CN203115921U - Structure for heat conduction, heat accumulation and heat dissipation of LED lamp - Google Patents

Structure for heat conduction, heat accumulation and heat dissipation of LED lamp Download PDF

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Publication number
CN203115921U
CN203115921U CN2013201125753U CN201320112575U CN203115921U CN 203115921 U CN203115921 U CN 203115921U CN 2013201125753 U CN2013201125753 U CN 2013201125753U CN 201320112575 U CN201320112575 U CN 201320112575U CN 203115921 U CN203115921 U CN 203115921U
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CN
China
Prior art keywords
heat
led lamp
circuit board
accumulation
dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013201125753U
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Chinese (zh)
Inventor
陈新琪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINYI PHOTOELECTRIC TECHNOLOGY (SHANGHAI) Co Ltd
Original Assignee
JINYI PHOTOELECTRIC TECHNOLOGY (SHANGHAI) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN2013201125753U priority Critical patent/CN203115921U/en
Application granted granted Critical
Publication of CN203115921U publication Critical patent/CN203115921U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a structure for heat conduction, heat accumulation and heat dissipation of an LED lamp. The structure comprises a circuit board connected with an LED light source, a high heat conductive piece is attached to the back face of the circuit board, and a graphite heat absorption and heat accumulation plate is attached to the back face of the high heat conductive piece. The structure for the heat conduction, the heat accumulation and the heat dissipation of the LED lamp is reasonable in structure and good in heat dissipation, and therefore the service life of the LED lamp is guaranteed; heat conductivity of an original circuit board is only 1-3W/M.K, the heat conductivity of the structure can reach more than 1200W/M.K, quick heat conduction can be achieved, heat is absorbed by graphite and the heat accumulation plate, and heat balance can be achieved; and when the temperature in a light source cavity is larger than the temperature of external environment, air dissipation can be achieved through metal shell fins.

Description

Solve the structure of LED lamp heat conducting, accumulation of heat, heat radiation
Technical field
The utility model relates to the structure of a kind of LED of solution lamp heat conducting, accumulation of heat, heat radiation.
Background technology
Existing great power LED light decay mainly is heat, and its weak point is the early ageing of thermic light, and that can not effectively protect led light source should have service life.
Summary of the invention
It is a kind of rational in infrastructure that the purpose of this utility model is to provide, perfect heat-dissipating, thereby the structure of the solution LED lamp heat conducting in protection LED due service life, accumulation of heat, heat radiation.
Technical solution of the present utility model is:
A kind of structure that solves LED lamp heat conducting, accumulation of heat, heat radiation is characterized in that: comprise the circuit board that connects led light source, back of circuit board posts high conducting strip, and graphite heat absorption and heat storage plate is posted at the high conducting strip back side.
The Kong Weiyu graphite heat absorption and heat storage plate of circuit board, the cavity between the lamp casing are formed light-source chamber.
The utility model is rational in infrastructure, perfect heat-dissipating, thus protect due service life of LED; Original circuit board thermal conductivity factor only has 1-3W/M.K, the utility model can realize that thermal conductivity factor is greater than 1200 W/M.K, realize quick conductive, heat is absorbed heat by graphite, heat accumulation plate absorbs and realization thermal balance, when the light source cavity temperature is higher than ambient temperature, by metal shell fin and the diffusing gas of air.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the structural representation of an embodiment of the utility model.
The specific embodiment
A kind of structure that solves LED lamp heat conducting, accumulation of heat, heat radiation comprises the circuit board 2 that connects led light source 1, and back of circuit board posts high conducting strip 3, and graphite heat absorption and heat storage plate 4 is posted at the high conducting strip back side.
The Kong Weiyu graphite heat absorption and heat storage plate of circuit board, the cavity between the lamp casing 5 are formed light-source chamber.
Also have metal shell radiating fin 6, metal tube connector 7, power source cavity 8, metal tube connector 9, electric wire/derivation line 10, metal backup shoe 11, cloche 12 among the figure.

Claims (2)

1. structure that solves LED lamp heat conducting, accumulation of heat, heat radiation, it is characterized in that: comprise the circuit board that connects led light source, back of circuit board posts high conducting strip, and graphite heat absorption and heat storage plate is posted at the high conducting strip back side.
2. the structure of solution LED lamp heat conducting according to claim 1, accumulation of heat, heat radiation is characterized in that: the Kong Weiyu graphite heat absorption and heat storage plate of circuit board, the composition of the cavity between lamp casing light-source chamber.
CN2013201125753U 2013-03-13 2013-03-13 Structure for heat conduction, heat accumulation and heat dissipation of LED lamp Expired - Fee Related CN203115921U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013201125753U CN203115921U (en) 2013-03-13 2013-03-13 Structure for heat conduction, heat accumulation and heat dissipation of LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013201125753U CN203115921U (en) 2013-03-13 2013-03-13 Structure for heat conduction, heat accumulation and heat dissipation of LED lamp

Publications (1)

Publication Number Publication Date
CN203115921U true CN203115921U (en) 2013-08-07

Family

ID=48896260

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013201125753U Expired - Fee Related CN203115921U (en) 2013-03-13 2013-03-13 Structure for heat conduction, heat accumulation and heat dissipation of LED lamp

Country Status (1)

Country Link
CN (1) CN203115921U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105805709A (en) * 2016-05-13 2016-07-27 常州市宏硕电子有限公司 Heat dissipation LED lampshade
CN107864550A (en) * 2017-10-20 2018-03-30 泰州市博泰电子有限公司 One kind is used to be based on the thermally equilibrated circuit board manufacturing method of micro unit
CN109377910A (en) * 2018-12-11 2019-02-22 北京天正伟业广告设计制作有限公司 A kind of novel light-emitting word

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105805709A (en) * 2016-05-13 2016-07-27 常州市宏硕电子有限公司 Heat dissipation LED lampshade
CN107864550A (en) * 2017-10-20 2018-03-30 泰州市博泰电子有限公司 One kind is used to be based on the thermally equilibrated circuit board manufacturing method of micro unit
CN109377910A (en) * 2018-12-11 2019-02-22 北京天正伟业广告设计制作有限公司 A kind of novel light-emitting word

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130807