US20140345842A1 - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
US20140345842A1
US20140345842A1 US13/945,166 US201313945166A US2014345842A1 US 20140345842 A1 US20140345842 A1 US 20140345842A1 US 201313945166 A US201313945166 A US 201313945166A US 2014345842 A1 US2014345842 A1 US 2014345842A1
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US
United States
Prior art keywords
fixing
heat sink
positioning
sink assembly
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/945,166
Inventor
Xiao-Feng Ma
Shao-Guang Su
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MA, Xiao-feng, SU, SHAO-GUANG
Publication of US20140345842A1 publication Critical patent/US20140345842A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat sink assembly.
  • Heat sinks generally define four through holes in corners of boards of the heat sinks, through which four fasteners extend to engage in motherboards, thereby fixing the heat sinks on electronic elements on the motherboards.
  • forces for fixing the four fasteners are not always the same. As a result, the board may not contact the electronic element perfectly.
  • FIG. 1 is an exploded, isometric view of an embodiment of a heat sink assembly.
  • FIG. 2 is a partly assembled view of FIG. 1 .
  • FIG. 3 is an assembled, isometric view of FIG. 1 .
  • FIG. 4 is a cross-sectional view of FIG. 3 , taken along the line IV-IV.
  • a heat sink assembly is mounted to a circuit board 10 .
  • An electronic element 12 is mounted on the circuit board 10 .
  • Two fixing holes 14 are defined in the circuit board 10 and at opposite sides of the electronic element 12 .
  • the heat sink assembly includes a heat sink 20 and two fixing members 30 .
  • the heat sink 20 includes a base board 22 and a plurality of fins 24 extending substantially perpendicularly up from a top of the base board 22 .
  • Three fixing portions 26 extend out from each of opposite sides of the base board 22 , and each fixing portion 26 defines a through hole 28 . Distances between two adjacent through holes 28 at a same side of the base board 22 are substantially the same.
  • the three fixing portions 26 can comprise a first fixing portion 26 and two second fixing portions 26 on opposite sides of the first fixing portion 26 .
  • the through hole 28 of the first fixing portion is the main through hole 28 and can have a different sized through hole 28 to accommodate the fixing bolts 36 .
  • Each fixing member 30 includes a driving portion 32 , two springs 34 , a fixing bolt 36 , and two positioning poles 38 .
  • the driving portion 32 includes a bar 320 and two tabs 322 connected to opposite ends of the bar 320 .
  • the bar 320 defines an installing hole 324 in a center portion.
  • Each tab 322 defines a positioning hole 326 .
  • the fixing bolt 36 includes a connecting pole 360 , a head 362 at one end of the connecting pole 360 , and a tapered locking portion 364 connected to an opposite end of the connecting pole 360 .
  • the locking portion 364 defines a slot in its center.
  • the locking portion 364 is pliable and deforms to extend through the installing hole 324 .
  • the head 362 abuts against a top of the bar 320 .
  • An annular blocking portion 382 protrudes from a circumference of each positioning pole 38 .
  • Each spring 34 is fitted about an upper portion of a positioning pole 38 above the corresponding blocking portion 382 .
  • bottom ends of the positioning poles 38 are inserted into the outer through holes 28 of a side of the heat sink 20 , until the blocking portions 382 abut against tops of the corresponding fixing portions 26 .
  • Top ends of the positioning poles 38 are inserted into the positioning holes 326 .
  • the springs 34 are sandwiched between the blocking portions 382 and the corresponding tabs 322 .
  • the fixing bolt 36 is inserted into the main through hole 28 , such that the locking portion 364 deforms through the main through hole 28 . After the locking portion 364 passes through the center fixing portion 26 , the locking portion 364 restores to abut against a bottom of the center fixing portion 26 , thereby fixing the fixing member 30 to the side of the heat sink 20 .
  • the other fixing member 30 is mounted to the opposite side of the heat sink 20 in the same manner.
  • the heat sink 20 is then mounted to the circuit board 10 and is rested on the electronic element 12 .
  • the heads 362 are pressed to allow the locking portions 364 to extend through the corresponding fixing holes 14 .
  • the locking portions 364 restore to abut against a bottom of the circuit board 10 .
  • the top ends of the positioning poles 38 extend out of the corresponding positioning holes 326 .
  • each fixing bolt 36 is spaced from the two corresponding positioning poles 38 substantially the same distance. Therefore, the force applied by the fixing bolt 36 is equally distributed to the positioning poles 38 to make the heat sink 20 evenly contact the electronic element 12 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

A heat sink assembly includes a heat sink and two fixing members. The heat sink includes a board and a number of fins extending substantially perpendicularly up from the board. A first fixing portion and two second fixing portions at opposite sides of the first fixing portion are formed at each of opposite sides of the board. Each fixing member includes a driving portion, a fixing bolt, and two positioning poles. Each driving portion defines an installing hole and two positioning holes at opposite sides of the installing hole. The fixing bolts extend through the installing holes, the first fixing portions, and a circuit board to engage with the circuit board. The positioning poles are inserted into the second fixing portions and the positioning holes. A spring is fitted about each positioning pole and is sandwiched between the corresponding second fixing portion and the corresponding driving portion.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat sink assembly.
  • 2. Description of Related Art
  • Heat sinks generally define four through holes in corners of boards of the heat sinks, through which four fasteners extend to engage in motherboards, thereby fixing the heat sinks on electronic elements on the motherboards. However, forces for fixing the four fasteners are not always the same. As a result, the board may not contact the electronic element perfectly.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of an embodiment of a heat sink assembly.
  • FIG. 2 is a partly assembled view of FIG. 1.
  • FIG. 3 is an assembled, isometric view of FIG. 1.
  • FIG. 4 is a cross-sectional view of FIG. 3, taken along the line IV-IV.
  • DETAILED DESCRIPTION
  • The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
  • Referring to FIG. 1, a heat sink assembly is mounted to a circuit board 10. An electronic element 12 is mounted on the circuit board 10. Two fixing holes 14 are defined in the circuit board 10 and at opposite sides of the electronic element 12.
  • The heat sink assembly includes a heat sink 20 and two fixing members 30.
  • The heat sink 20 includes a base board 22 and a plurality of fins 24 extending substantially perpendicularly up from a top of the base board 22. Three fixing portions 26 extend out from each of opposite sides of the base board 22, and each fixing portion 26 defines a through hole 28. Distances between two adjacent through holes 28 at a same side of the base board 22 are substantially the same. The three fixing portions 26 can comprise a first fixing portion 26 and two second fixing portions 26 on opposite sides of the first fixing portion 26. The through hole 28 of the first fixing portion is the main through hole 28 and can have a different sized through hole 28 to accommodate the fixing bolts 36.
  • Each fixing member 30 includes a driving portion 32, two springs 34, a fixing bolt 36, and two positioning poles 38.
  • The driving portion 32 includes a bar 320 and two tabs 322 connected to opposite ends of the bar 320. The bar 320 defines an installing hole 324 in a center portion. Each tab 322 defines a positioning hole 326.
  • The fixing bolt 36 includes a connecting pole 360, a head 362 at one end of the connecting pole 360, and a tapered locking portion 364 connected to an opposite end of the connecting pole 360. The locking portion 364 defines a slot in its center. The locking portion 364 is pliable and deforms to extend through the installing hole 324. The head 362 abuts against a top of the bar 320.
  • An annular blocking portion 382 protrudes from a circumference of each positioning pole 38.
  • Each spring 34 is fitted about an upper portion of a positioning pole 38 above the corresponding blocking portion 382.
  • Referring to FIGS. 2 to 4, in assembly of the fixing member 30 to a side of the heat sink 20, bottom ends of the positioning poles 38 are inserted into the outer through holes 28 of a side of the heat sink 20, until the blocking portions 382 abut against tops of the corresponding fixing portions 26. Top ends of the positioning poles 38 are inserted into the positioning holes 326. The springs 34 are sandwiched between the blocking portions 382 and the corresponding tabs 322. The fixing bolt 36 is inserted into the main through hole 28, such that the locking portion 364 deforms through the main through hole 28. After the locking portion 364 passes through the center fixing portion 26, the locking portion 364 restores to abut against a bottom of the center fixing portion 26, thereby fixing the fixing member 30 to the side of the heat sink 20.
  • The other fixing member 30 is mounted to the opposite side of the heat sink 20 in the same manner. The heat sink 20 is then mounted to the circuit board 10 and is rested on the electronic element 12. The heads 362 are pressed to allow the locking portions 364 to extend through the corresponding fixing holes 14. After the locking portions 364 pass through the circuit board 10, the locking portions 364 restore to abut against a bottom of the circuit board 10. The top ends of the positioning poles 38 extend out of the corresponding positioning holes 326.
  • Because the heat sink assembly only needs two fixing bolts 36, the risk of operation error is decreased. Additionally, each fixing bolt 36 is spaced from the two corresponding positioning poles 38 substantially the same distance. Therefore, the force applied by the fixing bolt 36 is equally distributed to the positioning poles 38 to make the heat sink 20 evenly contact the electronic element 12.
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being embodiments.

Claims (5)

What is claimed is:
1. A heat sink assembly to be mounted to a circuit board, the heat sink assembly comprising:
a heat sink comprising a base board, a plurality of fins extending up from the base board, and two fixing portion sets extending from opposite sides of the base board, each fixing portion set comprising a first fixing portion and two second fixing portions at opposite sides of the first fixing portion, each first fixing portion and second fixing portion defining a through hole; and
two fixing members, each fixing member comprising a driving portion, a fixing bolt, two positioning poles, and two springs fitted about the positioning poles, each driving portion defining an installing hole and two positioning holes at opposite sides of the installing hole;
wherein the fixing bolts extend through the installing holes and the through hole of the first fixing portions and engage in the circuit board; the positioning poles are respectively inserted into the through holes of the second fixing portions and the positioning holes; each spring is sandwiched between a corresponding second fixing portion and a corresponding driving portion.
2. The heat sink assembly of claim 1, wherein each first fixing portion is spaced from the corresponding second fixing portions substantially the same distances.
3. The heat sink assembly of claim 1, wherein each positioning pole comprises an elongated body and a blocking portion protruding from a circumference of the elongated body to abut against a top of the corresponding second fixing portion, and each spring is sandwiched between a corresponding blocking portion and the driving portion.
4. The heat sink assembly of claim 1, wherein each fixing bolt comprises a connecting pole, and a head and a tapered locking portion connected to opposite ends of the connecting pole, and the locking portion is pliable to extend through the corresponding installing hole.
5. The heat sink assembly of claim 4, wherein a slot is defined in the locking portion.
US13/945,166 2013-05-21 2013-07-18 Heat sink assembly Abandoned US20140345842A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310188128.0A CN104182012A (en) 2013-05-21 2013-05-21 Radiator assembly
CN2013101881280 2013-05-21

Publications (1)

Publication Number Publication Date
US20140345842A1 true US20140345842A1 (en) 2014-11-27

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ID=51934600

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/945,166 Abandoned US20140345842A1 (en) 2013-05-21 2013-07-18 Heat sink assembly

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US (1) US20140345842A1 (en)
CN (1) CN104182012A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10607917B2 (en) * 2018-05-24 2020-03-31 Fujitsu Limited Substrate
US11910566B1 (en) * 2021-03-18 2024-02-20 Amazon Technologies, Inc. Processor heat exchanger with separate mounting structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108766945B (en) * 2018-06-29 2020-02-21 安徽捷泰智能科技有限公司 Heat abstractor suitable for MOS pipe
CN109888799A (en) * 2019-02-25 2019-06-14 江苏亿能电气有限公司 A kind of synthesis three-phase imbalance controlling device of more back transmission lines

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
US6141220A (en) * 1999-04-02 2000-10-31 Global Win Technology Co., Ltd. CPU heat sink mounting arrangement
US20040066627A1 (en) * 2002-10-04 2004-04-08 Liu Heben Heat sink assembly with retaining device
US20040085735A1 (en) * 2002-11-20 2004-05-06 Liu Heben Heat sink assembly with retaining device
US20050024832A1 (en) * 2002-09-09 2005-02-03 Lee Hsieh Kun Heat sink clip with pressing post
US20090244849A1 (en) * 2008-03-26 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2582047Y (en) * 2002-10-23 2003-10-22 鸿富锦精密工业(深圳)有限公司 Radiator device combination
CN101541158A (en) * 2008-03-21 2009-09-23 鸿富锦精密工业(深圳)有限公司 Fixer, heat radiator module set with same and electronic equipment with same
CN103019331B (en) * 2011-09-26 2015-08-05 鸿富锦精密工业(武汉)有限公司 Bracing or strutting arrangement

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
US6141220A (en) * 1999-04-02 2000-10-31 Global Win Technology Co., Ltd. CPU heat sink mounting arrangement
US20050024832A1 (en) * 2002-09-09 2005-02-03 Lee Hsieh Kun Heat sink clip with pressing post
US20040066627A1 (en) * 2002-10-04 2004-04-08 Liu Heben Heat sink assembly with retaining device
US20040085735A1 (en) * 2002-11-20 2004-05-06 Liu Heben Heat sink assembly with retaining device
US20090244849A1 (en) * 2008-03-26 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10607917B2 (en) * 2018-05-24 2020-03-31 Fujitsu Limited Substrate
US11910566B1 (en) * 2021-03-18 2024-02-20 Amazon Technologies, Inc. Processor heat exchanger with separate mounting structure

Also Published As

Publication number Publication date
CN104182012A (en) 2014-12-03

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MA, XIAO-FENG;SU, SHAO-GUANG;REEL/FRAME:030825/0466

Effective date: 20130717

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MA, XIAO-FENG;SU, SHAO-GUANG;REEL/FRAME:030825/0466

Effective date: 20130717

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION