CN205749852U - Quasiconductor cooling aging equipment for the large-power LED light bead of LM-80 standard - Google Patents
Quasiconductor cooling aging equipment for the large-power LED light bead of LM-80 standard Download PDFInfo
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- CN205749852U CN205749852U CN201620416746.5U CN201620416746U CN205749852U CN 205749852 U CN205749852 U CN 205749852U CN 201620416746 U CN201620416746 U CN 201620416746U CN 205749852 U CN205749852 U CN 205749852U
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Abstract
The utility model discloses the quasiconductor cooling aging equipment of a kind of large-power LED light bead for LM 80 standard, including cabinet, at least three layers of calorstat that in described cabinet, setting from top to bottom arranges, described cabinet is provided with and described each calorstat controller one to one, described each calorstat is respectively provided with at least two and is respectively used to fixing LED lamp bead, and semiconductor cooling device LED lamp bead being freezed and heating.This utility model can detect greater number of LED lamp bead, is independently controlled, temperature control fast response time, makes the temperature equalization of each LED lamp bead, be effectively improved the detection accuracy of LED lamp bead when each LED lamp bead is by semiconductor cooling device.
Description
Technical field
This utility model relates to the instrument testing LED lamp bead, and the quasiconductor more particularly to a kind of large-power LED light bead for LM-80 standard cools down aging equipment.
Background technology
LED, because having environmental protection, the energy-conservation and advantage of life-span length, obtains rapid promotion and application in each field, has progressively replacement traditional lighting to become the trend of principal light source.LED (such as carries out LM80 standard authentication) when certification to carry out strict light decay and life test.LED lamp bead temperature and ambient temperature is strictly controlled, it is desirable to ambient temperature >=case temperature-5 DEG C during test.Temperature in the air of ambient temperature span 1.5 millimeters from LED lamp bead housing.Laboratory and encapsulation producer are all to test the aging of LED lamp bead shell with exact constant temperature case at present.Owing to the caloric value of LED lamp bead own is big, causes calorstat can only accurately control ambient temperature, and can not accurately control lamp bead temperature.When ambient temperature reaches the temperature of requirement, such as: 55 DEG C, 85 DEG C, or producer declares temperature, and actually since the caloric value of LED lamp bead own is big, plus the LED lamp bead putting more than 25 in a usual test space, so the case temperature of LED lamp bead can be the highest, the actual temperature of lamp bead case temperature is significantly larger than default temperature often.A lot of company's environment temperature control to 55 degree, and can burn in the LED lamp bead test process of reality, final test result deviation, and test life value can be less than normal, it is impossible to the light decay of true reflection LED lamp bead and life-span.And multiple LED lamp bead is tested in same calorstat together, also cannot effectively control the case temperature of each LED lamp bead sample in the deviation of negative 2 degree.
Utility model content
For solving the problem that above-mentioned prior art exists, this utility model provides the quasiconductor cooling aging equipment of a kind of large-power LED light bead for LM-80 standard, can the most at different temperature, while respectively multiple LED lamp bead being tested, the temperature equalization of each LED lamp bead can be made, be effectively improved the detection accuracy of LED lamp bead.
The technical solution of the utility model is: the quasiconductor cooling aging equipment of a kind of large-power LED light bead for LM-80 standard, including cabinet, at least three layers of calorstat that in described cabinet, setting from top to bottom arranges, described cabinet is provided with and described each calorstat controller one to one, described each calorstat is provided with at least two and is respectively used to fixing LED lamp bead, and semiconductor cooling device LED lamp bead being freezed and heating.
Described semiconductor cooling device includes test board, semiconductor chilling plate, fin and the first radiator fan being sequentially connected with, and described semiconductor chilling plate is connected with controller by control circuit board, and LED lamp bead is fixed on test board.
Described test board is aluminium sheet.
Heat insulation silicagel pad it is coated with outside described semiconductor chilling plate.
Described each calorstat is provided with the second radiator fan of function of environment heat emission in case.
Described each calorstat front is provided with the transparent windows for observing.
Generally circular in shape, the rectangle of described semiconductor cooling device or square.
It is provided with thermal insulation layer between described each calorstat.
Described cabinet is square, and the sidewall of cabinet is provided with heat radiation mesh, and the roof of cabinet is provided with power supply heat sinking net.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard that the utility model proposes is by being provided with multiple independent calorstat, LED lamp bead can be tested at a number of different temperatures simultaneously, each calorstat is provided with multiple semiconductor cooling device, once can detect greater number of LED lamp bead, each LED lamp bead is by independent control by semiconductor cooling device, temperature control fast response time, the cabinet temperature equalization of each LED lamp bead, is effectively improved the detection accuracy of LED lamp bead.
Accompanying drawing explanation
Fig. 1 is the Facad structure figure of this utility model quasiconductor cooling aging equipment.
Fig. 2 is the fragmentary sectional elevation view of this utility model quasiconductor cooling aging equipment.
Fig. 3 is the right side structure chart of this utility model quasiconductor cooling aging equipment.
Fig. 4 is the top surface structure figure of this utility model quasiconductor cooling aging equipment.
Fig. 5 is this utility model semiconductor cooling device axonometric chart in terms of front.
Fig. 6 is this utility model semiconductor cooling device axonometric chart in terms of the back side.
Fig. 7 is the structure chart from the side of this utility model semiconductor cooling device.
Detailed description of the invention
As shown in Figure 1, the quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard that the utility model proposes, including cabinet 10, at least three layers of calorstat 11 that in cabinet 10, setting from top to bottom arranges, it is provided with thermal insulation layer 13 between each calorstat 11, each calorstat 11 is independent, in the present embodiment, three layers of calorstat it are provided with in cabinet 10, it is respectively upper strata calorstat, middle level calorstat and lower floor's calorstat, these three layers of calorstats are separate, are provided with thermal insulation layer 13 between each calorstat.For ease of observing the situation in calorstat 11, each calorstat 11 front is provided with the transparent windows 111 for observing.Cabinet 10 is square, and the diapire of cabinet 10 has is easy to the castor 14 of mobile box and with the foot cup 15 of Telescopic, and foot cup 14 is spirally connected can stretch up and down with cabinet 10 base plate.
As in figure 2 it is shown, cabinet 10 is provided with and each calorstat 11 controller 12 one to one, each calorstat 11 is provided with at least two and is respectively used to fixing LED lamp bead, and semiconductor cooling device LED lamp bead being freezed and heating.In the present embodiment, each calorstat is provided with six semiconductor cooling devices, these 20 points of two rows of six semiconductor cooling devices, often row three is fixed in calorstat 11, these six semiconductor cooling devices 20 are all independent controls, do not interfere with each other, each semiconductor cooling device is fixed a LED lamp bead, these six semiconductor cooling devices 20 can need custom-made to be circular, rectangle or square according to client, and refrigeration work consumption also can be from 100W to 400W.Controller 12 controls the corresponding ambient temperature of calorstat 11, LED lamp bead case temperature and detection time etc. respectively.Each controller 12 controls the ambient temperature in a calorstat 11 and the temperature of six semiconductor cooling devices 20, and shows the humidity in calorstat 11.The parameter of each calorstat can show on corresponding controller 12.
Connecting on each calorstat 11 and have a circulating fan 30, this circulating fan 30 is by driven by motor, and circulating fan 30 is for controlling the ambient temperature in calorstat 11.Connecting on each calorstat 11 and have an exhaust fan 40, for being discharged by the air in calorstat 11, the sidewall of cabinet 10 is provided with the air holes 19 for air intake and air-out, the corresponding air holes 19 of each calorstat.
Cabinet 10 front is provided with the air switch 16 controlling whole equipment.Emergency stop switch and on and off switch it is additionally provided with on cabinet 10.
As shown in Figure 3 and Figure 4, in order to dispel the heat calorstat, each calorstat is provided with the second radiator fan 50 of function of environment heat emission in case.The sidewall of cabinet 10 is provided with heat radiation mesh 17, and the corresponding heat radiation mesh 17 of each calorstat, the roof of cabinet 10 is provided with power supply heat sinking net 18.
As shown in Figures 5 to 7, semiconductor cooling device 20 includes test board 21, semiconductor chilling plate 22, fin the 23, first radiator fan 24 and control circuit board, LED lamp bead is fixed on the one side of test board 21, semiconductor chilling plate 22 is fixed on the another side of test board, fin 23 is fixed on the back side of semiconductor chilling plate 22, first radiator fan 24 is fixed on fin 23, control circuit board is connected with semiconductor chilling plate 22 and controller 12 respectively, and control circuit board freezes for the sense of current controlled in semiconductor chilling plate or heats.The back side of calorstat offers the through hole identical with the shape of semiconductor cooling device 20, test board 21, semiconductor chilling plate 22 and control circuit board on semiconductor cooling device 20 are fixed on inside the calorstat back side, referring again to Fig. 3, fin 23 and the first radiator fan 24 stretch out calorstat by through hole.
In the present embodiment, test board 21 and fin 23 are all screwed on semiconductor chilling plate 22, and fin 23 is connected fixing with the first radiator fan 24 by screw.
The heat that LED lamp bead produces passes to beta version 21, the heat of test board 21 passes to semiconductor chilling plate 22, and freezed by semiconductor chilling plate 22 heat is taken away, the heat that semiconductor chilling plate 22 self produces is dispersed in air by fin 23 and the first radiator fan 24, form the transfer chain of a heat, LED lamp bead is cooled down.It addition, semiconductor chilling plate 22 can also heat, transfer heat to test board 21 and heat to LED lamp bead.
Test board 21 metal material that heat conductivity is good is made, and in the present embodiment, test board is aluminium sheet.
The bottom surface of lamp bead scribbles thermal grease conduction and cements on test board 21, and the heat conductivity of thermal grease conduction is no less than 3, to guarantee that the heat that LED lamp bead produces can be quickly transmitted to aluminium sheet.
It is coated with heat insulation silicagel pad outside semiconductor chilling plate 22, acts the effect sealed.
The present embodiment arranges in cabinet three layers of calorstat, three different ambient temperatures can be set respectively, the LED lamp bead that namely can do three varying environment temperature is aging, and in each calorstat, it is provided with six semiconductor cooling devices, these six semiconductor cooling devices independently control, can ensure that under same ambient temperature, the case temperature of whole LED lamp bead is distributed, it is possible to the LED lamp bead of aging different heat amount.
When LED lamp bead cements on aluminium sheet, set a running temperature, the temperature of aluminium sheet is less than the temperature set at the beginning, and now, control circuit board adjusts the sense of current of semiconductor chilling plate, semiconductor chilling plate starts to heat, and transferring heat to aluminium sheet, the lamp housing temperature of LED lamp bead is by quickly close to the temperature set, and control circuit board uses the PID output that calculus calculates, temperature is closer to design temperature, and output is the fewest.In like manner, when the case temperature of LED lamp bead is higher than the temperature set, control circuit board adjusts the sense of current of semiconductor chilling plate, semiconductor chilling plate starts refrigeration, and take away the heat being delivered on aluminium sheet by LED lamp bead generation, and make the lamp housing temperature of LED lamp bead quickly close to the temperature set, the PID that control circuit board uses calculus to calculate exports, temperature departure design temperature is the biggest, and output will be the biggest.PN junction principle according to semiconductor chilling plate, use alternating current direction, thus allow semiconductor chilling plate become not only can heat production but also the module that can freeze, the case temperature difficulty that can solve LED lamp bead in LED lamp bead burn-in test is applied to control and the uncontrollable difficult problem of large-power LED light bead, and it is accurately controlled the case temperature of LED lamp bead and the ambient temperature of calorstat, fully meets the requirement of LM-80 test.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard of the present utility model is provided with multiple independent calorstat, LED lamp bead can be tested at a number of different temperatures simultaneously, each calorstat is provided with multiple semiconductor cooling device, once can detect greater number of LED lamp bead, each LED lamp bead is by independent control by semiconductor cooling device, temperature control fast response time, makes the temperature equalization of each LED lamp bead, is effectively improved the detection accuracy of LED lamp bead.
Above specific embodiment is only in order to illustrate design of the present utility model, and those of ordinary skill in the art can make various deformation and change under design of the present utility model, within these deformation and change are included in protection domain of the present utility model.
Claims (9)
1. the quasiconductor for the large-power LED light bead of LM-80 standard cools down aging equipment, including cabinet (10), it is characterized in that, at least three layers of calorstat (11) that in described cabinet, setting from top to bottom arranges, described cabinet is provided with and described each calorstat controller one to one (12), described each calorstat is provided with at least two and is respectively used to fixing LED lamp bead, and the semiconductor cooling device (20) LED lamp bead being cooled down and heating.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 1, it is characterized in that, described semiconductor cooling device (20) includes test board (21), semiconductor chilling plate (22), fin (23) and the first radiator fan (24) being sequentially connected with, described semiconductor chilling plate is connected with controller (12) by control circuit board, and LED lamp bead is fixed on test board.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 2, it is characterised in that described test board (21) is aluminium sheet.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 1, it is characterised in that described semiconductor chilling plate is coated with heat insulation silicagel pad outside (22).
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 1, it is characterised in that described each calorstat (11) is provided with second radiator fan (50) of function of environment heat emission in case.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 5, it is characterised in that described each calorstat (11) front is provided with the transparent windows (111) for observing.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 1, it is characterised in that generally circular in shape, the rectangle of described semiconductor cooling device (20) or square.
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 1, it is characterised in that be provided with thermal insulation layer (13) between described each calorstat (11).
The quasiconductor cooling aging equipment of the large-power LED light bead for LM-80 standard the most according to claim 1, it is characterized in that, described cabinet (10) is square, and the sidewall of cabinet is provided with heat radiation mesh (17), and the roof of cabinet is provided with power supply heat sinking net (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620416746.5U CN205749852U (en) | 2016-05-10 | 2016-05-10 | Quasiconductor cooling aging equipment for the large-power LED light bead of LM-80 standard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620416746.5U CN205749852U (en) | 2016-05-10 | 2016-05-10 | Quasiconductor cooling aging equipment for the large-power LED light bead of LM-80 standard |
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| CN205749852U true CN205749852U (en) | 2016-11-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107132202A (en) * | 2016-12-20 | 2017-09-05 | 苏州赛德福科学仪器有限公司 | A kind of EISD |
| CN112964976A (en) * | 2021-05-19 | 2021-06-15 | 浙江杭可仪器有限公司 | Gallium nitride device ageing oven |
-
2016
- 2016-05-10 CN CN201620416746.5U patent/CN205749852U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107132202A (en) * | 2016-12-20 | 2017-09-05 | 苏州赛德福科学仪器有限公司 | A kind of EISD |
| CN107132202B (en) * | 2016-12-20 | 2023-10-27 | 苏州赛德福科学仪器有限公司 | Evaporation light scattering detector |
| CN112964976A (en) * | 2021-05-19 | 2021-06-15 | 浙江杭可仪器有限公司 | Gallium nitride device ageing oven |
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