CN219780737U - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN219780737U CN219780737U CN202223373522.5U CN202223373522U CN219780737U CN 219780737 U CN219780737 U CN 219780737U CN 202223373522 U CN202223373522 U CN 202223373522U CN 219780737 U CN219780737 U CN 219780737U
- Authority
- CN
- China
- Prior art keywords
- heat
- substrate
- heat sink
- connecting column
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation device, and belongs to the technical field of electronic device heat dissipation. The heat dissipation device includes: the heat-generating device is arranged on the substrate; the heat conducting fin is positioned at one side of the heating device, which is away from the substrate; the radiator is positioned at one side of the heat conducting fin away from the substrate; at least one of the radiator and the heat conducting fin is connected with the substrate through a connecting column, a compressed elastic heat conducting pad is clamped between the heat conducting fin and the heating device and at least one of the radiator and the heat conducting fin, and the height of the connecting column is larger than that of a rigid part between parts at two ends of the connecting column. According to the heat dissipation device disclosed by the utility model, on one hand, the mounting stress born by the heating device can be reduced, and the stress damage of the heating device is avoided; on the other hand, the heat-generating device, the heat-conducting fin and/or the contact between the heat-conducting fin and the radiator can be more reliable, so that the heat radiation performance is improved.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation of electronic devices, and particularly relates to a heat dissipation device.
Background
In the circuit board structure with the heating device, in order to prevent overheating, the ceramic gasket is generally arranged between the heating device and the radiator, so that the heating device conducts heat to the radiator, particularly, when the circuit board structure is assembled, the ceramic gasket is extruded by the heating device and is easy to crack, and meanwhile, the heating device is also easy to damage due to the reaction force of the ceramic gasket.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the heat dissipation device, which replaces the ceramic gasket on the premise that the heating device is enabled to conduct heat to the heat sink effectively, reduces the assembly stress suffered by the power tube and protects the power tube.
The utility model provides a heat dissipation device, comprising:
a substrate;
the heating device is arranged on the substrate;
the heat conducting sheet is positioned on one side of the heating device, which is away from the substrate;
the radiator is positioned on one side of the heat conducting fin away from the substrate; wherein,,
at least one of the radiator and the heat conducting fin is connected with the substrate through a connecting column, a compressed elastic heat conducting pad is clamped between the heat conducting fin and the heating device and at least one of the radiator and the heat conducting fin, and the height of the connecting column is larger than that of a rigid part between parts at two ends of the connecting column.
According to the heat dissipating device of the present utility model, by sandwiching the elastic heat conductive pad between the heat conductive sheet and the heat generating device and/or between the heat conductive sheet and the heat sink and securing the height of the connection post to be larger than the height of the rigid member between the members at both ends of the connection post, in the above arrangement, the connection post has a supporting effect on the substrate, i.e., a constant distance between the members at both ends of the connection post, the present utility model controls the constant distance according to the connection post selected, thereby controlling the magnitude of the assembly stress of the rigid member between the members at both ends of the connection post. The design is used for normalizing the assembly stress of the rigid parts between the parts at the two ends of the connecting column on one hand, and avoiding the overlarge assembly stress and stress damage caused by human factors; on the other hand, by means of the characteristics that the elastic heat conducting pad is compressed and can conduct heat, the components at the two ends of the connecting column are in close contact, and therefore the purpose of improving heat dissipation performance is achieved.
According to one embodiment of the utility model, the base plate is provided with a mounting hole, the connecting column is provided with a threaded hole, and the base plate is in threaded connection with the connecting column through a threaded connection penetrating through the mounting hole.
According to one embodiment of the utility model, the elastic heat conductive pad comprises an insulation base layer and heat conductive fillers coated on two sides of the insulation base layer.
According to one embodiment of the utility model, the heat conducting fin is connected with the substrate through a first connecting column, the height of the first connecting column is larger than the height of the heating device protruding out of the substrate, and a compressed first elastic heat conducting pad is arranged between the heat conducting fin and the heating device.
According to one embodiment of the utility model, the substrate is provided with a plurality of first mounting holes, the first mounting holes are arranged adjacent to the heating device, the first elastic heat conduction pad is provided with first avoiding holes, and the first connecting columns penetrate through the first avoiding holes and are opposite to the first mounting holes.
According to one embodiment of the utility model, the first connecting stud is integrally formed with the thermally conductive sheet.
According to one embodiment of the utility model, the heat sink is connected to the substrate through a second connection post, the height of the second connection post is larger than the sum of the height of the heat generating device protruding out of the substrate and the height of the heat conducting fin, and a compressed second elastic heat conducting pad is arranged between the heat sink and the heat conducting fin.
According to one embodiment of the utility model, the base plate is provided with a plurality of second mounting holes, which are distributed at the respective top corners of the base plate.
According to one embodiment of the utility model, a mounting surface is arranged on one side, facing the substrate, of the radiator, and the second elastic heat conduction pad is attached to the mounting surface.
According to one embodiment of the utility model, the second connection post is integrally formed with the heat sink.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present utility model;
FIG. 2 is a second schematic diagram of a heat dissipating device according to an embodiment of the present utility model;
FIG. 3 is a third schematic diagram of a heat dissipating device according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram of a heat dissipating device according to an embodiment of the present utility model;
FIG. 5 is a schematic diagram of a heat dissipating device according to an embodiment of the present utility model;
FIG. 6 is a schematic diagram of a heat dissipating device according to an embodiment of the present utility model;
FIG. 7 is a schematic diagram of a substrate and a heat generating device according to an embodiment of the present utility model;
FIG. 8 is a second schematic diagram of a substrate and a heat generating device according to an embodiment of the present utility model;
FIG. 9 is a third schematic diagram of a substrate and a heat generating device according to an embodiment of the present utility model;
FIG. 10 is a schematic diagram of a heat generating device according to an embodiment of the present utility model;
fig. 11 is a schematic structural view of a heat conductive sheet according to an embodiment of the present utility model;
FIG. 12 is a schematic view of an elastic thermal pad according to an embodiment of the present utility model;
FIG. 13 is a schematic diagram of a heat sink according to an embodiment of the present utility model;
fig. 14 is a second schematic structural diagram of a heat sink according to an embodiment of the utility model.
Reference numerals:
a substrate 100, a first mounting hole 110; a second mounting hole 120;
a heat generating device 200;
a heat conductive sheet 300, first connection posts 310;
a heat sink 400, a second connection post 410; a mounting surface 420;
an elastic thermal pad 500, a first elastic thermal pad 510; a first avoidance hole 511; and a second resilient thermal pad 520.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
A heat dissipating device according to an embodiment of the present utility model is described below with reference to fig. 1 to 14.
As shown in fig. 1 to 6, the heat dissipating device includes: a substrate 100, a heat generating device 200, a heat conductive sheet 300, and a heat sink 400.
The substrate 100 is not particularly limited to the size and shape of the substrate 100, and the substrate 100 may be, but not limited to, a printed circuit board, and in practical application, a thick copper plate, a high frequency plate, an impedance plate, or the like may be selected according to needs, which is not limited in this example.
The heat generating device 200 is mounted to the substrate 100, and in some examples, the substrate 100 may have pin receptacles that mate with pins of the heat generating device 200. The heat generating device 200 may be an electronic component that processes an electrical signal, such as a power tube, or may be other signal terminals that transmit an electrical signal, and the number of the electronic component and/or the number of the signal terminals are not particularly limited.
The heat conductive sheet 300 is located at a side of the heat generating device 200 facing away from the substrate 100, and the heat conductive sheet 300 can be connected to the substrate 100 through a connection post. The heat conductive sheet 300 may be a sheet-like structure made of a metal material or a non-metal material having a good heat conductive property.
The heat sink 400 is located at a side of the heat conductive sheet 300 facing away from the substrate 100, and the heat sink 400 can be connected to the substrate 100 through the connection post as well.
It should be noted that at least one of the heat conductive sheet 300 and the heat generating device 200 and the heat conductive sheet 300 and the heat sink 400 is interposed with the compressed elastic heat conductive pad 500, and the height of the connection post should be greater than the height of the rigid member between the members at both ends of the connection post.
When in assembly, the base plate 100 is arranged on the surface of the connecting column, and the connecting column has a supporting effect on the base plate 100, namely, the parts at the two ends of the connecting column are provided with constant distances.
The design is used for normalizing the assembly stress of the rigid parts between the parts at the two ends of the connecting column on one hand, and avoiding the overlarge assembly stress and stress damage caused by human factors; on the other hand, by means of the characteristics that the elastic heat conducting pad 500 is compressed and can conduct heat, the components at the two ends of the connecting column are in close contact, so that the purpose of improving the heat dissipation performance is achieved.
In some examples, the elastic thermal pad 500 may be made of a thermal interface material to provide better compression and thermal conductivity, and in other examples, the elastic thermal pad 500 may be made of an insulation base layer and a thermal conductive filler coated on both sides of the insulation base layer to provide a certain insulation property to the elastic thermal pad 500, and of course, without considering insulation, the thermal conductive pad 500 may be made of only one layer of thermal conductive filler to achieve heat transfer without using the insulation base layer.
In addition, the specific structure of the members at both ends of the connection post and the rigid members between the members at both ends of the connection post is shown from three different implementation angles on the basis of the above-described examples of the present utility model.
As a first possible embodiment, as shown in fig. 2, 7-12: the elastic heat conductive pad 500 includes a first elastic heat conductive pad 510, and the first elastic heat conductive pad 510 is sandwiched between the heat generating device 200 and the heat conductive sheet 300; the connection posts include first connection posts 310, and the heat conductive sheet 300 is connected to the substrate 100 through the first connection posts 310, and the height of the first connection posts 310 should be greater than the height of the heat generating device 200 protruding from the substrate 100.
In this embodiment, the components at two ends of the first connection post 310 are the substrate 100 and the heat conductive sheet 300, respectively, and the rigid component between the components at two ends of the first connection post 310 is the portion of the heat generating device 200 protruding from the substrate 100, and since the height of the first connection post 310 is determined, that is, the substrate 100 and the heat conductive sheet 300 have a constant distance, that is, after the first elastic heat conductive pad 510 is compressed, the assembly stress born by the heat generating device 200 is constant, so that the heat generating device 200 can be effectively prevented from being damaged due to the excessive assembly stress, thereby achieving the purpose of protecting the heat generating device 200.
It should be noted that, the contact surface of the heat generating device 200 and the heat conducting strip 300 has a certain processing deviation, that is, the contact surface of the heat generating device 200 and the heat conducting strip 300 may not be completely flat, and when the heat generating device 200 is in hard contact with the heat conducting strip 300, there may be a mutual acting force between the contact surfaces of the heat generating device 200 and the heat conducting strip 300, which also leads to an increase in the assembly stress of the heat generating device 200; in the utility model, the first elastic heat conducting pad 510 is configured between the heat generating device 200 and the heat conducting strip 300, so that the part of the heat generating device 200 protruding from the substrate 100 causes the first elastic heat conducting pad 510 to deform greatly, thereby avoiding hard contact between the heat generating device 200 and the heat conducting strip 300, reducing shearing stress on the heat generating device 200 caused by uneven contact surface of the heat generating device 200 and the heat conducting strip 300, and simultaneously, filling up possible gap between the contact surface of the heat generating device 200 and the heat conducting strip 300 through deformation generated by compression of the first elastic heat conducting pad 510, thereby indirectly ensuring more reliable contact between the heat generating device 200 and the heat conducting strip 300 and improving heat dissipation performance.
As shown in fig. 11, one end of the first connection post 310 may be integrally formed with the heat conductive sheet 300 or welded and fixed, and one end of the first connection post 310 may be detachably connected with the heat conductive sheet 300, wherein the assembly stress applied to the heat generating device 200 is controlled by replacing the heat conductive sheet 300 having the first connection post 310 of different heights or by detaching and replacing the first connection post 310 of different heights on the heat conductive sheet 300, thereby controlling the constant distance between the substrate 100 and the heat conductive sheet 300.
In some embodiments, the detachable connection manner between one end of the first connection post 310 and the heat conducting strip 300 includes, but is not limited to, threaded connection, mating buckle or plug connection, while the other end of the first connection post 310 is in threaded connection with the substrate 100 through a threaded connection piece, in some examples, the first connection post 310 has a threaded hole, the substrate 100 is provided with a first mounting hole 110 corresponding to the threaded hole, and when assembling, the other end of the first connection post 310 is abutted against the substrate 100, and then penetrates through the first mounting hole 110 through the threaded end of the threaded connection piece and is connected with the threaded hole.
It should be noted that, the threaded connection includes a screw, a stud, or other columnar structures with external threads, and in some examples, the threaded connection is a screw and a washer, where the washer is placed on the substrate 100, and then the screw sequentially penetrates through the washer, the first mounting hole 110, and is connected with the threaded hole; in order to make the support of the substrate 100 by the first connection post 310 more stable, the first mounting hole 110 is selected to be disposed adjacent to the heat generating device 200; in addition, the number of the first connection posts 310 may be one or more, and the present example shows the number of the first connection posts 310 as three.
As a second possible embodiment, as shown in fig. 3, 5-6 and 12-14: the elastic thermal pad 500 includes a second elastic thermal pad 520, and the second elastic thermal pad 520 is sandwiched between the thermal conductive sheet 300 and the heat sink 400; the connection posts include second connection posts 410, the heat sink 400 is connected with the substrate 100 through the second connection posts 410, and the height of the second connection posts 410 is greater than the sum of the height of the heat generating device 200 protruding from the substrate 100 and the height of the heat conductive sheet 300.
In this embodiment, the parts at the two ends of the second connection post 410 are the substrate 100 and the heat sink 400, respectively, and the rigid part between the parts at the two ends of the second connection post 410 is the portion of the heat generating device 200 protruding from the substrate 100 and the heat conducting strip 300, because the height of the second connection post 410 is determined, that is, the substrate 100 and the heat sink 400 have a constant distance, that is, after the second elastic heat conducting pad 520 is compressed, the assembly stress born by the heat generating device 200 and the heat conducting strip 300 is constant, so that damage to the heat generating device 200 and the heat conducting strip 300 due to excessive assembly stress can be effectively avoided, thereby achieving the purpose of protecting the heat generating device 200 and the heat conducting strip 300.
As shown in fig. 12 to 14, one end of the second connection post 410 may be integrally formed with the heat sink 400 or welded and fixed, and one end of the second connection post 410 may be detachably connected to the heat sink 400, wherein the assembly stress applied to the heat generating device 200 and the heat conductive sheet 300 is controlled by replacing the heat sink 400 having the second connection post 410 of a different height or by detaching the second connection post 410 of a different height from the heat sink 400, thereby controlling a constant distance between the substrate 100 and the heat sink 400.
The detachable connection manner of one end of the second connection post 410 and the heat sink 400 includes, but is not limited to, threaded connection, mating snap or plug connection, while the other end of the second connection post 410 is in threaded connection with the substrate 100 through a threaded connection piece, in some examples, the second connection post 410 has a threaded hole, the substrate 100 is provided with a second mounting hole 120 corresponding to the threaded hole, and when assembling, the other end of the second connection post 410 is abutted against the substrate 100, and then penetrates through the second mounting hole 120 through the threaded end of the threaded connection piece and is connected with the threaded hole.
It should be noted that, the threaded connection includes a screw, a stud, or other columnar structures with external threads, and in some examples, the threaded connection is a screw and a washer, where the washer is placed on the substrate 100, and then the screw sequentially penetrates through the washer, the second mounting hole 120, and is connected with the threaded hole; in order to make the support of the substrate 100 by the second connection posts 410 more stable, the second mounting holes 120 are selected to be distributed at the respective top corners of the substrate 100; in addition, the number of the second connection posts 410 may be one or more, and the present example shows the number of the first connection posts 310 as four.
As a third possible embodiment, as shown in fig. 1, 4-6 and 7-14: the elastic heat conductive pad 500 includes a first elastic heat conductive pad 510 and a second elastic heat conductive pad 520, wherein the first elastic heat conductive pad 510 is sandwiched between the heat generating device 200 and the heat conductive sheet 300, and the second elastic heat conductive pad 520 is sandwiched between the heat conductive sheet 300 and the heat sink 400; the connection posts include a first connection post 310 and a second connection post 410, wherein the heat conductive sheet 300 is connected with the substrate 100 through the first connection post 310, the first connection post 310 has a height greater than a height of the heat generating device 200 protruding from the substrate 100, the heat sink 400 is connected with the substrate 100 through the second connection post 410, and the second connection post 410 has a height greater than a sum of the height of the heat generating device 200 protruding from the substrate 100 and the height of the heat conductive sheet 300.
In this embodiment, the height of the first connection post 310 is determined, that is, the constant distance between the substrate 100 and the heat conductive sheet 300, that is, the constant assembly stress of the heat generating device 200 is received when the first elastic heat conductive pad 510 is compressed, and the height of the second connection post 410 is determined, that is, the constant distance between the substrate 100 and the heat sink 400, that is, the constant assembly stress of the heat generating device 200 and the heat conductive sheet 300 is received when the second elastic heat conductive pad 520 is compressed, so that the above design can normalize the assembly stress of the heat generating device 200 between the substrate 100 and the heat conductive sheet 300, and the assembly stress of the heat generating device 200 and the heat conductive sheet 300 between the substrate 100 and the heat sink 400, and can maximally protect the heat generating device 200, while the heat dissipation performance is also better.
The structure, size, shape, positional relationship and connection relationship of the first connection post 310, the second connection post 410, the first elastic heat conductive pad 510 and the second elastic heat conductive pad 520 are described in the above two embodiments, and are not described herein.
It should be appreciated that in any of the above embodiments, the elastic thermal pad 500 may be split-spliced or integrally formed according to actual assembly requirements.
As shown in fig. 3-4 and fig. 11-14, in order to facilitate the installation of the elastic thermal pad 500 or to make the installation stability of the elastic thermal pad 500 better, in some examples, the first elastic thermal pad 510 is attached to a side of the thermal conductive sheet 300 facing away from the heat sink 400, and the first elastic thermal pad 510 is provided with a first avoiding hole 511 opposite to the first installation hole 110, where the first avoiding hole 511 is matched with the first connection post 310. In other examples, the side of the heat sink 400 facing the heat conductive sheet 300 has a mounting surface 420 that is attached to the second elastic heat conductive pad 520, and the mounting surface 420 is configured to support the second elastic heat conductive pad 520, so that the mounting surface 420 may be a plane or a groove that mates with the second elastic heat conductive pad 520.
The assembly process of the application is described below by way of example of a third possible embodiment:
as shown in fig. 1, 5, 7, and 11 to 13, pins of the heat generating device 200 are first mounted into pin insertion holes of the substrate 100 and soldered; next, the first elastic heat conductive pad 510 is attached to the side of the heat conductive sheet 300 facing away from the heat sink 400, and the first avoiding holes 511 of the first elastic heat conductive pad 510 are matched with the first connecting columns 310; then aligning the screw holes of the first connection posts 310 with the first mounting holes 110 of the substrate, and connecting the screw holes of the first connection posts 310 by sequentially passing the screws through the washers and the first mounting holes 110; and then the second elastic heat conduction pad 520 is attached to the mounting surface 420 of the heat sink 400, and finally the threaded hole of the second connection post 410 is aligned with the second mounting hole 120 of the substrate, and is connected with the threaded hole of the second connection post 410 by passing a screw through the gasket and the second mounting hole 120 in sequence.
In summary, according to the heat dissipating device provided by the present utility model, the elastic heat conducting pad 500 is sandwiched between the heat conducting fin 300 and the heat generating device 200 and/or between the heat conducting fin 300 and the heat sink 400, and the height of the connecting post is ensured to be greater than the height of the rigid component between the components at two ends of the connecting post, so that the heat conducting fin 300 and the heat sink 400 are compressed and contracted during the fastening process with the substrate 100, on one hand, the installation stress born by the heat generating device 200 and the heat conducting fin 300 can be reduced, and the stress damage generated by the heat conducting fin is avoided; on the other hand, the heat generating device 200, the heat conductive sheet 300 and/or the contact between the heat conductive sheet 300 and the heat sink 400 is made more reliable, thereby improving heat dissipation performance.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate, such that the inventive examples may be practiced in other than those illustrated and described herein, and that the "first," "second," etc. distinguished objects are generally of the type that do not limit the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, "plurality" means two or more.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A heat sink, comprising:
a substrate;
the heating device is arranged on the substrate;
the heat conducting sheet is positioned on one side of the heating device, which is away from the substrate;
the radiator is positioned on one side of the heat conducting fin away from the substrate; wherein,,
at least one of the radiator and the heat conducting fin is connected with the substrate through a connecting column, a compressed elastic heat conducting pad is clamped between the heat conducting fin and the heating device and at least one of the radiator and the heat conducting fin, and the height of the connecting column is larger than that of a rigid part between parts at two ends of the connecting column.
2. The heat sink of claim 1, wherein,
the base plate is provided with a mounting hole, the connecting column is provided with a threaded hole, and the base plate is in threaded connection with the connecting column through a threaded connecting piece penetrating through the mounting hole.
3. The heat sink of claim 1, wherein,
the elastic heat conduction pad comprises an insulation base layer and heat conduction filling materials coated on two sides of the insulation base layer.
4. A heat sink according to any one of the claims 1-3, wherein,
the heat conducting fin is connected with the substrate through a first connecting column, the height of the first connecting column is larger than that of the heating device protruding out of the substrate, and a compressed first elastic heat conducting pad is arranged between the heat conducting fin and the heating device.
5. The heat sink of claim 4 wherein the heat sink is a heat sink,
the base plate is provided with a plurality of first mounting holes, the first mounting holes are arranged adjacent to the heating device, the first elastic heat conduction pad is provided with a first avoiding hole, and the first connecting column penetrates through the first avoiding hole and is opposite to the first mounting hole.
6. The heat sink of claim 4 wherein the heat sink is a heat sink,
the first connecting column and the heat conducting fin are integrally formed.
7. A heat sink according to any one of the claims 1-3, wherein,
the radiator is connected with the substrate through a second connecting column, the height of the second connecting column is larger than the sum of the height of the heating device protruding out of the substrate and the height of the heat conducting fin, and a compressed second elastic heat conducting pad is arranged between the radiator and the heat conducting fin.
8. The heat sink of claim 7 wherein the heat sink is configured to dissipate heat from the heat sink,
the base plate is provided with a plurality of second mounting holes, and the second mounting holes are distributed at each vertex angle of the base plate.
9. The heat sink of claim 7 wherein the heat sink is configured to dissipate heat from the heat sink,
and one side of the radiator facing the substrate is provided with a mounting surface, and the second elastic heat conduction pad is attached to the mounting surface.
10. The heat sink of claim 7, wherein the second connection post is integrally formed with the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223373522.5U CN219780737U (en) | 2022-12-13 | 2022-12-13 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223373522.5U CN219780737U (en) | 2022-12-13 | 2022-12-13 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780737U true CN219780737U (en) | 2023-09-29 |
Family
ID=88110887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223373522.5U Active CN219780737U (en) | 2022-12-13 | 2022-12-13 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780737U (en) |
-
2022
- 2022-12-13 CN CN202223373522.5U patent/CN219780737U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120244742A1 (en) | Low profile heat dissipating system with freely-oriented heat pipe | |
| US8437138B2 (en) | Lower profile heat dissipating system embedded with springs | |
| TWM579392U (en) | Electrical connector assembly | |
| EP2706828B1 (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
| US6500010B2 (en) | Electrical circuit connector with resilient pressure pads | |
| EP3654441B1 (en) | Cell supervision circuit and battery pack | |
| US20240235073A1 (en) | Electronic device and chip assembly | |
| CN214125853U (en) | Power module heat radiation structure | |
| CN107453104B (en) | Connector, power supply module and terminal equipment | |
| CN219780737U (en) | Heat dissipation device | |
| US11195779B2 (en) | Electronic module for motherboard | |
| CN112509994A (en) | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device | |
| CN211017061U (en) | Heat dissipation device and heat dissipation assembly | |
| CN217363615U (en) | Radiator for intelligent terminal | |
| CN214757567U (en) | Heat abstractor, support plate assembly and electronic equipment | |
| US10212850B1 (en) | Electronic device with heat sink flange and related methods | |
| US20040227230A1 (en) | Heat spreaders | |
| JP2014002971A (en) | Contact device, socket device, and electronic device | |
| CN213782008U (en) | Semiconductor device fixing device and heat dissipation assembly | |
| CN210379033U (en) | Power device connection structure | |
| CN213755478U (en) | Heat radiator | |
| CN219039699U (en) | Heat radiation module | |
| JP3651333B2 (en) | Semiconductor element mounting structure | |
| CN219536385U (en) | Supporting heat dissipation piece of circuit board | |
| CN220121226U (en) | CPU heat abstractor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |