CN207007473U - Semiconductor laser fiber coupling module test system - Google Patents

Semiconductor laser fiber coupling module test system Download PDF

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Publication number
CN207007473U
CN207007473U CN201720743517.9U CN201720743517U CN207007473U CN 207007473 U CN207007473 U CN 207007473U CN 201720743517 U CN201720743517 U CN 201720743517U CN 207007473 U CN207007473 U CN 207007473U
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China
Prior art keywords
fiber coupling
semiconductor laser
coupling module
test system
laser fiber
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CN201720743517.9U
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Chinese (zh)
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胡海
李成鹏
王泰山
李国泉
刘文斌
方继林
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SHENZHEN POKONG ELECTRONICS Ltd
Tsinghua University
Shenzhen Research Institute Tsinghua University
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SHENZHEN POKONG ELECTRONICS Ltd
Shenzhen Research Institute Tsinghua University
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Abstract

The utility model discloses a kind of semiconductor laser fiber coupling module test system, wherein, test system includes:Semiconductor laser fiber coupling module;Drive current source, it is connected with semiconductor laser fiber coupling module, and drive current source is provided with power supply overshoot protection;Measurement jig, it is arranged at below semiconductor laser fiber coupling module;Data acquisition module, coupled with semiconductor laser fiber coupling module, the running parameter for noise spectra of semiconductor lasers fiber coupling module carries out data acquisition;Processing module is calculated, divides drive current source and the data acquisition module to couple, the running parameter of control and noise spectra of semiconductor lasers fiber coupling module feeds back in real time with the progress that closes in test to the drive current source.By the above-mentioned means, the utility model can greatly improve testing efficiency, and with the advantages that simple in construction, cost is cheap, easy to operate.

Description

Semiconductor laser fiber coupling module test system
Technical field
This newly belongs to semiconductor laser optical fiber coupling module testing field with new, more particularly to a kind of semiconductor laser Device fiber coupling module test system.
Background technology
High-power semiconductor laser optical fiber coupling device is because of its power output height, long lifespan, high conversion efficiency, small volume etc. Advantage and be widely applied to the fields such as industry, national defence, medical treatment, light-pumped solid state laser, be the research of current laser technology field Focus.
Semiconductor laser, especially high-power semiconductor laser, the stability of its working condition, is directly affected State security and the use in field.No matter therefore develop and develop semiconductor laser optical fiber coupling module comprehensive performance testing system All there is particularly important meaning for R&D institution, production firm, using client.
Measurement jig to the power supply of laser fiber coupling module is an important step of test system, and it requires power supply system The stabilization of system, this is the precondition and guarantee that non-destructive testing is carried out to laser fiber coupling module.Existing laser fiber coupled mode , Railway Project be present in block measurement jig:Manual operation short time consumption is grown, and the mode for making to be screwed has pressure imbalance, Duplicate measurements low precision, the defects of causing module to damage, radiating effect is poor, and power test is inaccurate under high current.
The content of the invention
The utility model provides a kind of semiconductor laser fiber coupling module test system, can solve the problem that in the prior art Poorly efficient time-consuming, the uneven fragile laser fiber coupling module of screw fastening pressure of manual operation and the poor skill of radiating effect Art problem.
The utility model use a technical scheme be:A kind of semiconductor laser fiber coupling module test system is provided System, the test system include:Semiconductor laser fiber coupling module;Drive current source, with the semiconductor laser light Fine coupling module connection, and the drive current source is provided with power supply overshoot protection, for for the semiconductor laser optical fiber Coupling module provides operating current, and the luminous power and voltage of the test semiconductor laser fiber coupling module;Test Tool, for carrying the semiconductor laser fiber coupling module, the measurement jig has flatness and thermal conductivity;Data Acquisition module, coupled with the semiconductor laser fiber coupling module, for the semiconductor laser fiber coupling mould The running parameter of block carries out data acquisition;Calculate processing module, respectively with the drive current source and the data acquisition module Coupling, to close progress control in real time and to the semiconductor laser fiber coupling to the drive current source in test The running parameter of module is fed back.
The beneficial effects of the utility model are:A kind of semiconductor laser fiber coupling module test system is provided, passed through Measurement jig is set in semiconductor laser fiber coupling module test system, can solve the problem that manual operation is poorly efficient in the prior art Take, the technical problem that the uneven fragile laser fiber coupling module of screw fastening pressure and radiating effect are poor.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the utility model semiconductor laser fiber coupling module test system one Figure;
Fig. 2 is the structural representation of the embodiment of the utility model measurement jig one;
Fig. 3 is the structural representation of the embodiment of the utility model data acquisition module one.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, Fig. 1 is the utility model semiconductor laser fiber coupling module test system.Test system bag Include:Semiconductor laser fiber coupling module 11, drive current source 12, measurement jig 13, data acquisition module 14 and calculating Processing module 15.
Wherein, semiconductor laser fiber coupling module 11.
Wherein, drive current source 12, it is connected with semiconductor laser fiber coupling module 11, for for semiconductor laser Fiber coupling module test system provides the injection of operating current.In this application, the drive current source 12 can be selected and can compiled Journey power supply, and the drive current source 12 is provided with power supply overshoot protection, and the unlatching electricity of the drive current source 12 is set inside it Source overshoot is no more than 100mA.In this way, can be prevented when electric power starting because overshoot phenomenon and by semiconductor laser Other devices of the grade of fiber coupling module 11 are burnt out.
Measurement jig 13, the lower section of semiconductor laser fiber coupling module 11 is arranged at, for carrying the semiconductor laser Device fiber coupling module 11.Also referring to Fig. 2, Fig. 2 is the structural representation of the embodiment of the utility model measurement jig one.
The measurement jig further comprises:Including radiating microscope carrier and compressing unit, wherein, radiating microscope carrier is used to carry laser Fiber coupling module, and liquid cooling type radiation is carried out to the laser fiber coupling module in test;Compressing unit is used for bullet Property compress mode by the laser fiber coupling module be pressed on it is described radiating microscope carrier on so that tested.
Wherein, radiating microscope carrier further comprises:Substrate 110, insulating barrier pad 120, tank 130 and heat-dissipating metal sheet 140.
Wherein, substrate 110 can be supported to predetermined altitude by flat board and riser and tested with providing a stable support bearing Platform.
Insulating barrier pad 120 on the substrate 110 with by the part on substrate 110 and substrate 110 be dielectrically separated from Leaked electricity when preventing to electrical testing.
For tank 130 on the insulating barrier pad 120, tank 130 can use the preferable material of thermal conductivity factor, such as aluminium to close Golden material etc.;Heat-dissipating metal sheet 140 is on the tank 130, for carrying the lower surface of laser fiber coupling module, radiating The working face of metallic plate 140 is designed with strict flatness so that laser fiber coupling module bottom surface can fully contact with it, dissipate Thermometal plate 140 is used to heat shed in time in laser module test process, there is provided good heat dissipation environment, its size can be with Changed accordingly according to the size of disparate modules.
Wherein, the radiating microscope carrier of the application also includes semiconductor chilling plate 150, and the semiconductor chilling plate 150 is located at institute State between tank 130 and the heat-dissipating metal sheet 140, can be real by circulating water plus semiconductor refrigerating two level temperature control mode Now large-scale temperature accuracy control, the laser fiber coupling module test in the case of different temperatures can be met.
Further, the radiating microscope carrier also includes:Water inlet water pipe a and water outlet water pipe b.And water inlet pipe a, outlet pipe b with Tank 130 forms fluid circuit.
In the embodiment of the application one, compressing unit includes fixed mechanism, sliding equipment, controlling organization and elastic machine Structure.
Wherein, fixed mechanism is used for other mechanisms fixed installation for providing compressing unit, sliding equipment and fixed mechanism phase Xiang Gu, controlling organization is mutually fixed with fixed mechanism and coordinates with sliding equipment activity;Elastic mechanism is connected with controlling organization, with Lifted in the presence of controlling organization.
Specifically, the fixed mechanism includes support bar 210, crossbeam block 220 and L-type support plate 230.
Wherein, support bar 210 is fixed with the phase of substrate 110;Crossbeam block 220 is fixed on the support bar 210;L-type support plate 230 one side is fixed on the crossbeam block 220.
The sliding equipment includes slide rail installing plate 240, rail plate 250 and sliding block 260.
Wherein, slide rail installing plate 240 is fixed on the outer face of the crossbeam block 220;Rail plate 250 is fixed on the cunning The outer surface of rail installing plate 240 is simultaneously vertically arranged;Sliding block 260 is slidably matched with the rail plate 250.
The controlling organization includes quick clip 270 and connecting plate 280.
Wherein, quick clip 270 is fixed on the crossbeam block 220, and the quick clip 270 is mainly used to quickly compress list Member is lifted or pushed, and can not rebounded with self-locking when pushing.Connecting plate 280 is installed on the quick clip 270, and connecting plate 280 is in Contraband shape, intermediate portion are fixed with the sliding phase of sliding block 260, and two cephalic pleurites are connected with quick clip 270 and spring supporting block 290 respectively.
The elastic mechanism includes spring supporting block 290, telescopic spring plate 300, spring guiding bar 310, spring 320, silicon Glue cushion installing plate 330 and flexible silicon rubber cushion 340.
Wherein, spring supporting block 290 is connected to the bottom of the connecting plate 280, and specifically, spring supporting block 290 is also in Contraband shape, one block of side plate of in-between plate and connecting plate 280 are mutually fixed;Telescopic spring plate 300 is consolidated with the phase of spring supporting block 290 Fixed, specifically, telescopic spring plate 300 is fixedly connected on the end of the biside plate of spring supporting block 290;Spring guiding bar 310 One end is arranged on the telescopic spring plate 300, and the spring guiding bar 310 includes the body of rod and end cap, the body of rod and telescopic spring plate 300 wear and by holding cap spacing;Spring 320 is sheathed in the guiding bar 310 of spring 320;Silica gel cushion installing plate 330 connects The other end of the spring guiding bar 310 is connected to, the spring 320 is located at the expansion plate 300 of spring 320 and the silica gel is soft Between pad installing plate 330;Flexible silicon rubber cushion 340 is fixed on the lower surface of the silica gel cushion installing plate 330, is pushed down for elasticity The upper surface of the laser fiber coupling module, flexible silicon rubber cushion 340 are one piece, using the moderate material of heat resistance and elasticity Material, it is ensured that laser fiber coupling module fully contacts with heat-radiating substrate so that laser fiber coupling module is in test process In can preferably radiate.
During using the test provided by the utility model for semiconductor laser optical fiber coupling module measurement jig, first with Quick clip 270 lifts elastic mechanism, and laser fiber coupling module to be measured then is placed on into heat-dissipating metal sheet 140 manually In, finally elastic mechanism is pushed using quick clip 270 so that property silicagel pad 340 is pressed on laser fiber coupled mode to be measured On block.
Further, data acquisition module 14, coupled with semiconductor laser fiber coupling module 11, for semiconductor The running parameter of laser fiber coupling module 11 carries out data acquisition.It is specifically as follows and characterizes the semiconductor laser optical fiber coupling Close the collection of the parameter of modular character, the collection of such as LIV (light intensity-current-voltage) characteristics and spectral characteristic data.
Also referring to Fig. 3, Fig. 3 is the structural representation of the embodiment of the utility model data acquisition module one.The number Further comprise according to acquisition module 14:Integrating sphere 141, spectrometer 142 and amplifier 143.
Integrating sphere 141 connects semiconductor laser fiber coupling module 11.Wherein, integrating sphere 141 is to semiconductor laser A kind of high efficiency device that the laser that device fiber coupling module 11 is sent is collected, also known as light lead to ball, are one hollow Complete spherical shell.Inwall coating white diffusing reflection layer (barium sulfate), and the diffusion of ball inwall each point is uniform.Light source any point on ball wall Illuminance illuminance caused by multiple reflections light caused by upper is formed by stacking.The integrating sphere 141 allows by laser, and It is close in the photodiode detector on integrating sphere 141.
Spectrometer 142, first end connect 141 integrating spheres, and the connection of the second end calculates processing module 15.Wherein, the spectrometer 142 be micro spectrometer, and for exploring laser light spectrum, and its spectroscopic data is gathered by calculating processing module 15, its test scope The spectrometer of different-waveband scope can be matched according to the difference of semiconductor laser optic module.
Amplifier 143 is photodiode amplifier, and 143 amplifier one end connection integrating sphere 141, other end connection is driven Streaming current source 11.Wherein, the electric current that the amplifier 143 is used to detect the photodiode detector on integrating sphere 141 is believed Number data signal is converted to, by the voltage tester port of drive current source 12, by the gathered data of calculating processing module 15.
Calculate processing module 15, coupled respectively with 11 drive current sources and data acquisition module 14, with test when to drive The running parameter of control and noise spectra of semiconductor lasers fiber coupling module 11 is fed back in real time for the progress that closes in streaming current source 11.
Wherein, the calculating processing module 15 can further include industrial control computer and display (not shown), should Calculate processing module 15 and control remaining module by coordinating, the data collected are handled, analyze, calculated, including half The LIV characteristics and spectral characteristic of conductor laser fiber coupling module, show finally by data drawing list mode.
In addition, the semiconductor laser fiber coupling module test system can also include conductor temperature controller 16。
The connecting test tool 13 of conductor temperature controller 16, is monitored with the real time temperature to measurement jig 13. Wherein, conductor temperature controller 16 specifically carries out implementation prison to the temperature of the semiconductor chilling plate 150 in measurement jig 13 Survey.And the operating temperature of conductor temperature controller 16 can arbitrarily be set, the bound model of its operating temperature in this application Enclose and could be arranged to 0-80 DEG C, can also be other temperature ranges in other embodiments, the application is not specifically limited.And In concrete application, if being alarmed when the super upper limit of operating temperature or lower limit it.In order to obtain more preferable precision, the linearity and steady Fixed degree, the conductor temperature controller 16 that the application uses are grasped for standard PT1000 temperature sensors (RTD) by board Make software and monitor temperature in real time, open and close.In other embodiments, other types of temperature sensor can also be used, The application is not specifically limited.
Alternatively, the semiconductor laser fiber coupling module test system can also include Switching Power Supply 17, the switch Power supply 17 connects conductor temperature controller 16, and electric current is provided for the conductor temperature controller 16.
Alternatively, the semiconductor laser fiber coupling module test system can also include cooling-water machine 18, the cooling-water machine 18 are connected with the tank 130 in measurement jig 13.And the cooling-water machine 18 is used to provide circulating water, takes away waste heat, ensures The board of measurement jig 11 is in the temperature constant state of the setting of conductor temperature controller 16.
In the embodiment of the application one, semiconductor laser optical fiber coupling module 11 is placed on measurement jig 13, using quick Folder is compressed, and the Injection Current of drive current source 12 makes semiconductor laser optical fiber coupling module 11 work, semiconductor laser optical fiber Coupling module 11 produces substantial amounts of heat in test process, and the heat of this part can be timely by the He of semiconductor chilling plate 150 Cooling-water machine 18 form two level refrigeration system taken away by tank 130, semiconductor refrigerating electrical equipment and the two level of cooling-water machine 18 refrigeration Method can ensure that the temperature stabilization of heat-dissipating metal sheet 140 is reliable.Computer processing module 15 is realized and driven by USB interface Current source 12, conductor temperature controller 16, spectrometer 142 complete effective control and monitoring.System sets multiple important prisons Survey index, including coupling module measurement jig temperature, driving current, voltage, the integrating sphere time of integration and spectrometer test waves Section etc., can integrate the running status for embodying whole semiconductor laser optical fiber coupling module test system.And drive current source 12 In be provided with power supply overshoot protection, set the power-on overshoot of the drive current source 12 to be no more than 100mA inside it.Such as This, can be prevented when electric power starting because overshoot phenomenon and by other devices of the grade of semiconductor laser fiber coupling module 11 Part is burnt out.
In above-mentioned embodiment, by setting overcurrent protection in drive current source, because of electricity when can prevent electric power starting The phenomenon for flowing through punching and burning out semiconductor laser fiber coupling module.And the measurement jig described in the present embodiment can be real The now uniform pressure to laser fiber coupling module and electric current injection, enter to large-power semiconductor laser fiber coupling module Row non-destructive testing.Simple operations straight up and down can complete the loading of laser fiber coupling module, it is possible to provide stable electric current Injection, testing efficiency is greatly improved, and with the advantages that simple in construction, cost is cheap, easy to operate.
In summary, skilled addressee readily understands that provided by the utility model be used for semiconductor laser optical fiber coupling Matched moulds block measurement jig can realize uniform pressure and the electric current injection to laser fiber coupling module, to large-power semiconductor Laser fiber coupling module carries out non-destructive testing.Simple operations straight up and down can complete the dress of laser fiber coupling module Carry, it is possible to provide stable electric current injection, greatly improve testing efficiency, and with simple in construction, cost is cheap, easy to operate etc. Advantage.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is all It is the equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or directly or indirectly uses In other related technical areas, similarly it is included in scope of patent protection of the present utility model.

Claims (10)

1. a kind of semiconductor laser fiber coupling module test system, it is characterised in that the test system includes:
Semiconductor laser fiber coupling module;
Drive current source, it is connected with the semiconductor laser fiber coupling module, the drive current source is provided with power supply mistake Punching protection, for providing operating current, and the test semiconductor laser for the semiconductor laser fiber coupling module The luminous power and voltage of device fiber coupling module;
Measurement jig, be arranged at below the semiconductor laser fiber coupling module, the measurement jig have flatness and Thermal conductivity;
Data acquisition module, coupled with the semiconductor laser fiber coupling module, for the semiconductor laser light The running parameter of fine coupling module carries out data acquisition;
Calculate processing module, coupled respectively with the drive current source and the data acquisition module, with test to described Closing for drive current source carries out control in real time and the running parameter progress to the semiconductor laser fiber coupling module instead Feedback.
2. test system according to claim 1, it is characterised in that the drive current source is programmable power supply.
3. test system according to claim 1, it is characterised in that the measurement jig further comprises:
Radiate base wad, for placing the semiconductor laser fiber coupling module, and in test to the semiconductor laser Device fiber coupling module carries out liquid cooling type radiation;
Compressing unit, for the semiconductor laser fiber coupling module to be pressed on into radiating microscope carrier in a manner of elastic compression And then tested.
4. test system according to claim 3, it is characterised in that the radiating microscope carrier includes:
Substrate;
Insulating barrier pad, on the substrate;
Tank, on the insulating barrier pad;
Heat-dissipating metal sheet, on the tank, for carrying the lower surface of the semiconductor laser fiber coupling module.
5. test system according to claim 4, it is characterised in that the radiating microscope carrier also includes semiconductor chilling plate, The semiconductor chilling plate, between the tank and the heat-dissipating metal sheet.
6. test system according to claim 3, it is characterised in that the compressing unit includes:
Fixed mechanism;
Sliding equipment, it is mutually solid with the fixed mechanism;
Controlling organization, mutually fix with the fixed mechanism and coordinate with sliding equipment activity;
Elastic mechanism, it is connected with the controlling organization, to be lifted in the presence of the controlling organization.
7. test system according to claim 1, it is characterised in that the test system further comprises conductor temperature Controller, the conductor temperature controller are connected the measurement jig, supervised with the real time temperature to the measurement jig Survey.
8. test system according to claim 1, it is characterised in that the test system further comprises Switching Power Supply, The Switching Power Supply connects conductor temperature controller.
9. test system according to claim 1, it is characterised in that the data acquisition module further comprises:
Integrating sphere, the integrating sphere connects the semiconductor laser fiber coupling module, for testing the semiconductor laser The luminous power of device fiber coupling module;
Spectrometer, the spectrometer first end connect the integrating sphere, and the second end connects the calculating processing module;
Amplifier, described amplifier one end connect the integrating sphere, and the other end connects the drive current source.
10. test system according to claim 1, it is characterised in that the measurement jig further comprises cooling-water machine, institute Cooling-water machine is stated to be connected with the tank in the measurement jig.
CN201720743517.9U 2017-06-22 2017-06-22 Semiconductor laser fiber coupling module test system Active CN207007473U (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109708848A (en) * 2019-02-19 2019-05-03 深圳市杰普特光电股份有限公司 Test fixture and board
CN110657951A (en) * 2019-10-07 2020-01-07 深圳妙格投资控股集团有限公司 Laser diode focal length and spectrum testing device
CN114859479A (en) * 2022-04-27 2022-08-05 深圳市骏生科技有限公司 Device for coupling optical chip and tail fiber and coupling process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109708848A (en) * 2019-02-19 2019-05-03 深圳市杰普特光电股份有限公司 Test fixture and board
CN110657951A (en) * 2019-10-07 2020-01-07 深圳妙格投资控股集团有限公司 Laser diode focal length and spectrum testing device
CN110657951B (en) * 2019-10-07 2021-04-27 深圳妙格投资控股集团有限公司 Laser diode focal length and spectrum testing device
CN114859479A (en) * 2022-04-27 2022-08-05 深圳市骏生科技有限公司 Device for coupling optical chip and tail fiber and coupling process

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