CN210516717U

CN210516717U - Stacked packaged integrated circuit device

Info

Publication number: CN210516717U
Application number: CN201921170192.5U
Authority: CN
Inventors: 黄焕杰
Original assignee: Shanghai Jiayi Electronic Technology Co Ltd
Current assignee: Shanghai Jiayi Electronic Technology Co Ltd
Priority date: 2019-07-24
Filing date: 2019-07-24
Publication date: 2020-05-12
Anticipated expiration: 2029-07-24

Abstract

The utility model discloses a stack type packaged integrated circuit device, the structure of which comprises a stack chip, a resistor, an integrated circuit, a transistor, a circuit board, a screen divider, a pin, a diode, a metal sheet, a crystal oscillator, a capacitor and a controller, wherein the metal sheet is arranged below the stack chip, the lower surface of the resistor is welded on the circuit board, the integrated circuit is electrically connected with the circuit board, the lower surface of the transistor is attached on the circuit board, the screen divider is arranged at the left lower part of the stack chip, the upper surface of the pin is arranged below the circuit board, the diode is electrically connected with the circuit board, the lower part of the metal sheet is connected with the upper part of the circuit board, the crystal oscillator is arranged at the left upper part of the metal sheet, the lower part of the capacitor is arranged on the circuit board, the controller is electrically connected with the circuit board, and the right, the stacking chip is structurally arranged, so that the stacking connection is simple and easy to disassemble, and the lead between the chip and the chip is not easy to break.

Description

Stacked packaged integrated circuit device

Technical Field

The utility model relates to a heap encapsulation integrated circuit device belongs to the integrated circuit field.

Background

An integrated circuit is a miniature electronic device or component, and the components and wiring of transistor, resistor, capacitor and inductor required in a circuit are interconnected together by a certain process, and then are made into a small piece or several small pieces of semiconductor wafers or medium substrates, and then are packaged in a package to form a miniature structure with the required circuit function.

The connectivity of this prior art stack is weak, however, resulting in a chip-to-chip wire break.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heap encapsulation integrated circuit device to the connectivity that solves prior art and piles up is weak, leads to the problem that the wire between chip and the chip is easily interrupted.

In order to achieve the above purpose, the present invention is realized by the following technical solution: a stack-type packaged integrated circuit device comprises a stack chip, a resistor, an integrated circuit, a transistor, a circuit board, a screen divider, pins, a diode, a metal sheet, a crystal oscillator, a capacitor and a controller, wherein the metal sheet is arranged below the stack chip, the lower surface of the resistor is welded on the circuit board, the integrated circuit is electrically connected with the circuit board, the lower surface of the transistor is attached to the circuit board, the screen divider is arranged at the lower left of the stack chip, the upper surface of the pins is arranged below the circuit board, the diode is electrically connected with the circuit board, the lower part of the metal sheet is connected with the upper part of the circuit board, the crystal oscillator is arranged at the upper left of the metal sheet, the lower part of the capacitor is arranged on the circuit board, the controller is electrically connected with the circuit board, the controller is arranged at the right side of the capacitor, and the stack chip is electrically, the stacked chip is composed of a plurality of connecting strips, a first conducting strip, a second conducting strip, a chip main body and clamping grooves, the chip main body is provided with a plurality of connecting strips, the connecting strips penetrate through the plurality of chip main bodies, the chip main body and the clamping grooves are of an integrated structure, the first conducting strip is fixedly installed at the upper end of the chip main body, and the second conducting strip is fixedly installed at the lower end of the chip main body.

Further, the resistor is of a cuboid structure, and the length of the integrated circuit is 1 cm.

Further, the lower surface of the screen splitter is welded on the circuit board.

Furthermore, the inner surface of the clamping groove is provided with a semicircular lug, and two sides of the connecting strip are provided with semicircular grooves.

Furthermore, the bottom of the first conducting strip is triangular, the second conducting strip is M-shaped, and the diameter of the first conducting strip is larger than the diameter of the opening of the second conducting strip.

Furthermore, the connecting strip is made of PCV materials and has toughness and elasticity.

Furthermore, the first conducting strip and the second conducting strip are made of copper materials, and have good conducting performance.

Has the advantages that: through piling up the chip four corners and respectively being equipped with the draw-in groove, use the connecting strip to block downwards to the draw-in groove on the chip on the semicircle lug, make its fixture block and draw-in groove looks gomphosis, the opening that the first conducting strip in the chip main part inserted the second conducting strip goes out, make its interference fit, utilize first conducting strip and second conducting strip as the wire of being connected, the one-level conveying, make every chip main part can both receive, it piles up the chip to have set up on its structure, make its connection that piles up simple also quick detachable, make the difficult interrupt of wire between chip and the chip.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural diagram of a stacked package integrated circuit device according to the present invention;

fig. 2 is a schematic diagram of a connection cross-sectional structure of stacked chips of a stacked package integrated circuit device according to the present invention.

In the figure: the device comprises a stacked chip-1, a resistor-2, an integrated circuit-3, a transistor-4, a circuit board-5, a screen divider-6, a pin-7, a diode-8, a metal sheet-9, a crystal oscillator-10, a capacitor-11, a controller-12, a connecting strip-101, a first conducting strip-102, a second conducting strip-103, a chip body-104 and a card slot-105.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1 and 2, the present invention provides a stacked package integrated circuit device, comprising: the structure of the device comprises a stacked chip 1, a resistor 2, an integrated circuit 3, a transistor 4, a circuit board 5, a screen divider 6, a pin 7, a diode 8, a metal sheet 9, a crystal oscillator 10, a capacitor 11 and a controller 12, wherein the metal sheet 9 is arranged below the stacked chip 1, the lower surface of the resistor 2 is welded on the circuit board 5, the integrated circuit 3 is electrically connected with the circuit board 5, the lower surface of the transistor 4 is attached on the circuit board 5, the screen divider 6 is arranged at the lower left of the stacked chip 1, the upper surface of the pin 7 is arranged below the circuit board 5, the diode 8 is electrically connected with the circuit board 5, the lower part of the metal sheet 9 is connected with the upper part of the circuit board 5, the crystal oscillator 10 is arranged at the upper left of the metal sheet 9, the lower part of the capacitor 11 is arranged on the circuit board 5, and the controller 12 is electrically connected with the, the right side of the capacitor 11 is provided with a controller 12, the stacked chip 1 is electrically connected with the integrated circuit 3, the stacked chip 1 is composed of a connecting strip 101, a first conducting strip 102, a second conducting strip 103, a chip main body 104 and a clamping groove 105, the chip main body 104 is provided with a plurality of connecting strips 101, the connecting strip 101 penetrates through the plurality of chip main bodies 104, the chip main body 104 and the clamping groove 105 are of an integrated structure, the first conducting strip 102 is fixedly installed at the upper end of the chip main body 104, the second conducting strip 103 is fixedly installed at the lower end of the chip main body 104, the resistor is of a cuboid structure, the length of the integrated circuit is 1cm, the lower surface of the screen divider is welded on a circuit board, the inner surface of the clamping groove 105 is provided with a semicircular lug, semicircular grooves are formed in two sides of the connecting strip 101, the bottom of the first conducting strip 102 is of a, the diameter of the first conductive sheet 102 is larger than the diameter of the opening of the second conductive sheet 103, the connecting strip 101 is made of PCV material and has toughness and elasticity, and the first conductive sheet 102 and the second conductive sheet 103 are made of copper material and have good conductive performance.

The resistor 2 is generally and directly called as a resistor in daily life, and the controller 12 refers to a master device for controlling the starting, speed regulation, braking and reversing of the motor by changing the wiring of a main circuit or a control circuit and changing the resistance value in the circuit according to a preset sequence.

For example, four corners of the stacked chip 1 are respectively provided with a slot 105, the connecting strip 101 is used to be clamped downwards onto a semicircular bump in the slot 105 on the chip 104, so that the clamping block of the connecting strip is embedded with the slot, the first conductive sheet 102 on the chip body 104 is inserted into an opening of the second conductive sheet 103 to be in interference fit, and the first conductive sheet 102 and the second conductive sheet 103 are used as connecting wires to be transmitted in a primary transmission mode, so that each chip body 104 can receive the connecting wires.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A stack-packaged integrated circuit device, comprising: the structure of the circuit comprises a stacked chip (1), a resistor (2), an integrated circuit (3), a transistor (4), a circuit board (5), a screen divider (6), pins (7), a diode (8), a metal sheet (9), a crystal oscillator (10), a capacitor (11) and a controller (12), wherein the metal sheet (9) is arranged below the stacked chip (1), the lower surface of the resistor (2) is welded on the circuit board (5), the integrated circuit (3) is electrically connected with the circuit board (5), the lower surface of the transistor (4) is attached to the circuit board (5), the screen divider (6) is arranged below the left of the stacked chip (1), the upper surface of the pin (7) is arranged below the circuit board (5), the diode (8) is electrically connected with the circuit board (5), the lower part of the metal sheet (9) is connected with the upper part of the circuit board (5), a crystal oscillator (10) is arranged at the left upper part of the metal sheet (9), the lower part of the capacitor (11) is arranged on the circuit board (5), the controller (12) is electrically connected with the circuit board (5), the controller (12) is arranged on the right side of the capacitor (11), the stacked chip (1) is electrically connected with the integrated circuit (3), the stacked chip (1) is composed of a connecting bar (101), a first conducting strip (102), a second conducting strip (103), a chip main body (104) and a clamping groove (105), the chip main body (104) is provided with a plurality of grooves, and the connecting strips (101) penetrate through the plurality of chip bodies (104), the chip main body (104) and the clamping groove (105) are of an integrated structure, the first conducting strip (102) is fixedly arranged at the upper end of the chip main body (104), the second conducting strip (103) is fixedly arranged at the lower end of the chip main body (104).

2. The package on package integrated circuit device of claim 1, wherein: the resistor (2) is of a cuboid structure, and the length of the integrated circuit (3) is 1 cm.

3. The package on package integrated circuit device of claim 1, wherein: the lower surface of the screen splitter (6) is welded on the circuit board (5).

4. The package on package integrated circuit device of claim 1, wherein: the inner surface of the clamping groove (105) is provided with a semicircular lug, and two sides of the connecting strip (101) are provided with semicircular grooves.

5. The package on package integrated circuit device of claim 1, wherein: the bottom of the first conducting strip (102) is triangular, the second conducting strip (103) is M-shaped, and the diameter of the first conducting strip (102) is larger than that of the opening of the second conducting strip (103).