CN107196185B - Semiconductor laser sintering clamp - Google Patents
Semiconductor laser sintering clamp Download PDFInfo
- Publication number
- CN107196185B CN107196185B CN201710592819.5A CN201710592819A CN107196185B CN 107196185 B CN107196185 B CN 107196185B CN 201710592819 A CN201710592819 A CN 201710592819A CN 107196185 B CN107196185 B CN 107196185B
- Authority
- CN
- China
- Prior art keywords
- semiconductor laser
- laser sintering
- base
- pressing
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000000149 argon plasma sintering Methods 0.000 title claims abstract description 30
- 238000003825 pressing Methods 0.000 claims abstract description 37
- 230000006835 compression Effects 0.000 claims abstract description 20
- 238000007906 compression Methods 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 12
- 239000011324 bead Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 4
- 238000005245 sintering Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laser Beam Processing (AREA)
Abstract
The semiconductor laser sintering clamp is characterized by comprising a base, a limiting assembly arranged on the base, a plurality of compression bars connected with the limiting assembly and an elastic piece arranged on the base; the compression bar is pressed against the elastic piece; the compression bar comprises a transverse bar and a lower compression bar extending from one end of the transverse bar; the compression bar is pivoted on the limiting component; the limiting assembly comprises a limiting seat fixed on the base, a limiting strip arranged on the limiting seat and a locking shaft penetrating through the limiting seat. According to the semiconductor laser sintering clamp, one side of the pressing rod is pressed by the elastic piece, so that the lower pressing strip at the other end of the pressing rod presses the main chip of the semiconductor laser on the radiator with proper pressure, the welding effect of the main chip of the semiconductor laser can be ensured, and meanwhile, the main chip of the semiconductor laser can be prevented from being damaged due to overlarge pressure.
Description
Technical Field
The invention relates to a fixing device, in particular to a semiconductor laser sintering clamp.
Background
The semiconductor laser production process comprises a sintering process, and the main effect of the sintering process is to weld the main chip of the laser to a radiator with a heat dissipation function. The processing quality of the semiconductor laser in the sintering process directly affects the heat dissipation performance of the main chip. In the sintering process, the main chip of the laser is generally fixed to a heat sink by a sintering jig, and then sintering is performed. The existing sintering clamp generally uses a screw to press a block to fix a main chip of a laser, however, the pressure on the main chip is difficult to control by using the screw, and if the pressure on the main chip by the screw is too large, the main chip is broken; if the pressure of the screw on the main chip is insufficient, a cavity is generated between the main chip and the radiator, and the cavity can influence the heat dissipation performance of the main chip.
Disclosure of Invention
Based on this, the present invention provides a semiconductor laser sintering jig capable of pressing a semiconductor laser main chip onto a heat sink with an appropriate pressure.
In order to achieve the purpose of the invention, the invention adopts the following technical scheme:
the semiconductor laser sintering clamp is used for pressing a main chip of a semiconductor laser on a radiator under proper pressure when the semiconductor laser is sintered, and is characterized by comprising a base, a limiting assembly arranged on the base, a plurality of pressing rods connected with the limiting assembly and an elastic piece arranged on the base; the compression bar is pressed against the elastic piece; the compression bar includes a transverse bar, and a lower compression bar extending from one end of the transverse bar.
According to the semiconductor laser sintering clamp, one side of the pressing rod is pressed by the elastic piece, so that the lower pressing strip at the other end of the pressing rod presses the main chip of the semiconductor laser on the radiator with proper pressure, the welding effect of the main chip of the semiconductor laser can be ensured, and meanwhile, the main chip of the semiconductor laser can be prevented from being damaged due to overlarge pressure.
In one embodiment, the compression bar is pivotally connected to the limiting component.
In one embodiment, the limiting assembly comprises a limiting seat fixed on the base, a limiting strip installed on the limiting seat, and a locking shaft penetrating through the limiting seat.
In one embodiment, the transverse strip is provided with a steering hole which penetrates horizontally; the transverse strip is divided into a pressure bearing part and a pressure applying part by taking the steering hole as a demarcation point.
In one embodiment, the lower bead extends vertically downward from one end of the pressing portion; the length of the lower pressing strip is set according to the vertical distance between the upper surface of the main chip of the semiconductor laser and the steering hole; the lower end of the lower pressing strip is provided with an open slot.
In one embodiment, one end of the elastic member is connected to an upper surface of the base; the other end of the elastic piece is propped against the pressure-bearing part.
In one embodiment, the elastic member is a spring.
In one embodiment, two lock shaft blocks are arranged on the upper side of the limit seat; the base is provided with a plurality of dividing blocks between the two lock shaft blocks; the lock shaft block is provided with shaft holes which transversely penetrate through two sides; the dividing block is provided with through shaft holes with two sides penetrating through; and a rod placing groove is formed between the dividing blocks or between the dividing blocks and the lock shaft block.
In one embodiment, the lever is disposed in the lever slot.
In one embodiment, the locking shaft penetrates through the shaft penetrating hole of the locking shaft block, the shaft penetrating hole of the dividing block and the steering hole of the compression bar.
Drawings
FIG. 1 is a perspective view of a semiconductor laser sintering fixture according to a preferred embodiment of the present invention;
FIG. 2 is a perspective view of the semiconductor laser sintering fixture of FIG. 1 in use;
fig. 3 is an enlarged view of the semiconductor laser sintering jig shown in fig. 2 at circle a;
FIG. 4 is a side view of the semiconductor laser sintering fixture shown in FIG. 1;
FIG. 5 is a front view of the semiconductor laser sintering fixture shown in FIG. 1;
FIG. 6 is an exploded view of the semiconductor laser sintering fixture shown in FIG. 1;
FIG. 7 is an enlarged schematic view of circle B of the semiconductor laser sintering fixture shown in FIG. 4;
fig. 8 is an exploded view of the semiconductor laser sintering clamp shown in fig. 1 at another angle.
Detailed Description
The present invention will be described more fully hereinafter in order to facilitate an understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 8, a semiconductor laser sintering jig 100 according to a preferred embodiment of the present invention is used to press a main chip 801 of a semiconductor laser against a heat sink 802 with a proper pressure when the semiconductor laser is sintered, and the heat sink 802 is placed in a package 803. The semiconductor laser sintering clamp 100 comprises a base 10, a limiting assembly arranged on the base 10, a plurality of compression bars 30 connected with the limiting assembly, and an elastic piece 40 arranged on the base 10; specifically, the compression bar 30 is pivotally connected to the limiting component; the base 10 is used for bearing a package pipe 803; the elastic piece 40 presses the lower side of the compression bar 30; the pressing rod 30 is used for applying vertical downward pressure to the main chip 801 of the semiconductor laser, so that the main chip 801 of the semiconductor laser is reliably attached to the heat sink 802.
The semiconductor laser sintering fixture 100 further includes a plurality of fixtures.
The base 10 is horizontally arranged; four corners of the base 10 are provided with chamfer angles; the upper surface of the base 10 is provided with a receiving groove 11.
The limiting assembly comprises a limiting seat 50 fixed on the base 10, a limiting strip 60 arranged on the limiting seat 50 and a locking shaft 70 penetrating through the limiting seat 50; the upper side of the limit seat 50 is provided with two lock shaft blocks 51; the two lock shaft blocks 51 are respectively arranged on the upper sides of the two ends of the limiting seat 50; the lock shaft block 51 is provided with a through shaft hole 53 which transversely penetrates through two sides; the lock shaft block 51 is provided with a fixed shaft hole 54 penetrating from one side of the lock shaft block 51 and together with the penetrating shaft hole 53; the upper side of the lock shaft block 51 is provided with a screw hole 55.
The base 10 is provided with a plurality of dividing blocks 52 between the two locking shaft blocks 51; the dividing blocks 52 are distributed between the two lock shaft blocks 51 in parallel; the dividing block 52 is provided with a through shaft hole 57 with two sides penetrating through; the through-hole 53 and the through-hole 57 are coaxial with the same horizontal line; a rod groove 56 is formed between the split blocks 52 or between the split blocks 52 and the lock shaft block 51.
The limit strip 60 is arranged on the limit seat 50 and horizontally arranged; the middle part of the lower side of the limit strip 60 is extended with a lower lug 61; the two ends of the limit strip 60 are respectively provided with a strip fixing hole 62; the limit bar 60 is installed on the upper side of the limit seat 50; the lower protruding part is positioned between the two lock shaft blocks 51; the lower surface of the lower protrusion is attached to the upper side of the split block 52; the fixing strip hole 62 corresponds to the screw hole 55 on the lock shaft block 51; one of the fixing members is inserted through the fixing hole 62 and then is coupled to the screw hole 55.
The diameter of the locking shaft 70 corresponds to the size of the shaft penetrating hole 53 of the locking shaft block 51; meanwhile, the diameter of the locking shaft 70 corresponds to the size of the through-hole 57 of the split block 52.
The compression bar 30 includes a lateral bar 31, and a lower compression bar 32 vertically extending from one end of the lateral bar 31; the transverse strip 31 is provided with a steering hole 33 which penetrates horizontally; the transverse bar 31 is divided into a pressure bearing part 34 and a pressure applying part 35 by taking the steering hole 33 as a demarcation point; the lower bead 32 extends vertically downward from one end of the pressing part 35; an open slot 36 is arranged at the lower end of the lower pressing strip 32; the length of the lower depression bar 32 of each of the depression bars 30 is set according to the vertical distance between the upper surface of the main chip 801 of the corresponding semiconductor laser and the steering hole 33.
Each rod placing groove 56 is provided with a compression rod 30; the steering hole 33 on the compression bar 30 and the through hole 57 on the dividing block 52 take the same horizontal line as the central axis; the locking shaft 70 penetrates through the shaft holes 53 of the two locking shaft blocks 51, the shaft holes 57 of the dividing block 52, and the steering hole 33 of the pressing rod 30; one of the fixing members is inserted into the fixed shaft hole 54; one end of the fixing piece in the fixed shaft hole 54 presses the part of the locking shaft 70 located in the through shaft hole 53, so that the locking shaft 70 is fixed on the limiting seat 50; the plunger 30 is rotatable about the locking shaft 70.
The lower end of the elastic member 40 is mounted on the upper surface of the base 10; the upper end of the elastic member 40 is pressed against the lower side of the pressure-bearing portion 34 of the transverse strip 31; specifically, the elastic member 40 is a spring; in one embodiment, the base 10 is provided with a plurality of protruding columns; the lower end of the spring is sleeved on the convex column of the base 10.
When the semiconductor laser sintering fixture 100 is used, firstly, a packaging tube shell 803 is placed into the accommodating groove 11; a plurality of heat sinks 802 arranged in a height step manner are arranged in the package pipe case 803; the bottom surface of the accommodating groove 11 corresponds to the bottom plate of the package 803; the main chip 801 of the semiconductor laser is in a sheet shape; a strip-shaped light-emitting area 84 is arranged in the middle of the upper surface of the main chip 801 of the semiconductor laser; after the main chips 801 of the semiconductor lasers are respectively placed on the corresponding heat sinks 802 in the package pipes 803, the main chips 801 of the semiconductor lasers are at different heights because the heights of the heat sinks 802 are different.
The lower pressing bar 32 of each pressing bar 30 presses the main chip 801 of one semiconductor laser against the corresponding heat sink 802 by means of the elastic force of the elastic member 40; before the main chip 801 of the semiconductor laser is mounted below the lower molding bar 32, the lower molding bar 32 may be lifted by pressing the upper surface of the pressure-bearing portion 34 of the lateral bar 31, the main chip 801 of the semiconductor laser is placed on the corresponding heat sink 802, the pressure-bearing portion 34 of the lateral bar 31 is released, and the lower molding bar 32 naturally presses the upper surface of the main chip 801 of the semiconductor laser under the elastic force of the spring; the light emitting area 84 on the main chip 801 of the semiconductor laser is a vulnerable part, and the open slot 36 at the lower end of the lower pressing bar 32 corresponds to the light emitting area 84 on the main chip 801 of the semiconductor laser, so that the light emitting area 84 on the main chip 801 of the semiconductor laser is prevented from being damaged due to being pressed.
In this embodiment, the position of the lower pressing bar 32 can be adjusted by pressing the pressing portion 34 of the pressing bar 30, which can facilitate placement of the main chip 801 of the semiconductor laser.
The vertical distance between the main chip 801 of any semiconductor laser and the corresponding steering hole 33 of the lower molding 32 is an absolute distance, and since the length of each lower molding 32 is set according to the corresponding absolute distance, the lower end of the lower molding 32 is pressed against the upper surface of the main chip 801 of the semiconductor laser with vertical pressure, so that the inclination angle between the lower surface and the upper surface of the heat sink 802 caused by the pressure of the main chip 801 of the semiconductor laser which is not perpendicular to the upper surface is avoided and the welding effect is affected.
By selecting a spring with a suitable elastic coefficient, the pressing rod 30 can press the main chip 801 of the semiconductor laser on the heat sink 802 with a proper pressure, so as to avoid damage of the main chip.
In this embodiment, the elastic member is used to press one side of the pressing rod, so that the lower pressing rod at the other end of the pressing rod presses the main chip of the semiconductor laser on the heat sink with a proper pressure, so that the welding effect of the main chip of the semiconductor laser can be ensured, and meanwhile, the damage of the main chip of the semiconductor laser due to the overlarge pressure can be avoided.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The semiconductor laser sintering clamp is used for respectively pressing main chips of a plurality of semiconductor lasers on a supporting surface of a radiator with proper pressure when the semiconductor lasers are sintered, and the heights of the supporting surfaces of the radiator are changed in a step mode, and is characterized by comprising a base, a limiting assembly arranged on the base, a plurality of pressing rods connected with the limiting assembly and an elastic piece arranged on the base; the compression bar is pressed against the elastic piece; the compression bar comprises a transverse bar and a lower compression bar extending from one end of the transverse bar; the lower pressing strip extends from one end of the transverse strip towards the base; the transverse strips are provided with steering holes which penetrate horizontally, and the steering holes of the transverse strips are positioned on the same straight line; the length of the lower pressing strip is set according to the vertical distance between the upper surface of the main chip of the semiconductor laser and the steering hole and shows a step change corresponding to the supporting surface of the radiator.
2. The semiconductor laser sintering fixture of claim 1, wherein the plunger is pivotally connected to the limit assembly.
3. The semiconductor laser sintering fixture of claim 2, wherein the limit assembly comprises a limit seat fixed on the base, a limit bar mounted on the limit seat, and a locking shaft penetrating through the limit seat.
4. The semiconductor laser sintering jig according to claim 3, wherein the lateral bar is divided into a pressure receiving portion and a pressing portion with the turning hole as a boundary point.
5. The semiconductor laser sintering jig according to claim 4, wherein the lower bead extends vertically downward from one end of the pressing portion; the lower end of the lower pressing strip is provided with an open slot.
6. The semiconductor laser sintering jig according to claim 4, wherein one end of the elastic member is connected to an upper surface of the base; the other end of the elastic piece is propped against the pressure-bearing part.
7. The semiconductor laser sintering fixture of claim 6, wherein the resilient member is a spring.
8. The semiconductor laser sintering clamp according to claim 4, wherein two lock shaft blocks are arranged on the upper side of the limiting seat; the base is provided with a plurality of dividing blocks between the two lock shaft blocks; the lock shaft block is provided with shaft holes which transversely penetrate through two sides; the dividing block is provided with through shaft holes with two sides penetrating through; and a rod placing groove is formed between the dividing blocks or between the dividing blocks and the lock shaft block.
9. The semiconductor laser sintering fixture according to claim 8, wherein the stem groove is provided therein with the pressing stem.
10. The semiconductor laser sintering fixture according to claim 9, wherein the lock shaft penetrates through a through-shaft hole of the lock shaft block, a through-shaft hole of the split block, and a steering hole of the pressing rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710592819.5A CN107196185B (en) | 2017-07-19 | 2017-07-19 | Semiconductor laser sintering clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710592819.5A CN107196185B (en) | 2017-07-19 | 2017-07-19 | Semiconductor laser sintering clamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107196185A CN107196185A (en) | 2017-09-22 |
| CN107196185B true CN107196185B (en) | 2023-11-03 |
Family
ID=59883958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710592819.5A Active CN107196185B (en) | 2017-07-19 | 2017-07-19 | Semiconductor laser sintering clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107196185B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690643A (en) * | 2019-10-11 | 2020-01-14 | 江苏天元激光科技有限公司 | Semiconductor laser chip welding jig |
| CN111037139B (en) * | 2019-12-31 | 2021-12-14 | 中国电子科技集团公司第四十七研究所 | Control method for sealing voidage of large-size circuit |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006592A (en) * | 2002-04-26 | 2004-01-08 | Fuji Xerox Co Ltd | Semiconductor laser device and mounting structure thereof, and mounting structure of light source unit |
| CN101609122A (en) * | 2009-07-16 | 2009-12-23 | 无锡市电子仪表工业有限公司 | Device for detecting performance of laser sound pickup |
| CN103326231A (en) * | 2012-03-20 | 2013-09-25 | 山东浪潮华光光电子股份有限公司 | Semiconductor laser aging method and fixing clamp |
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN105591279A (en) * | 2014-10-30 | 2016-05-18 | 山东华光光电子有限公司 | Clamp capable of alignment batch sintering of semiconductor laser pipe core, and sintering method |
| CN206811554U (en) * | 2017-03-10 | 2017-12-29 | 车城汽车配件（福建）有限公司 | A kind of track rod is made of horizontal dedicated fixture for drilling |
-
2017
- 2017-07-19 CN CN201710592819.5A patent/CN107196185B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006592A (en) * | 2002-04-26 | 2004-01-08 | Fuji Xerox Co Ltd | Semiconductor laser device and mounting structure thereof, and mounting structure of light source unit |
| CN101609122A (en) * | 2009-07-16 | 2009-12-23 | 无锡市电子仪表工业有限公司 | Device for detecting performance of laser sound pickup |
| CN103326231A (en) * | 2012-03-20 | 2013-09-25 | 山东浪潮华光光电子股份有限公司 | Semiconductor laser aging method and fixing clamp |
| CN105591279A (en) * | 2014-10-30 | 2016-05-18 | 山东华光光电子有限公司 | Clamp capable of alignment batch sintering of semiconductor laser pipe core, and sintering method |
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN206811554U (en) * | 2017-03-10 | 2017-12-29 | 车城汽车配件（福建）有限公司 | A kind of track rod is made of horizontal dedicated fixture for drilling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107196185A (en) | 2017-09-22 |
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