US20140345842A1 - Heat sink assembly - Google Patents
Heat sink assembly Download PDFInfo
- Publication number
- US20140345842A1 US20140345842A1 US13/945,166 US201313945166A US2014345842A1 US 20140345842 A1 US20140345842 A1 US 20140345842A1 US 201313945166 A US201313945166 A US 201313945166A US 2014345842 A1 US2014345842 A1 US 2014345842A1
- Authority
- US
- United States
- Prior art keywords
- fixing
- heat sink
- positioning
- sink assembly
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to a heat sink assembly.
- Heat sinks generally define four through holes in corners of boards of the heat sinks, through which four fasteners extend to engage in motherboards, thereby fixing the heat sinks on electronic elements on the motherboards.
- forces for fixing the four fasteners are not always the same. As a result, the board may not contact the electronic element perfectly.
- FIG. 1 is an exploded, isometric view of an embodiment of a heat sink assembly.
- FIG. 2 is a partly assembled view of FIG. 1 .
- FIG. 3 is an assembled, isometric view of FIG. 1 .
- FIG. 4 is a cross-sectional view of FIG. 3 , taken along the line IV-IV.
- a heat sink assembly is mounted to a circuit board 10 .
- An electronic element 12 is mounted on the circuit board 10 .
- Two fixing holes 14 are defined in the circuit board 10 and at opposite sides of the electronic element 12 .
- the heat sink assembly includes a heat sink 20 and two fixing members 30 .
- the heat sink 20 includes a base board 22 and a plurality of fins 24 extending substantially perpendicularly up from a top of the base board 22 .
- Three fixing portions 26 extend out from each of opposite sides of the base board 22 , and each fixing portion 26 defines a through hole 28 . Distances between two adjacent through holes 28 at a same side of the base board 22 are substantially the same.
- the three fixing portions 26 can comprise a first fixing portion 26 and two second fixing portions 26 on opposite sides of the first fixing portion 26 .
- the through hole 28 of the first fixing portion is the main through hole 28 and can have a different sized through hole 28 to accommodate the fixing bolts 36 .
- Each fixing member 30 includes a driving portion 32 , two springs 34 , a fixing bolt 36 , and two positioning poles 38 .
- the driving portion 32 includes a bar 320 and two tabs 322 connected to opposite ends of the bar 320 .
- the bar 320 defines an installing hole 324 in a center portion.
- Each tab 322 defines a positioning hole 326 .
- the fixing bolt 36 includes a connecting pole 360 , a head 362 at one end of the connecting pole 360 , and a tapered locking portion 364 connected to an opposite end of the connecting pole 360 .
- the locking portion 364 defines a slot in its center.
- the locking portion 364 is pliable and deforms to extend through the installing hole 324 .
- the head 362 abuts against a top of the bar 320 .
- An annular blocking portion 382 protrudes from a circumference of each positioning pole 38 .
- Each spring 34 is fitted about an upper portion of a positioning pole 38 above the corresponding blocking portion 382 .
- bottom ends of the positioning poles 38 are inserted into the outer through holes 28 of a side of the heat sink 20 , until the blocking portions 382 abut against tops of the corresponding fixing portions 26 .
- Top ends of the positioning poles 38 are inserted into the positioning holes 326 .
- the springs 34 are sandwiched between the blocking portions 382 and the corresponding tabs 322 .
- the fixing bolt 36 is inserted into the main through hole 28 , such that the locking portion 364 deforms through the main through hole 28 . After the locking portion 364 passes through the center fixing portion 26 , the locking portion 364 restores to abut against a bottom of the center fixing portion 26 , thereby fixing the fixing member 30 to the side of the heat sink 20 .
- the other fixing member 30 is mounted to the opposite side of the heat sink 20 in the same manner.
- the heat sink 20 is then mounted to the circuit board 10 and is rested on the electronic element 12 .
- the heads 362 are pressed to allow the locking portions 364 to extend through the corresponding fixing holes 14 .
- the locking portions 364 restore to abut against a bottom of the circuit board 10 .
- the top ends of the positioning poles 38 extend out of the corresponding positioning holes 326 .
- each fixing bolt 36 is spaced from the two corresponding positioning poles 38 substantially the same distance. Therefore, the force applied by the fixing bolt 36 is equally distributed to the positioning poles 38 to make the heat sink 20 evenly contact the electronic element 12 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to a heat sink assembly.
- 2. Description of Related Art
- Heat sinks generally define four through holes in corners of boards of the heat sinks, through which four fasteners extend to engage in motherboards, thereby fixing the heat sinks on electronic elements on the motherboards. However, forces for fixing the four fasteners are not always the same. As a result, the board may not contact the electronic element perfectly.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of an embodiment of a heat sink assembly. -
FIG. 2 is a partly assembled view ofFIG. 1 . -
FIG. 3 is an assembled, isometric view ofFIG. 1 . -
FIG. 4 is a cross-sectional view ofFIG. 3 , taken along the line IV-IV. - The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
- Referring to
FIG. 1 , a heat sink assembly is mounted to acircuit board 10. Anelectronic element 12 is mounted on thecircuit board 10. Twofixing holes 14 are defined in thecircuit board 10 and at opposite sides of theelectronic element 12. - The heat sink assembly includes a
heat sink 20 and twofixing members 30. - The
heat sink 20 includes abase board 22 and a plurality offins 24 extending substantially perpendicularly up from a top of thebase board 22. Threefixing portions 26 extend out from each of opposite sides of thebase board 22, and eachfixing portion 26 defines a throughhole 28. Distances between two adjacent throughholes 28 at a same side of thebase board 22 are substantially the same. The threefixing portions 26 can comprise afirst fixing portion 26 and twosecond fixing portions 26 on opposite sides of thefirst fixing portion 26. Thethrough hole 28 of the first fixing portion is the main throughhole 28 and can have a different sized throughhole 28 to accommodate thefixing bolts 36. - Each
fixing member 30 includes adriving portion 32, twosprings 34, afixing bolt 36, and twopositioning poles 38. - The
driving portion 32 includes abar 320 and twotabs 322 connected to opposite ends of thebar 320. Thebar 320 defines aninstalling hole 324 in a center portion. Eachtab 322 defines apositioning hole 326. - The
fixing bolt 36 includes a connectingpole 360, ahead 362 at one end of the connectingpole 360, and atapered locking portion 364 connected to an opposite end of the connectingpole 360. Thelocking portion 364 defines a slot in its center. Thelocking portion 364 is pliable and deforms to extend through the installinghole 324. Thehead 362 abuts against a top of thebar 320. - An
annular blocking portion 382 protrudes from a circumference of eachpositioning pole 38. - Each
spring 34 is fitted about an upper portion of apositioning pole 38 above thecorresponding blocking portion 382. - Referring to
FIGS. 2 to 4 , in assembly of thefixing member 30 to a side of theheat sink 20, bottom ends of thepositioning poles 38 are inserted into the outer throughholes 28 of a side of theheat sink 20, until the blockingportions 382 abut against tops of thecorresponding fixing portions 26. Top ends of thepositioning poles 38 are inserted into thepositioning holes 326. Thesprings 34 are sandwiched between the blockingportions 382 and thecorresponding tabs 322. Thefixing bolt 36 is inserted into the main throughhole 28, such that thelocking portion 364 deforms through the main throughhole 28. After thelocking portion 364 passes through thecenter fixing portion 26, thelocking portion 364 restores to abut against a bottom of thecenter fixing portion 26, thereby fixing thefixing member 30 to the side of theheat sink 20. - The
other fixing member 30 is mounted to the opposite side of theheat sink 20 in the same manner. Theheat sink 20 is then mounted to thecircuit board 10 and is rested on theelectronic element 12. Theheads 362 are pressed to allow thelocking portions 364 to extend through thecorresponding fixing holes 14. After thelocking portions 364 pass through thecircuit board 10, thelocking portions 364 restore to abut against a bottom of thecircuit board 10. The top ends of thepositioning poles 38 extend out of thecorresponding positioning holes 326. - Because the heat sink assembly only needs two
fixing bolts 36, the risk of operation error is decreased. Additionally, eachfixing bolt 36 is spaced from the twocorresponding positioning poles 38 substantially the same distance. Therefore, the force applied by thefixing bolt 36 is equally distributed to thepositioning poles 38 to make theheat sink 20 evenly contact theelectronic element 12. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being embodiments.
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310188128.0A CN104182012A (en) | 2013-05-21 | 2013-05-21 | Radiator assembly |
CN2013101881280 | 2013-05-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140345842A1 true US20140345842A1 (en) | 2014-11-27 |
Family
ID=51934600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/945,166 Abandoned US20140345842A1 (en) | 2013-05-21 | 2013-07-18 | Heat sink assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US20140345842A1 (en) |
CN (1) | CN104182012A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10607917B2 (en) * | 2018-05-24 | 2020-03-31 | Fujitsu Limited | Substrate |
US11910566B1 (en) * | 2021-03-18 | 2024-02-20 | Amazon Technologies, Inc. | Processor heat exchanger with separate mounting structure |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108766945B (en) * | 2018-06-29 | 2020-02-21 | 安徽捷泰智能科技有限公司 | Heat abstractor suitable for MOS pipe |
CN109888799A (en) * | 2019-02-25 | 2019-06-14 | 江苏亿能电气有限公司 | A kind of synthesis three-phase imbalance controlling device of more back transmission lines |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037660A (en) * | 1998-05-06 | 2000-03-14 | Liu; Yen-Wen | Device for securing a finned radiating structure to a computer chip |
US6141220A (en) * | 1999-04-02 | 2000-10-31 | Global Win Technology Co., Ltd. | CPU heat sink mounting arrangement |
US20040066627A1 (en) * | 2002-10-04 | 2004-04-08 | Liu Heben | Heat sink assembly with retaining device |
US20040085735A1 (en) * | 2002-11-20 | 2004-05-06 | Liu Heben | Heat sink assembly with retaining device |
US20050024832A1 (en) * | 2002-09-09 | 2005-02-03 | Lee Hsieh Kun | Heat sink clip with pressing post |
US20090244849A1 (en) * | 2008-03-26 | 2009-10-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2582047Y (en) * | 2002-10-23 | 2003-10-22 | 鸿富锦精密工业(深圳)有限公司 | Radiator device combination |
CN101541158A (en) * | 2008-03-21 | 2009-09-23 | 鸿富锦精密工业(深圳)有限公司 | Fixer, heat radiator module set with same and electronic equipment with same |
CN103019331B (en) * | 2011-09-26 | 2015-08-05 | 鸿富锦精密工业(武汉)有限公司 | Bracing or strutting arrangement |
-
2013
- 2013-05-21 CN CN201310188128.0A patent/CN104182012A/en active Pending
- 2013-07-18 US US13/945,166 patent/US20140345842A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037660A (en) * | 1998-05-06 | 2000-03-14 | Liu; Yen-Wen | Device for securing a finned radiating structure to a computer chip |
US6141220A (en) * | 1999-04-02 | 2000-10-31 | Global Win Technology Co., Ltd. | CPU heat sink mounting arrangement |
US20050024832A1 (en) * | 2002-09-09 | 2005-02-03 | Lee Hsieh Kun | Heat sink clip with pressing post |
US20040066627A1 (en) * | 2002-10-04 | 2004-04-08 | Liu Heben | Heat sink assembly with retaining device |
US20040085735A1 (en) * | 2002-11-20 | 2004-05-06 | Liu Heben | Heat sink assembly with retaining device |
US20090244849A1 (en) * | 2008-03-26 | 2009-10-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10607917B2 (en) * | 2018-05-24 | 2020-03-31 | Fujitsu Limited | Substrate |
US11910566B1 (en) * | 2021-03-18 | 2024-02-20 | Amazon Technologies, Inc. | Processor heat exchanger with separate mounting structure |
Also Published As
Publication number | Publication date |
---|---|
CN104182012A (en) | 2014-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MA, XIAO-FENG;SU, SHAO-GUANG;REEL/FRAME:030825/0466 Effective date: 20130717 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MA, XIAO-FENG;SU, SHAO-GUANG;REEL/FRAME:030825/0466 Effective date: 20130717 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |