CN211465116U - General type laser heat sink reflow soldering device - Google Patents
General type laser heat sink reflow soldering device Download PDFInfo
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- CN211465116U CN211465116U CN201921910923.5U CN201921910923U CN211465116U CN 211465116 U CN211465116 U CN 211465116U CN 201921910923 U CN201921910923 U CN 201921910923U CN 211465116 U CN211465116 U CN 211465116U
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- heat sink
- elastic
- block
- laser heat
- wedge
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Abstract
The utility model relates to a general type laser heat sink reflow soldering device belongs to the laser instrument field, on the base around the laser heat sinks, through elasticity clamping sleeve with electrode slice clamping module to and wedge heat sink locking module with the laser heat sink locking, the locking position can be adjusted according to the laser heat sink specification. Meanwhile, the elastic slide block on the elastic clamping sleeve ensures that the elastic top block on the elastic clamping sleeve always applies uniform and reliable elastic clamping force to the electrode plate when the temperature is subjected to the change process of 'room temperature-200 ℃ -room temperature', so that soldering tin is uniformly distributed on the contact surface of the electrode plate and the laser heat sink, and the welding reliability and the welding quality are ensured.
Description
Technical Field
The invention belongs to the field of lasers, and relates to a universal laser heat sink reflow soldering device.
Background
Laser heat sink reflow soldering is an important link in the assembly process of lasers with various specifications, and the quality of the laser heat sink reflow soldering directly influences the working stability and performance of the lasers.
The clamping force of the existing heat sink reflow soldering device on the heat sink electrode plate is uneven and difficult to control, the welding quality is unreliable, the consistency of repeated welding is difficult to guarantee, meanwhile, the heat sink has various configurations and sizes, and the universality of the existing reflow soldering device is not strong. In order to ensure the quality of laser heat sink reflow soldering and save cost, the universality, reliability and soldering consistency of the heat sink reflow soldering device need to be further improved.
Disclosure of Invention
Technical problem to be solved
In order to avoid the defects of the prior art, the invention provides a universal laser heat sink reflow soldering device, which solves the requirements of multiple lasers on the universality, reliability and soldering consistency of the laser heat sink reflow soldering device.
Technical scheme
A general type laser heat sink reflow soldering device is characterized by comprising a base 1, an elastic clamping sleeve 2, a first screw 7, a first wedge-shaped locking block 8, a second wedge-shaped locking block 9, a second screw 10 and an electrode plate clamping module 11; two opposite electrode plate clamping modules 11 are arranged in the middle of the base 1 and are in sliding fit with T-shaped grooves in opposite positions on the base 1 through T-shaped structures at the lower ends, a plurality of elastic clamping sleeves 2 are arranged on the outer sides of the electrode plate clamping modules 11, and the elastic clamping sleeves 2 are located in arc-shaped grooves of the base 1; the other two sides are provided with second wedge-shaped locking blocks 9, and the first wedge-shaped locking blocks 8 pass through the second wedge-shaped locking blocks 9 through first screws 7 to be fixed with the base 1; two sides of the second wedge-shaped locking block 9 are respectively provided with an elastic clamping sleeve 2; the elastic clamping sleeve 2 is fixed with the base through a second screw 10; when the laser welding fixture works, the laser heat sink of the laser is arranged in the middle of the base 1, the elastic clamping sleeve 2 is adjusted to clamp the electrode plate clamping module 11 along the T-shaped sliding groove from two sides, and then the second screw 10 is screwed down; the other two sides are fastened by a second wedge-shaped locking block 9 and then fixed on the base 1 by a first screw 7 through a first wedge-shaped locking block 8.
The elastic clamping sleeve 2 comprises a threaded pressing block 3, a spring 4, an elastic sliding block 5 and an elastic jacking block 6; the elastic ejecting block 6 is installed in the elastic sliding block 5 through threaded connection, and the elastic ejecting block 6 is pressed into the elastic clamping sleeve 2 through the threaded pressing block 3 and the spring 4.
And an elastic block is arranged at the joint of the electrode plate clamping module 11 and the laser heat sink block of the laser.
The outer side of the electrode plate clamping module 11 is provided with three elastic clamping sleeves 2.
Advantageous effects
The invention provides a universal laser heat sink reflow soldering device, which belongs to the field of lasers. Meanwhile, the elastic slide block on the elastic clamping sleeve ensures that the elastic top block on the elastic clamping sleeve always applies uniform and reliable elastic clamping force to the electrode plate when the temperature is subjected to the change process of 'room temperature-200 ℃ -room temperature', so that soldering tin is uniformly distributed on the contact surface of the electrode plate and the laser heat sink, and the welding reliability and the welding quality are ensured.
The advantages are that:
1. the laser can be quickly locked by heat sink, the clamping force of reflow soldering is uniform and adjustable, and the locking reliability is high;
2. the heat sink electrode plate can be clamped quickly, the clamping is reliable, and the clamping force is uniform;
3. the universality is strong, and the method can be suitable for the heat sink reflow soldering of a multi-type laser; the requirements of the multi-type laser on the universality, the reliability and the welding consistency of the laser heat sink reflow soldering device can be met.
4. The structure design is simple, the processing and the production are easy, and the production cost is lower.
Drawings
FIG. 1: the front structure schematic diagram of the general laser heat sink reflow soldering device;
FIG. 2: the back structure schematic diagram of the general laser heat sink reflow soldering device;
FIG. 3: the general laser heat sink reflow soldering device is a wedge-shaped heat sink locking structure schematic diagram;
wherein: 1-a base; 2-an elastic clamping sleeve; 3-pressing the screw thread block; 4-a spring; 5-an elastic sliding block; 6-elastic top block; 7-a first screw; 8-a first wedge-shaped locking block; 9-a second wedge-shaped locking block; 10-a second screw; and 11, electrode plate clamping module.
Detailed Description
The invention will now be further described with reference to the following examples and drawings:
the general laser heat sink reflow soldering device of the embodiment. The clamping module with the elastic adjustable electrode plates, the base with the T-shaped sliding groove and the wedge-shaped heat sink locking module are adopted, and the clamping module is suitable for the heat sink reflow soldering of the multi-type laser array. By utilizing the device, the laser heat sink used by the existing multi-type laser can be quickly locked, and the stress of the electrode plate of the laser heat sink in the reflow soldering process is ensured to be reliable and uniform.
The universal laser heat sink reflow soldering device adopts a plurality of adjustable clamping modules, a base with T-shaped sliding grooves and a wedge-shaped locking module. The electrode plate clamping device is composed of a base 1, eight elastic clamping sleeves 2, two first wedge-shaped locking blocks 8, two second wedge-shaped locking blocks 9, a plurality of first screws 7, a plurality of second screws 10 and two electrode plate clamping modules.
The elastic clamping sleeve 2 comprises a threaded pressing block 3, a spring 4, an elastic sliding block 5 and an elastic jacking block 6; the elastic ejecting block 6 is installed in the elastic sliding block 5 through threaded connection, and the elastic ejecting block 6 is pressed into the elastic clamping sleeve 2 through the threaded pressing block 3 and the spring 4.
The elastic clamping sleeve 2 is arranged in the arc-shaped groove of the base 1 and is fastened on the base 1 through a second screw 10. The first wedge block 8 and the second wedge block 9 are fastened to the base 1 by means of first screws 7.
The base 1 is provided with a T-shaped sliding groove, the electrode plate clamping module is arranged in the T-shaped sliding groove, the elastic clamping sleeve 2 enables the electrode plate clamping module to move, and therefore the electrode plate clamping device is suitable for different clamping positions of heat sink electrode plates of various configurations and has high adaptability.
The initial compression amount of the spring 4 can be adjusted by adjusting the screwing depth of the thread pressing block 3 in the elastic clamping sleeve 2, so that the clamping force of the elastic jacking block 6 on the electrode plate can be adjusted.
And an elastic block is arranged at the joint of the electrode plate clamping module 11 and the laser heat sink block of the laser.
The second wedge-shaped locking block 9 is provided with a waist-shaped sliding groove, and the position of the second wedge-shaped locking block 9 along the waist-shaped sliding groove can be adjusted by adjusting the screwing depth of the first screw 7 and the screw thread of the base 1, so that the heat sinks with different sizes can be reliably clamped.
When in work:
locking a laser heat sink block of a laser: the laser heat sink of the laser is arranged at the approximate center of the base, the heat sink locking block is in an active state at the moment, and the second wedge-shaped locking block 9 can lock the heat sink after the first screw 7 is screwed to a certain depth by increasing the screwing depth of the first screw on the base 1.
Electrode slice clamping module: electrode slice clamping modules at corresponding positions are installed through a T-shaped sliding groove in the base 1 as required, the positions of the electrode slice clamping modules in the T-shaped sliding groove are adjusted, and when an elastic ejector block on the electrode slice clamping module 11 is in contact with an electrode slice on a laser heat sink, the elastic adjustable electrode slice clamping modules are fastened from the bottom of the base 1 through second screws 10.
Laser heat sink reflow soldering: and putting the clamped laser heat sink and the laser heat sink reflow soldering device into reflow soldering equipment, wherein the temperature can be changed from room temperature to 200-room temperature in the reflow soldering process of the laser heat sink. In the process, the elastic jacking block applies uniform and reliable elastic clamping force to the electrode plate all the time, so that the soldering tin is uniformly distributed on the contact surface of the electrode plate and the laser heat sink, and the welding reliability and the welding quality are ensured.
Disassembling the laser heat sink: after the laser heat sink reflow soldering of the laser is finished, firstly, the fastening of the elastic adjustable electrode plate clamping module is cancelled by loosening the second screw 10, and the elastic adjustable electrode plate clamping module slides out along the T-shaped sliding groove of the base 1. At this time, the locking of the second wedge-shaped locking block 9 to the laser heat sink is released by loosening the first screw 7. And the laser heat sink with the welded electrode plate can be taken out.
The invention has higher adjustability and universality, and the adopted elastic adjustable electrode plate clamping module and the heat sink locking block have small volume, simple structure and convenient assembly and adjustment, and can be widely used in the design of the clamping device.
Claims (4)
1. A general type laser heat sink reflow soldering device is characterized by comprising a base (1), an elastic clamping sleeve (2), a first screw (7), a first wedge-shaped locking block (8), a second wedge-shaped locking block (9), a second screw (10) and an electrode plate clamping module (11); two opposite electrode plate clamping modules (11) are arranged in the middle of the base (1), and are in sliding fit with T-shaped grooves in opposite positions on the base (1) through a T-shaped structure at the lower end, a plurality of elastic clamping sleeves (2) are arranged on the outer sides of the electrode plate clamping modules (11), and the elastic clamping sleeves (2) are positioned in arc-shaped grooves of the base (1); the other two sides of the base are provided with second wedge-shaped locking blocks (9), and the first wedge-shaped locking blocks (8) penetrate through the second wedge-shaped locking blocks (9) through first screws (7) to be fixed with the base (1); two sides of the second wedge-shaped locking block (9) are respectively provided with an elastic clamping sleeve (2); the elastic clamping sleeve (2) is fixed with the base through a second screw (10); when the laser clamping device works, the laser heat sink of the laser is arranged in the middle of the base (1), the elastic clamping sleeve (2) is adjusted to clamp the electrode plate clamping module (11) from two sides along the T-shaped sliding groove, and then the second screw (10) is screwed; and the other two sides are fastened by a second wedge-shaped locking block (9) and then fixed on the base (1) by a first screw (7) through a first wedge-shaped locking block (8).
2. The general type laser heat sink reflow soldering apparatus according to claim 1, wherein: the elastic clamping sleeve (2) comprises a threaded pressing block (3), a spring (4), an elastic sliding block (5) and an elastic jacking block (6); the elastic ejecting block (6) is installed into the elastic sliding block (5) through threaded connection, and the elastic ejecting block (6) is pressed into the elastic clamping sleeve (2) through the threaded pressing block (3) and the spring (4).
3. The general type laser heat sink reflow soldering apparatus according to claim 1, wherein: and an elastic block is arranged at the joint of the electrode plate clamping module (11) and the laser heat sink block of the laser.
4. The general type laser heat sink reflow soldering apparatus according to claim 1, wherein: the electrode plate clamping module (11) is provided with a plurality of elastic clamping sleeves (2) in the number of three on the outer side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921910923.5U CN211465116U (en) | 2019-11-07 | 2019-11-07 | General type laser heat sink reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921910923.5U CN211465116U (en) | 2019-11-07 | 2019-11-07 | General type laser heat sink reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211465116U true CN211465116U (en) | 2020-09-11 |
Family
ID=72367256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921910923.5U Active CN211465116U (en) | 2019-11-07 | 2019-11-07 | General type laser heat sink reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211465116U (en) |
-
2019
- 2019-11-07 CN CN201921910923.5U patent/CN211465116U/en active Active
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