CN203656874U - Fast cooling structural module - Google Patents

Fast cooling structural module Download PDF

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Publication number
CN203656874U
CN203656874U CN201320870347.2U CN201320870347U CN203656874U CN 203656874 U CN203656874 U CN 203656874U CN 201320870347 U CN201320870347 U CN 201320870347U CN 203656874 U CN203656874 U CN 203656874U
Authority
CN
China
Prior art keywords
light source
led light
hole
heat
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320870347.2U
Other languages
Chinese (zh)
Inventor
林春权
戴利波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU PANASIGN INTELLIGENT OPTOELECTRONICS CO., LTD.
Original Assignee
HANGZHOU PANASIGN PHOTOELECTRIC STANDARD DECORATION CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU PANASIGN PHOTOELECTRIC STANDARD DECORATION CO Ltd filed Critical HANGZHOU PANASIGN PHOTOELECTRIC STANDARD DECORATION CO Ltd
Priority to CN201320870347.2U priority Critical patent/CN203656874U/en
Application granted granted Critical
Publication of CN203656874U publication Critical patent/CN203656874U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a fast cooling structural module. The heat of an LED (light emitting diode) cannot be effectively fast emitted to outside by using a cooling structure, so the junction temperature of an LED light source is overhigh, the light failure is severe, and the service life is short. The fast cooling structural module comprises the LED light source, a PCB (printed circuit board), a heat conduction piece and an aluminum cooling base; a through hole is formed in the PCB by corresponding to the LED light source, a lug on the aluminum cooling base penetrates through the through hole and is attached to a heat conduction layer of the LED light source by the heat conduction piece; the LED light source, the through hole and the lug are coaxially arranged. The utility model designs a brand new cooling structure, the junction temperature of the LED light source is effectively reduced, and the service life of the LED light source is effectively prolonged.

Description

A kind of heat dissipation structure module
Technical field
The utility model belongs to LED product lighting technical field, relates to a kind of heat dissipation structure module.
Background technology
It is that the bead weld of LED lamp is connected on PCB substrate that existing LED module product adopts structure, then pcb board is fixed on heat-dissipating aluminium plate, and heat carries heat-conducting layer by LED and imports substrate into, and substrate heat imports on heat-dissipating aluminium plate.Be limited to pcb board thermal conductivity factor (<2W/ (m.K)), thus such radiator structure can not be fast and effectively LED dissipation of heat in the external world, thereby cause LED light source junction temperature too high, light decay is serious, service life is short.
Summary of the invention
The utility model, for the deficiencies in the prior art, provides a kind of heat dissipation structure module.
The technical scheme that the utility model technical solution problem is taked is:
A kind of heat dissipation structure module, comprise LED light source, pcb board, conducting strip and aluminium radiating seat, on pcb board, corresponding LED light source place has through hole, projection on aluminium radiating seat is through this through hole, and by the heat-conducting layer laminating of conducting strip and LED light source, described LED light source, through hole and projection coaxially arrange.
Described pcb board is positioned on aluminium radiating seat, and both are fixedly connected with.
The beneficial effects of the utility model: designed a kind of brand-new radiator structure, effectively reduced LED light source junction temperature, effectively improved the service life of LED light source.
Accompanying drawing explanation
Fig. 1 is the utility model explosive view.
Fig. 2 is the schematic diagram after the utility model moulding.
The specific embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As depicted in figs. 1 and 2, the utility model comprises LED light source 1, pcb board 2, conducting strip 3 and aluminium radiating seat 4, on pcb board, corresponding LED light source place has through hole, rectangular, projection on aluminium radiating seat is through this through hole, and by the heat-conducting layer laminating of conducting strip and LED light source, the heat that LED light source produces in the time of work can be delivered on aluminium radiating seat in time by conducting strip, LED light source junction temperature heat is effectively reduced, and the LED life-span effectively improves.Described LED light source, through hole and projection coaxially arrange, and are convenient to assembling.Fixed screw 5 is fixed on pcb board on aluminium radiating seat, and wherein aluminium radiating seat adopts one-body molded.

Claims (1)

1. a heat dissipation structure module, comprises LED light source, pcb board, conducting strip and aluminium radiating seat, it is characterized in that:
On pcb board, corresponding LED light source place has through hole, and the projection on aluminium radiating seat is through this through hole, and by the heat-conducting layer laminating of conducting strip and LED light source, described LED light source, through hole and projection coaxially arrange;
Described pcb board is positioned on aluminium radiating seat, and both are fixedly connected with.
CN201320870347.2U 2013-12-26 2013-12-26 Fast cooling structural module Expired - Fee Related CN203656874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320870347.2U CN203656874U (en) 2013-12-26 2013-12-26 Fast cooling structural module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320870347.2U CN203656874U (en) 2013-12-26 2013-12-26 Fast cooling structural module

Publications (1)

Publication Number Publication Date
CN203656874U true CN203656874U (en) 2014-06-18

Family

ID=50923255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320870347.2U Expired - Fee Related CN203656874U (en) 2013-12-26 2013-12-26 Fast cooling structural module

Country Status (1)

Country Link
CN (1) CN203656874U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110536589A (en) * 2019-08-26 2019-12-03 深圳市三旺通信股份有限公司 A kind of radiator structure in PCB design

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110536589A (en) * 2019-08-26 2019-12-03 深圳市三旺通信股份有限公司 A kind of radiator structure in PCB design

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Nangong Qianjiang Economic Development Zone Hangzhou city Zhejiang province 311100 River Road No. 1 Bo Industrial Park

Patentee after: HANGZHOU PANASIGN INTELLIGENT OPTOELECTRONICS CO., LTD.

Address before: Nangong Qianjiang Economic Development Zone Hangzhou city Zhejiang province 311100 River Road No. 1 Bo Industrial Park

Patentee before: Hangzhou Panasign Photoelectric Standard Decoration Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140618

Termination date: 20201226