TWM580852U - Heat sink fixing component - Google Patents

Abstract

A heat sink fixing component is assembled to a circuit board having a processor socket, and includes a bottom frame, a pressing plate, a positioning member, a heat sink, a first fixing member, and an elastic body. The bottom frame is located on the circuit board and surrounds the processor socket. The pressing plate is located on the bottom frame and surrounds the processor socket. The positioning member is located on the bottom frame and has a protruding portion, and the protruding portion of the positioning member protrudes away from the bottom frame. The heat sink is located on the protruding portion of the positioning member and covers the bottom frame and the pressing plate. The first fixing member penetrates through the heat sink and the protruding portion of the positioning member, and is configured to fix the heat sink onto the protruding portion of the positioning member. The elastic body is located between the protruding portion of the positioning member and the bottom frame, and the first fixing member penetrates through the elastic body.

Description

Heat sink fixing component

This case is about a heat-dissipating fixed component.

A central processing unit (CPU) can perform complex logic operations and is an indispensable component in a computer. The components used to secure the central processor must provide sufficient downforce to pressurize the central processor to ensure that the central processor is able to maintain a stable electrical connection with the connector in the server or workstation.

However, the performance of the central processing unit has gradually increased with the development of technology, and its size and foot position have also increased greatly. Therefore, the components conventionally used for fixing the central processing unit are not enough to provide sufficient downforce to apply pressure to the central processing unit. This prevents a good electrical conduction between the central processor and the connector. In addition, the higher the efficiency of the processor, the higher the need for heat dissipation. The components traditionally used to fix the processor are not easy to install the heat sink quickly.

One aspect of the present disclosure is a heat dissipating fixing assembly mounted on a circuit board having a connector.

According to an embodiment of the present disclosure, a heat dissipation fixing component includes Bottom frame, pressure plate, positioning member, heat sink, first fixing member and elastic body. The bottom frame is on the board and surrounds the connector. The pressure plate is located on the bottom frame and surrounds the connector. The positioning member is located on the bottom frame and has a convex portion, and the convex portion protrudes away from the bottom frame. The heat sink is located on the convex portion of the positioning member and covers the bottom frame and the pressure plate. The first fixing member passes through the convex portion of the heat sink and the positioning member, and is configured to fix the heat sink to the convex portion of the positioning member. The elastic body is located between the convex portion and the bottom frame of the positioning member, and the first fixing member passes through the elastic body.

In an embodiment of the disclosure, the positioning member has a first positioning hole, and the heat sink has a second positioning hole substantially aligned with the first positioning hole, and the first fixing member passes through the first positioning hole and the second positioning hole.

In an embodiment of the present disclosure, the first fixing member includes a screw and a nut, the screw is surrounded by an elastic body, and the nut is located on the heat sink and meshes with the screw.

In an embodiment of the disclosure, the heat dissipating fixing component further comprises a backing plate respectively located on opposite sides of the circuit board with the bottom frame.

In an embodiment of the disclosure, the heat dissipation fixing assembly further includes a hinge plate disposed along one side of the bottom frame, wherein the pressure plate is pivotally connected to the hinge plate.

In an embodiment of the disclosure, the positioning member and the hinge plate are respectively located on adjacent sides of the bottom frame.

In an embodiment of the disclosure, the pressure plate has a hook, the hinge plate has a rotating shaft, and the hook is coupled to the rotating shaft.

In an embodiment of the present disclosure, the hinge plate has opposite extending portions extending away from the bottom frame, and both ends of the rotating shaft are respectively positioned in the two extending portions.

In an embodiment of the disclosure, the heat dissipating fixing component further includes a second fixing member that passes through the pressing plate and the hinge plate and is fixed to the bottom frame.

In an embodiment of the present disclosure, the positioning member has two extending portions, and the two extending portions are fixed to the bottom frame and respectively extend from opposite sides of the convex portion.

According to the above embodiment of the present disclosure, a central processing unit (CPU) can be positioned in a space between the connector and the pressure plate, and the pressure plate can apply a downward pressure to the central processing unit. In addition, the heat sink can be fixed to the convex portion of the positioning member by the first fixing member to cover the bottom frame and the pressure plate to indirectly apply the downward pressure to the central processing unit, and the heat sink can be quickly installed. In addition, the strength of the downforce applied by the heat sink can be changed by the elastomer to meet the needs of the central processor of different sizes and positions. In this way, the central processor located on the connector can be subjected to double downforce between the pressure plate and the heat sink, so that the electrical connection between the central processor and the connector of the server or the workstation is more. Stable, not only reduces the risk of failure or damage to the connector terminals, but also improves heat dissipation efficiency.

100‧‧‧Heat fixing components

110‧‧‧ Backboard

112‧‧‧ Positioning rod

120‧‧‧ bottom frame

130, 130a‧‧‧ hinge plate

132‧‧‧Extension

134‧‧‧ shaft

140‧‧‧ Positioning parts

142‧‧‧First positioning hole

144‧‧‧ convex

146‧‧‧Extension

150‧‧‧ pressure plate

152‧‧‧ card hook

154‧‧‧ openings

160‧‧‧ radiator

162‧‧‧Second positioning hole

170‧‧‧First fixture

172‧‧‧ screws

174‧‧‧ Nuts

180‧‧‧ Elastomers

190, 190a‧‧‧second fixture

192, 192a‧‧‧ screws

194, 194a‧‧‧ nuts

200‧‧‧ Rivets

210‧‧‧ third fixture

300‧‧‧ boards

302‧‧‧third positioning hole

310‧‧‧Connector

500‧‧‧Central processor

600‧‧‧ Screwdriver

FIG. 1 is a perspective view of a heat dissipating fixing assembly according to an embodiment of the present disclosure.

Fig. 2 is an exploded view showing the heat dissipating fixing assembly of Fig. 1.

Fig. 3 is a partially enlarged view showing the heat dissipating fixing assembly of Fig. 2.

Fig. 4 is a side view showing the heat dissipating fixing assembly of Fig. 1.

FIG. 5 is a perspective view of the pressure plate opened according to an embodiment of the present disclosure and the central processor is disposed on the connector.

Fig. 6 is a perspective view showing the pressure plate of Fig. 5 closed.

Figure 7 is a perspective view of the positioning member of Figure 6 after the heat sink is attached.

The embodiments of the present disclosure are disclosed in the following drawings, and for the sake of clarity, the details of the invention will be described in the following description. However, it should be understood that these practical details are not intended to limit the disclosure. That is, in some embodiments of the disclosure, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a perspective view of a heat dissipation fixing assembly 100 according to an embodiment of the present disclosure. FIG. 2 is an exploded view of the heat dissipation fixing assembly 100 of FIG. 1. Referring to FIGS. 1 and 2 together, the heat dissipation fixing assembly 100 is mounted on the circuit board 300 having the connector 310, and includes a bottom frame 120, a pressure plate 150, a positioning member 140, a heat sink 160, a first fixing member 170, and elasticity. Body 180. The bottom frame 120 is located on the circuit board 300 and surrounds the connector 310. The pressure plate 150 is located on the bottom frame 120 and surrounds the connector 310. The positioning member 140 is located on the bottom frame 120 and has a convex portion 144 protruding in a direction away from the bottom frame 120. The heat sink 160 is located on the convex portion 144 of the positioning member 140 and covers the bottom frame 120 and the pressure plate 150. The first fixing member 170 passes through the heat sink 160 and the convex portion 144 of the positioning member 140 and is configured to fix the heat sink 160 on the convex portion 144 of the positioning member 140. The elastic body 180 is located between the convex portion 144 of the positioning member 140 and the bottom frame 120 , and the first fixing member 170 passes through the elastic body 180 .

In this embodiment, the central processing unit (CPU) can be positioned in the space between the connector 310 and the pressure plate 150, and is electrically connected through the connector 310. Circuit board 300. The platen 150 can apply a downforce to the central processor. In addition, the heat sink 160 can be fixed on the convex portion 144 of the positioning member 140 by the first fixing member 170 to cover the bottom frame 120 and the pressing plate 150, and can indirectly apply a downward pressure to the central processing unit, and the heat sink 160 can be quickly installation. In addition, the strength of the downforce applied by the heat sink 160 can also be varied by the elastomer 180 to meet the needs of a central processor of different sizes and feet. That is to say, the designer can change the strength of the downforce applied by the heat sink 160 through the selection of different elastomers 180. In this way, the central processor located on the connector 310 can be subjected to double downforce exerted by the pressure plate 150 and the heat sink 160, so that the central processor and the associated server (Server) or the workstation of the workstation 310 The electrical connection between the two is more stable, which not only reduces the risk of failure or damage of the connector 310 terminal, but also improves the heat dissipation efficiency.

In the present embodiment, the heat dissipation fixing assembly 100 may further include a backing plate 110 on the surface of the circuit board 300 facing away from the bottom frame 120. The plan view area of the backplane 110 may be smaller than the plan view area of the circuit board 300, and the backplane 110 may be used to support the circuit board 300, the connector 310, and the heat dissipation fixing assembly 100 above it. In addition, the upper surface of the backing plate 110 may further include a positioning rod 112, and the circuit board 300 has a third positioning hole 302 substantially aligned with the positioning rod 112. When the circuit board 300 is disposed on the back board 110, the third positioning hole 302 can be coupled to the corresponding positioning rod 112 such that the circuit board 300 can be positioned on the back board 110. In this embodiment, the number of the third positioning holes 302 and the corresponding positioning rods 112 may be one or more, depending on the needs of the designer, and is not intended to limit the disclosure.

FIG. 3 is a partial enlarged view of the heat dissipation fixing assembly 100 of FIG. 2, and FIG. 4 is a side view of the heat dissipation fixing assembly 100 of FIG. See also 3 and 4 , in the present embodiment, the heat dissipation fixing assembly 100 may further include a hinge plate 130 disposed along one side of the bottom frame 120 , and the hinge plate 130 has two opposite ends extending away from the bottom frame 120 . The extension 132. That is, the extension 132 is substantially perpendicular to the bottom frame 120. The hinge plate 130 also has a rotating shaft 134, and both ends of the rotating shaft 134 are respectively positioned in the two extending portions 132. In the present embodiment, the heat dissipating fixing assembly 100 may include a hinge plate 130a having no rotating shaft 134 in addition to the hinge plate 130. The number of the hinge plates 130a is not intended to limit the disclosure.

In addition, one side of the pressure plate 150 has a hook 152, and the hook 152 is coupled to the rotating shaft 134 between the two extending portions 132 of the hinge plate 130, so that the pressing plate 150 can be pivotally connected to the hinge plate 130 and can be rotated relative to the connector 310. . In addition, the heat dissipation fixing assembly 100 may further include a second fixing member 190 fixed to the bottom frame 120. The second fixing member 190 includes a screw 192 and a nut 194, and the screw 192 is located in the hinge plate 130, 130a and the pressing plate 150, and is engaged with the nut 194 located on the pressing plate 150. That is to say, in addition to fixing the hinge plates 130, 130a to the bottom frame 120, the second fixing member 190 can also fix the pressure plate 150 to the bottom frame 120 to ensure that the central processing unit located on the connector 310 can be accurately positioned. There is no positional deviation in the space between the connector 310 and the pressure plate 150. In this embodiment, the number of the second fixing members 190 may be one or more, depending on the needs of the designer. In addition, the heat dissipating fixing assembly 100 may further include a second fixing member 190a that does not pass through the hinge plate 130 and directly passes through the pressing plate 150, and the second fixing member 190a includes a screw 192a and a nut 194a, but is not intended to limit the disclosure.

In the present embodiment, the positioning member 140 and the hinge plate 130 are respectively located on adjacent sides of the bottom frame 120, and the positioning member 140 has two extending portions 146 extending from opposite sides of the convex portion 144, respectively. Two extensions 146 through the rivet 200 and the third The fixing member 210 is fixed to the bottom frame 120. In addition, since the positioning member 140 has a first positioning hole 142, and the heat sink 160 has a second positioning hole 162 substantially aligned with the first positioning hole 142, the first fixing member 170 includes a screw 172 and a nut located on the heat sink 160. 174. Therefore, the screw 172 of the first fixing member 170 can pass through the first positioning hole 142 and the second positioning hole 162 and engage with the nut 174 located above the second positioning hole 162 to fix the heat sink 160 to the positioning member. The bottom frame 120 and the pressure plate 150 are covered on the 140. In this embodiment, the number of the positioning members 140 may be one or more, which may be determined by the designer and is not intended to limit the disclosure.

Referring to FIG. 4, the elastic body 180 is located between the convex portion 144 of the positioning member 140 and the bottom frame 120, and the screw 172 of the first fixing member 170 is surrounded by the elastic body 180. That is, the screw 172 passes through the elastic body 180. In this way, the elastic body 180 can provide a positive force to the positioning member 140, and the positive force can be transmitted to the central processor and the connector 310 through the pair of locks of the positioning member 140 and the heat sink 160 (see Figure 3) to maintain good electrical conduction between the central processor and the connector 310. In addition, different downforce strengths can be provided to the central processor by selecting elastomers 180 of different parameters to meet the needs of central processors of different sizes and feet.

In the embodiment, when the heat dissipating fixing component 100 is assembled, the circuit board 300 may be disposed on the back board 110 such that the third positioning hole 302 of the circuit board 300 is coupled to the positioning rod 112 on the back board 110 to ensure the circuit. The board 300 can be positioned on the back board 110. Next, the bottom frame 120 is disposed on the circuit board 300 such that the bottom frame 120 surrounds the connector 310 of the circuit board 300. Subsequently, the hinge plate 130 may be disposed along one side of the bottom frame 120. Next, the pressing plate 150 having the hook 152 can be coupled to the rotating shaft 134 between the two extending portions 132 of the hinge plate 130. In this way, the pressure plate 150 It can be pivotally connected to the hinge plate 130 and can be rotated relative to the connector 310, so that the pressure plate 150 can assume two states of "on" and "off" with respect to the connector 310.

After the above steps are completed, the positioning member 140 may be disposed on one side of the bottom frame 120 adjacent to the hinge plate 130. The two extensions 146 of the positioning member 140 are fixed to the bottom frame 120 through the rivet 200 and the third fixing member 210. In addition, a screw 172 may be disposed between the positioning member 140 and the bottom frame 120, and an elastic body 180 is disposed around the screw 172, and the screw 172 passes through the first positioning hole 142 of the convex portion 144 of the positioning member 140. In the following description, the subsequent assembly steps will be further explained.

FIG. 5 is a perspective view of the pressure plate 150 being opened and the central processing unit 500 is disposed on the connector 310 according to an embodiment of the present disclosure. After the above steps are completed, the pressure plate 150 can be rotated to the "open" state with respect to the connector 310, and then the central processing unit 500 can be disposed in the connector 310.

FIG. 6 is a perspective view showing the pressure plate 150 of FIG. 5 closed, and after the central processing unit 500 is placed on the connector 310, the pressure plate 150 can be rotated to the "closed" state with respect to the connector 310. Subsequently, the screws 192, 192a (see FIG. 3) of the second fixing members 190, 190a (refer to FIG. 3) can be bolted to the nuts 194, 194a to be engaged with each other using the screwdriver 600, so that the pressure plate 150 can be fixed. Above the bottom frame 120 and a downward pressure can be applied to the central processor 500. In this way, the central processing unit 500 can be accurately positioned in the space between the connector 310 and the pressure plate 150 without positional displacement, so that good electrical conduction can be maintained between the central processing unit 500 and the connector 310. In the present embodiment, the pressure plate 150 may have an opening 154 at the center of the pressure plate 150, and the central processing unit 500 disposed on the connector 310 may be exposed from the opening 154. Face of opening 154 The product is smaller than the area of the central processing unit 500, and the shape of the opening 154 can be determined by the designer and is not intended to limit the disclosure.

FIG. 7 is a perspective view of the positioning member 140 of FIG. 6 after the heat sink 160 is locked. Referring to FIGS. 4 and 7, the heat sink 160 can be disposed on the convex portion 144 of the positioning member 140 after the pressure plate 150 is fixed to the central processing unit 500 (see FIG. 6) and the central processing unit 500 is positioned. And screwing the screw 172 of the first fixing member 170 and the nut 174 to be engaged with each other by using the screwdriver 600, so that the heat sink 160 can be fixed on the positioning member 140 and covering the bottom frame 120 and the pressing plate 150, and can be applied The pressure is applied to the central processing unit 500. In addition, the strength of the downforce applied by the heat sink 160 to the central processing unit 500 can be varied by replacing the elastomer 180 of different parameters to meet the needs of the central processor 500 of different sizes and positions.

The present disclosure has been disclosed in the above embodiments, and is not intended to limit the disclosure. Any one skilled in the art can make various modifications and retouchings without departing from the spirit and scope of the disclosure. The scope is subject to the definition of the scope of the patent application attached.

Claims (10)

A heat dissipating fixing component is mounted on a circuit board having a connector, the heat dissipating fixing component comprises: a bottom frame on the circuit board and surrounding the connector; a pressing plate located on the bottom frame and surrounding the connecting frame a positioning member on the bottom frame and having a convex portion protruding in a direction away from the bottom frame; a heat sink located on the convex portion of the positioning member and covering the bottom frame And the pressing plate; a first fixing member passing through the heat sink and the convex portion of the positioning member, configured to fix the heat sink to the convex portion of the positioning member; and an elastic body located at the positioning member The convex portion is between the convex portion and the bottom frame, and the first fixing member passes through the elastic body. The heat dissipating fixing assembly of claim 1, wherein the positioning member has a first positioning hole, the heat sink has a second positioning hole substantially aligned with the first positioning hole, and the first fixing member passes through the first Positioning the hole and the second positioning hole. The heat dissipating fixing assembly of claim 1, wherein the first fixing member comprises a screw and a nut, the screw is surrounded by the elastic body, and the nut is located on the heat sink and engaged with the screw. The heat dissipating fixing component of claim 1, further comprising: a backing plate, wherein the bottom frame is respectively located on opposite surfaces of the circuit board. The heat dissipating fixing component of claim 1, further comprising: a hinge plate disposed along one side of the bottom frame, wherein the pressing plate is pivotally connected to the hinge plate. The heat dissipating fixing assembly of claim 5, wherein the positioning member and the hinge plate are respectively located on adjacent sides of the bottom frame. The heat dissipating fixing assembly of claim 5, wherein the pressing plate has a hook, the hinge plate has a rotating shaft, and the hook is coupled to the rotating shaft. The heat dissipating fixing assembly of claim 7, wherein the hinge plate has opposite extending portions extending away from the bottom frame, and two ends of the rotating shaft are respectively positioned in the two extending portions. The heat dissipating fixing assembly of claim 5, further comprising: a second fixing member passing through the pressing plate and the hinge plate and fixed to the bottom frame. The heat dissipating fixing assembly of claim 1, wherein the positioning member has two extending portions, and the two extending portions are fixed to the bottom frame and respectively extend from opposite sides of the convex portion.