CN102788945A - Universal power semiconductor module fixture - Google Patents
Universal power semiconductor module fixture Download PDFInfo
- Publication number
- CN102788945A CN102788945A CN2012102520726A CN201210252072A CN102788945A CN 102788945 A CN102788945 A CN 102788945A CN 2012102520726 A CN2012102520726 A CN 2012102520726A CN 201210252072 A CN201210252072 A CN 201210252072A CN 102788945 A CN102788945 A CN 102788945A
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- slide rail
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Abstract
A universal power semiconductor module fixture comprises a pressure fixture capable of adjusting a pressing position and a height, and a heat sink. The pressure fixture comprises a pedestal (1), a sliding rail set (3) installed on the pedestal (1) and a sliding block set (4) installed on the sliding rail set (3). The heat sink is an independent liquid cooling plate (5) with a liquid passage; and the liquid cooling plate (5) is arranged on a bottom plate (11) of the pressure fixture, or is a bottom plate (110) of the pressure fixture, which is integrated with the liquid passage.
Description
Technical field
The present invention relates to a kind of universal fixturing, particularly be used for the anchor clamps of the power semiconductor modular thermo-resistance measurement of different size.
Background technology
The thermal resistance of power semiconductor modular is the important indicator of its performance parameter, the heat-sinking capability of representation module.Thermal resistance is a key factor that needs consideration in the modular structure design.Measure thermal resistance accurately and important significance is arranged improving module package and heat dissipation design.
At present, thermal resistance measurement method to the semiconductor devices of single heat dissipation path has been proposed among the up-to-date JEDEC standard JESD-51-14.Use this method of testing that power semiconductor modular is tested, require module to fit tightly and apply certain snap-in force with radiating bottom plate and contact good with assurance.Classic method adopts bolt directly to fix or use general presser type hold down gag.If use bolt directly to be fixed on module on the radiating bottom plate through the module mounting hole; Need on the radiating bottom plate relevant position, beat threaded hole; Yet because the packing forms of power semiconductor modular is different; The relative position of its mounting hole of different module is different with the number in hole, and promptly almost each module all needs radiating bottom plate to be provided with position, corresponding hole to match with it, adopts thisly to compress the design that mode can make radiating bottom plate and become very loaded down with trivial details.Especially be the situation of liquid cooling plate for radiating bottom plate, the position in hole needs when satisfying cooperation are avoided the fluid water channel, more increase its difficulty of design and complicacy.And for general presser type hold down gag; Pressing plate directly is pressed in the upper surface of device or module; Cause this device only the module of flat encapsulation to be suitable for, and the electrode terminal of many power semiconductor modulars is positioned at upper surface, vertical with pressing plate; Can't adopt pressing plate directly to compress, so such hold down gag versatility is relatively limited.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art versatility difference, propose a kind of power semiconductor modular universal fixturing.The present invention can provide snap-in force and heat dissipation channel in the power semiconductor modular test process, and is applicable to the thermo-resistance measurement of the power semiconductor modular of different packing forms.
For achieving the above object, the present invention adopts following technical scheme to be achieved:
The present invention includes the pressing jig and the heat abstractor of tight position of scalable and height.
Said pressing jig by pedestal, be installed in the slide rail set on this pedestal, the slide block group that is installed on the slide rail set is formed.
Said pedestal roughly takes the shape of the letter U, and comprises base plate, perpendicular to base plate and be positioned at first side plate of base plate one side, and perpendicular to base plate and be positioned at second side plate of base plate opposite side.On first side plate and second side plate vertical slide rail is installed, vertically the two ends of slide rail all are equipped with caging bolt.
Said slide rail set comprises a brace summer, first slide block and second slide block, a horizontal slide rail.Wherein, two slide blocks are fixed in the below at the two ends of brace summer, and laterally slide rail is installed on the top of brace summer, and the distance between two slide blocks equates that with the distance of two vertical slide rails in the pedestal two slide blocks are installed in respectively on two vertical slide rails.
Said slide block group comprises the 3rd slide block, fixed mount and fastening bolt, and wherein, the fixed mount below is equipped with the 3rd slide block, and the slide block group is installed in through the 3rd slide block on the horizontal slide rail of slide rail set, can laterally laterally slide on the slide rail.Have threaded hole on the fixed mount, fastening bolt is installed through this threaded hole is vertical with fixed mount.The end of fastening bolt is processed as taper; Through twisting fastening bolt clockwise or counterclockwise, can realize moving up and down of fastening bolt.
Anchor clamps of the present invention can comprise two groups and the above slide rail set, and two groups and the above slide rail set can be installed on the slide rail set.
Said heat abstractor is the liquid cooling plate of independently carrying liqs passage, and described liquid cooling plate is positioned on the base plate of pressing jig, and the liquid cooling plate comprises a liquid-inlet and a liquid outlet, and liquid-inlet is connected the outer loop cooling system with liquid outlet; Also can be in the base plate of pressing jig integrated fluid passage.Both sides have some counter sinks on the base plate, use the bolt and first side plate and second side plate to be fixed together.Said base plate comprises a liquid-inlet and a liquid outlet, and liquid-inlet is connected the outer loop cooling system with liquid outlet.
The characteristic that the present invention is different from prior art is:
1, the mode of using bolt to compress ensures that module well contacts with radiating bottom plate in the power semiconductor modular test, makes the thermo-resistance measurement result more accurate;
2, bolt end design can make the bolt central axis overlap with the mounting hole center of circle, guarantees that bolt and base plate remain relative position in the process that bolt is tightened, and has stopped horizontal play, and enough snap-in forces are provided;
3, adopt the unique slide rail and the structure of slide block, but can make fixed range adjustable continuously on horizontal, vertical and height, satisfy the testing requirement of the power semiconductor modular of different packing forms, improved versatility and ease for use.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention one;
Fig. 2 is the front schematic view of the embodiment of the invention one;
Fig. 3 is the embodiment of the invention one a liquid cooling plate synoptic diagram;
Fig. 4 is the front schematic view of the embodiment of the invention two;
Fig. 5 is the base plate synoptic diagram of the embodiment of the invention two carrying liqs passages.
Embodiment
Further specify the present invention below in conjunction with accompanying drawing and embodiment.
As shown in Figure 1, the present invention includes tight position of scalable and pressing jig and heat abstractor highly.
Said pressing jig by pedestal 1, be installed in the slide rail set 3 on this pedestal 1, the slide block group 4 that is installed on the slide rail set 3 is formed.
Said pedestal 1 roughly takes the shape of the letter U, comprising base plate 11, perpendicular to base plate 11 and be positioned at first side plate 12 of base plate 11 1 sides, perpendicular to base plate 11 and be positioned at second side plate 13 of base plate 11 opposite sides.Be equipped with on first side plate 12 on vertical slide rail 14, the second side plates 15 vertical slide rail 15 is installed.Vertically the two ends of slide rail 14 are equipped with caging bolt 16,17, and vertically the two ends of slide rail 15 are equipped with caging bolt 18,19, are used to stop that slide rail set 3 skids off vertical slide rail.
Said slide rail set 3 comprises a brace summer 33, first slide block 31 and second slide block 32, a horizontal slide rail 34.Wherein, First slide block 31, second slide block 32 are fixed in the below at the two ends of brace summer 33; Laterally slide rail 34 is installed on the top of brace summer 33, and the distance in the distance between two slide blocks 31 and 32 and the pedestal 1 between two vertical slide rails 14 and 15 equates, and first slide block 31 and second slide block 32 are installed in respectively on first vertical slide rail 14 and the second vertical slide rail 15; Make slide rail set 3 to realize longitudinal sliding motion along first vertical slide rail 14 and second vertical slide rail 15.
Said slide block group 4 comprises the 3rd slide block 41, fixed mount 42 and fastening bolt 43.Wherein, fixed mount 42 belows are equipped with the 3rd slide block 41, and slide block group 4 is installed in through the 3rd slide block 41 on the horizontal slide rail 34 of slide rail set 3, can laterally laterally slide on the slide rail 34.Have the threaded hole that is at least M8 on the fixed mount 42, fastening bolt 43 is installed through this threaded hole is vertical with fixed mount.The end 44 of fastening bolt 43 is processed as taper; Through twisting fastening bolt 43 clockwise or counterclockwise, can realize moving up and down of fastening bolt 43.
Anchor clamps of the present invention can comprise two groups and the above slide rail set 3, and two groups and the above slide rail set 4 can be installed on the slide rail set 3.
Said heat abstractor can be the liquid cooling plate 5 of independently carrying liqs passage as shown in Figure 3; Liquid cooling plate 5 is positioned on the base plate 11 of pressing jig; Liquid cooling plate 5 comprises a liquid-inlet 51 and a liquid outlet 52, and liquid-inlet 51 is connected the outer loop cooling system with liquid outlet 52; Said heat abstractor also can be the base plate 110 of the pressing jig that is integrated with fluid passage as shown in Figure 5, and both sides have some counter sinks 1104 on the base plate 110, uses the bolt and first side plate 12 and second side plate 13 to be fixed together.Base plate 110 comprises a liquid-inlet 1101 and a liquid outlet 1102, and liquid-inlet 1101 is connected the outer loop cooling system with liquid outlet 1102.
Embodiment one
Present embodiment is applicable to and uses the independently test of liquid cooling plate.
As shown in Figure 2, liquid cooling plate 5 is placed on the base plate 11, and power semiconductor modular 2 coated on bottom side to be measured are wiped with heat-conducting silicone grease, are placed on the liquid cooling plate 5.The position of slip slide rail set 3 is adjusted the position of slide block group 4 then, guarantees that fastening bolt 43 is vertical with the mounting hole 21 of power semiconductor modular 2 to be measured.Twist fastening bolt 43, make fastening bolt 43 move down perpendicular to power semiconductor modular 2 to be measured, the tapered end 44 of fastening bolt 43 gets into the mounting hole 21 of semi-conductor power module 2 to be measured; Because its conical design, its maximum gauge is greater than the aperture of mounting hole 21, and minimum diameter is less than the aperture of mounting hole 21; In the process of tightening fastening bolt 43; Can guarantee that the bolt central axis overlaps with the mounting hole center of circle, stop horizontal play, and enough snap-in forces are provided.Its excess-three fastening bolt compress the operation consistent with foregoing description.
As shown in Figure 3; Liquid cooling plate 5 comprises a liquid-inlet 51 and a liquid outlet 52, and liquid-inlet 51 is communicated with fluid passage 53 with liquid outlet 52, and fluid passage 53 is " S " type at the liquid cooling intralamellar part; Liquid-inlet 51 links to each other with the outer loop cooling system with liquid outlet 52; Cooling liquid such as monoethylene glycol, mineral wet goods flow into through fluid passage 53 from liquid-inlet 51, flow out from liquid outlet 52 at last.
During measurement; The pressure of four fastening bolts makes the bottom surface of power semiconductor modular 2 closely contact with liquid cooling plate 5; The heat that power semiconductor modular 2 after powering up produces transmits downwards, imports in the liquid cooling plate 5 through heat-conducting silicone grease, owing to circulating of cooling liquid; Take away the heat of generation, guarantee that the heat radiation border is constant.
Embodiment two
Present embodiment is applicable to and do not use independent liquid cooling plate, in the test of the direct integrated fluid passage of base plate of anchor clamps.
As shown in Figure 4, the power semiconductor modular to be measured 2 that coated on bottom side is wiped with heat-conducting silicone grease is placed on the base plate 110 that is integrated with fluid passage.The position of slip slide rail set 3 is adjusted the position of slide block group 4 then, guarantees that fastening bolt 43 is vertical with the mounting hole 21 of power semiconductor modular 2 to be measured.Twist fastening bolt 43, make fastening bolt 43 move down perpendicular to power semiconductor modular 2 to be measured, the tapered end 44 of fastening bolt 43 gets into the mounting hole 21 of semi-conductor power module 2 to be measured; Because its conical design, its maximum gauge is greater than the aperture of mounting hole 21, and minimum diameter is less than the aperture of mounting hole 21; In the process of tightening fastening bolt 43; Slide block can receive the uneven horizontal tension of bolt and move before and after on slide rail, but it is static finally can to move to the place, equilibrium position, thereby guarantees that the bolt central axis overlaps with the mounting hole center of circle automatically; Stopped horizontal play, and enough snap-in forces are provided.Its excess-three fastening bolt compress the operation consistent with foregoing description.
As shown in Figure 5; The base plate 110 that is integrated with fluid passage comprises a liquid-inlet 1101 and a liquid outlet 1102, and liquid-inlet 1101 is communicated with fluid passage 1103 with liquid outlet 1102, and fluid passage is " S " type in base plate 110 inside; Liquid-inlet 1101 links to each other with the outer loop cooling system with liquid outlet 1102; Cooling liquid such as monoethylene glycol, mineral oil flow into through fluid passage 1103 from liquid-inlet 1101, flow out from liquid outlet 1102 at last.Both sides have some counter sinks 1104 on the base plate 110, use the bolt and first side plate 12 and second side plate 13 to be fixed together.
During measurement; The pressure of fastening bolt makes the bottom surface of power semiconductor modular 2 closely contact with base plate 110; The heat that power semiconductor modular 2 after powering up produces transmits downwards, imports in the base plate 110 through heat-conducting silicone grease, owing to circulating of cooling liquid; Take away the heat of generation, guarantee that the heat radiation border is constant.
Claims (6)
1. a power semiconductor modular universal fixturing is characterized in that, described universal fixturing comprises the pressing jig and the heat abstractor of tight position of scalable and height; Said pressing jig by pedestal (1), be installed in the slide rail set (3) on the said pedestal (1) and the slide block group (4) that is installed on the slide rail set (3) is formed; Said pedestal (1) takes the shape of the letter U, and first side plate (12) and second side plate (13) be perpendicular to base plate (11), and lays respectively at the both sides of said base plate (11); Vertical slide rail (14) is installed on first side plate (12), vertical slide rail (15) is installed on second side plate (13), vertically the two ends of slide rail (14) respectively are equipped with a caging bolt (16,17); Vertically the two ends of slide rail (15) respectively are equipped with a caging bolt (18,19); Described slide rail set (3) comprises a brace summer (33), slide block (31,32) and horizontal slide rail (34); First slide block (31) and second slide block (32) are individually fixed in the below at brace summer (33) two ends; Laterally slide rail (34) is installed on the top of brace summer (33), and the distance between two slide blocks (31,32) equates with distance between two described vertical slide rails (14,15); First slide block (31) is installed on first vertical slide rail (14), and second slide block (32) is installed on second vertical slide rail (15), and slide rail set (3) is along first vertical slide rail (14) and second vertical slide rail (15) longitudinal sliding motion; Described slide block group (4) comprises the 3rd slide block (41), fixed mount (42) and fastening bolt (43); The below of fixed mount (42) is equipped with the 3rd slide block (41); Slide block group (4) is installed in through the 3rd slide block (41) on the horizontal slide rail (34) of slide rail set (3), and slide block group (4) is in laterally upward laterally slip of slide rail (34); Fixed mount has threaded hole on (42), and fastening bolt (43) is through this threaded hole and the vertical installation of fixed mount (42);
Said heat abstractor is the liquid cooling plate (5) of independently carrying liqs passage, and liquid cooling plate (5) is positioned on the base plate (11) of pressing jig.
2. according to the described power semiconductor modular universal fixturing of claim 1; It is characterized in that; Described heat abstractor is the base plate (110) that is integrated with the pressing jig of fluid passage; The both sides of base plate (110) have counter sink, are fixed together through bolt and described first side plate (12) and second side plate (13).
3. according to the described power semiconductor modular universal fixturing of claim 2; It is characterized in that; Described base plate (110) has a liquid-inlet (1101) and a liquid outlet (1102); Liquid-inlet (1101) is communicated with fluid passage (1103) with liquid outlet (1102), and fluid passage (1103) is " S " type in base plate (110) inside, and liquid-inlet (1102) is connected the outer loop cooling system with liquid outlet (1102); Cooling liquid flows into from liquid-inlet (1101), flows out from liquid outlet (1102) through fluid passage (1103).
4. according to the described power semiconductor modular universal fixturing of claim 1; It is characterized in that; Described liquid cooling plate (5) has a liquid-inlet (51) and a liquid outlet (52); Liquid-inlet (51) and liquid outlet (52) are communicated with fluid passage (53), and fluid passage (53) is " S " type in liquid cooling plate (5) inside, and liquid-inlet (51) is connected the outer loop cooling system with liquid outlet (52); Cooling liquid flows into through fluid passage (53) from liquid-inlet (51), flows out from liquid outlet (52).
5. according to the described power semiconductor modular universal fixturing of claim 1, it is characterized in that the end (44) of described fastening bolt (43) is processed as taper.
6. according to the described power semiconductor modular universal fixturing of claim 1, it is characterized in that described universal fixturing comprises two groups of the above slide rail set (3), slide rail set (3) goes up installs two groups of above said slide rail set (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102520726A CN102788945A (en) | 2012-07-19 | 2012-07-19 | Universal power semiconductor module fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102520726A CN102788945A (en) | 2012-07-19 | 2012-07-19 | Universal power semiconductor module fixture |
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| Publication Number | Publication Date |
|---|---|
| CN102788945A true CN102788945A (en) | 2012-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102520726A Pending CN102788945A (en) | 2012-07-19 | 2012-07-19 | Universal power semiconductor module fixture |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102944706A (en) * | 2012-11-29 | 2013-02-27 | 西安电力电子技术研究所 | Adaptive power semiconductor module reliability test testing clamp |
| CN103675622A (en) * | 2013-12-04 | 2014-03-26 | 株洲南车时代电气股份有限公司 | Device and method for testing partial discharge of IGBT module |
| CN103852707A (en) * | 2014-03-04 | 2014-06-11 | 中国科学院电工研究所 | Power semiconductor chip testing tool |
| CN104647239A (en) * | 2013-11-22 | 2015-05-27 | 珠海格力电器股份有限公司 | Key life test sample fixing fixture |
| CN105118791A (en) * | 2015-09-18 | 2015-12-02 | 西安派瑞功率半导体变流技术有限公司 | Directly-inserted power semiconductor module test clamp |
| CN106323870A (en) * | 2015-06-24 | 2017-01-11 | 哈尔滨飞机工业集团有限责任公司 | Test clamp for adhesive non-uniform tearing tests |
| CN107167722A (en) * | 2016-03-08 | 2017-09-15 | 大唐移动通信设备有限公司 | A kind of instrument detecting tool platform and instrument detection device |
| CN109581175A (en) * | 2018-12-04 | 2019-04-05 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN110676238A (en) * | 2019-09-24 | 2020-01-10 | 安徽国晶微电子有限公司 | Integrated circuit packaging shell |
| CN117438367A (en) * | 2023-10-25 | 2024-01-23 | 江苏派沃福半导体科技有限公司 | Clamp and method for packaging semiconductor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102944706A (en) * | 2012-11-29 | 2013-02-27 | 西安电力电子技术研究所 | Adaptive power semiconductor module reliability test testing clamp |
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| CN106323870A (en) * | 2015-06-24 | 2017-01-11 | 哈尔滨飞机工业集团有限责任公司 | Test clamp for adhesive non-uniform tearing tests |
| CN105118791A (en) * | 2015-09-18 | 2015-12-02 | 西安派瑞功率半导体变流技术有限公司 | Directly-inserted power semiconductor module test clamp |
| CN105118791B (en) * | 2015-09-18 | 2018-04-10 | 西安派瑞功率半导体变流技术股份有限公司 | Direct insertion power semiconductor modular test fixture |
| CN107167722A (en) * | 2016-03-08 | 2017-09-15 | 大唐移动通信设备有限公司 | A kind of instrument detecting tool platform and instrument detection device |
| CN109581175A (en) * | 2018-12-04 | 2019-04-05 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN110676238A (en) * | 2019-09-24 | 2020-01-10 | 安徽国晶微电子有限公司 | Integrated circuit packaging shell |
| CN110676238B (en) * | 2019-09-24 | 2021-03-19 | 安徽国晶微电子有限公司 | Integrated circuit packaging shell |
| CN117438367A (en) * | 2023-10-25 | 2024-01-23 | 江苏派沃福半导体科技有限公司 | Clamp and method for packaging semiconductor chip |
| CN117438367B (en) * | 2023-10-25 | 2024-05-17 | 深圳市宏能微电子有限公司 | Clamp and method for packaging semiconductor chip |
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Application publication date: 20121121 |