation device Download PDFInfo
- Publication number
- CN202523767U CN202523767U CN2012201085018U CN201220108501U CN202523767U CN 202523767 U CN202523767 U CN 202523767U CN 2012201085018 U CN2012201085018 U CN 2012201085018U CN 201220108501 U CN201220108501 U CN 201220108501U CN 202523767 U CN202523767 U CN 202523767U
- Authority
- CN
- China
- Prior art keywords
- pedestal
- led chip
- thermal conductivity
- power led
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229920003023 plastic Polymers 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 6
- 239000000084 colloidal system Substances 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 6
- 239000007770 graphite material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000005439 thermosphere Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
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- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a big power LED heat radiation device which includes a pedestal. The upper end of the pedestal is provided with a high heat conduction layer which can increase the horizontal heat conduction. The high heat conduction layer is fixed with an LED chip and a convex lens rubber. The LED chip is connected with welding feet which are packaged in the pedestal via leads. The convex lens rubber is combined with the high heat conduction layer to seal the LED chip and the leads. The lower end of the pedestal is provided with fin-shaped heat radiating sheets. The heat radiation device increases the horizontal heat conduction efficiency via the high heat conduction layer, enlarges the effective area of the vertical heat conduction, shortens the heat radiation path, and increases the heat radiation area to the air, so the heat resistance of the chip to the air is obviously reduced, the temperature of a heating electronic device is effectively reduced, the stability and the reliability of the big power LED chip are greatly enhanced, and the service lifetime of the big power LED chip is prolonged. Besides, the big power LED heat radiation device is simple in structure, and the pedestal is made of plastic, so the cost is saved, the production is convenient, and the product safety is improved, and consequently the wide application is realized.
Description
Technical field
The utility model relates to a kind of heat abstractor, especially a kind of high-power LED heat radiating device.
Background technology
LED is a kind of injection electroluminescence device; But the LED photoelectric conversion efficiency is still not high enough at present; 15% ~ 30% the electric energy of only having an appointment is converted into luminous energy output; All the other all convert heat energy into, and the led chip junction temperature rose when this directly caused work, cause that the lost of life, thermal stress are concentrated, degradation problem under chip light emitting efficient and the fluorescent material launching efficiency.Therefore, heat radiation becomes a key factor of its development of restriction.
In the existing high-power LED encapsulation radiator structure, led chip generally is fixed on the heating panel, and the heat that led chip produces vertically conducts to heating panel earlier, carries out convection current and heat loss through radiation through heating panel and air again.But cooling plate structure is complicated in the existing application product, and operation is various, has increased the thermal resistance of led chip to air, and heat can't effectively be delivered in the air.
The patent No. is that 201010160082.8 Chinese utility model patent discloses " heat radiator with composite structure and preparation method thereof "; Utilize the high advantage of in-plane thermal conductivity of flexible graphite material to cooperate and optimized the heat conducting structure, form good three-dimensional heat dissipation effect with expanded graphite composite material high heat capacity performance.It is low that but the radiator of graphite moulding is prone to embrittlement, bending resistance and tensile strength, and graphite is conductor, is easy to generate the danger of electric leakage, in practical application, has significant limitation.
The utility model content
The technical problem that the utility model mainly solves is: a kind of simple in structure, perfect heat-dissipating, reliability and the high high-power LED heat radiating device of security performance are provided.
For solving the problems of the technologies described above, the technical scheme that the utility model adopted is:
A kind of high-power LED heat radiating device; Comprise pedestal; Said pedestal upper end be provided with one be used to increase horizontal heat conduction high thermal conductivity layer, be fixed with led chip and convex lens colloid on the said high thermal conductivity layer, said led chip is connected with leg in being wrapped in said pedestal through lead; Said convex lens colloid combines with high thermal conductivity layer said led chip and lead sealing, and said pedestal lower end is provided with the fin of fin-shaped shape.
Further as preferred embodiment, the high thermal conductivity layer zone that is positioned at convex lens colloid below is overseas except the crystal bonding area of led chip, on high thermal conductivity layer, be coated with one be used to increase the led chip light extraction efficiency the reflector.
Further as preferred embodiment, said high thermal conductivity layer is processed by graphite material with high thermal conductivity or metal material, and the thermal conductivity of said high thermal conductivity layer is 400W/mK ~ 2000W/mK.
Further as preferred embodiment, said metal material is copper or silver.
Further as preferred embodiment, the thickness of said high thermal conductivity layer is 0.1 ~ 0.3mm.
Further as preferred embodiment, said pedestal is that plastics are processed.
The beneficial effect of the utility model is: the utility model adopts high thermal conductivity layer to strengthen the horizontal heat-conducting effect of led chip; Effectively enlarge vertical conduction surface of heat abstractor, shortened heat dissipation path, increased area of dissipation; Thereby obviously reduced chip to the air thermal resistance; Effectively reduce the temperature of heating electronic device, make that the stability of high-power LED chip and reliability are greatly strengthened, and prolonged its useful life; Further, be provided with the fin of fin-shaped shape in the pedestal lower end, can increase cross-ventilation and heat loss through radiation area.And the utility model is simple in structure, and pedestal adopts plastics to process, and has reduced cost, and is easy to process, and improved the safety of products performance, is convenient to extensive use.
Description of drawings
Be described further below in conjunction with the embodiment of accompanying drawing the utility model:
Fig. 1 is the structural representation of the utility model high-power LED heat radiating device.
Embodiment
With reference to Fig. 1; A kind of high-power LED heat radiating device comprises pedestal 1, pedestal 1 upper end be provided with one be used to increase horizontal heat conduction high thermal conductivity layer 13; Be fixed with led chip 2 and convex lens colloid 3 on the high thermal conductivity layer 13; Led chip 2 is connected with leg 12 in being wrapped in said pedestal 1 through lead 4, and said convex lens colloid 3 combines with high thermal conductivity layer 13 said led chip 2 and lead 4 are sealed, and said pedestal 1 lower end is provided with the fin 11 of fin-shaped shape.
In specific embodiment; Led chip 2 is fixed on the high thermal conductivity layer 13 through welding, heat conduction elargol or other modes; High thermal conductivity layer 13 is processed by graphite material with high thermal conductivity or metal material, and the thermal conductivity of high thermal conductivity layer 13 is 400W/mK ~ 2000W/mK.The utility model has strengthened the horizontal heat conduction of heat abstractor through in pedestal 1 upper end high thermal conductivity layer 13 being set, thereby has avoided led chip central authorities temperature to rise sharply, and has enlarged area of dissipation longitudinally, has improved heat dispersion.High thermal conductivity layer 13 can adopt the graphite material with high thermal conductivity to process, and also can adopt metal material, and for example copper, silver etc. are processed, and to strengthen the horizontal capacity of heat transmission of heat abstractor, preferably, the thickness of high thermal conductivity layer 13 is 0.1 ~ 0.3mm.
Preferably; Said pedestal 1 adopts plastics to process; Because the heat-conducting plastic cost is low, machine-shaping is convenient, and can guarantee good heat-conducting, and avoided adopting the danger of electric leakage easily of metal fin; Improved the safety of products performance, the radiator that has also overcome the graphite moulding is prone to embrittlement, bending resistance and the low defective of tensile strength.
Preferably, the high thermal conductivity layer zone that is positioned at convex lens colloid 3 belows is overseas except the crystal bonding area of led chip 2, on height thermosphere 13, be coated with one be used to increase led chip 2 light extraction efficiencies reflector 14.
More than be that preferred embodiment to the utility model specifies; But the utility model is created and is not limited to said embodiment; Those of ordinary skill in the art can also make all equivalent variations or replacement under the prerequisite of the utility model spirit, distortion that these are equal to or replacement all are included in the application's claim institute restricted portion.
Claims (6)
1. high-power LED heat radiating device; Comprise pedestal (1); It is characterized in that: said pedestal (1) upper end be provided with one be used to increase horizontal heat conduction high thermal conductivity layer (13); Be fixed with led chip (2) and convex lens colloid (3) on the said high thermal conductivity layer (13); Said led chip (2) is connected through lead (4) leg (12) interior with being wrapped in said pedestal (1), and said convex lens colloid (3) combines with high thermal conductivity layer (13) said led chip (2) and lead (4) sealing, and said pedestal (1) lower end is provided with the fin (11) of fin-shaped shape.
2. a kind of high-power LED heat radiating device according to claim 1; It is characterized in that: the high thermal conductivity layer zone that is positioned at convex lens colloid (3) below is overseas except the crystal bonding area of led chip (2), on height thermosphere (13), be coated with one be used to increase led chip (2) light extraction efficiency reflector (14).
3. a kind of high-power LED heat radiating device according to claim 2; It is characterized in that: said high thermal conductivity layer (13) is processed by graphite material with high thermal conductivity or metal material, and the thermal conductivity of said high thermal conductivity layer (13) is 400W/mK ~ 2000W/mK.
4. a kind of high-power LED heat radiating device according to claim 3 is characterized in that: said metal material is copper or silver.
5. a kind of high-power LED heat radiating device according to claim 2 is characterized in that: the thickness of said high thermal conductivity layer (13) is 0.1 ~ 0.3mm.
6. a kind of high-power LED heat radiating device according to claim 2 is characterized in that: said pedestal (1) is processed for plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201085018U CN202523767U (en) | 2012-03-21 | 2012-03-21 | Big power LED heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201085018U CN202523767U (en) | 2012-03-21 | 2012-03-21 | Big power LED heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202523767U true CN202523767U (en) | 2012-11-07 |
Family
ID=47106698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201085018U Expired - Fee Related CN202523767U (en) | 2012-03-21 | 2012-03-21 | Big power LED heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202523767U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610737A (en) * | 2012-03-21 | 2012-07-25 | 广州市鸿利光电股份有限公司 | Heat-radiating device of high-power LED (Light Emitting Diode) |
| CN102931333A (en) * | 2012-11-08 | 2013-02-13 | 杭州天柱科技有限公司 | White-light light-emitting diode (LED) apparatus using cubic boron nitride film to promote radiation of chips |
| CN113311922A (en) * | 2020-02-26 | 2021-08-27 | 神讯电脑(昆山)有限公司 | Heat dissipation framework |
-
2012
- 2012-03-21 CN CN2012201085018U patent/CN202523767U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610737A (en) * | 2012-03-21 | 2012-07-25 | 广州市鸿利光电股份有限公司 | Heat-radiating device of high-power LED (Light Emitting Diode) |
| CN102931333A (en) * | 2012-11-08 | 2013-02-13 | 杭州天柱科技有限公司 | White-light light-emitting diode (LED) apparatus using cubic boron nitride film to promote radiation of chips |
| CN113311922A (en) * | 2020-02-26 | 2021-08-27 | 神讯电脑(昆山)有限公司 | Heat dissipation framework |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou Patentee before: Guangzhou Hongli Tronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20190321 |