CN212519746U

CN212519746U - High-frequency power supply module inserts frame structure

Info

Publication number: CN212519746U
Application number: CN202021190165.7U
Authority: CN
Inventors: 倪婕雨
Original assignee: Wuxi Tianhe Electronic Co ltd
Current assignee: Wuxi Tianhe Electronic Co ltd
Priority date: 2020-06-23
Filing date: 2020-06-23
Publication date: 2021-02-09
Anticipated expiration: 2030-06-23

Abstract

The utility model discloses a high frequency power module inserts frame structure, including copper chassis, mounting hole, guide way, U type copper, connecting plate, screw thread post, screwed pipe, rolling disc, ring, connecting strip, anti-skidding recess, first heat conduction silica gel piece, fin, heat dissipation through-hole, bearing and second heat conduction silica gel piece. The utility model has reasonable structure, compared with the traditional inserting frame structure, the space height for inserting and placing is adjustable, thereby being applicable to inserting and placing high-frequency power supply modules with different thicknesses in a certain range, ensuring that the top and the bottom of the high-frequency power supply module are both clamped, and having better inserting and placing stability; still have better radiating effect, insert the back of putting, the top and the bottom of high frequency power module contact with first heat conduction silica gel piece, second heat conduction silica gel piece, further dispel the heat through copper chassis, U type copper, still set up fin, heat dissipation through-hole, improved heat radiating area, further improved the radiating effect.

Description

High-frequency power supply module inserts frame structure

Technical Field

The utility model relates to a power module inserts frame structure specifically is a high frequency power module inserts frame structure, belongs to high frequency power module and inserts frame application technical field.

Background

The high-frequency power supply is also called an electronic tube frequency conversion device and is key equipment of the high-frequency induction furnace. The high-frequency power supply and the induction heating technology have the advantages of highest heating efficiency and quickest speed on metal materials, low energy consumption and environmental protection. It is widely used in various industries for the hot working, heat treatment, hot assembly, welding, smelting and other processes of metal materials.

The existing high-frequency power supply is inserted through an inserting frame structure, and the gap between the installed high-frequency power supply and a storage space is probably larger; the stability of installation may be poor, and at the same time, the storage space lacks the function of adjustment, and the use may be inconvenient; and the heat dissipation effect may be insufficient. Therefore, a high frequency power module insertion frame structure is proposed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high frequency power module inserts frame structure just in order to solve above-mentioned problem.

The utility model discloses a following technical scheme realizes above-mentioned purpose, a high frequency power module inserts frame structure, including copper chassis and U type copper, open at the top of copper chassis has two guide ways, the both ends of U type copper run through two guide ways respectively, clearance fit is connected between guide way and the U type copper, the bottom fixed mounting of U type copper has the connecting plate, the screwed pipe is installed in the middle part rotation of connecting plate, the inner wall threaded connection of screwed pipe has the screw thread post, the top of screw thread post is with the top inboard center department vertical rigid coupling of copper chassis, the bottom fixed mounting rolling disc of screwed pipe;

the heat dissipation through-hole that the rectangle array distributes has all been opened to a plurality of in the both sides of U type copper, the top inner wall of U type copper bonds and has first heat conduction silica gel piece, the top outer wall of U type copper evenly is provided with a plurality of fin, the top of copper chassis bonds and has second heat conduction silica gel piece.

Preferably, the middle part of the connecting plate is provided with a round hole, the round hole is fixedly embedded with a bearing, and the inner ring of the bearing is fixedly sleeved with the outer wall of the top end of the threaded pipe.

Preferably, the rotating disc comprises a circular ring, four connecting strips are uniformly and fixedly mounted on the inner ring of the circular ring, the tail ends of the connecting strips are fixedly welded with the outer wall of the threaded pipe, and a plurality of anti-skidding grooves are uniformly formed in the outer ring of the circular ring.

Preferably, mounting holes are formed in two ends of the copper underframe, and the copper underframe is of an inverted U-shaped structure.

Preferably, the inner wall of the threaded pipe and the cylindrical surface of the threaded column are respectively provided with an internal thread and an external thread.

Preferably, a rectangular storage cavity is formed between the bottom of the U-shaped copper plate and the top of the copper underframe.

The utility model has the advantages that:

1. the insertion frame structure can be used for storing high-frequency power supply modules, and compared with the traditional insertion frame structure, the insertion frame structure has the advantages that the space height for insertion is adjustable, so that the insertion frame structure can be suitable for the insertion of the high-frequency power supply modules with different thicknesses in a certain range, the clamping force on the top and the bottom of the high-frequency power supply module is guaranteed, and the insertion stability is good;

2. this kind of insert frame structure still has better radiating effect, after inserting and putting, high frequency power module's top and bottom and first heat conduction silica gel piece, the contact of second heat conduction silica gel piece, the contact effect is better, elasticity and compliance through self, be convenient for carry out the contact of unevenness department, further dispel the heat through copper chassis, U type copper, the fin has still been set up simultaneously, heat dissipation through-hole, heat radiating area has been improved, further the radiating effect has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of a U-shaped copper plate and a heat dissipation through hole of the present invention;

FIG. 3 is a schematic view of the bottom structure of the connecting plate of the present invention;

fig. 4 is a schematic structural view of the threaded pipe and the rotating disc of the present invention.

In the figure: 1. copper chassis, 2, mounting hole, 3, guide way, 4, U type copper, 5, connecting plate, 6, screw thread post, 7, screwed pipe, 8, rolling disc, 801, ring, 802, connecting strip, 803, anti-skidding recess, 9, first heat conduction silica gel piece, 10, fin, 11, heat dissipation through-hole, 12, bearing, 13, second heat conduction silica gel piece.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-4, a high-frequency power module plug frame structure includes a copper base frame 1 and a U-shaped copper plate 4, wherein the top of the copper base frame 1 is provided with two guide grooves 3, two ends of the U-shaped copper plate 4 respectively penetrate through the two guide grooves 3, and the guide grooves 3 provide guidance and limit for the movement of the U-shaped copper plate 4; the guide groove 3 is in clearance fit connection with the U-shaped copper plate 4, a connecting plate 5 is fixedly installed at the bottom of the U-shaped copper plate 4, the connecting plate 5 provides an installation position for a threaded pipe 7, the threaded pipe 7 is rotatably installed in the middle of the connecting plate 5, a threaded column 6 is in threaded connection with the inner wall of the threaded pipe 7, the top end of the threaded column 6 is vertically and fixedly connected with the center of the inner side of the top of the copper chassis 1, a rotating disc 8 is fixedly installed at the bottom end of the threaded pipe 7, and the rotating disc 8 is used for manual rotation;

the both sides of U type copper 4 all opened the heat dissipation through-hole 11 that a plurality of is the rectangular array and distributes, the top inner wall of U type copper 4 bonds and has first heat conduction silica gel piece 9, the top outer wall of U type copper 4 evenly is provided with a plurality of fin 10, the top of copper chassis 1 bonds and has second heat conduction silica gel piece 13, and first heat conduction silica gel piece 9 and second heat conduction silica gel piece 13 compress tightly high frequency power module, realize pressing from both sides tightly spacing, through the elasticity and the compliance of first heat conduction silica gel piece 9 and second heat conduction silica gel piece 13 self, are convenient for carry out the contact of unevenness department, and the contact effect is better.

A round hole is formed in the middle of the connecting plate 5, a bearing 12 is fixedly embedded in the round hole, an inner ring of the bearing 12 is fixedly sleeved with the outer wall of the top end of the threaded pipe 7, and the threaded pipe 7 and the connecting plate 5 are rotatably mounted through the bearing 12, namely when the threaded pipe 7 rotates, the connecting plate 5 is guided and limited by the U-shaped copper plate 4 and the guide groove 3, so that the threaded pipe 7 and the connecting plate 5 are prevented from rotating together; the rotating disc 8 comprises a circular ring 801, four connecting strips 802 are uniformly and fixedly installed on the inner ring of the circular ring 801, the tail ends of the connecting strips 802 are fixedly welded with the outer wall of the threaded pipe 7, a plurality of anti-skidding grooves 803 are uniformly formed in the outer ring of the circular ring 801, the threaded pipe 7 can rotate conveniently through the rotating disc 8, and the anti-skidding effect is achieved through the anti-skidding grooves 803; mounting holes 2 are formed in two ends of the copper underframe 1, the copper underframe 1 is of an inverted U-shaped structure, and mounting is provided for the copper underframe 1 through the mounting holes 2; the inner wall of the threaded pipe 7 and the cylindrical surface of the threaded column 6 are respectively provided with internal threads and external threads, so that threaded connection between the threaded pipe 7 and the threaded column 6 is realized; a rectangular storage cavity is formed between the bottom of the U-shaped copper plate 4 and the top of the copper underframe 1 and used for inserting and placing a high-frequency power supply.

When the utility model is used, the whole structure is installed with the external plane through the installation hole 2 on the copper underframe 1, 2 positions of the installation hole are provided through the installation hole 2, and the fixed installation is realized through bolts or screws;

when the high-frequency power supply module needs to be inserted, the high-frequency power supply module is placed between the first heat-conducting silicon sheet 9 and the second heat-conducting silicon sheet 13, the rotating disc 8 is manually rotated, so that the threaded pipe 7 rotates relative to the threaded column 6, and after the threaded pipe 7 rotates, the threaded pipe can move along the length direction of the threaded column 6, so that the U-shaped copper plate 4 and the connecting plate 5 are driven to move together, the height of an insertion space is adjusted, the high-frequency power supply module can be inserted and placed in a certain range, the high-frequency power supply module with different thicknesses can be pressed tightly by the first heat-conducting silicon sheet 9 and the second heat-conducting silicon sheet 13, clamping and limiting are achieved, uneven contact can be conveniently carried out through the elasticity and flexibility of the first heat-conducting silicon sheet 9 and the second heat-conducting silicon sheet 13, and the contact effect is good;

in the use process of the high-frequency power supply module, the generated heat is transmitted to the copper bottom frame 1 and the U-shaped copper plate 4 through the first heat-conducting silica gel sheet 9 and the second heat-conducting silica gel sheet 13 and is dissipated, and through the arrangement of the radiating fins 10, the radiating area is increased, and the radiating effect is further improved.

It is well within the skill of those in the art to implement, without undue experimentation, the present invention does not relate to software and process improvements, as related to circuits and electronic components and modules.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a frame structure is inserted to high frequency power module which characterized in that: the copper chassis comprises a copper chassis (1) and a U-shaped copper plate (4), wherein the top of the copper chassis (1) is provided with two guide grooves (3), two ends of the U-shaped copper plate (4) penetrate through the two guide grooves (3) respectively, the guide grooves (3) are in clearance fit connection with the U-shaped copper plate (4), the bottom of the U-shaped copper plate (4) is fixedly provided with a connecting plate (5), the middle of the connecting plate (5) is rotatably provided with a threaded pipe (7), the inner wall of the threaded pipe (7) is in threaded connection with a threaded column (6), the top end of the threaded column (6) is vertically fixedly connected with the center of the inner side of the top of the copper chassis (1), and a rotating disc (8) is fixedly arranged at the bottom end of the threaded pipe (7);

the heat dissipation device is characterized in that a plurality of heat dissipation through holes (11) distributed in a rectangular array are formed in the two sides of the U-shaped copper plate (4), a first heat conduction silica gel sheet (9) is bonded on the inner wall of the top of the U-shaped copper plate (4), a plurality of cooling fins (10) are evenly arranged on the outer wall of the top of the U-shaped copper plate (4), and a second heat conduction silica gel sheet (13) is bonded on the top of the copper bottom frame (1).

2. The high-frequency power supply module insertion frame structure according to claim 1, characterized in that: the middle part of the connecting plate (5) is provided with a round hole, the round hole is fixedly embedded with a bearing (12), and the inner ring of the bearing (12) is fixedly sleeved with the outer wall of the top end of the threaded pipe (7).

3. The high-frequency power supply module insertion frame structure according to claim 1, characterized in that: the rotating disc (8) comprises a circular ring (801), four connecting strips (802) are uniformly and fixedly mounted on the inner ring of the circular ring (801), the tail ends of the connecting strips (802) are fixedly welded with the outer wall of a threaded pipe (7), and a plurality of anti-skidding grooves (803) are uniformly formed in the outer ring of the circular ring (801).

4. The high-frequency power supply module insertion frame structure according to claim 1, characterized in that: mounting holes (2) are formed in two ends of the copper bottom frame (1), and the copper bottom frame (1) is of an inverted U-shaped structure.

5. The high-frequency power supply module insertion frame structure according to claim 1, characterized in that: and the inner wall of the threaded pipe (7) and the cylindrical surface of the threaded column (6) are respectively provided with an internal thread and an external thread.

6. The high-frequency power supply module insertion frame structure according to claim 1, characterized in that: a rectangular storage cavity is formed between the bottom of the U-shaped copper plate (4) and the top of the copper underframe (1).