CN106300003A - A kind of diode-pumped nd yag laser module packaging system - Google Patents
A kind of diode-pumped nd yag laser module packaging system Download PDFInfo
- Publication number
- CN106300003A CN106300003A CN201610970297.3A CN201610970297A CN106300003A CN 106300003 A CN106300003 A CN 106300003A CN 201610970297 A CN201610970297 A CN 201610970297A CN 106300003 A CN106300003 A CN 106300003A
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- China
- Prior art keywords
- diode
- shaped
- pumped
- device entity
- yag laser
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a kind of diode-pumped nd yag laser module packaging system, N number of triangular prism is formed n-shaped device entity by described packaging system, by upper holder block and the lower lock block of taper laterally zygomorphic in take-up device entity, the outside uniform expansion of device entity, compress the outer corresponding N number of diode (led) module of device entity, added solder in the position that N number of diode (led) module has a common boundary and in high temperature furnace, melt solder, after room temperature cooling, remove apparatus module, obtain diode-pumped nd yag laser module.The diode-pumped nd yag laser module packaging system of the present invention improves the distributing homogeneity of diode (led) module on cooler, improve the pumping performance of crystal bar, quick and easy for installation, the most efficiently, improve the safety of diode (led) module, it is achieved that the diode-pumped nd yag laser module encapsulation of relatively small dimension.
Description
Technical field
The invention belongs to semiconductor laser technique field, be specifically related to a kind of diode-pumped nd yag laser module packaging system.
Background technology
Annular pump module is vital ingredient in diode-pumped solid laser system.At annular pump mould
In block, diode (led) module is directly connected to its pumping performance around the uniformity of crystal bar (gain medium) circle distribution.And
Crystal bar and cooler can ensure coaxial by machining, therefore cooler just on tangent plane diode (led) module encapsulate equal
Even property directly affects the pumping performance of module.Early stage diode (led) module encapsulates the most by hand, is primarily present following Railway Project:
(1) heat sink in diode (led) module and potsherd fix insecure, fill solder is difficult；
(2) after welding, solder cannot separate with cooler；
(3) not having diode (led) module safeguard procedures, diode (led) module is easily bruised；
(4) inconvenient operation, packaging efficiency is low；
(5) each diode (led) module discontinuity on cooler so that it is distributing homogeneity cannot ensure；
(6) pump module for relatively small dimension cannot encapsulate by hand.
Currently need the envelope of a kind of pumping diode (led) module and annular pump module cooler (hereinafter referred to as cooler) badly
Assembling device.
Summary of the invention
A technical problem to be solved by this invention is to provide a kind of diode-pumped nd yag laser module packaging system.
The diode-pumped nd yag laser module packaging system of the present invention, is characterized in: this device includes installing pedestal, cooling
Device, lower lock block, device entity, O, silicone rubber pad, upper holder block and long spiro nail, diode (led) module；
Described cooler is placed on the upper surface installing pedestal；
Described device entity is the n-shaped body being made up of N number of identical triangular prism, and cooler inner chamber is for join with device entity
The n-shaped cavity of dress, installs in pedestal and has the n-shaped groove equipped with device entity, n-shaped cavity, n-shaped groove and
The central shaft of n-shaped body overlaps, and n-shaped cavity and n-shaped body have uniform gap L1, n-shaped groove and n-shaped
Uniform gap L2, L1 ＞ L2 is had between body；Having n-shaped boss in n-shaped groove, the height of n-shaped boss is more than positive N
The height of limit shape groove, n-shaped boss is inserted upwardly into the gap L1 between n-shaped cavity and n-shaped body；N≥5；
The inner chamber of described device entity is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, and upper holder block is to be equipped with upper conical chamber
Circular cone, lower lock block is the circular cone equipped with inferior pyramidal chamber, runs through and have vertical long spiro nail between upper holder block and lower lock block,
Tighten long spiro nail, upper holder block and lower lock block the most close；
The lower end of described lower lock block is cylinder, and installing base bottom has the location hole through with n-shaped groove, lower lock block
Cylinder is equipped with hole, location, after the cylinder of lower lock block sinks to position hole, and the lower surface of device entity and n-shaped boss
The EDGE CONTACT of upper surface；
Symmetrical above and below winding O of the outer surface of described device entity, the outer surface of each triangular prism of device entity
The identical silicone rubber pad of the symmetrical thickness in horizontally and vertically direction, the vertically symmetrical center of the outer surface of each triangular prism is stayed
There is gap.
The described material installing pedestal is oxygen-free copper.
The linear groove of vertical direction is carved with at the vertically symmetrical center of each triangular prism outer surface of described device entity.
Described gap L1 and gap L2, meets 2 mm≤L1-L2≤4 mm.
The diode-pumped nd yag laser module packaging system of the present invention improves being evenly distributed of diode (led) module on cooler
Property, improve the pumping performance of crystal bar, quick and easy for installation, the most efficiently, improve the safety of diode (led) module, it is achieved
The diode-pumped nd yag laser module encapsulation of relatively small dimension.The diode-pumped nd yag laser module packaging system of the present invention is suitable for half
Use during conductor Laser module making.
Accompanying drawing explanation
Fig. 1 is the diode-pumped nd yag laser module packaging system front view of the present invention；
Fig. 2 is the diode-pumped nd yag laser module packaging system top view of the present invention；
In figure, pedestal 2. cooler 3. lower lock block 4. device entity 5.O type circle 6. silicone rubber pad 7. upper holder block is 1. installed
8. long spiro nail 9. diode (led) module.
Detailed description of the invention
The present invention is described in detail below in conjunction with the accompanying drawings with embodiment.
Following example are merely to illustrate the present invention, and not limitation of the present invention.Relevant person skilled in the art exists
In the case of the spirit and scope of the present invention, it is also possible to make a variety of changes, replace and modification, the most equal technology
Scheme falls within scope of the invention.
As shown in Figure 1, 2, the diode-pumped nd yag laser module packaging system of the present invention include install pedestal 1, cooler 2,
Lower lock block 3, device entity 4, O 5, silicone rubber pad 6, upper holder block 7 and long spiro nail 8, diode (led) module 9；
Described cooler 2 is placed on the upper surface installing pedestal 1；
Described device entity 4 is the n-shaped body being made up of N number of identical triangular prism, and cooler 2 inner chamber is and device entity
4 equipped n-shaped cavitys, have in installing pedestal 1 and the equipped n-shaped groove of device entity 4, n-shaped cavity, positive N limit
The central shaft of shape groove and n-shaped body overlaps, and n-shaped cavity and n-shaped body have a uniform gap L1, n-shaped groove with
Uniform gap L2, L1 ＞ L2 is had between n-shaped body；N-shaped boss, the height of n-shaped boss is had in n-shaped groove
More than the height of n-shaped groove, n-shaped boss is inserted upwardly into the gap L1 between n-shaped cavity and n-shaped body；N≥5；
The inner chamber of described device entity 4 is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, and upper holder block 7 is for join with upper conical chamber
The circular cone of dress, lower lock block 3 is the circular cone equipped with inferior pyramidal chamber, runs through and have vertical length between upper holder block 7 and lower lock block 3
Screw 8, tightens long spiro nail 8, upper holder block 7 and lower lock block 3 the most close；
The lower end of described lower lock block 3 is cylinder, installs and has the location hole through with n-shaped groove, lower lock block bottom pedestal 1
The cylinder of 3 is equipped with hole, location, after the cylinder of lower lock block 3 sinks to position hole, and the lower surface of device entity 4 and n-shaped
The EDGE CONTACT of the upper surface of boss；
Symmetrical above and below winding O 5 of the outer surface of described device entity 4, the appearance of each triangular prism of device entity 4
The silicone rubber pad 6 that the symmetrical thickness in horizontally and vertically direction in face is identical, the outer surface of each triangular prism vertically symmetrical in
The heart leaves gap.
The described material installing pedestal 1 is oxygen-free copper.
The linear groove of vertical direction is carved with at the vertically symmetrical center of each triangular prism outer surface of described device entity 4.
Described gap L1 and gap L2, meets 2 mm≤L1-L2≤4 mm.
Embodiment 1
Cooler 2 is arranged on the upper surface installing pedestal 1 by 1a.；
Device entity 4 is bundled into a regular pentagon body, N=5 by 1b. O 5；
Upper holder block 7 and lower lock block 3 are arranged in the inner chamber of device entity 4 by 1c., then by tightening long spiro nail 8, device is real
Body 4, upper holder block 7 and lower lock block 3 are fixed into an apparatus module；
Apparatus module is vertically penetrated cooler 2 and installs pedestal 1 by 1d., the cylinder of lower lock block 3 lower end and installation pedestal 1 end
Equipped location, the hole, location in portion, gap L1 and gap L2, meet L1-L2=2mm；
5 diode (led) modules 9 are individually positioned in the upper surface of the regular pentagon boss of correspondence by 1e.；
It is the most close that 1f. continues to tighten long spiro nail 8, upper holder block 7 and lower lock block 3, by 5 identical three of component devices entity 4
Prism is outwards pushed, until each triangular prism correspondence compresses corresponding diode (led) module 9, forms a diode assembly；
1g. adds solder in the position that 5 diode (led) modules 9 have a common boundary, and solder is indium；
Diode assembly is put into high temperature furnace by 1h., raises high temperature furnace furnace temperature, until indium melts；
1i. takes out diode assembly, after room temperature cooling, removes apparatus module, obtains pentagon diode-pumped nd yag laser module.
Embodiment 2
Embodiment 2 is essentially identical with the embodiment of embodiment 1, differs primarily in that N=7, L1-L2=2.5mm, obtains heptagon
Diode-pumped nd yag laser module.
Embodiment 3
Embodiment 3 is essentially identical with the embodiment of embodiment 1, differs primarily in that N=9, L1-L2=3mm, obtains nonagon two
Tube pump Pu, pole laser module.
Embodiment 4
Embodiment 4 is essentially identical with the embodiment of embodiment 1, differs primarily in that N=11, L1-L2=3mm, obtains ten
Shape diode-pumped nd yag laser module.
Claims (4)
1. a diode-pumped nd yag laser module packaging system, it is characterised in that: this device includes installing pedestal (1), cooler
(2), lower lock block (3), device entity (4), O (5), silicone rubber pad (6), upper holder block (7) and long spiro nail (8), diode die
Block (9)；
Described cooler (2) is placed on the upper surface installing pedestal (1)；
Described device entity (4) is the n-shaped body being made up of N number of identical triangular prism, and cooler (2) inner chamber is and device
The n-shaped cavity that entity (4) is equipped, has the n-shaped groove equipped with device entity (4), n-shaped in installing pedestal (1)
The central shaft of cavity, n-shaped groove and n-shaped body overlaps, and n-shaped cavity and n-shaped body have uniform gap L1, just
Uniform gap L2, L1 ＞ L2 is had between N limit shape groove and n-shaped body；N-shaped boss, n-shaped is had in n-shaped groove
The height of boss is more than the height of n-shaped groove, and n-shaped boss is inserted upwardly into the seam between n-shaped cavity and n-shaped body
Gap L1；N≥5；
The inner chamber of described device entity (4) is laterally zygomorphic upper conical chamber and inferior pyramidal chamber, and upper holder block (7) is with upper conical
The circular cone that chamber is equipped, lower lock block (3) is the circular cone equipped with inferior pyramidal chamber, runs through between upper holder block (7) and lower lock block (3)
There is vertical long spiro nail (8), tighten long spiro nail (8), upper holder block (7) and lower lock block (3) the most close；
The lower end of described lower lock block (3) is cylinder, and installing pedestal (1) bottom has the location hole through with n-shaped groove, under
The cylinder of briquetting (3) is equipped with hole, location, after the cylinder of lower lock block (3) sinks to position hole, and the lower surface of device entity (4)
EDGE CONTACT with the upper surface of n-shaped boss；
Symmetrical above and below winding O (5) of the outer surface of described device entity (4), each triangular prism of device entity (4)
The identical silicone rubber pad (6) of the symmetrical thickness in horizontally and vertically direction of outer surface, the outer surface of each triangular prism perpendicular
Straight symmetrical centre leaves gap.
Diode-pumped nd yag laser module packaging system the most according to claim 1, it is characterised in that: described installation pedestal
(1) material is oxygen-free copper.
Diode-pumped nd yag laser module packaging system the most according to claim 1, it is characterised in that: described device entity
(4) linear groove of vertical direction is carved with at the vertically symmetrical center of each triangular prism outer surface.
Diode-pumped nd yag laser module packaging system the most according to claim 1, it is characterised in that: described gap L1 and
Gap L2, meets 2 mm≤L1-L2≤3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970297.3A CN106300003B (en) | 2016-11-07 | 2016-11-07 | Diode pumping laser module packaging hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970297.3A CN106300003B (en) | 2016-11-07 | 2016-11-07 | Diode pumping laser module packaging hardware |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106300003A true CN106300003A (en) | 2017-01-04 |
| CN106300003B CN106300003B (en) | 2023-04-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610970297.3A Active CN106300003B (en) | 2016-11-07 | 2016-11-07 | Diode pumping laser module packaging hardware |
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| CN (1) | CN106300003B (en) |
Citations (7)
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|---|---|---|---|---|
| CN201821000U (en) * | 2010-09-27 | 2011-05-04 | 苏州光格设备有限公司 | High-power laser diode horizontal line array pump solid state laser cavity |
| US20120044967A1 (en) * | 2010-02-23 | 2012-02-23 | Seagate Technology Llc | Capping Method For Laser Diode Protection |
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| CN103779782A (en) * | 2014-01-08 | 2014-05-07 | 中国工程物理研究院应用电子学研究所 | High average power diode pumping laser module and preparation method thereof |
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2016
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| US20120044967A1 (en) * | 2010-02-23 | 2012-02-23 | Seagate Technology Llc | Capping Method For Laser Diode Protection |
| CN201821000U (en) * | 2010-09-27 | 2011-05-04 | 苏州光格设备有限公司 | High-power laser diode horizontal line array pump solid state laser cavity |
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| CN103915751A (en) * | 2013-01-05 | 2014-07-09 | 中国科学院光电研究院 | Semiconductor laser side pump module |
| CN103457151A (en) * | 2013-08-08 | 2013-12-18 | 中国科学院苏州生物医学工程技术研究所 | High-temperature hard solder quasi-continuous semiconductor laser bar stack encapsulating method |
| CN103779782A (en) * | 2014-01-08 | 2014-05-07 | 中国工程物理研究院应用电子学研究所 | High average power diode pumping laser module and preparation method thereof |
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| CN106300003B (en) | 2023-04-07 |
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