CN110544870A - Sintering clamp and sintering method for high-power micro-channel structure bar laser - Google Patents
Sintering clamp and sintering method for high-power micro-channel structure bar laser Download PDFInfo
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- CN110544870A CN110544870A CN201810524808.8A CN201810524808A CN110544870A CN 110544870 A CN110544870 A CN 110544870A CN 201810524808 A CN201810524808 A CN 201810524808A CN 110544870 A CN110544870 A CN 110544870A
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- 238000005245 sintering Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 232
- 229910052738 indium Inorganic materials 0.000 claims description 16
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 16
- 230000008020 evaporation Effects 0.000 claims description 14
- 238000001704 evaporation Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000005484 gravity Effects 0.000 description 8
- 238000000149 argon plasma sintering Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000010025 steaming Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 241000238586 Cirripedia Species 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to a sintering clamp of a high-power microchannel structure bar laser and a sintering method thereof, belonging to the field of semiconductor laser manufacturing, wherein the sintering clamp comprises a positioning base, a heat sink pressing block and a bar pressing block, the positioning base comprises a first surface and a second surface, the first surface is used for placing the heat sink pressing block, the second surface is used for placing the bar pressing block, slopes facing the inside of the positioning base are arranged on the first surface and the second surface, and the slope of the first surface is vertical to the slope of the second surface; the bar pressing block width limiting groove is used for limiting the bar pressing block, and the bar pressing block contact surface correspond to the upper surface of the bar in size. The method can reduce or even avoid smile phenomenon, and improve the consistency and stability of bar sintering.
Description
Technical Field
The invention relates to a sintering clamp and a sintering method for a high-power micro-channel structure bar laser, and belongs to the field of semiconductor laser manufacturing.
Background
With the great improvement of the material epitaxy technology and the laser packaging technology, high-power laser diode devices and array devices are rapidly developed at home and abroad, become the main direction of the application and expansion of the current laser industry, have the advantages of small volume, high efficiency, low cost and the like, and are widely applied to the technical fields of laser medical treatment, industrial processing, military weapons, solid lasers, fiber laser pumping and the like. The output optical power, the photoelectric conversion efficiency and the reliability are three main parameters for measuring the performance of the laser, and the most important factor for limiting the development of the three is heat, which determines the output optical power of the laser, the photoelectric conversion efficiency and the reliability. Besides the properties of the semiconductor laser, the packaging quality of the laser is also a key factor influencing heat dissipation, and the welding between the laser and the heat sink is required to have the characteristics of firmness, no cavity, good heat conductivity, fatigue resistance, low heat resistance and the like. Therefore, the process and method of sintering a semiconductor laser onto a heat sink is one of the key technologies for high power semiconductor laser applications.
at present, most of packages of high-power microchannel bar lasers are sintered in reflow soldering equipment by using a sintering clamp, for example, in a bar chip sintering clamp of a high-power laser disclosed in Chinese patent document CN205282874U, five spring probes are used for applying pressure to the bar, and a thread and an adjustable bolt are arranged for adjusting the torque, but no reference standard exists in the process of adjusting balance to improve the smile effect, the torque of the five probes needs to be continuously adjusted, and the operation process is complex; in addition, the consistency of the bar sintering is difficult to guarantee, and the sintering yield may be influenced.
The bar sintering clamp proposed by "a sintering clamp of micro-channel semiconductor laser and sintering method thereof" disclosed in chinese patent document CN105244756A includes a positioning base and an adjustable cover plate, pressure is applied to the bar by adjusting a pressing block in the adjustable cover plate through a screw, the size of the pressing block is equal to the size of the bar, so as to ensure that the applied pressure is uniform, but it is difficult to ensure consistency of each pressing through the way of adjusting the pressure through the screw, i.e. repeatability of bar sintering is relatively low, unless quantitative pressing is performed through adjusting the screw by a torque screwdriver.
disclosure of Invention
the invention provides a sintering clamp of a high-power micro-channel structure bar laser and a sintering method thereof, which can reduce or even avoid smile phenomenon and improve the consistency and stability of bar sintering.
The invention adopts the following technical scheme:
on one hand, the invention provides a sintering clamp of a high-power micro-channel structure bar laser, which comprises a positioning base, a heat sink pressing block and a bar pressing block, wherein:
the positioning base comprises a first surface for placing the heat sink pressing block and a second surface for placing the bar pressing block, slopes facing the inside of the positioning base are arranged on the first surface and the second surface, the slopes of the first surface and the slopes of the second surface are mutually perpendicular, namely, the included angle between the slopes of the first surface and the slopes of the second surface is 90 degrees, the heat sink pressing block and the bar pressing block can be prevented from sliding in the pressure applying process, and the protruding amount of the bar light-emitting surface relative to the front end of the heat sink can be strictly controlled;
Be provided with on the first face be used for right the spacing wide spacing groove of heat sink briquetting, heat sink briquetting can slide in the wide spacing groove of heat sink briquetting and realize compressing tightly heat sink, be equipped with on the second face and be used for the spacing wide spacing groove of bar briquetting to bar briquetting, bar briquetting can slide in the wide spacing inslot of bar briquetting and realize compressing tightly the bar, when the sintering needs bigger pressure, can increase the weight of heat sink briquetting and bar briquetting and increase the pressure of exerting pressure, for exerting pressure evenly, bar briquetting and bar contact surface, with bar upper surface size corresponds.
according to the invention, preferably, in order to ensure that the heat sink pressing block applies pressure to the heat sink uniformly, the width of the contact surface between the heat sink pressing block and the heat sink corresponds to the width of the heat sink, the width of the heat sink pressing block is adapted to the width limiting groove of the heat sink pressing block, and the heat sink can be accurately positioned through two sides of the width limiting groove of the heat sink pressing block; the bottom surface of heat sink briquetting is provided with first cylinder pole, heat sink briquetting wide spacing inslot set up with the narrow spacing groove of heat sink briquetting of first cylinder pole matched with, the narrow spacing groove of heat sink briquetting is the slotted hole, and the diameter of first cylinder pole is preferred to be equivalent with the width of the narrow spacing groove of heat sink briquetting, and the two phase-match is spacing to heat sink briquetting, and first cylinder pole can slide in the narrow spacing inslot of heat sink briquetting and realize spacing to heat sink briquetting, carries on spacingly through the both sides of the wide spacing groove of heat sink briquetting and the first cylinder pole of heat sink briquetting to heat sink briquetting, guarantees that the gravity of heat sink briquetting evenly exerts on heat sink, realizes the accurate positioning to heat sink.
According to the invention, the batten pressing block is a cuboid, the trapezoidal pressing block with the size corresponding to the upper surface of the batten is arranged below the cuboid, so that the pressing is uniform, the middle part of the bottom surface of the batten pressing block is provided with the convex strip matched with the wide limiting groove of the batten pressing block, and the convex strip can slide in the wide limiting groove of the batten pressing block, so that the positioning is more accurate.
furthermore, two sides of the bottom surface of the bar pressing block are respectively provided with a second cylindrical rod, two sides of the bar pressing block wide limiting groove on the second surface are respectively provided with a bar pressing block narrow limiting groove used for being matched with the second cylindrical rods, the bar pressing block narrow limiting grooves are long round holes, the second cylindrical rods are preferably two symmetrically distributed rods, the diameters of the second cylindrical rods are preferably equal to the width of the bar pressing block narrow limiting groove, the bar pressing blocks are limited by matching the bar pressing block narrow limiting grooves and the bar pressing block narrow limiting grooves, the bar pressing block wide limiting groove and the bar pressing block narrow limiting groove are designed according to the sizes of the bar pressing block and the second cylindrical rods, the bar pressing block is placed on the upper surface of the front end of the heat sink under a microscope, the bar is adjusted to be in the middle position of the heat sink, the bar light-emitting surface is in close contact with the bar pressing block wide limiting groove surface, the bar pressing block is limited by the bar pressing block wide limiting groove and the bar narrow limiting groove, and the gravity of the bar pressing block is ensured to, the accurate positioning of the bars is realized.
Furthermore, the positioning base is L-shaped, the included angle between the slope of the first surface and the horizontal plane is 30 degrees, the included angle between the slope of the second surface and the horizontal plane is 60 degrees, and the 30-degree angle of the first surface provides a force parallel to the first surface downwards and vertical to the second surface for the heat sink so as to ensure that the heat sink is in close contact with the second surface; the 60 angle of the second face provides a vertical downward force on the bar to ensure adequate compression.
preferably, the first surface is provided with a heat sink limiting groove for limiting the heat sink, the heat sink limiting groove is positioned at the front end of the wide limiting groove of the heat sink pressing block, the heat sink is placed in the heat sink limiting groove, the front end of the heat sink pressing block is tightly attached to the wide limiting groove of the bar pressing block, the heat sink pressing block is placed in the wide limiting groove of the heat sink pressing block, meanwhile, the first cylindrical rod of the heat sink pressing block is inserted into the narrow limiting groove of the heat sink pressing block, the heat sink pressing block slides downwards along the wide limiting groove of the heat sink pressing block until the heat sink pressing block is contacted with the heat; the bar is placed on the upper surface of the front end of the heat sink, the light emitting surface of the bar is tightly attached to the wide limiting groove of the bar pressing block, the bar pressing block is placed in the wide limiting groove of the bar pressing block, meanwhile, the second cylindrical rod is inserted into the narrow limiting groove of the bar pressing block, the bar pressing block slides downwards along the wide limiting groove of the bar pressing block until contacting with the upper surface of the bar, the bar is pressed by the gravity of the bar pressing block, and good contact between the bar and the heat sink is guaranteed.
the width of the heat sink limiting groove is matched with that of the heat sink, the heat sink limiting groove is designed according to the size of the heat sink, the heat sink is placed in the heat sink limiting groove under a microscope, the front end of the heat sink is adjusted to be in close contact with the surface of the wide limiting groove of the bar pressing block, and the heat sink is accurately limited through two sides of the heat sink limiting groove.
preferably, the positioning base is made of stainless steel or aluminum material, and the heat sink pressing block and the batten pressing block are made of stainless steel material.
Preferably, the size of the contact surface of the bar pressing block and the N surface of the bar is equal to that of the bar, so that the pressing uniformity of the bar pressing block is ensured, and the surface of the bar pressing block, which is in contact with the N surface of the bar, is polished, so that the contact tightness of the bar pressing block and the surface of the bar pressing block is ensured.
in another aspect, the invention provides a sintering method of the sintering fixture for the bar laser with the high-power micro-channel structure, which includes:
step 1: the indium evaporation end is propped against the surface of a bar pressing block wide limiting groove, the heat sink pressing block is placed in the heat sink pressing block wide limiting groove, and the heat sink pressing block slides downwards along the heat sink pressing block wide limiting groove until the heat sink pressing block is propped against the tail end of the heat sink to position the heat sink;
step 2: placing the bar at a heat sink indium evaporation position, adjusting the bar to be positioned in the middle of a heat sink indium evaporation surface under a microscope, and enabling a light emitting surface of the bar to be close to the surface of a bar pressing block width limiting groove;
And step 3: placing a bar pressing block in a bar width limiting groove, wherein the bar pressing block slides downwards along the bar pressing block width limiting groove until the bar pressing block presses the N surface of the bar;
And 4, step 4: and placing the whole fixture in vacuum reflow soldering equipment, and loading the set sintering curve for sintering.
Further, in the step 1, the microchannel after indium evaporation is firstly placed in a heat sink limiting groove of the positioning base in a heat sink manner, and then the indium evaporation end is propped against the surface of the wide limiting groove of the bar pressing block;
In the step 1, a first cylindrical rod of a heat sink pressing block is inserted into a narrow limiting groove of the heat sink pressing block, and the heat sink pressing block slides downwards along a wide limiting groove of the heat sink pressing block until the first cylindrical rod abuts against the tail end of a heat sink to position the heat sink;
In the step 3, the second cylindrical rod of the bar pressing block is inserted into the narrow limiting groove of the bar pressing block, and the bar pressing block slides downwards along the wide limiting groove of the bar pressing block until pressing the N surface of the bar.
The invention has the beneficial effects that:
1) In the sintering clamp of the high-power micro-channel structure bar laser, the slope of the first surface and the slope of the second surface of the positioning base are perpendicular to each other, so that the sliding of the heat sink pressing block and the bar pressing block in the pressure applying process can be avoided, and the protruding amount of the bar light-emitting surface relative to the front end of the heat sink can be strictly controlled.
2) the sintering clamp for the high-power micro-channel structure batten laser has the advantages of simple structure, low cost, simplicity and convenience in operation and high reliability, the slope and the plurality of limiting grooves of the first surface and the second surface of the positioning base are used for limiting the heat sink pressing block and the batten pressing block, the heat sink can be accurately positioned through the limited heat sink pressing block, the limited batten pressing block can be accurately aligned to the N surface of the batten and evenly applies pressure to the batten through self gravity, and the consistency, uniformity and stability of the applied pressure are guaranteed.
3) In the sintering process, the limiting grooves designed according to the sizes of the bars and the heat sink are used for limiting each part, the heat sink pressing block and the bars pressing block are used for respectively positioning and pressing the heat sink and the bars by using the gravity of the heat sink pressing block and the bars pressing block during sintering, the pressing pressure can be adjusted by adjusting the weight of the bars pressing block during sintering, the contact surface of the bars pressing block and the bars corresponds to the size of the upper surface of the bars, the pressing is uniform, the consistency and the accuracy are ensured, the efficiency is improved, and the method is suitable for batch production.
4) the clamp can accurately position the heat sink and the bars, and the bar pressing block provides uniform pressure for sintering, so that sintering stress caused by uneven stress is avoided, and the smile phenomenon is reduced or even avoided.
5) The sintering fixture of the high-power micro-channel structure bar laser is matched with a packaging process, the packaging overall qualification rate is more than 98%, and sintering cavities are greatly reduced.
drawings
FIG. 1 is a schematic diagram of the overall structure of a high-power micro-channel structure bar laser sintering fixture of the present invention;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a schematic structural view of the positioning base in FIG. 1;
FIG. 4 is a schematic structural view of the heat-sinking compact of FIG. 1;
FIG. 5 is a schematic view of the structure of the barnacle compact of FIG. 1;
Wherein: 1-positioning base, 2-heat sink pressing block, 3-bar pressing block, 301-trapezoidal pressing block, 4-heat sink, 5-bar, 6-heat sink limiting groove, 7-heat sink pressing block wide limiting groove, 8-heat sink pressing block narrow limiting groove, 9-bar pressing block wide limiting groove, 901-convex strip, 10-bar pressing block narrow limiting groove, 11-first cylindrical rod and 12-second cylindrical rod.
the specific implementation mode is as follows:
in order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific examples, but not limited thereto, and the present invention is not described in detail and is in accordance with the conventional techniques in the art.
Example 1:
As shown in fig. 1-5, a sintering fixture for a high-power micro-channel structure bar laser comprises a positioning base 1, a heat sink pressing block 2 and a bar pressing block 3, wherein:
the positioning base 1 comprises a first surface for placing the heat sink pressing block 2 and a second surface for placing the bar pressing block 3, slopes facing the inside of the positioning base 1 are arranged on the first surface and the second surface, the slopes of the first surface and the slopes of the second surface are mutually perpendicular, namely, the included angle between the slopes of the first surface and the slopes of the second surface is 90 degrees, so that the heat sink pressing block 2 and the bar pressing block 3 can be prevented from sliding in the pressure applying process, and the protruding amount of the light emitting surface of the bar 5 relative to the front end of the heat sink 4 can be strictly controlled;
be provided with on the first face and be used for the wide spacing groove 7 of heat sink briquetting 2 spacing heat sink briquetting, heat sink briquetting 2 can slide in heat sink briquetting wide spacing groove 7 and realize compressing tightly heat sink 4, be equipped with on the second face and be used for the wide spacing groove 9 of bar briquetting 3 spacing bar briquetting, bar briquetting 3 can slide in bar briquetting wide spacing groove 9 and realize compressing tightly bar 5, when the sintering needs bigger pressure, can increase heat sink briquetting 2 and bar briquetting 3's weight and increase the pressure of exerting pressure, in order to exert pressure evenly, bar briquetting 3 and bar 5 contact surface, correspond with 5 upper surface dimensions of bar.
Example 2:
A high-power micro-channel structure bar laser sintering clamp is structurally as shown in embodiment 1, and is different in that in order to ensure that a heat sink pressing block 2 uniformly presses a heat sink 4, the width of the contact surface of the heat sink pressing block 2 and the heat sink 4 corresponds to the width of the heat sink 4, the width of the heat sink pressing block 2 is adapted to a width limiting groove 7 of the heat sink pressing block, and the heat sink 4 can be accurately positioned through two sides of the width limiting groove 7 of the heat sink pressing block; the bottom surface of heat sink briquetting 2 is provided with first cylinder pole 11, set up in the wide spacing groove 7 of heat sink briquetting with the narrow spacing groove 8 of heat sink briquetting 11 matched with of first cylinder pole 11, the narrow spacing groove 8 of heat sink briquetting is the slotted hole, the diameter of first cylinder pole 11 is preferred to be equivalent with the width of the narrow spacing groove 8 of heat sink briquetting, the two matches and carries on spacingly to heat sink briquetting 2, first cylinder pole 11 can slide in the narrow spacing groove 8 of heat sink briquetting and realize spacing to heat sink briquetting 2, the both sides of the first cylinder pole 11 through the wide spacing groove 7 of heat sink briquetting and 2 pieces of heat sink briquetting carry on spacingly to heat sink briquetting 2, guarantee that the gravity of heat sink briquetting 2 evenly exerts on heat sink 4, realize the accurate positioning to heat sink 4.
Example 3:
the utility model provides a high-power microchannel structure stick laser instrument sintering anchor clamps, the structure is as shown in embodiment 1, the difference is, stick briquetting 3 is the cuboid, the cuboid below is provided with the trapezoidal briquetting 301 that size and stick upper surface correspond, it is even to be convenient for exert pressure, the bottom surface middle part of stick briquetting 3 is provided with the sand grip 901 with the wide spacing groove 9 matched with of stick briquetting, sand grip 901 can slide in the wide spacing groove 9 of stick briquetting, make the location more accurate.
Example 4:
A sintering clamp of a high-power micro-channel structure bar laser is structurally shown in embodiment 3, and is different in that two sides of the bottom surface of a bar pressing block 3 are provided with second cylindrical rods 12, two sides of a bar pressing block wide limiting groove 9 on a second surface are provided with bar pressing block narrow limiting grooves 10 matched with the second cylindrical rods 12, the bar pressing block narrow limiting grooves 10 are long round holes, the second cylindrical rods 12 are preferably symmetrically distributed, the diameters of the second cylindrical rods are preferably equal to the width of the bar pressing block narrow limiting grooves 10, the bar pressing block narrow limiting grooves 10 and the bar pressing block narrow limiting grooves are matched to limit the bar pressing block 3, the bar pressing block wide limiting groove 9 and the bar pressing block narrow limiting groove 10 are designed according to the sizes of the bar pressing block 5 and the second cylindrical rods 12, the bar pressing block 5 is placed on the upper surface of the front end of a heat sink 4 under a microscope, the bar pressing block 5 is adjusted to be in the middle position of the heat sink 4, and a light emitting surface of the bar pressing block 5 is in close contact with the, the batten pressing blocks 3 are limited through the batten pressing block wide limiting grooves 9 and the batten pressing block narrow limiting grooves 10, the fact that the gravity of the batten pressing blocks 3 is evenly applied to the batten 5 is guaranteed, and accurate positioning of the batten 5 is achieved.
example 5:
a high-power micro-channel structure bar laser sintering clamp is structurally shown as an embodiment 1, and is different in that a positioning base 1 is preferably L-shaped, an included angle between a slope of a first surface and a horizontal plane is 30 degrees, an included angle between a slope of a second surface and the horizontal plane is 60 degrees, and a 30-degree angle of the first surface provides a force parallel to the first surface and downward and vertical to the second surface for a heat sink 4 so as to ensure that the heat sink 4 is in close contact with the second surface; the angle of 60 of the second face provides a vertical downward force to the bar 5 to ensure adequate compression.
example 6:
a high-power micro-channel structure bar laser sintering clamp is structurally as shown in embodiment 1, and is different in that a heat sink limiting groove 6 for limiting a heat sink is arranged on a first surface, the heat sink limiting groove 6 is positioned at the front end of a heat sink pressing block wide limiting groove 7, a heat sink 5 is placed in the heat sink limiting groove 6, the front end of the heat sink pressing block wide limiting groove 9 is tightly attached to the bar pressing block wide limiting groove 9, a heat sink pressing block 2 is placed in the heat sink pressing block wide limiting groove 7, meanwhile, a first cylindrical rod 11 of the heat sink pressing block 2 is inserted into a heat sink pressing block narrow limiting groove 8, the heat sink pressing block 2 slides downwards along the heat sink pressing block wide limiting groove 7 until the heat sink pressing block is contacted with a heat sink 4, and the; the bar 5 is placed on the upper surface of the front end of the heat sink 4, the light-emitting surface of the bar 5 is tightly attached to the bar pressing block wide limiting groove 9, the bar pressing block 3 is placed in the bar pressing block wide limiting groove 9, meanwhile, the second cylindrical rod 12 is inserted into the bar pressing block narrow limiting groove 10, the bar pressing block 3 slides downwards along the bar pressing block wide limiting groove 9 until contacting with the upper surface of the bar 5, the bar 5 is pressed by the gravity of the bar pressing block 3, and good contact between the bar 5 and the heat sink 4 is guaranteed. The width of the heat sink limiting groove 6 is adapted to the width of the heat sink 4, the heat sink 4 is placed into the heat sink limiting groove 6 under a microscope according to the size of the heat sink 4, the front end of the heat sink 4 is adjusted to be in close contact with the surface of the batten pressing block width limiting groove 9, and the heat sink 4 is accurately limited by the two sides of the heat sink limiting groove 6.
Example 7:
A bar laser sintering clamp with a high-power micro-channel structure is structurally shown in embodiment 1, and is different in that a positioning base 1 is made of stainless steel or aluminum materials, and a heat sink pressing block 2 and a bar pressing block 3 are made of stainless steel materials; the surface of the batten pressing block 3, which is in contact with the N surface of the batten 1, is polished to ensure the contact tightness of the batten pressing block and the batten.
example 8:
A sintering method of a sintering clamp of a high-power micro-channel structure bar laser comprises the following steps:
step 1: the indium evaporation end is propped against the surface of the bar pressing block width limiting groove 9, the heat sink pressing block 2 is placed in the heat sink pressing block width limiting groove 7, and the heat sink pressing block 2 slides downwards along the heat sink pressing block width limiting groove 7 until the heat sink pressing block is propped against the tail end of the heat sink 4 to position the heat sink 4;
step 2: placing the bar 5 at a heat sink indium steaming position, adjusting the bar to be positioned in the middle of a heat sink indium steaming surface under a microscope, and enabling a light emitting surface of the bar 5 to be close to the surface of a bar pressing block width limiting groove 9;
And step 3: placing the batten pressing block 3 in the batten pressing block wide limiting groove 9, and sliding the batten pressing block 3 along the batten pressing block wide limiting groove 9 until the batten pressing block is pressed on the N surface of the batten 5;
And 4, step 4: and placing the whole fixture in vacuum reflow soldering equipment, and loading the set sintering curve for sintering.
Example 9:
A sintering method of a bar laser sintering clamp with a high-power microchannel structure is disclosed as an embodiment 9, and is different in that in the step 1, a microchannel subjected to indium evaporation is firstly placed in a heat sink limiting groove 6 of a positioning base 1 in a heat sinking mode, and then an indium evaporation end is propped against the surface of a bar pressing block width limiting groove 9;
in the step 1, a first cylindrical rod 11 of a heat sink pressing block 2 is inserted into a narrow limiting groove 8 of the heat sink pressing block, and the heat sink pressing block 2 slides downwards along a wide limiting groove 7 of the heat sink pressing block until the first cylindrical rod abuts against the tail end of a heat sink 4 to position the heat sink 4;
In the step 3, the second cylindrical rod 12 of the batten pressing block 3 is firstly inserted into the batten pressing block narrow limiting groove 10, and the batten pressing block 3 slides down along the batten pressing block wide limiting groove 9 until the batten pressing block is pressed on the N surface of the batten 5.
Comparative example 1:
Chinese patent document CN105244756A discloses "a sintering jig for a microchannel semiconductor laser and a sintering method thereof", and the sintering environment is the same as that of example 1.
The sintering fixture of the high-power micro-channel structure bar laser is matched with a packaging process, the packaging overall qualification rate is more than 98%, the occurrence of sintering cavities can be greatly reduced, the sintering quality is verified through ultrasonic scanning, and the data comparison shown in the table 1 is obtained:
TABLE 1
| bar number | sintered void ratio of comparative document 1 | sintered voidage of example 1 |
| 1 | 3.3％ | 0.9％ |
| 2 | 2.9％ | 0.6％ |
| 3 | 3.2％ | 0.5％ |
| 4 | 3％ | 0.8％ |
| 5 | 3.3％ | 0.7％ |
| 6 | 2.5％ | 0.9％ |
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. a sintering clamp for a high-power micro-channel structure bar laser is characterized by comprising a positioning base, a heat sink pressing block and a bar pressing block, wherein the positioning base comprises a first surface and a second surface, the first surface is used for placing the heat sink pressing block, the second surface is used for placing the bar pressing block, slopes facing the inside of the positioning base are arranged on the first surface and the second surface, and the slope of the first surface is perpendicular to the slope of the second surface;
The bar pressing block width limiting groove is used for limiting the bar pressing block, and the bar pressing block and the bar contact surface correspond to the upper surface of the bar in size.
2. the sintering fixture for the high-power micro-channel structure bar laser of claim 1, wherein the width of the contact surface of the heat sink pressing block and the heat sink corresponds to the width of the heat sink, a first cylindrical rod is arranged on the bottom surface of the heat sink pressing block, a narrow heat sink pressing block limiting groove matched with the first cylindrical rod is arranged in the wide heat sink pressing block limiting groove, and the narrow heat sink pressing block limiting groove is a long circular hole.
3. The sintering fixture for the high-power micro-channel structure bar laser device as claimed in claim 1, wherein the bar pressing block is a cuboid, a trapezoidal pressing block corresponding to the upper surface of the bar is arranged below the cuboid, and a protruding strip matched with the wide limiting groove of the bar pressing block is arranged in the middle of the bottom surface of the bar pressing block.
4. the sintering fixture for the high-power micro-channel structure bar laser as claimed in claim 3, wherein the bar pressing block is provided with second cylindrical rods on both sides of the bottom surface, narrow limiting grooves for the bar pressing block to be matched with the second cylindrical rods are provided on both sides of the wide limiting groove of the bar pressing block on the second surface, and the narrow limiting grooves for the bar pressing block are slotted holes.
5. The sintering fixture of high-power microchannel structure bar laser as claimed in claim 1, wherein the positioning base is L-shaped, the included angle between the slope of the first surface and the horizontal plane is 30 °, and the included angle between the slope of the second surface and the horizontal plane is 60 °.
6. The sintering fixture for the high-power micro-channel structure bar laser device as claimed in claim 1, wherein a heat sink limiting groove for limiting the heat sink is disposed on the first surface, and the width of the heat sink limiting groove is adapted to the width of the heat sink.
7. the sintering fixture for high-power micro-channel structure bar laser of claim 1, wherein the positioning base is made of stainless steel or aluminum material, and the heat sink pressing block and the bar pressing block are made of stainless steel material.
8. The sintering fixture for bar lasers with high power and microchannel structures as claimed in claim 1, wherein the surface of the bar pressing block contacting with the N-face of the bar is polished.
9. the sintering method of the sintering fixture for the high-power micro-channel structure bar laser device as claimed in any one of claims 1 to 8, comprising the following steps:
Step 1: pushing an indium evaporation end against the surface of the bar pressing block wide limiting groove, placing the heat sink pressing block in the heat sink pressing block wide limiting groove, and enabling the heat sink pressing block to slide downwards along the heat sink pressing block wide limiting groove until the indium evaporation end abuts against the tail end of the heat sink to position the heat sink;
Step 2: placing the bar at a heat sink indium evaporation position, adjusting the bar to be positioned in the middle of a heat sink indium evaporation surface under a microscope, and enabling a light emitting surface of the bar to be close to the surface of a bar pressing block width limiting groove;
And step 3: placing a bar pressing block in a bar pressing block width limiting groove, wherein the bar pressing block slides downwards along the bar pressing block width limiting groove until the bar pressing block presses the N surface of the bar;
And 4, step 4: and placing the whole fixture in vacuum reflow soldering equipment, and loading the set sintering curve for sintering.
10. The sintering method of the sintering fixture of the bar laser with the high-power microchannel structure according to claim 9, wherein in the step 1, the microchannel after indium evaporation is firstly heat-deposited and placed in a heat sink limiting groove of a positioning base, and then the end of the indium evaporation is propped against the surface of a bar pressing block width limiting groove;
in the step 1, a first cylindrical rod of a heat sink pressing block is inserted into a narrow limiting groove of the heat sink pressing block, and the heat sink pressing block slides downwards along a wide limiting groove of the heat sink pressing block until the first cylindrical rod abuts against the tail end of a heat sink to position the heat sink;
In the step 3, the second cylindrical rod of the bar pressing block is inserted into the narrow limiting groove of the bar pressing block, and the bar pressing block slides downwards along the wide limiting groove of the bar pressing block until pressing the N surface of the bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810524808.8A CN110544870A (en) | 2018-05-28 | 2018-05-28 | Sintering clamp and sintering method for high-power micro-channel structure bar laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810524808.8A CN110544870A (en) | 2018-05-28 | 2018-05-28 | Sintering clamp and sintering method for high-power micro-channel structure bar laser |
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| Publication Number | Publication Date |
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| CN110544870A true CN110544870A (en) | 2019-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810524808.8A Pending CN110544870A (en) | 2018-05-28 | 2018-05-28 | Sintering clamp and sintering method for high-power micro-channel structure bar laser |
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| CN (1) | CN110544870A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513769A (en) * | 2022-11-16 | 2022-12-23 | 度亘激光技术（苏州）有限公司 | Semiconductor laser packaging equipment and method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195376B1 (en) * | 1998-03-31 | 2001-02-27 | Opto Power Corporation | Semiconductor laser array stack package & method of fabrication |
| CN201374497Y (en) * | 2009-03-04 | 2009-12-30 | 中国电子科技集团公司第十三研究所 | Mounting clamp with micro-passage laser |
| CN104368891A (en) * | 2013-08-16 | 2015-02-25 | 东方强光（北京)科技有限公司 | Lamination sintering clamp for laser array units |
| CN105428994A (en) * | 2015-12-21 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-power laser strip-type chip sintering clamp |
| CN106129793A (en) * | 2016-08-11 | 2016-11-16 | 南京伏尔甘光电科技有限公司 | A kind of DPL pulse laser side pump housing |
| CN106981820A (en) * | 2016-09-22 | 2017-07-25 | 道中道激光科技有限公司 | High power laser diode palladium bar sealing weld clamp |
| CN208336807U (en) * | 2018-05-28 | 2019-01-04 | 山东华光光电子股份有限公司 | A kind of high-power microchannel structure bar laser sintering fixture |
-
2018
- 2018-05-28 CN CN201810524808.8A patent/CN110544870A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195376B1 (en) * | 1998-03-31 | 2001-02-27 | Opto Power Corporation | Semiconductor laser array stack package & method of fabrication |
| CN201374497Y (en) * | 2009-03-04 | 2009-12-30 | 中国电子科技集团公司第十三研究所 | Mounting clamp with micro-passage laser |
| CN104368891A (en) * | 2013-08-16 | 2015-02-25 | 东方强光（北京)科技有限公司 | Lamination sintering clamp for laser array units |
| CN105428994A (en) * | 2015-12-21 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-power laser strip-type chip sintering clamp |
| CN106129793A (en) * | 2016-08-11 | 2016-11-16 | 南京伏尔甘光电科技有限公司 | A kind of DPL pulse laser side pump housing |
| CN106981820A (en) * | 2016-09-22 | 2017-07-25 | 道中道激光科技有限公司 | High power laser diode palladium bar sealing weld clamp |
| CN208336807U (en) * | 2018-05-28 | 2019-01-04 | 山东华光光电子股份有限公司 | A kind of high-power microchannel structure bar laser sintering fixture |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513769A (en) * | 2022-11-16 | 2022-12-23 | 度亘激光技术（苏州）有限公司 | Semiconductor laser packaging equipment and method |
| CN115513769B (en) * | 2022-11-16 | 2023-03-10 | 度亘激光技术（苏州）有限公司 | Semiconductor laser packaging equipment and method |
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