CN108766945B - Heat abstractor suitable for MOS pipe - Google Patents
Heat abstractor suitable for MOS pipe Download PDFInfo
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- CN108766945B CN108766945B CN201810692172.8A CN201810692172A CN108766945B CN 108766945 B CN108766945 B CN 108766945B CN 201810692172 A CN201810692172 A CN 201810692172A CN 108766945 B CN108766945 B CN 108766945B
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- heat dissipation
- fixedly connected
- mos tube
- fixed shell
- fixed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device suitable for an MOS (metal oxide semiconductor) tube, which comprises a fixed shell and a heat dissipation box, wherein the fixed shell consists of two L-shaped supports, the MOS tube is arranged in a containing cavity formed by the two L-shaped supports, a heat dissipation sheet is fixedly connected inside the fixed shell and is tightly attached to the rear side wall of the MOS tube, the rear end surface of the fixed shell is in through connection with the heat dissipation box, a partition plate is fixedly connected inside the heat dissipation box, a plurality of cooling liquid cavities are formed in the partition plate at equal intervals, cooling liquid is placed in the cooling liquid cavities, at least one heat dissipation fan is fixedly connected to the rear end surface of the partition. The invention can achieve the aim of performing multiple times of college heat dissipation on the MOS tube through a simple structure, and well solves the defect of low heat dissipation efficiency of the MOS tube in the working process in the prior art.
Description
Technical Field
The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device suitable for MOS transistors.
Background
A mosfet (metal oxide semiconductor field effect transistor), i.e., a metal oxide semiconductor type field effect transistor, belongs to an insulated gate type in a field effect transistor. Therefore, MOS transistors are sometimes referred to as field effect transistors. In a general electronic circuit, a MOS transistor is generally used for an amplifying circuit or a switching circuit. In the power voltage regulator circuit on the main board, the MOSFET plays a role mainly in determining the voltage level, which is commonly expressed by "Q" plus a number on the main board.
The MOS tube is often applied to products such as an inverter power supply, a solar controller, a discharging instrument, a UPS power supply and the like, particularly, the MOS tube is required to be used for a high-power supply product, the MOS tube is a power device, the temperature is very high during normal work, an aluminum radiator is required to be used for radiating the MOS tube, meanwhile, the MOS tube and the aluminum radiator need to be in full contact, otherwise, poor heat radiation can be caused to cause faults.
Disclosure of Invention
The invention aims to solve the defect of low heat dissipation efficiency of an MOS tube in the working process in the prior art, and provides a heat dissipation device suitable for the MOS tube.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a heat abstractor suitable for MOS pipe, includes set casing and heat dissipation case, and the set casing comprises two L shape supports, and the appearance intracavity that two L shape supports formed is equipped with the MOS pipe, the inside fixedly connected with fin of set casing, and the MOS pipe rear side wall is hugged closely to the fin, and set casing rear end face through connection has the heat dissipation case, and the inside fixedly connected with baffle of heat dissipation case, baffle and fin vacuole formation have seted up a plurality of recesses on the baffle, each the recess activity grafting respectively has the heat dissipation strip, and a plurality of coolant liquid chambeies have been seted up to the equidistance on the baffle, and the coolant liquid has been placed to coolant liquid intracavity portion, and 3 heat dissipation fans of baffle rear end face fixedly connected with have.
Preferably, the fixed cover ring that has cup jointed of the other end of heat dissipation strip, the fixed lasso passes through support frame fixed connection, a lateral wall that two fixed lassos that are close to the set casing lateral wall kept away from mutually is the one end of fixedly connected with connecting strip respectively, the other end of connecting strip passes through slider sliding connection in the spout that set casing lateral wall was seted up, the one end of the back lateral wall fixedly connected with spliced pole of one of them connecting strip, the other end of spliced pole runs through the one end lateral wall that the baffle reachd opposite side and fixedly connected with annular rack, annular rack inside toothing is connected with lacks the gear, lack the gear and pass through axis of rotation fixedly connected with micro motor's output, micro motor passes through fixed bolster fixed connection.
Preferably, the through holes are distributed in an annular array, and the diameter of each through hole is 3-5 mm.
Preferably, the fixing shell, the radiating fins and the radiating strips are all made of aluminum sheets.
Preferably, the sliding block is elastically connected with the side wall of the sliding groove through a spring.
Preferably, the number of the heat dissipation bars is 6.
The heat dissipation device suitable for the MOS tube has the advantages that:
1. in the working process of the MOS tube, the peripheral heat of the MOS tube is quickly conducted to the outside through a fixed shell made of an aluminum sheet, and preliminary heat dissipation is carried out;
2. the radiating fins arranged inside the fixed shell carry out secondary heat radiation on the MOS tube, so that the heat radiation efficiency of the MOS tube is accelerated;
3. the heat dissipation strip is in circulating contact with and separated from the heat dissipation fins, heat on the heat dissipation fins is quickly transferred to cooling liquid in the partition plate through the heat dissipation strip, and then the heat dissipation fan is used for cooling, so that the effect of quickly dissipating heat of the MOS tube is achieved.
The invention can achieve the aim of performing multiple times of college heat dissipation on the MOS tube through a simple structure, and well solves the defect of low heat dissipation efficiency of the MOS tube in the working process in the prior art.
Drawings
Fig. 1 is a schematic front view of the present invention.
Fig. 2 is a schematic structural diagram of the present invention.
Fig. 3 is an enlarged view of the structure of part a.
Fig. 4 is an enlarged schematic view of the structure of the part B.
FIG. 5 is a schematic view of a cross-sectional structure of C-C.
In the figure: 1-MOS tube, 2-fixed shell, 3-radiating fin, 4-radiating box, 5-cooling liquid cavity, 6-radiating strip, 7-fixed ferrule, 8-supporting frame, 9-connecting strip, 10-sliding block, 11-spring, 12-radiating fan, 13-through hole, 14-connecting column, 15-annular rack, 16-missing gear, 17-rotating shaft and 18-motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, a heat dissipation device suitable for an MOS tube comprises a fixed shell 2 and a heat dissipation box 4, wherein the fixed shell 2 is composed of two L-shaped supports, the L-shaped supports can accurately limit and fix the MOS tube 1, the MOS tube 1 is arranged in a cavity formed by the two L-shaped supports, a heat dissipation sheet 3 is fixedly connected inside the fixed shell 2, the heat dissipation sheet 3 is tightly attached to the rear side wall of the MOS tube 1, and the heat dissipation sheet 3 is tightly attached to the rear side wall of the MOS tube 1 and can more rapidly conduct heat on the rear side wall of the MOS tube 1, so that the heat dissipation sheet is conducted to a heat dissipation strip 6 for heat dissipation; 2 rear end faces of set casing through connection have heat dissipation case 4, the inside fixedly connected with baffle of heat dissipation case 4, baffle and 3 vacuoles of fin, a plurality of recesses have been seted up on the baffle, each recess activity is pegged graft respectively has 6 heat dissipation strip 6, a plurality of coolant liquid chamber 5 have been seted up to the equidistance on the baffle, coolant liquid has been placed to coolant liquid chamber 5 inside, 1 at least heat dissipation fan 12 of baffle rear end face fixedly connected with, a plurality of through-holes 13 have been seted up to heat dissipation case 4 rear side wall, through-hole 13 is the annular array and distributes, and the diameter of through-hole 13 is 5mm, heat dissipation fan 12 and the coolant liquid chamber of heat dissipation case 4 inside set up can carry out further giving off with the heat on fin 3 and the set casing 2.
Fixed cover of the other end of heat dissipation strip 6 has been connect fixed lasso 7, fixed lasso 7 passes through 8 fixed connection of support frame, a lateral wall that two fixed lassos 7 that are close to the 2 lateral walls of set casing are kept away from mutually is the one end of fixedly connected with connecting strip 9 respectively, the other end of connecting strip 9 passes through slider 10 sliding connection in the spout that the 2 lateral walls of set casing were seted up, slider 10 passes through spring 11 elastic connection with the spout lateral wall, the rear side wall fixedly connected with spliced pole 14's of one of them connecting strip 9 one end, the other end of spliced pole 14 runs through the baffle and reachs the one end lateral wall of opposite side and fixedly connected with annular rack 15, annular rack 15 inside meshing is connected with lacks gear 16, it passes through the output of axis of rotation 17 fixedly connected with micro motor 18 to lack gear 16, micro.
The micro motor 18 drives the gear 16 to further engage the annular rack 15 to move so as to control the contact of the heat dissipation strip 6 with the heat dissipation plate 3 and the cooling liquid cavity 5 to conduct heat conduction.
The fixed shell 2, the radiating fins 3 and the radiating strips 6 are all made of aluminum sheets.
The working principle is as follows: in the working process of the MOS tube 1, the heat around the MOS tube 1 is quickly conducted to the outside through the fixing shell 2 made of an aluminum sheet, and preliminary heat dissipation is carried out; the radiating fins 3 arranged inside the fixed shell 2 carry out secondary heat radiation on the MOS tube 1, so that the heat radiation efficiency of the MOS tube 1 is improved; micro motor 18 switch on, start work, micro motor 18 drives axis of rotation 17 and rotates, and then it rotates to drive to lack gear 16, lack the inside tooth of gear 16 meshing annular rack 15, it reciprocates to drive annular rack 15, thereby utilize spliced pole 14 to drive connecting strip 9 and reciprocate, control heat dissipation strip 6 and 3 cyclic contact of fin and separation, in the heat on the fin 3 transmits the coolant liquid in the baffle through heat dissipation strip 6 fast, recycle heat dissipation fan 12 cools off, reach the quick radiating effect to MOS pipe 1.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The utility model provides a heat abstractor suitable for MOS pipe, includes set casing (2) and heat dissipation case (4), its characterized in that: the fixed shell (2) is composed of two L-shaped brackets, an MOS tube (1) is arranged in a cavity formed by the two L-shaped brackets, the interior of the fixed shell (2) is fixedly connected with a radiating fin (3), the radiating fin (3) is tightly attached to the rear side wall of the MOS tube (1), the rear end surface of the fixed shell (2) is connected with a heat dissipation box (4) in a run-through manner, a clapboard is fixedly connected inside the heat dissipation box (4), the clapboard and the radiating fins (3) form a cavity, the clapboard is provided with a plurality of grooves, each groove is movably inserted with a radiating strip (6), a plurality of cooling liquid cavities (5) are arranged on the partition plate at equal intervals, cooling liquid is placed in the cooling liquid cavities (5), the baffle rear end face fixedly connected with at least 1 heat dissipation fan (12), a plurality of through-holes (13) have been seted up to heat dissipation case (4) rear side wall.
2. The heat dissipation device of claim 1, wherein: the fixed cover of the other end of heat dissipation strip (6) has been connect fixed lasso (7), fixed lasso (7) is through support frame (8) fixed connection, is close to the one end of a lateral wall difference fixedly connected with connecting strip (9) that two fixed lassos (7) of set casing (2) lateral wall kept away from mutually, the other end of connecting strip (9) passes through slider (10) sliding connection in the spout that set casing (2) lateral wall was seted up, the one end of back lateral wall fixedly connected with spliced pole (14) of one of them connecting strip (9), the other end of spliced pole (14) runs through the baffle and reachs the one end lateral wall of opposite side and fixedly connected with annular rack (15), annular rack (15) inside toothing is connected with lacks gear (16), lack gear (16) through the output of axis of rotation (17) fixedly connected with micro motor (18), the micro motor (18) is fixedly connected to the side wall of the heat dissipation box (4) through a fixing support.
3. The heat dissipation device of claim 1, wherein: the through holes (13) are distributed in an annular array, and the diameter of each through hole (13) is 3-5 mm.
4. The heat dissipation device of claim 1, wherein: the fixed shell (2), the radiating fins (3) and the radiating strips (6) are all made of aluminum sheets.
5. The heat dissipation device of claim 2, wherein: the sliding block (10) is elastically connected with the side wall of the sliding groove through a spring (11).
6. The heat dissipation device of claim 1, wherein: the number of the heat dissipation strips (6) is 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810692172.8A CN108766945B (en) | 2018-06-29 | 2018-06-29 | Heat abstractor suitable for MOS pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810692172.8A CN108766945B (en) | 2018-06-29 | 2018-06-29 | Heat abstractor suitable for MOS pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108766945A CN108766945A (en) | 2018-11-06 |
| CN108766945B true CN108766945B (en) | 2020-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810692172.8A Active CN108766945B (en) | 2018-06-29 | 2018-06-29 | Heat abstractor suitable for MOS pipe |
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| Country | Link |
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| CN (1) | CN108766945B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114924378B (en) * | 2022-05-30 | 2023-10-27 | 深圳综合粒子设施研究院 | Mirror surface shape control structure and beam line device |
| CN116705724B (en) * | 2023-06-27 | 2024-03-22 | 先之科半导体科技(东莞)有限公司 | MOS transistor convenient to maintain and long in service life |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2708375Y (en) * | 2004-05-28 | 2005-07-06 | 陈鸿华 | Heat sink for notebook computer |
| JP4591699B2 (en) * | 2005-10-19 | 2010-12-01 | 信越化学工業株式会社 | Cover for heat-generating electronic parts and method of attaching the cover |
| CN104182012A (en) * | 2013-05-21 | 2014-12-03 | 鸿富锦精密工业（深圳）有限公司 | Radiator assembly |
| CN207067917U (en) * | 2017-08-01 | 2018-03-02 | 上海岂安信息科技有限公司 | A kind of server Special water cooling heat spreader structures |
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2018
- 2018-06-29 CN CN201810692172.8A patent/CN108766945B/en active Active
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| Publication number | Publication date |
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| CN108766945A (en) | 2018-11-06 |
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