CN214349048U - Ultra-thin heat conduction paster levelling tool - Google Patents

Abstract

The utility model discloses an ultrathin heat conduction patch leveling jig, which comprises a base; two side plates are vertically arranged at the top of the base; the upper parts of the opposite sides of the two side plates are connected through an upper mounting plate; the left end and the right end of the upper mounting plate are respectively provided with a screw through hole; a cylindrical head screw penetrates through each screw through hole; the bottom of a polished rod of each cylindrical head screw is fixedly connected with the left end and the right end of the leveling upper pressure plate; the leveling upper pressing plates are longitudinally distributed and are positioned right below the upper mounting plate; a connecting beam is fixed in the middle of the top of the leveling upper pressure plate; an elbow clip is arranged at the center of the upper mounting plate; the lower end part of the pressing rod of the elbow clamp is fixed with a connecting beam; a leveling bottom plate is arranged below the leveling upper pressure plate; the top of levelling bottom plate is provided with ultra-thin heat conduction paster standing groove. The utility model discloses can make things convenient for, the ultra-thin heat conduction paster of small deformation, uneven problem appears in the external surface reliably levels, realizes the adjustment of ultra-thin heat conduction paster plane degree.

Description

Ultra-thin heat conduction paster levelling tool

Technical Field

The utility model relates to a manufacturing technical field of ultra-thin heat conduction paster especially relates to an ultra-thin heat conduction paster levelling tool.

Background

With the rapid development of microelectronic technology and the increasing integration level and performance of chips, the heat dissipation capacity of more and more high-power chips has a continuously increasing trend. If the heat generated during the operation of the chip can not be dissipated in time, the working stability of the chip is affected, the mean time without failure is reduced, and the chip can be even burnt out in severe cases. Meanwhile, the movement of the transistors of different functional modules in the chip can cause the generation of heat with uneven height, and then a hot spot area which changes along with time and space appears in the chip, and the hot spot can bring greater damage to the chip. However, the trend of miniaturization and integration of chips is not changed, and the heat dissipation problem of chips is becoming more serious.

At present, the most effective means is that the ultrathin heat conducting patch manufactured by utilizing the phase change principle can strongly control the temperature of a discrete local heat source hot area.

For the ultrathin heat conducting patch, the flatness of the ultrathin heat conducting patch has great influence on the heat conducting performance of a product, and when the flatness is large, the ultrathin heat conducting patch cannot realize good surface contact with a heat source and a heat radiating fin, so that the heat radiating performance is greatly reduced.

However, in the manufacturing process of the existing ultrathin heat conducting patch, due to the technical limitation of the current processing and manufacturing, the outer surface of the produced ultrathin heat conducting patch has the problems of small deformation and unevenness, so that the heat dissipation performance of the ultrathin heat conducting patch product is influenced, and the attractiveness of the product is also influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an ultra-thin heat conduction paster levelling tool to the technical defect that prior art exists.

Therefore, the utility model provides an ultrathin heat conduction patch leveling jig, which comprises a base;

two lateral plates which are transversely spaced are vertically arranged at the top of the base;

the two side plates are distributed in bilateral symmetry;

the upper parts of the opposite sides of the two side plates are connected through an upper mounting plate which is transversely distributed;

wherein, the left end and the right end of the upper mounting plate are respectively provided with a vertically through screw through hole;

a cylindrical head screw penetrates through each screw through hole;

the screw cap of each cylindrical head screw is positioned right above the upper mounting plate;

the bottom of a polished rod of each cylindrical head screw is positioned right below the upper mounting plate;

the bottom of a polished rod of each cylindrical head screw is fixedly connected with the middle parts of the left end and the right end of a leveling upper pressure plate;

the polished rod of each cylindrical head screw is sleeved with a spiral round wire spring, and the part of the outer wall of the polished rod of each cylindrical head screw is positioned between the screw cap of the cylindrical head screw and the top surface of the upper mounting plate;

the leveling upper pressing plates are longitudinally distributed and are positioned right below the upper mounting plate;

the middle part of the top of the leveling upper pressure plate is fixedly provided with connecting beams which are longitudinally distributed;

wherein, the center of the upper mounting plate is provided with an elbow clip mounting hole which is vertically penetrated;

the elbow clip is arranged on the elbow clip mounting hole;

the lower end part of a pressing rod of the elbow clamp is fixedly connected with the central position of the connecting beam;

the elbow clamp is provided with a handle which is positioned above the upper mounting plate;

wherein, a leveling bottom plate which is longitudinally distributed is arranged below the leveling upper pressure plate;

the middle part of the top of the leveling bottom plate is provided with at least one transversely-distributed and concave ultrathin heat conducting patch placing groove for placing ultrathin heat conducting patches to be leveled;

and the ultrathin heat conduction patch placing groove is positioned right below the leveling upper pressing plate.

Preferably, a positioning pin accommodating hole is formed in each of the rear side of the left end and the front side of the right end of the top of the leveling bottom plate;

each positioning pin accommodating hole is inserted with a positioning pin;

the left end and the right end of the leveling upper pressure plate are respectively provided with a positioning pin positioning groove at the position corresponding to each positioning pin.

Preferably, the upper end and the lower end of each positioning pin positioning groove are opened, and the outer side wall of each positioning pin positioning groove is opened.

Preferably, the front end and the rear end of the top of the leveling bottom plate are respectively provided with an overpressure-proof block arrangement groove;

each overpressure-preventing block is provided with a central position of the groove and is provided with an overpressure-preventing block accommodating hole;

an upward protruding overpressure-preventing block is inserted into each overpressure-preventing block accommodating hole.

Preferably, a pair of open grooves is respectively formed in the front side and the rear side of each ultrathin heat conducting patch placing groove on the top of the leveling bottom plate;

leveling the part of the top of the bottom plate between each pair of open grooves, wherein the leveling bottom plate is provided with a concave patch placing expansion groove;

the bottom surface of the expansion groove for placing the patch and the bottom surface of the ultrathin heat conduction patch placing groove are positioned on the same horizontal plane.

Preferably, the ultrathin heat conducting patch comprises an upper plate and a lower plate which are arranged up and down, wherein each open slot is used for selectively placing a limit cushion block;

the shape and size of the limiting cushion block are correspondingly matched with those of the open slot;

after the limiting cushion block is placed in the open slot, the height of the top surface of the limiting cushion block is higher than that of the bottom surface of the patch placing expansion slot;

the height of the top surface of the limit cushion block is higher than the height of the bottom surface of the expansion slot for placing the patch, and is equal to the vertical distance between the bottom surface of the upper plate and the bottom surface of the lower plate of the ultrathin heat conduction patch.

Preferably, the left end of each ultra-thin heat conducting patch placing groove is provided with a liquid injection pipe guide placing hole for accommodating a liquid injection pipe in the middle of the left end of the ultra-thin heat conducting patch.

Preferably, the screw through holes on the upper mounting plate are in clearance fit with the cylindrical head screws.

Preferably, the bottom surface of the leveling upper press plate, the bottom surface of the ultra-thin heat-conducting chip placing groove and the bottom surface of the chip placing expansion groove are smooth planes.

Preferably, the center point of the leveling upper press plate, the center point of the connecting beam and the central axis of the pressing rod are positioned on the same vertical central line.

By the above the technical scheme provided by the utility model it is visible, compare with prior art, the utility model provides an ultra-thin heat conduction paster levelling tool, its structural design science can make things convenient for, levelly the ultra-thin heat conduction paster that small deformation, not parallel problem appear in the external surface reliably, through applying external pressure, realizes the adjustment of ultra-thin heat conduction paster plane degree to effectively promote the heat dispersion of ultra-thin heat conduction paster, have great practical meaning.

The utility model discloses, on the concrete application, consider that ultra-thin heat conduction paster adopts pure copper to make basically, the external force of applying need not too big, just can realize the levelling, is favorable to improving the heat dispersion of ultra-thin heat conduction paster reliably.

Drawings

Fig. 1 is a schematic perspective view of an ultra-thin heat conducting patch leveling jig according to the present invention;

fig. 2 is a schematic view of a three-dimensional structure of the ultra-thin heat conducting patch leveling jig according to the present invention when penetrating from the right side;

fig. 3 is a schematic view of a three-dimensional decomposition structure of an ultra-thin heat conducting patch leveling jig provided by the present invention;

fig. 4 is a schematic view of a three-dimensional structure of a leveling base plate in the ultra-thin heat conducting patch leveling jig provided by the present invention;

fig. 5 is a schematic view of a three-dimensional structure of an ultra-thin heat conducting patch leveling jig provided by the present invention, when two ultra-thin heat conducting patches are placed on a leveling base plate;

fig. 6 is a schematic perspective view of an ultra-thin heat conducting patch to be leveled according to the present invention;

in the figure: the leveling device comprises a base 1, a leveling bottom plate 2, a leveling upper pressure plate 3, a connecting beam 4 and a round wire spring 5;

6 is a cylindrical head screw, 7 is an elbow clamp, 8 is an upper mounting plate, 9 is a side plate, and 10 is an ultrathin heat conduction patch;

20, an ultrathin heat conducting patch placing groove, 21, 22, 23 and 24, wherein the ultrathin heat conducting patch placing groove is used for preventing an over-pressing block, the limiting cushion block is used for limiting, and the positioning pin is used for positioning a pin;

200 is a liquid injection pipe guide placing hole, 201 is an open slot, 202 is a patch placing expansion slot 202, and 203 is provided with a groove for an overpressure prevention block;

230 is a positioning pin accommodating hole, 231 is a positioning pin positioning groove;

and 80 is an elbow clip mounting hole.

Detailed Description

In order to make the technical means of the present invention easier to understand, the present application will be further described in detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the present application are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

It should be noted that in the description of the present application, the terms of direction or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In addition, it should be noted that, in the description of the present application, unless otherwise explicitly specified and limited, the term "mounted" and the like should be interpreted broadly, and may be, for example, either fixedly mounted or detachably mounted.

The specific meaning of the above terms in the present application can be understood by those skilled in the art as the case may be.

Referring to fig. 1 to 6, the utility model provides an ultra-thin heat conducting patch leveling jig, which comprises a base 1;

two lateral plates 9 which are transversely spaced are vertically arranged at the top of the base 1;

the two side plates 9 are distributed in bilateral symmetry;

the upper parts of the opposite sides of the two side plates 9 are connected through an upper mounting plate 8 which is transversely distributed;

wherein, the left and right ends of the upper mounting plate 8 are respectively provided with a vertically through screw through hole;

a cylindrical head screw 6 is inserted into each screw through hole in a penetrating manner;

the screw cap of each cylindrical head screw 6 is positioned right above the upper mounting plate 8;

the bottom of a polished rod of each cylindrical head screw 6 is positioned right below the upper mounting plate 8;

the middle parts of the left end and the right end of the leveling upper pressing plate 3 are fixedly connected with the bottom of a polished rod of each cylindrical head screw 6;

the polished rod of each cylindrical head screw 6 is sleeved with a spiral round wire spring 5 at the part of the outer wall between the screw cap of the cylindrical head screw 6 and the top surface of the upper mounting plate 8;

wherein, the leveling upper press plate 3 is distributed longitudinally and is positioned right below the upper mounting plate 8;

the middle part of the top of the leveling upper pressure plate 3 is fixedly provided with connecting beams 4 which are longitudinally distributed;

wherein, the center of the upper mounting plate 8 is provided with a vertically through elbow clip mounting hole 80;

the elbow clip 7 is arranged on the elbow clip mounting hole;

the elbow clamp 7 is provided with the lower end part of a pressing rod 72 which is fixedly connected with the central position of the connecting beam 4;

the elbow clamp 7 has a handle 71 located above the upper mounting plate 8.

Wherein, a leveling bottom plate 2 which is longitudinally distributed is arranged below the leveling upper pressure plate 3;

at least one transversely distributed and concave ultrathin heat conducting patch placing groove 20 (not limited to two) is arranged in the middle of the top of the leveling bottom plate 2 and used for placing ultrathin heat conducting patches 10 to be leveled;

and the ultrathin heat conduction patch placing groove 20 is positioned right below the leveling upper pressing plate 3.

In the present invention, in the specific implementation, a positioning pin receiving hole 230 is formed in each of the rear side of the left end and the front side of the right end of the top of the leveling base plate 2;

one positioning pin 23 is inserted into each positioning pin accommodating hole 230;

the leveling upper platen 3 has a positioning pin positioning groove 231 at each of its left and right ends at a position corresponding to each positioning pin 23.

It should be noted that the positioning pin positioning groove 231 is disposed vertically corresponding to the positioning pin 23 (i.e., located directly above the positioning pin 23) and is used for guiding when the leveling upper platen 3 is pressed down and for limiting in the vertical direction (i.e., the height direction).

In a specific implementation, the upper end and the lower end of each positioning pin positioning groove 231 are open, and the outer side wall of each positioning pin positioning groove 231 is open (i.e., the side wall opening on the left side or the right side of the adjacent leveling base plate 2).

It should be noted that, to the utility model discloses, through setting up locating pin 23, guarantee to level top board 3 and in the course of pushing down, keep not producing the skew in the vertical direction.

In the utility model, in the concrete implementation, the front end and the rear end of the top of the leveling bottom plate 2 are respectively provided with an anti-overvoltage block arrangement groove 203;

each overpressure-proof block is provided with a central position of the groove 203 and is provided with an overpressure-proof block accommodating hole 210;

in each of the overpressure preventing block receiving holes 210, an overpressure preventing block 21 is inserted to protrude upward.

In a specific implementation, it should be noted that the overpressure prevention block 21 is configured to be inserted into a reserved overpressure prevention block accommodating hole formed in the flat base plate 2. After the excessive pressure prevention block 21 is inserted into the excessive pressure prevention block accommodating hole 210, the height of the excessive pressure prevention block 21, which is exposed out of the excessive pressure prevention block accommodating hole 210 upwards, is the same as the thickness of the standard qualified ultrathin heat conduction patch to be obtained;

the bottom surface of the overpressure-preventing block-setting groove 203 is the same in height as the bottom surface of the ultrathin heat-conducting patch-placing groove 20 for placing the ultrathin heat-conducting patch 10, and is located on the same horizontal plane.

It should be noted that, to the utility model discloses, prevent through the setting that briquetting 21, the material of preventing briquetting 21 is Cr12(Cr12 steel), prevents that the prominent height of excessive pressure piece 21 is unanimous with ultra-thin heat conduction paster thickness, when can guaranteeing to level top board 3 and push down, pushes up to preventing excessive pressure fast 21 to ultra-thin heat conduction paster 10 can not crushed.

In the present invention, in the specific implementation, a pair of open slots 201 are respectively opened at the front and the rear sides of each ultra-thin heat conducting patch placing slot 20 at the top of the leveling bottom plate 2;

leveling the portion of the top of the base plate 2 between each pair of open slots 201, with recessed patch placement expansion slots 202;

the bottom surface of the expansion groove 202 is placed on the patch, and the bottom surface of the ultrathin heat conducting patch placing groove 20 is located on the same horizontal plane, so that the ultrathin heat conducting patch is placed horizontally, and the flatness of the ultrathin heat conducting patch after being extruded by external force is guaranteed.

Each of the open grooves 201 is used for selectively placing a spacing block 22 to fit the ultra-thin heat conducting patch placing groove 20 and the patch placing expansion groove 202 for placing the ultra-thin heat conducting patch 10 with a larger size (longitudinal width size).

The ultra-thin heat conducting patch 10 includes an upper plate 101 and a lower plate 102 (specifically, an upper copper plate and a lower copper plate, respectively) disposed above and below;

the upper plate 101 has a size larger than that of the lower plate 102, and the upper plate 101 has an edge portion protruding from the periphery of the lower plate 102.

In a specific implementation, the ultrathin heat conducting patch 10 includes an upper plate 101 and a lower plate 102 which are arranged up and down;

the shape and size of the limit cushion block 22 are correspondingly matched with those of the open slot 201;

after the limiting cushion block 22 is placed in the open slot 201, the height of the top surface of the limiting cushion block 22 is higher than that of the bottom surface of the patch placing expansion slot 202;

the height of the top surface of the limiting cushion block 22 is higher than the height of the bottom surface of the patch placing expansion groove 202, and is equal to the vertical distance between the bottom surface of the upper plate 101 and the bottom surface of the lower plate 102 of the ultra-thin heat conducting patch 10.

It should be noted that, according to the size of the ultra-thin heat conducting patch, the position-limiting cushion block 22 is selected to be placed in the corresponding opening groove 201, so as to be attached to the protruding edge position around the ultra-thin heat conducting patch, so as to achieve the effect that the ultra-thin heat conducting patch is limited inside. The method specifically comprises the following steps: when the side surfaces of the limiting cushion blocks 22 are attached to the front end and the rear end of the lower plate 102, the lower plate 102 is limited, and meanwhile, the top parts of the limiting cushion blocks 22 are attached to the bottom surface of the upper plate 101 to effectively support the upper plate 101.

To the utility model discloses, the long limit of both sides is by placing the cushion block clamping position in the open slot around the ultra-thin heat conduction paster, skew about can not.

It should be noted that, to the utility model discloses, cushion 22 specifically can adopt stainless steel, can remove, cooperates the ultra-thin heat conduction paster of different width size, freely puts in the open slot of different positions.

It should be noted that, to the utility model discloses, because the arch on the ultra-thin heat conduction paster is anomalous shape, the ultra-thin heat conduction paster of different width needs can reach the arch (the step that forms between upper plate and the hypoplastron) restriction that lets ultra-thin heat conduction paster in fixed range through the position of the spacing cushion of adjustment both sides. The ultra-thin heat conduction paster of jumbo size width need put spacing cushion in the both sides that lean on the outside, and the ultra-thin heat conduction paster of small-size width need put spacing cushion in the both sides that lean on the inside.

The utility model discloses in, on specifically realizing, the left end of every ultra-thin heat conduction paster standing groove 20 has one and annotates the liquid pipe direction and place hole 200 for hold the notes liquid pipe at ultra-thin heat conduction paster 10 left end middle part.

The utility model discloses in, specifically realize, cylindric head screw 6 is socket head cap screw.

In the utility model, in the concrete implementation, the front end part and the rear end part of the top of the leveling bottom plate 2 are respectively provided with a long round hole 24 which is transversely distributed;

each long round hole 24 is connected with a positioning hole reserved on the leveling bottom plate 2 through a bolt, so that the leveling bottom plate 2 is limited and fixed in position.

The utility model discloses in, on specifically realizing, go up between the screw through-hole on the mounting panel 8 and the cap screw 6, for clearance fit.

In the present invention, in the concrete implementation, the shape of the connecting beam 4 is preferably a "n" shape, or a doorframe shape.

The utility model discloses in, on specifically realizing, the central point of levelling top board 3, with the central point of tie-beam 4 to and the central axis that compresses tightly pole 72, be located same vertical center line.

The utility model discloses in, in the concrete realization, the lower tip that compresses tightly pole 72 that elbow clamp 7 had can be connected with tie-beam 4 through fastening nut.

In the present invention, in the concrete implementation, the fixed block 73 provided on the toggle clamp 7 is embedded in the toggle clamp mounting hole.

It should be noted that the toggle clamp 7 is fixedly connected with the internal thread inside the toggle clamp mounting hole through the external thread on the lower outer wall of the fixing block 73.

The utility model discloses in, on specifically realizing, the bottom surface that expansion groove 202 was placed to the bottom surface of leveling top board 3, the bottom surface of ultra-thin heat conduction paster standing groove 20 and paster, is glossy plane.

The utility model discloses in, on specifically realizing, elbow clamp 7 is current mechanical component, can adopt the elbow product of rice thinking rice, the model for example: MC02-1, closure pressure 900N.

The utility model discloses in, on specifically realizing, locating pin 23 can adopt the locating pin product of rice thinking rice, the model: BJPNGA 3-P5.

In order to understand the technical solution of the present invention more clearly, the working principle of the present invention is explained below.

For the utility model discloses, on ultra-thin heat conduction paster 10 placed school flat base 2, ultra-thin heat conduction paster 10 appearance all around can fall into ultra-thin heat conduction paster standing groove 20 on the school flat base 2, through the elbow clamp 7 that pushes down, drive levelling top board 3 downstream, through levelling top board 3's extrusion effect downwards, realize compressing tightly ultra-thin heat conduction paster 10, through applying sufficient pressure for ultra-thin heat conduction paster 10's overall plane degree promotes.

In the concrete implementation, a polished rod part between a screw cap of the cylindrical head screw and the upper mounting plate 8 is sleeved with a round wire spring 5, and after the elbow clamp 7 is pressed downwards, if the elbow clamp is loosened, the leveling upper pressing plate 3 can move upwards under the action of the elastic force of the round wire spring 5.

Compared with the prior art, the utility model provides an ultra-thin heat conduction paster levelling tool has following beneficial effect:

1. the operation is simple, the practicability is strong, the movement is convenient, and the device is suitable for various occasions;

2. the leveling device is suitable for various ultrathin heat-conducting patches with different sizes, and the leveling function of the ultrathin heat-conducting patches with different sizes (namely the longitudinal width size) is realized by adjusting the positions of the cushion blocks in the grooves of the leveling base plate;

3. the anti-over pressing block is arranged to avoid crushing the ultrathin heat conducting patch;

4. can realize leveling the flatness of two ultrathin heat conducting patches simultaneously.

To sum up, compare with prior art, the utility model provides a pair of ultra-thin heat conduction paster levelling tool, its structural design science can be convenient, levelly the ultra-thin heat conduction paster that small deformation, not smooth problem appear in the external surface reliably, through applying external pressure, realizes the adjustment of ultra-thin heat conduction paster plane degree to effectively promote the heat dispersion of ultra-thin heat conduction paster, have great practical meaning.

The utility model discloses, on the concrete application, consider that ultra-thin heat conduction paster adopts pure copper to make basically, the external force of applying need not too big, just can realize the levelling, is favorable to improving the heat dispersion of ultra-thin heat conduction paster reliably.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. An ultrathin heat conduction patch leveling jig is characterized by comprising a base (1);

two lateral plates (9) which are transversely spaced are vertically arranged at the top of the base (1);

the two side plates (9) are distributed in bilateral symmetry;

the upper parts of the opposite sides of the two side plates (9) are connected through an upper mounting plate (8) which is transversely distributed;

wherein, the left end and the right end of the upper mounting plate (8) are respectively provided with a vertically through screw through hole;

a cylindrical head screw (6) is inserted into each screw through hole in a penetrating way;

the nut of each cylindrical head screw (6) is positioned right above the upper mounting plate (8);

the bottom of a polished rod of each cylindrical head screw (6) is positioned right below the upper mounting plate (8);

the bottom of a polished rod of each cylindrical head screw (6) is fixedly connected with the middle parts of the left end and the right end of a leveling upper pressure plate (3);

the polished rod of each cylindrical head screw (6), the part of the outer wall between the screw cap of the cylindrical head screw (6) and the top surface of the upper mounting plate (8) is sleeved with a spiral round wire spring (5);

wherein, the leveling upper press plate (3) is longitudinally distributed and is positioned right below the upper mounting plate (8);

the middle part of the top of the leveling upper pressure plate (3) is fixedly provided with connecting beams (4) which are longitudinally distributed;

wherein, the center of the upper mounting plate (8) is provided with a vertically through toggle clamp mounting hole (80);

the elbow clip (7) is arranged on the elbow clip mounting hole;

the elbow clamp (7) is provided with the lower end part of a pressing rod (72) and is fixedly connected with the central position of the connecting beam (4);

the elbow clip (7) is provided with a handle (71) which is positioned above the upper mounting plate (8);

wherein, a leveling bottom plate (2) which is longitudinally distributed is arranged below the leveling upper pressure plate (3);

the middle part of the top of the leveling bottom plate (2) is provided with at least one transversely-distributed and concave ultrathin heat conducting patch placing groove (20) for placing an ultrathin heat conducting patch (10) to be leveled;

and the ultrathin heat conduction patch placing groove (20) is positioned right below the leveling upper pressing plate (3).

2. The ultra-thin heat conduction patch leveling jig according to claim 1, wherein the leveling base plate (2) is provided with a positioning pin receiving hole (230) at each of a rear side of a left end and a front side of a right end of the top;

one positioning pin (23) is inserted into each positioning pin accommodating hole (230);

the leveling upper pressure plate (3) has a positioning pin positioning groove (231) at the left and right ends thereof, respectively, at a position corresponding to each positioning pin (23).

3. The ultra-thin thermal patch leveling tool as claimed in claim 2, wherein each positioning pin positioning slot (231) is open at both upper and lower ends thereof, and each positioning pin positioning slot (231) is open at an outer sidewall thereof.

4. The ultra-thin heat conduction patch leveling jig of claim 1, wherein the leveling base plate (2) has an overpressure block prevention setting groove (203) at each of the front and rear ends of the top;

each overpressure-proof block is provided with a central position of the groove (203) and is provided with an overpressure-proof block accommodating hole (210);

an upward protruding overpressure prevention block (21) is inserted into each overpressure prevention block accommodating hole (210).

5. The ultra-thin heat conduction patch leveling jig according to claim 1, wherein a pair of open grooves (201) are respectively formed at the top of the leveling base plate (2) at the front and rear sides of each ultra-thin heat conduction patch placing groove (20);

the part of the top of the leveling bottom plate (2) between each pair of the open grooves (201) is provided with a concave patch placing expansion groove (202);

the bottom surface of the patch placing expansion groove (202) and the bottom surface of the ultrathin heat conduction patch placing groove (20) are positioned on the same horizontal plane.

6. The ultra-thin heat conduction patch leveling jig according to claim 5, wherein the ultra-thin heat conduction patch (10) comprises an upper plate (101) and a lower plate (102) which are arranged up and down;

each open slot (201) is used for selectively placing a limit cushion block (22);

the shape and size of the limiting cushion block (22) are correspondingly matched with those of the open slot (201);

after the limiting cushion block (22) is placed in the open slot (201), the height of the top surface of the limiting cushion block (22) is higher than that of the bottom surface of the patch placing expansion slot (202);

the height of the top surface of the limiting cushion block (22) is higher than that of the bottom surface of the patch placing expansion groove (202), and is equal to the vertical distance between the bottom surface of the upper plate (101) and the bottom surface of the lower plate (102) of the ultrathin heat conducting patch (10).

7. The ultra-thin heat conduction patch leveling jig according to claim 1, wherein the left end of each ultra-thin heat conduction patch placing groove (20) has a liquid injection pipe guide placing hole (200) for receiving a liquid injection pipe at the middle of the left end of the ultra-thin heat conduction patch (10).

8. The ultra-thin heat conduction patch leveling jig of claim 1, wherein the screw through holes on the upper mounting plate (8) are in clearance fit with the cylindrical head screws (6).

9. The ultra-thin thermal patch leveling jig according to claim 1, wherein the bottom surface of the leveling upper platen (3), the bottom surface of the ultra-thin thermal patch placement groove (20), and the bottom surface of the patch placement expansion groove (202) are smooth and flat surfaces.

10. The ultra-thin thermal patch leveling jig according to any one of claims 1 to 9, wherein the center point of the leveling upper platen (3), the center point of the connecting beam (4), and the central axis of the pressing rod (72) are located on the same vertical center line.

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