TWI721886B - Electronic device and its assembling method - Google Patents

Abstract

An electronic device includes a frame, a circuit assembly, a radiator and a buffer mechanism. The frame includes a top plate and a plurality of studs. The circuit assembly includes a base plate fixed on the studs, and a heating module welded on the top surface of the base plate. The radiator includes a heat dissipation plate fixed on the top plate and a heat dissipation block. The heat dissipation block exerts a pressure on the heating module to closely contact the heating module. The buffer mechanism includes a plurality of elastic elements arranged on the substrate adjacent to the outer periphery of the heating module, and the elastic elements respectively apply a plurality of upward biasing elastic forces opposite to the downward pressure on the substrate. Thereby, a good buffering effect of the substrate can be provided to prevent the degree of dent deformation from being too large, and cracks in the solder between the heating module and the substrate can be avoided.

Description

Electronic device and its assembling method

The invention relates to an electronic device, in particular to an electronic device with a buffer mechanism and an assembling method thereof.

The existing barebones computer is assembled on a casing through an open-top radiator, so that the radiator can contact a CPU on a circuit board to dissipate heat. Whether the radiator can closely contact the central processing unit is an important key to affecting the heat dissipation effect. If the contact interference between the radiator and the central processing unit is small, it is easy to cause excessive heat dissipation; If the amount of contact interference with the CPU is too large, it is easy to cause excessive bending and deformation of the circuit board, which in turn causes cracks in the solder between the circuit board and a socket for the CPU to plug in.

Therefore, one objective of the present invention is to provide an electronic device that can overcome at least one of the disadvantages of the prior art.

Therefore, the electronic device of the present invention includes a frame, a circuit assembly, a heat sink, and a buffer mechanism.

The frame includes a top plate and a plurality of studs arranged on the bottom surface of the top plate, and the top plate is formed with an opening. The circuit assembly includes a base plate fixed on the studs, and a heating module welded on the top surface of the base plate and corresponding to the opening. The radiator includes a heat dissipation plate locked to the top plate, and a heat dissipation block protruding from the bottom surface of the heat dissipation plate. The heat dissipation block penetrates the opening and exerts a pressure on the heating module to closely contact the heating block. Module. The buffer mechanism includes a plurality of elastic elements arranged on the substrate adjacent to the outer periphery of the heating module, and the elastic elements respectively apply a plurality of upward biasing elastic forces opposite to the downward pressure on the substrate.

In the electronic device of the present invention, the heating module has four corners, the substrate has four regions adjacent to the corners, the number of the elastic members is four, and the elastic members are respectively arranged in the regions And the upper bias elastic force is respectively applied to it.

In the electronic device of the present invention, the buffer mechanism further includes four screws, each of which locks the corresponding elastic member to the top of the corresponding area, and each of the elastic members is in a state of tensile deformation and is applied through the corresponding screw. The corresponding upper bias elastic force corresponds to the corresponding area.

In the electronic device of the present invention, each of the elastic members is an elastic piece and has a lower piece, an upper piece, and an inclined piece. The lower piece is located at the top of the corresponding area and corresponds to the bottom of the opening and is provided for corresponding The screw is locked, the upper plate is fixedly connected to the bottom surface of the top plate, and the inclined plate extends from one end of the lower plate upward and away from the lower plate to be connected to one end of the upper plate.

In the electronic device of the present invention, the frame further includes four pairs of pressure riveting parts protruding on the bottom surface of the top plate, and the upper plate of the elastic member corresponding to each pair of pressure riveting parts is fixed to the bottom surface of the top plate.

In the electronic device of the present invention, each of the elastic members is in a compressed and deformed state and the corresponding upper bias elastic force is applied to the corresponding bottom of the area.

In the electronic device of the present invention, the buffer mechanism further includes a bearing plate fixedly connected to the frame and spaced below the substrate, and each of the elastic members is a compression spring whose upper and lower ends abut against the substrate and the bearing plate, respectively .

In the electronic device of the present invention, the buffer mechanism further includes four screws respectively locked in the regions, and each elastic piece is sleeved on the corresponding screw.

One purpose of the present invention is to provide an assembling method of an electronic device that can overcome at least one of the disadvantages of the prior art.

Therefore, the assembling method of the electronic device of the present invention includes the following steps:

In the step of providing a frame, a frame is provided, and the frame includes a top plate and a plurality of studs arranged on the bottom surface of the top plate;

The step of assembling the circuit assembly is to lock a base plate of a circuit assembly to the studs so that a heating module soldered on the top surface of the base plate corresponds to an opening of the top plate;

In the step of assembling the buffer mechanism, a plurality of elastic members of a buffer mechanism are arranged on the substrate adjacent to the outer periphery of the heating module, so that the elastic members respectively apply a plurality of upward biasing elastic forces to the substrate; and

The step of assembling the radiator is to lock a radiator on the top plate, so that a heat sink of the radiator passing through the opening applies a downward force opposite to the upper bias elastic force on the heating module to tightly Touch the heating module.

In the assembling method of the electronic device of the present invention, in the step of assembling the buffer mechanism, the number of the elastic members is four, and the elastic members are respectively arranged on the four corners of the substrate adjacent to the four corners of the heating module. The area at which the upper bias elastic force is applied to these areas respectively.

In the assembling method of the electronic device of the present invention, in the step of providing the frame, an upper body of each elastic member is fixedly connected to the bottom surface of the top plate, and in the step of assembling the circuit assembly, the lower body of each elastic member The bottom surface is separated from the top surface of the substrate by a first distance. In the step of assembling the buffer mechanism, the lower plates of the elastic members are respectively locked on the tops of the regions by four screws, so that the elastic members are A stretched deformation state applies the corresponding upper bias elastic force to the corresponding area through the corresponding screw.

In the assembling method of the electronic device of the present invention, in the step of assembling the buffer mechanism, the elastic members are pressed toward the bottom surface of the substrate through a bearing plate of the buffer mechanism, so that the elastic members are in a compressed and deformed state and applied The corresponding upper bias elastic force corresponds to the bottom of the region.

In the method for assembling an electronic device of the present invention, the step of assembling the heat sink includes the following sub-steps:

The sub-step of placing the radiator, placing the radiator so that the heat dissipation block contacts the top surface of the heating module, and the bottom surface of a heat dissipation plate of the radiator is separated from the top surface of the top plate by a second distance; and

In the sub-step of fixing the radiator, the heat dissipation plate is fixed to the top plate through a plurality of bolts, so that the heat dissipation block applies the downward force to the heating module.

The effect of the present invention is that the direction of the upper bias elastic force applied to the substrate by the elastic members of the buffer mechanism is opposite to the direction of the downward force. Therefore, the upper bias elastic force can The downforce that greatly reduces the downforce. In this way, a good buffering effect of the substrate can be provided to prevent the degree of depression and deformation of the substrate from being too large, and cracks in the solder between the heating module and the substrate can also be avoided.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

1 is a first embodiment of the electronic device 100 of the present invention. The electronic device 100 is an example of a barebones computer, which includes a casing 1, a frame 2, a circuit assembly 3, and a heat sink 4 , Multiple bolts 5, and a buffer mechanism 6.

The casing 1 is formed with an accommodating space 11 with an opening facing upward.

1 and 2, the frame 2 is in an inverted U shape and includes a top plate 21, two side plates 22, and a plurality of studs 23. The top plate 21 has a bottom surface 211 and a top surface 212 opposite to the bottom surface 211. The top plate 21 is formed with an opening 213 extending between the bottom surface 211 and the top surface 212 and a plurality of screw holes 214 extending between the bottom surface 211 and the top surface 212. The opening 213 has a square shape. The side plates 22 respectively extend downward from the left and right sides of the top plate 21, and the side plates 22 are spaced apart along a left and right direction Y. The studs 23 are respectively disposed on the bottom surface 211 of the top plate 21.

1 and 3, the circuit assembly 3 is a printed circuit board assembly (PCBA) and includes a substrate 31, a heating module 32, and a plurality of screws 33. The substrate 31 has a bottom surface 311 and a top surface 312 opposite to the bottom surface 311. The substrate 31 is formed with a plurality of through holes 313 extending between the bottom surface 311 and the top surface 312. The number of the perforations 313 is the same as the number of the studs 23 and the positions are corresponding. In the first embodiment, the heating module 32 has a socket 321 and a heating element 322. The socket 321 is a flat grid array package (LGA) socket that is soldered to the top surface 312 of the substrate 31 by soldering, and the socket 321 corresponds to the position of the opening 213. The heating element 322 is a central processing unit (CPU) pluggable into the socket 321, and the heating element 322 has a top surface 323. The number of the screws 33 is the same as the number of the through holes 313, and each of the screws 33 is used to pass through the corresponding through hole 313 to be screwed to the corresponding stud 23, so as to lock the base plate 31 to the Stud 23 on.

It should be noted that in other implementations of the first embodiment, the heating module 32 can also have the following different changes according to requirements. For example, the socket 321 can also be a pin grid array package (PGA) The heating module 32 can also be a central processing unit or chip in the form of a ball grid array package (BGA), which can be directly soldered to the top surface 312 of the substrate 31 through solder balls.

Referring to FIG. 1, the radiator 4 is an open-top radiator and includes a heat dissipation plate 41 and a heat dissipation block 42. The heat dissipation plate 41 has a plate body 411 and a plurality of heat dissipation fins 412. The board 411 has a bottom surface 413 for abutting the top surface 212 and a top surface 414 opposite to the bottom surface 413. The plate body 411 is formed with a plurality of through holes 415 extending between the bottom surface 413 and the top surface 414. The through holes 415 and the screw holes 214 have the same number and corresponding positions. The heat dissipation fins 412 protrude from the top surface 414. The heat dissipation block 42 is integrally protruded on the bottom surface 413 of the heat dissipation plate 41 and corresponds to the position of the opening 213 of the frame 2. The heat dissipation block 42 is used to penetrate the opening 213 to contact the heating element 322 The top surface 323.

The number of the bolts 5 is the same as the number of the through holes 415, and each of the bolts 5 is used to pass through the corresponding through hole 415 to be screwed to the corresponding screw hole 214, thereby to lock the radiator 4 It is fixed to the top plate 21.

Referring to FIGS. 1, 2 and 3, the buffer mechanism 6 includes a plurality of elastic members 61 and a plurality of screws 62. The elastic members 61 are arranged on the substrate 31 adjacent to the outer periphery of the heating module 32 to support the substrate 31 and provide a cushioning effect. Specifically, in the first embodiment, the heating module 32 has four corners 324, the substrate 31 has four regions 314 respectively adjacent to the corners 324, and each region 314 is formed with an extension The screw hole 315 between the bottom surface 311 and the top surface 312 is used for screwing the corresponding screw 62. The number of the elastic members 61 and the number of the screws 62 are each taken as an example. Each elastic member 61 is an elastic piece made of, for example, spring steel, and each elastic member 61 extends along the left-right direction Y It also has a lower sheet body 611, an upper sheet body 612, and an inclined sheet body 613. The upper plate 612 is located on the bottom surface 211 of the top plate 21 and adjacent to the side of the opening 213, and the upper plate 612 is used to be fixedly connected to the bottom surface 211. The lower plate 611 corresponds to the bottom of the opening 213 and forms a through hole 614. The through hole 614 is located above the corresponding screw hole 315 for the corresponding screw 62 to pass through. The inclined sheet 613 extends from one end of the lower sheet 611 upward and away from the lower sheet 611 to be connected to one end of the upper sheet 612. Each screw 62 has a stud 621 and a screw head 622 at the top of the stud 621. The stud 621 of each screw 62 is used to penetrate the through hole 614 of the corresponding elastic member 61 and screw it to the corresponding screw hole 315 to lock the lower plate 611 of the corresponding elastic member 61 At the top of the corresponding area 314.

The following is a detailed description of the assembling method of the electronic device 100 of the first embodiment:

4 is a step flow chart of the assembling method of the electronic device 100, including the following steps: providing a frame step S1, assembling a circuit assembly step S2, assembling a buffer mechanism step S3, assembling a casing step S4, and assembling a heat sink step S5.

Referring to FIGS. 1, 2 and 4, in the providing frame step S1, the frame 2 is provided, and the upper plate 612 of the elastic members 61 is fixedly connected to the bottom surface 211 of the top plate 21. In the first embodiment, the frame 2 further includes four pairs of pressure riveting portions 24 protruding from the bottom surface 211 of the top plate 21, of which two pairs of pressure riveting portions 24 are adjacent to the left side of the opening 213 and along a front-to-back direction X are spaced apart, and the other two pairs of pressure riveting portions 24 are adjacent to the right side of the opening 213 and spaced apart along the front and rear direction X. Each pair of press riveting portions 24 press riveting the corresponding upper plate 612 of the elastic member 61 to fix the upper plate 612 to the bottom surface 211 of the top plate 21 so as not to rotate relative to the top plate 21. With the aforementioned pressure riveting method, the convenience of assembling and connecting the upper plate 612 and the top plate 21 can be improved, and no additional fasteners such as screws are required for connection and locking, thereby reducing the manufacturing cost.

4 and 5, in the assembling circuit assembly step S2, each screw 33 is inserted through the corresponding through hole 313 and screwed to the corresponding stud 23, so as to lock the substrate 31 to the Wait for the stud 23 to make the heating module 32 correspond to the bottom of the opening 213 of the top plate 21. At this time, the bottom surface of the lower sheet body 611 of each elastic member 61 and the top surface 312 of the substrate 31 are spaced along a vertical direction Z by a first distance D1, and the perforation 614 of each elastic member 61 is aligned with the corresponding Above the screw hole 315.

Since a height H of each elastic member 61 along the up-and-down direction Z (that is, the vertical distance between the bottom surface of the lower sheet body 611 and the top surface of the upper sheet body 612) will have manufacturing tolerances during production, therefore In order to avoid that the elastic parts 61 are manufactured with a positive tolerance and cannot provide the expected elastic force after subsequent assembly, in the first embodiment, the first distance D1 is taken as the positive tolerance limit value and the negative tolerance limit value Take the sum of as an example. For example, the positive tolerance limit value and the negative tolerance limit value are both 0.2 mm, so the value of the first distance D1 is, for example, 0.4 mm.

4, 6 and 7, in the step S3 of assembling the buffer mechanism, first pass each screw 62 through the opening 213 of the top plate 21 from top to bottom, and then screw the screw 62 of each screw 62 The pillar 621 penetrates through the corresponding through hole 614 and is screwed into the corresponding screw hole 315.

In addition, since the bottom surface of the lower plate 611 of each elastic member 61 is spaced from the top surface 312 of the base plate 31 by the first distance D1 (as shown in FIG. 5), the stud 621 of each screw 62 In the process of screwing into the corresponding screw hole 315, when the screw head 622 of each screw 62 contacts the top surface of the corresponding lower plate body 611, it will push it downward, so that the lower plate body 611 can penetrate the The inclined plate 613 pulls the upper plate 612 to bend downward and accumulate the elastic force of restoring. When the screw head 622 of each screw 62 pushes the corresponding lower piece 611 to a position close to the top surface 312 of the base plate 31, the bottom of the stud 621 protrudes from the bottom surface 311 of the base plate 31, Each of the screws 62 locks the corresponding lower plate 611 to the top surface 312 of the base plate 31, so that each of the elastic members 61 is in a stretched and deformed state (as shown in FIG. 6). Since each elastic member 61 accumulates a return elastic force in the stretched and deformed state, each elastic member 61 converts the accumulated return elastic force through the corresponding screw 62 into an upward bias applied to the corresponding region 314 Compressive force F1. Thereby, the regions 314 of the substrate 31 are pressed upward by the upward biasing elastic forces F1, respectively.

With the design of each elastic member 61 as an elastic piece in the first embodiment, the structural strength of each elastic member 61 is better. In addition to supporting the substrate 31 well, it can also provide a stable The upper bias elastic force F1 is applied to the substrate 31.

By the structural design of the lower sheet body 611, the upper sheet body 612, and the inclined sheet body 613 of each of the elastic members 61, each of the elastic members 61 is fixed to the corresponding position of the region 314 through the lower sheet body 611 And the position fixed to the top plate 21 through the upper plate 612 will not overlap up and down. In addition, the lower piece body 611 of each elastic member 61 corresponds to the bottom of the opening 213, so that the operator can conveniently lock the corresponding lower piece of each screw 62 directly through the opening 213. The body 611 corresponds to the operation at the top of the area 314.

It should be noted that the positions of the screw holes 315 of the regions 314 of the substrate 31 in the first embodiment are designed with reference to the positions of the locking holes of the existing heat sink, and are used as the locking points of the elastic members 61 And the placement location. In this way, it is ensured that the placement position of the elastic elements 61 can be kept at a proper distance from the heating module 32, so that the elastic elements 61 can indeed support the substrate 31 and provide cushioning. In other implementations of the first embodiment, the number, locking points, and placement positions of the elastic members 61 can also vary according to actual application requirements, and the number can also be, for example, two, three, or four. More than one, the locking point and the arrangement position can also be designed in other suitable areas of the substrate 31 adjacent to the outer periphery of the heating module 32, and are not limited to those disclosed in the first embodiment.

Referring to Figures 4 and 8, in step S4 of assembling the case, the hard disk (not shown) and other necessary components (not shown) of the electronic device 100 (shown in Figure 1) are first installed in Inside the accommodating space 11 of the casing 1. Then, the casing 1 is assembled to the frame 2 so that the frame 2 is accommodated in the accommodating space 11.

4 and 9, the step S5 of assembling the radiator includes the following substeps: a substep of placing the radiator, and a substep of locking the radiator.

In the sub-step of placing the heat sink, the heat sink 4 is placed so that the heat dissipation block 42 penetrates the opening 213 and contacts the top surface 323 of the heating element 322. At this time, the bottom surface 413 of the heat dissipation plate 41 of the heat sink 4 and the top surface 212 of the top plate 21 are spaced along the vertical direction Z by a second distance D2. In the first embodiment, the assembly tolerance between the top surface 323 of the heating element 322 and the top surface 312 of the base plate 31 along the vertical direction Z, and the manufacturing tolerance of each stud 23 along the vertical direction Z , And the manufacturing tolerance of the heat sink 42 along the up-and-down direction Z is the key to affect whether the heat sink 42 can contact the top surface 323 of the heating element 322 after the heat sink 4 is assembled, in order to avoid the assembly tolerance and the The manufacturing tolerances are all the limit values of the negative tolerances, so that the heat sink 42 cannot touch the top surface 323 of the heating element 322. Therefore, in the first embodiment, the second distance D2 is the negative of the assembly tolerance. Take the sum of the tolerance limit values and the negative tolerance limit values of these manufacturing tolerances as an example. For example, the negative tolerance limit value of the assembly tolerance is 0.4 mm, and the negative tolerance limit values of the manufacturing tolerances are each 0.1 mm, so the value of the second distance D2 is, for example, 0.6 mm, which is a pre-interference amount.

In addition, if the assembly tolerance and the manufacturing tolerances are both the limit value of the positive tolerance, the sum of the aforementioned limit value of the positive tolerance and the pre-interference amount is a maximum interference amount. In the first embodiment, the positive tolerance limit value of the assembly tolerance is 0.4 mm, and the positive tolerance limit values of the manufacturing tolerances are each 0.1 mm, so the value of the maximum interference amount is, for example, 1.2 mm. The maximum amount of interference will cause the heat sink 4 to cause the substrate 31 to produce the maximum plate bending amount after assembly. Therefore, it is necessary to judge whether the maximum plate bending amount is less than an allowable plate bending amount during design to ensure the maximum plate bending amount. Comply with relevant design specifications.

Referring to FIGS. 1, 9 and 10, the sub-step of fixing the radiator is performed, and each bolt 5 is inserted into the corresponding through hole 415 and screwed into the corresponding screw hole 214. Since the bottom surface 413 of the heat dissipation plate 41 and the top surface 212 of the top plate 21 are separated by the second distance D2, each of the bolts 5 is screwed to the corresponding screw hole 214, when each of the bolts 5 When a bolt head 51 touches the top surface 414 of the plate body 411, it pushes it downward, causing the radiator 4 to move downward. During the downward movement of the radiator 4, the heat dissipation block 42 applies a downward pressure F2 opposite to the upward biasing elastic forces F1 on the top surface 323 of the heating element 322, so that the bottom surface of the heat dissipation block 42 closely contacts the The top surface 323 of the heating element 322 pushes it downward. When the heating module 32 is pushed down, the substrate 31 below it will be slightly dented and deformed, so that the substrate 31 stretches the elastic members 61 to increase the degree of stretching deformation. When the bottom surface 413 of the heat dissipation plate 41 contacts the top surface 212 of the top plate 21 and is blocked by it, the radiator 4 cannot move down any more. At this time, each bolt 5 locks the radiator 4 to The top plate 21.

By setting the second distance D2 as the pre-interference amount, after the heat sink 4 is locked to the top plate 21, it can be ensured that the actual contact interference amount between the heat sink 42 and the heating element 322 is at least equal to The amount of pre-interference enables the heat dissipation block 42 to reliably and closely contact the heating element 322 to produce a good heat dissipation effect. In addition, since the upward biasing elastic force F1 applied to the regions 314 by the elastic members 61 through the screws 62 is opposite to the downward force F2, the upward biasing force F2 The elastic force F1 can greatly reduce the downforce of the downforce F2. In this way, the substrate 31 can be provided with a buffering effect to avoid excessive depression and deformation, and it can also prevent the solder between the socket 321 and the substrate 31 from being cracked due to the deformation of the substrate 31. Furthermore, when the heating element 322 is to be disassembled and replaced, the bolts 5 are removed from the screw holes 214, and then the radiator 4 is removed from the top plate 21 of the frame 2, so that the operator can conveniently and The heating element 322 can be quickly removed and replaced through the opening 213. Thereby, the operating convenience of disassembly and replacement of the heating element 322 can be greatly improved, and the man-hours of disassembly and replacement can be saved.

Referring to FIG. 11, it is the second embodiment of the electronic device 100 of the present invention. Its overall structure and assembly method are roughly the same as those of the first embodiment, except for the buffer mechanism 6.

In the second embodiment, the buffer mechanism 6 further includes a carrying plate 63 having a top surface 631 and two side ends 632 located on the left and right sides, respectively. The top surface 631 of the supporting board 63 is used for supporting the elastic elements 61. The side ends 632 are respectively used to connect to the side plates 22 of the frame 2. Wherein, each of the side plates 22 has a slot 221 formed on the inner surface thereof, and each of the side ends 632 is used to lock the corresponding slot 221 of the side plate 22. Each elastic member 61 is a compression spring used to sleeve the stud 621 of the corresponding screw 62, and the upper and lower ends of each elastic member 61 are used to abut against the bottom surface 311 of the substrate 31 and the The top surface 631 of the bearing plate 63.

11 and 12, in the assembling buffer mechanism step S3, the stud 621 of each screw 62 is locked to the corresponding screw hole 315 of the area 314, so that the stud 621 of each screw 62 The bottom protrudes from the bottom surface 311. Then, each of the elastic members 61 is sleeved on the corresponding part of the stud 621 protruding from the bottom surface 311, so that each of the elastic members 61 can be positioned at the bottom of the corresponding area 314 without moving arbitrarily. Subsequently, the carrier plate 63 is placed under the substrate 31 and the elastic members 61 are pressed toward the bottom surface 311 of the substrate 31, so that each elastic member 61 is in a compressed and deformed state and the corresponding upward bias is applied. The compressive elastic force F1 corresponds to the bottom of the region 314. Finally, the side ends 632 of the supporting plate 63 are respectively clamped in the grooves 221 of the side plates 22, so that the supporting plate 63 is fixed to the frame 22 to ensure that the elastic members 61 are held in the Compression deformation state.

Referring to FIGS. 11 and 13, in the step S5 of assembling the heat sink, each bolt 5 is inserted through the corresponding through hole 415 and screwed into the corresponding screw hole 214. When each bolt 5 is screwed to the corresponding screw hole 214, each bolt 5 pushes the heat sink 4 and the heating module 32 downward, so that the substrate 31 under the heating module 32 is slightly It dents downwards and deforms, and the base plate 31 compresses the elastic members 61 to increase the degree of compression deformation. The upward biasing elastic force F1 applied to the bottom of the regions 314 by the elastic members 61 can also greatly reduce the downward pressure path of the downward force F2, so as to provide the substrate 31 with a cushioning effect and avoid its depression and deformation. The degree is too large.

To sum up, in the electronic device 100 of each embodiment, the application direction of the upward bias elastic force F1 applied to the substrate 31 by the elastic members 61 of the buffer mechanism 6 and the application of the downward force F2 The direction of the force is opposite, therefore, the upward bias elastic force F1 can greatly reduce the downward pressure path of the downward pressure F2. Thereby, a good cushioning effect of the substrate 31 can be provided to avoid excessive depression and deformation, and cracks in the solder between the socket 321 of the heating module 32 and the substrate 31 can be avoided, so that the cost can indeed be achieved. The purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

100: electronic device 1: chassis 11: accommodating space 2: frame 21: Top plate 211: Bottom 212: top surface 213: open hole 214: screw hole 22: side panel 221: card slot 23: Stud 24: Pressure riveting department 3: Circuit assembly 31: substrate 311: Bottom 312: top surface 313: Piercing 314: area 315: screw hole 32: heating module 321: Socket 322: Heating element 323: top surface 324: corner corner 33: Screw 4: radiator 41: heat sink 411: plate body 412: cooling fins 413: Bottom 414: top surface 415: Through hole 42: heat sink 5: Bolt 51: Bolt head 6: Buffer mechanism 61: Elastic 611: lower body 612: upper body 613: Tilted Sheet 614: piercing 62: Screw 621: Stud 622: Screw Head 63: Carrier plate 631: top surface 632: side end D1: first pitch D2: second spacing F1: Upper bias elastic force F2: Downforce H: height X: front and back direction Y: left and right direction Z: Up and down direction

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: 1 is a front exploded view of the first embodiment of the electronic device of the present invention, illustrating the assembly relationship between a casing, a frame, a circuit assembly, a radiator, a plurality of bolts, and a buffer mechanism; 2 is an incomplete bottom view of the frame of the first embodiment, illustrating the assembling relationship between a plurality of elastic members and a top plate of the frame; 3 is an incomplete top view of the circuit assembly of the first embodiment; Fig. 4 is a step flow chart of the assembling method of the first embodiment; FIG. 5 is an assembly diagram of the first embodiment, illustrating that a plurality of screws fix a base plate on a plurality of studs, and the lower part of each elastic member is separated from the base plate by a first distance; 6 is an assembly diagram of the first embodiment, illustrating that a plurality of screws respectively lock the elastic members to the substrate, so that each elastic member is in a state of tensile deformation and is applied to the substrate through the corresponding screw One biased elasticity; FIG. 7 is an assembly diagram of the first embodiment, illustrating that the screws respectively lock the elastic members to the base plate; FIG. 8 is an assembly diagram of the first embodiment, illustrating that the frame is assembled in an accommodating space of the casing; 9 is an assembly schematic diagram of the first embodiment, illustrating that a heat dissipation block of the heat sink contacts a heating element, so that a heat dissipation plate of the heat sink is separated from the top plate by a second distance; FIG. 10 is an assembly schematic diagram of the first embodiment, illustrating that a plurality of bolts lock the radiator to the top plate, so that the heat sink block exerts a pressure on the heating element; 11 is a front exploded view of the second embodiment of the electronic device of the present invention; FIG. 12 is an assembly diagram of the second embodiment, illustrating that each of the elastic members is in a compressed and deformed state and the corresponding upper bias elastic force is applied to the substrate; and Fig. 13 is an assembly diagram of the second embodiment.

21: Top plate

212: top surface

213: open hole

23: Stud

31: substrate

312: top surface

314: area

32: heating module

321: Socket

322: Heating element

323: top surface

4: radiator

41: heat sink

411: plate body

413: Bottom

42: heat sink

61: Elastic

611: lower body

612: upper body

613: Tilted Sheet

62: Screw

621: Stud

622: Screw Head

F1: Upper bias elastic force

F2: Downforce

Y: left and right direction

Z: Up and down direction

Claims (13)

An electronic device including: A frame, including a top plate, and a plurality of studs arranged on the bottom surface of the top plate, the top plate is formed with an opening; A circuit assembly, including a base plate that is fixed to the studs, and a heating module welded to the top surface of the base plate and corresponding to the opening; A heat sink includes a heat dissipation plate locked to the top plate, and a heat dissipation block protruding from the bottom surface of the heat dissipation plate. The heat dissipation block penetrates the opening and applies a pressure on the heating module to closely contact the heat dissipation block. Heating module; and A buffer mechanism includes a plurality of elastic elements arranged on the substrate adjacent to the outer periphery of the heating module, and the elastic elements respectively apply a plurality of upward biasing elastic forces opposite to the downward pressure on the substrate. The electronic device according to claim 1, wherein the heating module has four corners, the substrate has four areas adjacent to the corners, and the number of the elastic members is four, and the elastic members They are respectively arranged in these areas and the upper bias elastic forces are respectively applied to them. The electronic device according to claim 2, wherein the buffer mechanism further includes four screws, each of which locks the corresponding elastic member to the top of the corresponding region, and each of the elastic members is in a stretched and deformed state. The corresponding upper bias elastic force is applied to the corresponding area through the corresponding screw. The electronic device according to claim 3, wherein each of the elastic members is an elastic sheet and has a lower sheet, an upper sheet, and an inclined sheet, and the lower sheet is located at the top of the corresponding area and corresponds to the The upper plate is fixedly connected to the bottom surface of the top plate, and the inclined plate extends upward from one end of the lower plate and extends obliquely away from the lower plate to be connected to the lower plate. One end of the upper body. The electronic device according to claim 4, wherein the frame further includes four pairs of squeezing portions protruding from the bottom surface of the top plate, and each pair of squeezing portions squeezes the upper body of the elastic member corresponding to it to fix it On the bottom surface of the top plate. The electronic device according to claim 2, wherein each of the elastic members is in a compressed and deformed state and applies the corresponding upward biasing elastic force to the corresponding bottom of the region. The electronic device according to claim 6, wherein the buffer mechanism further includes a carrier plate fixedly connected to the frame and spaced below the substrate, and each of the elastic members has an upper and lower end abutting against the substrate and The compression spring of the bearing plate. The electronic device according to claim 7, wherein the buffer mechanism further includes four screws respectively locked in the regions, and each elastic member is sleeved on the corresponding screw. An assembling method of an electronic device includes the following steps: In the step of providing a frame, a frame is provided, and the frame includes a top plate and a plurality of studs arranged on the bottom surface of the top plate; The step of assembling the circuit assembly is to lock a base plate of a circuit assembly to the studs so that a heating module soldered on the top surface of the base plate corresponds to an opening of the top plate; In the step of assembling the buffer mechanism, a plurality of elastic members of a buffer mechanism are arranged on the substrate adjacent to the outer periphery of the heating module, so that the elastic members apply a plurality of upward biasing elastic forces to the substrate; The step of assembling the radiator is to lock a radiator on the top plate, so that a heat sink of the radiator passing through the opening applies a downward force opposite to the upper bias elastic force on the heating module to tightly Touch the heating module. The method for assembling an electronic device according to claim 9, wherein, in the step of assembling the buffer mechanism, the number of the elastic members is four, and the elastic members are respectively arranged on the four substrates adjacent to the heating mold The areas at the four corners of the group are used to apply the upward biasing elastic forces to these areas respectively. The method for assembling an electronic device according to claim 10, wherein, in the step of providing the frame, an upper plate of each elastic member is fixedly connected to the bottom surface of the top plate, and in the step of assembling the circuit assembly, each of the The bottom surface of the lower piece of the elastic piece is spaced from the top surface of the substrate by a first distance. In the step of assembling the buffer mechanism, the lower pieces of the elastic piece are respectively locked on the top of the regions through four screws. Each of the elastic members is in a state of tensile deformation and the corresponding upper biasing elastic force is applied to the corresponding area through the corresponding screw. The method for assembling an electronic device according to claim 10, wherein, in the step of assembling the buffer mechanism, the elastic members are pressed toward the bottom surface of the substrate through a carrier plate of the buffer mechanism, so that the elastic members are A state of compression and deformation is applied and the corresponding upper bias elastic force is applied to the corresponding bottom of the region. The method for assembling an electronic device according to any one of claims 9 to 12, wherein the step of assembling the heat sink includes the following sub-steps: The sub-step of placing the heat sink, placing the heat sink so that the heat dissipation block contacts the top surface of the heating module, and the bottom surface of a heat dissipation plate of the heat sink is spaced a second distance from the top surface of the top plate; In the sub-step of fixing the radiator, the heat dissipation plate is fixed to the top plate through a plurality of bolts, so that the heat dissipation block applies the downward force to the heating module.

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