CN107799457A - A kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load - Google Patents
A kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load Download PDFInfo
- Publication number
- CN107799457A CN107799457A CN201711316870.XA CN201711316870A CN107799457A CN 107799457 A CN107799457 A CN 107799457A CN 201711316870 A CN201711316870 A CN 201711316870A CN 107799457 A CN107799457 A CN 107799457A
- Authority
- CN
- China
- Prior art keywords
- briquetting
- high accuracy
- hybrid circuit
- component
- limit clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005496 eutectics Effects 0.000 title claims abstract description 18
- 238000005245 sintering Methods 0.000 title claims abstract description 15
- 230000037431 insertion Effects 0.000 claims abstract 2
- 238000003780 insertion Methods 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/8084—Sintering
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Constitution Of High-Frequency Heating (AREA)
Abstract
The invention discloses a kind of eutectic for being used to realize microwave hybrid circuit high accuracy load to sinter fixture, it includes shell, the limit clamp for placing component is provided with shell, limit clamp top is provided with stationary fixture, insertion is provided with multiple through holes on stationary fixture, matching is provided with the briquetting being inserted into through hole, and briquetting is pressed on component by through hole.The limit clamp of the present invention, for fixing the position of component；Briquetting, for applying certain pressure to component；Stationary fixture, for fixing briquetting；The present invention can realize high-precision load, and load precision reaches ± 50um；It can realize that all components disposably complete eutectic sintering in shell, improve production efficiency simultaneously, it also avoid component thermal stress caused by undergoing multiple high temp and fail.Which solve microwave hybrid circuit high accuracy load and improve production efficiency, for Microwave Power Tubes it is highly integrated, minimize provide good solution.
Description
Technical field
The present invention relates to eutectic Plant fragment field in microwave hybrid circuit, is specially that one kind is used to realize Microwave Hybrid electricity
The eutectic sintering fixture of road high accuracy load.
Background technology
Microwave hybrid circuit is widely used in communication system and radar system.The encapsulation court of microwave current hybrid circuit
Highly integrated, trend toward miniaturization development, so requires to integrate more devices, mesh on small a shell or substrate
The preceding situation for being directed to super multicomponent device in microwave hybrid circuit generally uses full-automatic loader load, but its production efficiency is very
Low, full-automatic loader can ensure high accuracy but production efficiency is low, and thus exploitation can realize high-precision load again
The eutectic sintering fixture that production efficiency can be improved seems particularly significant, also turns into a big technical barrier in the industry.
The content of the invention
In order to overcome above mentioned problem, the present invention provides a kind of eutectic for being used to realize microwave hybrid circuit high accuracy load and burnt
Tie fixture.
The technical scheme is that provide a kind of eutectic sintering clip for being used to realize microwave hybrid circuit high accuracy load
Tool, it includes shell, it is characterised in that：The limit clamp for placing component, the position limiting clamp are provided with the shell
Tool top is provided with stationary fixture, is penetrated on the stationary fixture and is provided with multiple through holes, matching is provided with the through hole
The briquetting being inserted into, the briquetting are pressed on component by the through hole.
Further, the shell includes base and is arranged at the connector of the middle of the base, in the connector
A groove is offered, the limit clamp is arranged in the groove.
Further, multiple storage tanks for being used to place component are provided with the limit clamp.
Further, the stationary fixture is arranged in the groove and positioned at the top of the limit clamp.
Further, the through hole is arranged to cylindric, and the briquetting matching is arranged to cylindric.
Further, the bottom of the briquetting includes the pressure head of a taper.
The beneficial effects of the invention are as follows：The present invention is provided with limit clamp, stationary fixture and briquetting, limit clamp, is used for
Fixed component（Including chip, electric capacity, inductance etc.）Position；Briquetting, for applying certain pressure to component；Geometrical clamp
Tool, for fixing briquetting；The present invention can realize high-precision load, and load precision reaches ± 50um；Shell can be realized simultaneously
Interior all components disposably complete eutectic sintering, improve production efficiency, it also avoid component because experience multiple high temp is made
Into thermal stress failure.Which solve microwave hybrid circuit high accuracy load and improve production efficiency, be that Microwave Power Tubes are high
Integrated, miniaturization provides good solution.
Brief description of the drawings
Fig. 1 is the side structure schematic diagram of the present invention；
Fig. 2 is the top surface dimensional structure diagram of the limit clamp of the present invention；
Fig. 3 is the top surface structure schematic diagram of the stationary fixture of the present invention；
Fig. 4 is the side structure schematic diagram of the briquetting of the present invention.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Specific embodiment is closed, the present invention is expanded on further.
As shown in Figures 1 to 4, a kind of eutectic sintering clip for being used to realize microwave hybrid circuit high accuracy load of the invention
Tool, it includes shell 1, and the limit clamp 2 for placing component is provided with shell 1, multiple appearances are provided with limit clamp 2
Put groove 21 to be used to place component, the top of limit clamp 2 is provided with stationary fixture 3, penetrates on stationary fixture 3 and be provided with multiple lead to
Hole 31, through hole 31 are arranged to cylindric, and matching is provided with the briquetting 4 being inserted into through hole 31, and the matching of briquetting 4 is arranged to round
Column, the bottom of briquetting 4 include the pressure head 41 of a taper, and briquetting 4 is stretched into stationary fixture 3 by through hole 31, and pressure head 41
It is pressed on component.
Shell 1 includes base 11 and is arranged at the connector 12 at the middle part of base 11, and a groove is offered in connector 12
13, limit clamp 2 is arranged in groove 13, and stationary fixture 3 is arranged in groove 13 and positioned at the top of limit clamp 2.
The present invention is provided with limit clamp 2, stationary fixture 3 and briquetting 4, limit clamp 2, for fixing component（Including
Chip, electric capacity, inductance etc.）Position；Briquetting 4, for applying certain pressure to component；Stationary fixture 3, pressed for fixed
Block 4；The present invention can realize high-precision load, and load precision reaches ± 50um；All components in shell 1 can be realized simultaneously
It is disposable to complete eutectic sintering, production efficiency is improved, component thermal stress caused by undergoing multiple high temp is it also avoid and loses
Effect.Which solve microwave hybrid circuit high accuracy load and improve production efficiency, be that Microwave Power Tubes are highly integrated, minimize
Provide good solution.
In practical operation, first limit clamp 2 is placed in shell 1, then by all components according to assembling drawing according to
In the secondary storage tank 21 for being placed on limit clamp 2；Then stationary fixture 3 is placed in shell 1, briquetting 4 is passed through into stationary fixture 3
Through hole 31 is pressed in the clamping work that component is completed on component.
A kind of above example only present invention embodiment therein, its description is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection model of the present invention
Enclose.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load, it includes shell, it is characterised in that：
The limit clamp for placing component is provided with the shell, the limit clamp top is provided with stationary fixture, described
Insertion is provided with multiple through holes on stationary fixture, matches the briquetting for being provided with and being inserted into the through hole, the briquetting leads to
The through hole is crossed to be pressed on component.
2. a kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load according to claim 1, its
It is characterised by：The shell includes base and is arranged at the connector of the middle of the base, and one is offered in the connector
Groove, the limit clamp are arranged in the groove.
3. a kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load according to claim 1 or 2,
It is characterized in that：Multiple storage tanks for being used to place component are provided with the limit clamp.
4. a kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load according to claim 2, its
It is characterised by：The stationary fixture is arranged in the groove and positioned at the top of the limit clamp.
5. a kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load according to claim 1, its
It is characterised by：The through hole is arranged to cylindric, and the briquetting matching is arranged to cylindric.
6. a kind of eutectic sintering fixture for being used to realize microwave hybrid circuit high accuracy load according to claim 1 or 5,
It is characterized in that：The bottom of the briquetting includes the pressure head of a taper, and the pressure head pushes down component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316870.XA CN107799457B (en) | 2017-12-12 | 2017-12-12 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316870.XA CN107799457B (en) | 2017-12-12 | 2017-12-12 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107799457A true CN107799457A (en) | 2018-03-13 |
| CN107799457B CN107799457B (en) | 2024-05-24 |
Family
ID=61537703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711316870.XA Active CN107799457B (en) | 2017-12-12 | 2017-12-12 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107799457B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326857A (en) * | 2018-10-29 | 2019-02-12 | 摩比天线技术（深圳）有限公司 | Cavity body filter assembly technology |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202003965U (en) * | 2011-02-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Rejects cutting-off fixture |
| CN102931123A (en) * | 2011-08-12 | 2013-02-13 | 英飞凌科技股份有限公司 | Fixing semiconductor die in dry and pressure supported assembly processes |
| CN202855725U (en) * | 2012-07-23 | 2013-04-03 | 深圳市祥承业科技开发有限公司 | Eutectic machine ceramic support clamp |
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN204720420U (en) * | 2015-06-30 | 2015-10-21 | 西安机电研究所 | Heavy radiator for thyristors fixture |
| CN205194681U (en) * | 2015-11-16 | 2016-04-27 | 桐乡市中辰化纤有限公司 | Silk car chip supporter |
| CN105789071A (en) * | 2016-03-29 | 2016-07-20 | 中国电子科技集团公司第二十九研究所 | Device used for realizing microwave chip eutectic pressurization and pressurization method |
| CN207558775U (en) * | 2017-12-12 | 2018-06-29 | 江苏博普电子科技有限责任公司 | A kind of eutectic sintering fixture for being used to implement microwave hybrid circuit high-precision load |
-
2017
- 2017-12-12 CN CN201711316870.XA patent/CN107799457B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202003965U (en) * | 2011-02-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Rejects cutting-off fixture |
| CN102931123A (en) * | 2011-08-12 | 2013-02-13 | 英飞凌科技股份有限公司 | Fixing semiconductor die in dry and pressure supported assembly processes |
| CN202855725U (en) * | 2012-07-23 | 2013-04-03 | 深圳市祥承业科技开发有限公司 | Eutectic machine ceramic support clamp |
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN204720420U (en) * | 2015-06-30 | 2015-10-21 | 西安机电研究所 | Heavy radiator for thyristors fixture |
| CN205194681U (en) * | 2015-11-16 | 2016-04-27 | 桐乡市中辰化纤有限公司 | Silk car chip supporter |
| CN105789071A (en) * | 2016-03-29 | 2016-07-20 | 中国电子科技集团公司第二十九研究所 | Device used for realizing microwave chip eutectic pressurization and pressurization method |
| CN207558775U (en) * | 2017-12-12 | 2018-06-29 | 江苏博普电子科技有限责任公司 | A kind of eutectic sintering fixture for being used to implement microwave hybrid circuit high-precision load |
Non-Patent Citations (1)
| Title |
|---|
| 黄得梅;: "焙烧多功能机组双联夹具的结构及常见问题分析", 有色矿冶, no. 01 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326857A (en) * | 2018-10-29 | 2019-02-12 | 摩比天线技术（深圳）有限公司 | Cavity body filter assembly technology |
| CN109326857B (en) * | 2018-10-29 | 2020-10-09 | 摩比天线技术（深圳）有限公司 | Cavity filter assembly process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107799457B (en) | 2024-05-24 |
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