CN104182012A - Radiator assembly - Google Patents

Radiator assembly Download PDF

Info

Publication number
CN104182012A
CN104182012A CN201310188128.0A CN201310188128A CN104182012A CN 104182012 A CN104182012 A CN 104182012A CN 201310188128 A CN201310188128 A CN 201310188128A CN 104182012 A CN104182012 A CN 104182012A
Authority
CN
China
Prior art keywords
fixed
fixing
heating radiator
pressing rod
fixed part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310188128.0A
Other languages
Chinese (zh)
Inventor
马小峰
苏绍光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201310188128.0A priority Critical patent/CN104182012A/en
Priority to US13/945,166 priority patent/US20140345842A1/en
Publication of CN104182012A publication Critical patent/CN104182012A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a radiator assembly. The radiator assembly comprises a radiator and two fixing pieces, wherein the radiator comprises a bottom plate and a plurality of radiating fins which are vertically arranged on the top surface of the bottom plate; each side of the bottom plate comprises a first fixing part arranged at the middle part and a plurality of second fixing parts arranged on the two sides of the first fixing part; each fixing piece comprises a pressing rod, a locking column and a plurality of positioning rods; each pressing rod comprises a first fixing hole formed in the middle part and a plurality of second fixing holes formed in the two sides of the first fixing hole; the two locking columns pass through the first fixing holes of the two pressing rods and the first fixing parts and then are clamped into a main board; the positioning rods pass through the second fixing parts and the second fixing holes of the pressing rods; an elastic piece sleeves each positioning rod, and the end part of each elastic piece is pressed against the corresponding second fixing part and the corresponding pressing rod. The two locking columns of the radiator assembly are arranged at the first positioning parts in the middle of the radiator and the middle parts of the pressing rods in a penetration manner and are clamped into the main board, and force can be evenly distributed to the positioning rods on the two sides, so that the radiator can be in better contact with an electronic element of the main board.

Description

Heating radiator combination
Technical field
The present invention relates to a kind of heating radiator combination.
Background technology
Existing heating radiator Chang Yusi angle arranges perforating, four locks is locked to mainboard through perforating, thereby heating radiator is fixed on to mainboard.Four locks application of force difference in the time locking mainboard, easily causes heating radiator to contact bad with the electronic component on mainboard.
Summary of the invention
In view of more than, be necessary to provide a kind of heating radiator that can make to contact good heating radiator combination with the electronic component on mainboard.
A kind of heating radiator combination, comprise a heating radiator and two fixtures, this heating radiator comprises a base plate and is vertical at some radiating fins of the end face of this base plate, each side of this base plate comprises one first fixed part of being located at middle part and some the second fixed parts of being located at the both sides of the first fixed part, each fixture comprises a pressing rod, one lock and some backstays, each pressing rod comprises the first fixed orifice of being located at middle part and some the second fixed orifices of being located at the first fixed orifice both sides, two locks snap in a mainboard through the first fixed orifice and first fixed part of two pressing rods, these backstays are through the second fixed orifice of these second fixed parts and pressing rod, these positioning arm covers are provided with the elastic component of end butt the second fixed part and pressing rod.
Compare prior art, the first location division and pressing rod middle part that two locks of above-mentioned heating radiator combination are arranged in heating radiator middle part snap in mainboard, power can be averagely allocated to the backstay of both sides, make heating radiator contact better the electronic component of mainboard.
Brief description of the drawings
Fig. 1 is the three-dimensional exploded view of the preferred embodiments of heating radiator combination of the present invention.
Fig. 2 is the part assembly drawing of Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of Fig. 1.
Fig. 4 is the cut-open view of Fig. 3 along IV-IV line.
Main element symbol description
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Please refer to Fig. 1, radiator panel of the present invention attaches together is located at a mainboard 10.This mainboard 10 is provided with an electronic component 12 and lays respectively at two locking holes 14 of the both sides of this electronic component 12.This heating radiator combination comprises a heating radiator 20 and two fixtures 30.
This heating radiator 20 comprises a base plate 22 and is vertical at the some radiating fins 24 on this base plate 22.The both sides of this base plate 22 are outwards convexly equipped with respectively equally spaced three fixed parts 26 accordingly.Each fixed part 26 is offered a perforation 28.
Each fixture 30 comprises a pressing rod 32, two elastic components 34, a lock 36 and two backstays 38.In the present embodiment, elastic component 34 is spring.
This pressing rod 32 comprises a plate 320 and respectively from outward extending two lugs 322 in two ends of the end face of this web joint 320.This web joint 320 offers a fixed orifice 324 in middle part.Each lug 322 offers a through hole 326.
The head 362 and one that this lock 36 comprises a cylinder 360 and is located at respectively the two ends of this cylinder 360 is the stop section 364 of back taper.The middle part of this stop section 364 is provided with groove, make this stop section 364 can elastic deformation through the fixed orifice 324 of this web joint 320.These head 362 blocks are in the end face of web joint 320.
The adjacent positon of near bottom of the periphery of every a positioning rod 38 is outwards convexly equipped with the catch 382 of an annular.The top of every a positioning rod 38 is arranged with an elastic component 34.
Please refer to Fig. 2 to Fig. 4, when assembling, two perforation 28 of the outermost end of the same side of this heating radiator 20 are inserted respectively in the bottom of this two backstay 38, until catch 382 blocks are in the end face of corresponding fixed part 26.The top of this two backstay 38, respectively from bottom to up through the two through hole 326 of this pressing rod 32, is folded in respectively between corresponding catch 382 and the lug 322 of correspondence this two elastic component 34.Compress the head 362 of the lock 36 of this fixture 30 downwards, make these stop section 364 elastic deformations through middle perforation 28, until elastic deformation block is recovered in the bottom surface of corresponding fixed part 26 in this stop section 364, thereby this fixture 30 is installed in to a side of this heating radiator 20.
In like manner, another fixture 30 is installed in to the opposite side of this heating radiator 20.Afterwards this heating radiator 20 is placed on the electronic component 12 of this mainboard 10.Compress the head 362 of the lock 36 of fixture 30 downwards, make elastic component 34 elastic deformations, corresponding through hole 326 is stretched out on the top of backstay 38 gradually, 364 elastic deformation ground, stop section pass respectively the locking hole 14 of mainboard 10, until elastic deformation block is recovered in the bottom surface of mainboard 10 in stop section 364, thereby heating radiator 20 is fixed on to mainboard 10.
Heating radiator combination of the present invention only needs this two lock 36 of locking, only needs two operating points, has reduced operational error.And the lock 36 of each fixture 30 is positioned at the middle of two backstays 38, power can be averagely allocated to the backstay 38 of both sides, make heating radiator 20 contact better electronic component 12.

Claims (5)

1. a heating radiator combination, comprise a heating radiator and two fixtures, this heating radiator comprises a base plate and is vertical at some radiating fins of the end face of this base plate, each side of this base plate comprises one first fixed part of being located at middle part and some the second fixed parts of being located at the both sides of the first fixed part, each fixture comprises a pressing rod, one lock and some backstays, each pressing rod comprises the first fixed orifice of being located at middle part and some the second fixed orifices of being located at the first fixed orifice both sides, two locks snap in a mainboard through the first fixed orifice and first fixed part of two pressing rods, these backstays are through the second fixed orifice of these second fixed parts and pressing rod, these positioning arm covers are provided with the elastic component of end butt the second fixed part and pressing rod.
2. heating radiator combination as claimed in claim 1, it is characterized in that: the second fixed part of each side of this base plate is two, this two second fixed part is identical to the distance of the first corresponding fixed part, the second fixed orifice of each pressing rod is two, and this two second fixed orifice is identical to the distance of the first corresponding fixed orifice.
3. heating radiator combination as claimed in claim 1, is characterized in that: the periphery of every a positioning rod convexes with a catch, and this catch block is in the second fixed part of correspondence, and elastic component is folded between corresponding catch and the pressing rod of correspondence.
4. heating radiator combination as claimed in claim 1, it is characterized in that: each lock comprises a cylinder and be located at respectively the stop section of the back taper that the head and at the two ends of this cylinder can elastic deformation, stop section elastic deformation terminates in the bottom surface of mainboard through mainboard backstop.
5. heating radiator combination as claimed in claim 1, is characterized in that: the first fixed part and the second fixed part are provided with respectively the perforation that supplies lock or backstay to pass.
CN201310188128.0A 2013-05-21 2013-05-21 Radiator assembly Pending CN104182012A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310188128.0A CN104182012A (en) 2013-05-21 2013-05-21 Radiator assembly
US13/945,166 US20140345842A1 (en) 2013-05-21 2013-07-18 Heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310188128.0A CN104182012A (en) 2013-05-21 2013-05-21 Radiator assembly

Publications (1)

Publication Number Publication Date
CN104182012A true CN104182012A (en) 2014-12-03

Family

ID=51934600

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310188128.0A Pending CN104182012A (en) 2013-05-21 2013-05-21 Radiator assembly

Country Status (2)

Country Link
US (1) US20140345842A1 (en)
CN (1) CN104182012A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108766945A (en) * 2018-06-29 2018-11-06 安徽捷泰智能科技有限公司 A kind of radiator suitable for metal-oxide-semiconductor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7115032B2 (en) * 2018-05-24 2022-08-09 富士通株式会社 substrate
US11910566B1 (en) * 2021-03-18 2024-02-20 Amazon Technologies, Inc. Processor heat exchanger with separate mounting structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2582047Y (en) * 2002-10-23 2003-10-22 鸿富锦精密工业(深圳)有限公司 Radiator device combination
US20040085735A1 (en) * 2002-11-20 2004-05-06 Liu Heben Heat sink assembly with retaining device
CN101541158A (en) * 2008-03-21 2009-09-23 鸿富锦精密工业(深圳)有限公司 Fixer, heat radiator module set with same and electronic equipment with same
CN103019331A (en) * 2011-09-26 2013-04-03 鸿富锦精密工业(武汉)有限公司 Support device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
US6141220A (en) * 1999-04-02 2000-10-31 Global Win Technology Co., Ltd. CPU heat sink mounting arrangement
TW578992U (en) * 2002-09-09 2004-03-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
TW540988U (en) * 2002-10-04 2003-07-01 Hon Hai Prec Ind Co Ltd A heat dissipating assembly
CN101547585A (en) * 2008-03-26 2009-09-30 富准精密工业(深圳)有限公司 Heat sink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2582047Y (en) * 2002-10-23 2003-10-22 鸿富锦精密工业(深圳)有限公司 Radiator device combination
US20040085735A1 (en) * 2002-11-20 2004-05-06 Liu Heben Heat sink assembly with retaining device
CN101541158A (en) * 2008-03-21 2009-09-23 鸿富锦精密工业(深圳)有限公司 Fixer, heat radiator module set with same and electronic equipment with same
CN103019331A (en) * 2011-09-26 2013-04-03 鸿富锦精密工业(武汉)有限公司 Support device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108766945A (en) * 2018-06-29 2018-11-06 安徽捷泰智能科技有限公司 A kind of radiator suitable for metal-oxide-semiconductor

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PB01 Publication
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141203

WD01 Invention patent application deemed withdrawn after publication