CN109508078B - Adjusting assembly - Google Patents
Adjusting assembly Download PDFInfo
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- CN109508078B CN109508078B CN201811592297.XA CN201811592297A CN109508078B CN 109508078 B CN109508078 B CN 109508078B CN 201811592297 A CN201811592297 A CN 201811592297A CN 109508078 B CN109508078 B CN 109508078B
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- radiator
- chip module
- adjustment assembly
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an adjusting component for adjusting a radiator gland and a chip module, which comprises: a top plate is arranged on the radiator; a guide post is positioned on one side of the chip module, the top plate is sleeved on the guide post, so that the top plate slides up and down relative to the guide post, and the top surface of the guide post is higher than the radiator; the top plate is flat, the structure is simple, the top plate is formed by stamping once without a plurality of bending processes, the cost is low, the force acting on the lead screw directly acts on the radiator, and the acting force required by rotating the lead screw is small.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to an adjusting assembly, and more particularly to an adjusting assembly for a heat sink of a CPU.
[ background of the invention ]
Generally, a plurality of electronic elements are arranged in the computer, the electronic elements can generate certain heat in the working process, and when the heat cannot be timely discharged, the temperature in the computer is too high, so that the use performance and the service life of the computer are influenced. The chip module is an important electronic component in a computer, and when the chip module is mounted on the electrical connector, a heat dissipation device is usually mounted on the chip module for dissipating heat.
The fixing device comprises an adjustable module, a plurality of fixing components, a plurality of elastic components and an adjusting component. The adjustable module is arranged on the radiator; the fixing component fixes the radiator and the adjustable module on the substrate and is positioned at four corners of the radiator; the elastic components are respectively sleeved on the fixed components, and two ends of each elastic component are respectively abutted against the fixed components and the adjustable modules; the adjusting component is arranged between the radiator and the adjustable module and is in threaded connection with the radiating part, and the adjusting component is rotated to apply an acting force to the adjustable module so that the adjustable module compresses the elastic component to control the acting force acting on the radiator, and the acting force enables the radiator to averagely contact the chip packaging body. However, the fixing component of the fixing device is lower than the top surface of the heat dissipation part, the top plate in the center of the adjustable module is positioned above the heat dissipation part, four support legs extend downwards from four corners of the top plate respectively, the tail ends of the support legs are provided with a baffle plate connected to the fixing component, when the adjusting component is rotated, because the support legs are separated between the force application point at the top plate and the force bearing points at the four corner baffle plates, and the support legs have elasticity, when the adjusting component in the middle of the lock is locked, part of the force transmitted to the baffle plate from the top plate can be lost at the middle support leg section, the acting force acting on the adjusting component needs to be several times larger than the acting force acting on the radiator, and the adjusting module needs to be formed by a plurality of processes, so that the cost is higher.
Therefore, there is a need to design a new adjustment assembly to overcome the above problems.
[ summary of the invention ]
The invention aims to provide a radiator adjusting assembly which is simple in structure and small in force applied by a lead screw.
In order to achieve the purpose, the invention adopts the following technical scheme:
an adjustment assembly for adjusting a heat sink cover-die assembly, comprising: a top plate is arranged on the radiator; a guide post is positioned on one side of the chip module, the top plate is sleeved on the guide post, so that the top plate slides up and down relative to the guide post, and the top surface of the guide post is higher than the radiator; and a lead screw is connected with the top plate and the radiator, and the distance between the top plate and the radiator can be adjusted by rotating the lead screw so as to control the radiator to press down the chip module to dissipate heat.
Further, the heat sink includes a heat transfer base plate pressed on the chip module and a heat dissipation portion disposed on the heat transfer base plate.
Furthermore, the number of the guide pillars is four, each guide pillar is provided with a head, the head is located above the heat dissipation portion, the top plate is provided with four round holes for the guide pillars to penetrate through, the diameter of the head is larger than that of the round holes, and the head is provided with a stop surface for stopping the top plate.
Furthermore, a first threaded hole is formed in the center of the top plate, and the lead screw penetrates through the first threaded hole and is matched with the first threaded hole.
Further, the bottom end of the screw rod is provided with a pivoting part which is pivoted with a propping part, the pivoting part can rotate in the propping part, the propping part is arranged at the center of the heat dissipation part, and the propping part props against the heat transfer bottom plate.
Further, the abutting part is composed of a first abutting part and a second abutting part, and the pivoting part is clamped together.
Further, the top end of the lead screw is provided with an operating part, the operating part is rotated, when the top plate moves to abut against the stop surface, the top plate is stopped, and the lead screw is continuously rotated to enable the radiator to press the chip module.
An adjustment assembly for adjusting a heat sink cover-die assembly, comprising: a top plate is arranged on the radiator; a guide post is positioned on one side of the chip module, the top plate is sleeved on the guide post, so that the top plate slides up and down relative to the guide post, and the top surface of the guide post is higher than the radiator; the fixing piece is arranged in the center of the radiator and is fixed on a back plate; and the lead screw is connected with the top plate and the fixing piece, and the distance between the top plate and the radiator can be adjusted by rotating the lead screw so as to control the radiator to press down the chip module to dissipate heat.
Further, the heat sink includes a heat transfer base plate pressed on the chip module and a heat dissipation portion disposed on the heat transfer base plate.
Furthermore, a through groove is formed in the center of the heat dissipation portion, the fixing piece is located in the through groove, and a second threaded hole is formed in the center of the fixing piece and used for the lead screw to be matched with.
Furthermore, two ends of the fixing piece are respectively provided with a first positioning hole, the fixing piece is fixed on the back plate through a screw, a second positioning hole is arranged between the second threaded hole and the first positioning hole, a pin is arranged in the second positioning hole and penetrates through the heat transfer bottom plate downwards, and the heat transfer bottom plate can move up and down relative to the fixing piece.
Furthermore, the adjusting assembly further comprises at least one elastic piece, the elastic piece is sleeved on the guide post, and two ends of the elastic piece are respectively abutted to the top plate and the heat transfer bottom plate.
Furthermore, the top plate is buckled on the lead screw through a locking piece, and the lead screw is rotated to drive the top plate to move downwards to compress the elastic piece so as to control the pressure on the radiator.
Furthermore, a buckle seat is arranged above a circuit board and is framed outside the electric connector, the back plate is arranged below the circuit board, and the buckle seat and the back plate are fixed on the circuit board together.
Furthermore, the fastening seat is provided with at least one fastening part, the electric connector comprises a base, a plurality of conductive terminals are contained in the base to be abutted against the chip module, two opposite sides of the base are respectively provided with a groove, and the fastening parts are fastened in the grooves to fix the base on the circuit board.
Compared with the prior art, the adjusting assembly has the following beneficial effects:
the head is located above the heat dissipation portion, the top plate is located between the head and the heat dissipation portion, the top plate is flat, the structure is simple, the top plate is formed by stamping once, multiple bending procedures are not needed, the cost is low, force acting on the lead screw directly acts on the heat radiator, and acting force required by rotating the lead screw is small.
[ description of the drawings ]
FIG. 1 is an exploded perspective view of a first embodiment of an adjustment assembly in accordance with the present invention;
FIG. 2 is a perspective assembly view of FIG. 1;
FIG. 3 is a perspective assembly view of the guide posts of FIG. 2 fixed to a back plate;
fig. 4 is a cross-sectional view of the heat sink of fig. 3 before it compresses the chip module;
fig. 5 is a cross-sectional view of the heat sink of fig. 3 after compressing the chip module;
FIG. 6 is an exploded perspective view of a second embodiment of the adjustment assembly of the present invention;
FIG. 7 is a perspective assembly view of FIG. 6;
FIG. 8 is a perspective assembly view of the guide posts of FIG. 7 fixed to the back plate;
fig. 9 is a cross-sectional view of the heat sink of fig. 8 before it compresses the chip module;
fig. 10 is a cross-sectional view of the heat sink of fig. 8 after pressing the chip module.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
buckling part 22 of accommodating cavity 21 of buckling seat 2 of circuit board 1
First circular hole 611 of heat-transfer base plate 61 of heat sink 6 of chip module 5
Through 713 guide post 72 head 721 stop surface 7211
The fastener 75 abuts against the first positioning hole 91 of the fixing part 9 of the holding part 8
The second abutting portion 82 has a convex portion 96 of the arm portion 95
[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
As shown in fig. 1 to 5, a first embodiment of an adjusting assembly 7 of the present invention is for adjusting a heat sink 6 to press a chip module 5 on the heat sink 6, and includes a top plate 71, four guide posts 72, a lead screw 73 and four elastic members 74, wherein the top plate 71 is disposed above the heat sink 6, the four guide posts 72 are respectively disposed on two opposite sides of the chip module 5, the guide posts 72 downwardly penetrate the top plate 71, the elastic members 74 and the heat sink 6, and the lead screw 73 downwardly penetrates the center of the top plate 71 to connect with the heat sink 6.
As shown in fig. 1 and 4, the heat sink 6 includes a heat transfer base plate 61 pressed on the chip module 5 and a heat dissipating portion 62 fixed on the heat transfer base plate 61, a through hole 621 is formed in the center of the heat dissipating portion 62, a supporting portion 8 is disposed in the through hole 621 and supported on the heat transfer base plate 61, and the supporting portion 8 is connected to the lead screw 73. In this embodiment, the abutting portion 8 is composed of a first abutting portion 81 and a second abutting portion 82, and the first abutting portion 81 and the second abutting portion 82 are used for clamping the screw rod 73 together, and the first abutting portion 81 and the second abutting portion 82 are fixed to the heat transfer base plate 61 through a screw and a nut, in other embodiments, the abutting portion 8 may be an integral structure and may be sleeved on one end of the screw rod 73, and the abutting portion 8 may not be fixed to the heat transfer base plate 61. The heat transfer base plate 61 is rectangular, and four corners of the heat transfer base plate 61 are respectively provided with a first circular hole 611 (see fig. 1) for the four guide pillars 72 to pass through.
As shown in fig. 1 and 4, the top plate 71 has a rectangular flat plate shape and is positioned above the heat dissipation portion 62. A second circular hole 711 is disposed at each of four corners of the top plate 71 corresponding to the first circular hole 611 (see fig. 1), so that the four guide posts 72 can pass through the second circular hole 711, and the top plate 71 can slide up and down relative to the guide posts 72. A first threaded hole 712 is formed in the center of the top plate 71 for the lead screw 73 to pass through, and the first threaded hole 712 is matched with the lead screw 73.
As shown in fig. 1 and 4, each of the guide pillars 72 has a head portion 721, the head portion 721 is located above the heat dissipating portion 62, the head portion 721 has a stop surface 7211 for stopping the top plate 71, the head portion 721 extends downward to form a middle portion 722, the diameter of the head portion 721 is greater than that of the second circular hole 711, the middle portion 722 extends downward to form a tail portion 723, and the surface of the tail portion 723 is provided with threads.
As shown in fig. 1 and 4, the top end of the screw 73 has an operation portion 731, the operation portion 731 can be rotated by a tool (not shown), a rod portion 732 is formed by extending downward from the operation portion 731, a surface of the rod portion 732 is provided with a screw thread to match with the first screw hole 712, a pivot portion 733 is extended downward from the rod portion 732, the pivot portion 733 is clamped by the first abutting portion 81 and the second abutting portion 82, and the pivot portion 733 can rotate in the abutting portion 8.
As shown in fig. 1 and 4, the four elastic members 74 are respectively sleeved on the guide posts 72 and respectively abut against the top plate 71 and the heat transfer bottom plate 61 to support the top plate 71, in this embodiment, the elastic members 74 are springs, but the elastic members 74 may also be elastic sleeves.
As shown in fig. 1 and 2, a fastening seat 2 and a back plate 3 are respectively fixed on the upper and lower surfaces of a circuit board 1, the fastening seat 2 and the back plate 3 are both made of metal material, and the fastening seat 2 is framed outside an electrical connector 4. Holes are formed in the peripheries of the buckle seat 2, the circuit board 1 and the back plate 3, and the back plate 3 and the buckle seat 2 are locked and fixed on the circuit board 1 together through a small screw and nut locking and matching structure arranged in the corresponding holes, so that the circuit board 1 becomes a rigid body and is not easy to bend and deform. The center of the buckle base 2 has a receiving cavity 21 for receiving the electrical connector 4. Two buckling parts 22 are respectively protruded from two opposite sides of the buckling seat 2 to the accommodating cavity 21 (of course, in other embodiments, the number of the buckling parts 22 may not be two, and the buckling parts 22 may also be disposed around the accommodating cavity 21), so as to fix the electrical connector 4 to the circuit board 1.
As shown in fig. 1 and 2, the electrical connector 4 includes a base 41 mounted on the upper surface of the circuit board 1 and carrying the chip module 5, and a plurality of conductive terminals accommodated in the base 41 and electrically connecting the chip module 5 and the circuit board 1. Two opposite sides of the base 41 are respectively provided with two grooves 411 corresponding to the fastening parts 22, and the fastening parts 22 are fastened in the grooves 411 to fix the base 41 to the circuit board 1.
During assembly, the fastening seat 2 and the back plate 3 are firstly locked on the circuit board 1 by using small screws and nuts, and meanwhile, the fastening part 22 is fastened in the groove 411 to fix the base 41 accommodating a plurality of conductive terminals (not numbered) on the circuit board 1, the conductive terminals can be directly connected with the circuit board 1 in a guiding manner, so that the problem that the flatness of the conductive terminals is poor due to the fact that the base 41 is heated, warped and deformed in the process of welding the conductive terminals to the circuit board 1 is avoided. Then, the chip module 5 is placed at a corresponding position of the electrical connector 4, the lead screw 73 penetrates through the top plate 71, the first abutting portion 81 and the second abutting portion 82 clamp the pivot 733, then the first abutting portion 81 and the second abutting portion 82 are fixed to the heat transfer bottom plate 61 through screws and nuts, the four guide posts 72 respectively penetrate through the second round hole 711, the elastic member 74 and the first round hole 611 in sequence, so that the lead screw 73, the top plate 71, the guide posts 72 and the heat sink 6 are integrated, and then the tail 723 of the four guide posts 72 is locked to the back plate 3 through nuts, so that the heat sink 6 is pressed on the chip module 5.
As shown in fig. 4 and 5, when the heat sink 6 does not press the chip module 5, there is a gap between the top plate 71 and the stop surface 7211 in the vertical direction, when the operation portion 731 is screwed downward by a tool (not shown), the top plate 71 moves upward due to screw-fit, the lead screw 73 presses the abutting portion 8 downward to move the heat sink 6 downward, the guide post 72 is locked to the back plate 3 and has a constant height, when the top plate 71 moves upward to be in close contact with the stop surface 7211, the top plate 71 is stopped and is screwed into the lead screw 73 downward continuously, so that the heat transfer bottom plate 61 presses the chip module 5 to dissipate heat, and the heat transfer bottom plate 61 is arranged at the center of the heat sink 6 to press the chip module 5 vertically and in parallel. Since the head 721 is positioned above the heat dissipating portion 62, the top plate 71 is positioned between the head 721 and the heat dissipating portion 62, and the top plate 71 is flat, a force acting on the lead screw 73 directly acts on the heat sink 6, and a force required by the lead screw 73 is small.
As shown in fig. 6 to 10, a second embodiment of the adjusting assembly 7 of the present invention is different from the first embodiment in that a neck portion 734 is disposed between the operating portion 731 and the rod portion 732, a through hole 713 is disposed in the center of the top plate 71, the screw 73 passes through the through hole 713, and the top plate 71 is fastened to the neck portion 734 through a locking member 75, so as to fasten the top plate 71 and the screw 73 together. A through slot 622 penetrates the heat dissipating part 62 back and forth and is located in the center of the heat dissipating part 62 to divide the heat dissipating part 62 into two identical parts, a fixing member 9 is located in the through slot 622 and has a gap with the heat transfer base plate 61, two ends of the fixing member 9 respectively extend downward to form an arm 95, a first positioning hole 91 penetrates the arm 95 up and down, the first positioning hole 91 is used for fixing the fixing member 9 to the back plate 3 by screw and nut locking, a convex portion 96 is convexly arranged in the middle of the fixing member 9 upward, a second threaded hole 92 penetrates the convex portion 96 up and down but does not penetrate the fixing member 9, the second threaded hole 92 is used for the lead screw 73 to cooperate, a second positioning hole 93 is located between the convex portion 96 and the arm 95 and is located between the second threaded hole 92 and the first positioning hole 91, and a third positioning hole 612 is respectively located at a position of the heat transfer base plate 61 corresponding to the second positioning hole 93, two pins 94 are respectively inserted into the second positioning hole 93 and the third positioning hole 612 from top to bottom, so that the fixing member 9 is coaxial with the heat sink 6, the heat sink 6 is prevented from moving left and right in the downward moving process, and the heat transfer bottom plate 61 can move up and down relative to the fixing member 9. The rest of the structure and function are completely the same as those of the first embodiment, and are not described herein.
During assembly, the fixing member 9 is first positioned on the heat transfer base plate 61 by two pins 94, then the screw 73 is inserted through the through hole 713, the top plate 71 is fastened to the neck portion 734 by the locking member 75, the screw 73 is screwed into the second threaded hole 92 by a tool (not shown), then the four guide posts 72 are respectively inserted through the second round hole 711, the elastic member 74 and the first round hole 611 in sequence, and then the guide posts 72 are locked to the back plate 3, so that the fixing member 9 is fixed to the back plate 3.
As shown in fig. 9 and 10, when the screw rod 73 is screwed into the second threaded hole 92 by a tool (not shown), the screw rod 73 drives the top plate 71 to move downward together, the top plate 71 compresses the four elastic members 74, and the four elastic members 74 simultaneously apply an equalizing pressure to the heat transfer base plate 61, so that the heat transfer base plate 61 vertically and parallelly presses down the chip module 5. The top plate 71 is a flat plate, the force acting on the lead screw 73 directly acts on the elastic member 74 to press down the heat sink 6, and the acting force required by the lead screw 73 is small.
In summary, the adjusting assembly 7 of the present invention has the following advantages:
(1) the head 721 is positioned above the heat dissipation portion 62, the top plate 71 is positioned between the head 721 and the heat dissipation portion 62, and the top plate 71 is flat, so that the structure is simple, the top plate 71 is formed by stamping once, a plurality of bending processes are not needed, and the cost is low.
(2) The top plate 71 is flat, a force acting on the lead screw 73 directly acts on the heat sink 6, and a force required for the lead screw 73 is small.
(3) The lead screw 73 is arranged in the center of the heat sink 6, and the force application point is the middle, so that the heat sink 6 vertically and parallelly presses down the chip module 5, and the chip module 5 is prevented from being badly contacted or damaged.
(4) The fastening portion 22 is fastened to the groove 411 to fix the base 41 to the circuit board 1, so that the assembly is simple and convenient, and the time is saved.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and the drawings are included in the scope of the present invention.
Claims (14)
1. An adjustment assembly for adjusting a heat sink cover-die assembly, comprising:
a top plate is arranged on the radiator;
the four guide posts are positioned on the outer side of the chip module, each guide post is provided with a head, the top plate is sleeved on the four guide posts, so that the top plate slides up and down relative to the guide posts, the top surfaces of the guide posts are higher than the radiator, and the heads are provided with a stop surface positioned above the top plate for stopping the top plate;
the top plate is connected with the radiator through a lead screw, the four guide posts are located on the periphery of the lead screw, when the top plate abuts against the stop surface, the top plate is stopped, and the lead screw is rotated to adjust the distance between the top plate and the radiator so as to control the radiator to press the chip module downwards to enable the chip module to radiate.
2. The adjustment assembly of claim 1, wherein: the heat radiator comprises a heat transfer bottom plate pressed on the chip module and a heat dissipation part arranged on the heat transfer bottom plate.
3. The adjustment assembly of claim 2, wherein: the head is located above the heat dissipation portion, the top plate is flat, the top plate is provided with four round holes for the guide pillars to penetrate through, and the diameter of the head is larger than that of the round holes.
4. The adjustment assembly of claim 2, wherein: the center of the top plate is provided with a first threaded hole, and the lead screw penetrates through the first threaded hole and is matched with the first threaded hole.
5. The adjustment assembly of claim 2, wherein: the bottom end of the screw rod is provided with a pivoting part which is pivoted with a propping part, the pivoting part can rotate in the propping part, the propping part is arranged in the center of the heat dissipation part, and the propping part props against the heat transfer bottom plate.
6. The adjustment assembly of claim 5, wherein: the abutting part consists of a first abutting part and a second abutting part, and the first abutting part and the second abutting part jointly clamp the pivoting part.
7. The adjustment assembly of claim 3, wherein: the top end of the lead screw is provided with an operating part, the operating part is rotated, when the top plate moves to abut against the stop surface, the top plate is stopped, and the lead screw is continuously rotated to enable the radiator to press the chip module.
8. An adjustment assembly for adjusting a heat sink cover-die assembly, comprising:
a top plate is arranged on the radiator;
the four guide posts are positioned on the outer side of the chip module, the top plate is sleeved on the four guide posts, so that the top plate slides up and down relative to the guide posts, and the top surfaces of the guide posts are higher than the radiator;
the four elastic pieces are correspondingly sleeved on the four guide posts, and two ends of each elastic piece are respectively abutted against the top plate and the radiator;
the fixing piece is arranged in the center of the radiator and is fixed on a back plate;
the top plate is connected with the fixing piece through a screw rod, the screw rod is in threaded connection with the fixing piece, the four guide posts are located on the periphery of the screw rod, the distance between the top plate and the radiator can be adjusted by rotating the screw rod, the top plate moves downwards to compress the elastic piece, and the elastic piece presses the radiator downwards to control the radiator to press the chip module downwards to enable the chip module to radiate.
9. The adjustment assembly of claim 8, wherein: the radiator comprises a heat transfer bottom plate pressed on the chip module and a heat dissipation part arranged on the heat transfer bottom plate, the lead screw is provided with an operation part positioned above the top plate, a locking part is buckled on the lead screw and positioned below the top plate, and the top plate is clamped between the operation part and the locking part.
10. The adjustment assembly of claim 9, wherein: the central part of the heat dissipation part is provided with a through groove, the fixing part is positioned in the through groove, and the central part of the fixing part is provided with a second threaded hole for the screw rod to be matched.
11. The adjustment assembly of claim 10, wherein: the fixing piece is fixed on the back plate through a screw, a second positioning hole is formed between the second threaded hole and the first positioning hole, a pin is arranged in the second positioning hole and penetrates through the heat transfer bottom plate downwards, and the heat transfer bottom plate can move up and down relative to the fixing piece.
12. The adjustment assembly of claim 8, wherein: the top plate is buckled on the screw rod through a locking piece, and the screw rod is rotated to drive the top plate to move downwards to compress the elastic piece so as to control the pressure on the radiator.
13. The adjustment assembly of claim 8, wherein: the buckling seat is arranged above a circuit board and is framed outside the electric connector, the back plate is arranged below the circuit board, the buckling seat and the back plate are fixed on the circuit board together, the guide pillar is locked on the back plate, and the top plate is in a flat plate shape.
14. The adjustment assembly of claim 13, wherein: the buckling seat is provided with at least one buckling part, the electric connector comprises a base, a plurality of conductive terminals are contained in the base to be abutted against the chip module, two opposite sides of the base are respectively provided with a groove, and the buckling parts are buckled in the grooves so as to fix the base on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811592297.XA CN109508078B (en) | 2018-12-25 | 2018-12-25 | Adjusting assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811592297.XA CN109508078B (en) | 2018-12-25 | 2018-12-25 | Adjusting assembly |
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| Publication Number | Publication Date |
|---|---|
| CN109508078A CN109508078A (en) | 2019-03-22 |
| CN109508078B true CN109508078B (en) | 2022-02-22 |
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| CN201811592297.XA Active CN109508078B (en) | 2018-12-25 | 2018-12-25 | Adjusting assembly |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382588B (en) * | 2020-11-11 | 2023-01-24 | 海光信息技术股份有限公司 | Chip mounting device and chip mounting method |
| CN112306205B (en) * | 2020-11-30 | 2021-06-08 | 深圳市高昱电子科技有限公司 | Radiator for computer and manufacturing method thereof |
| CN117998808A (en) * | 2022-11-01 | 2024-05-07 | 中兴通讯股份有限公司 | Chip heat dissipation assembly and electronic equipment |
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| CN2591668Y (en) * | 2002-12-04 | 2003-12-10 | 惠翔企业有限公司 | Central processor radiating structural parts with fixed pins |
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| CN101026926A (en) * | 2006-02-18 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Radiator fastening device |
| CN204155922U (en) * | 2014-09-10 | 2015-02-11 | 番禺得意精密电子工业有限公司 | Heat radiator fixing device combination |
| CN108710409A (en) * | 2017-07-05 | 2018-10-26 | 华为技术有限公司 | A kind of processor fixed structure piece, component and computer equipment |
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| CN109508078A (en) | 2019-03-22 |
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