CN210328115U

CN210328115U - Novel high heat dissipating circuit board

Info

Publication number: CN210328115U
Application number: CN201920886299.3U
Authority: CN
Inventors: 陈连根
Original assignee: Zhongshan Kasun Circuit Board Co ltd
Current assignee: Zhongshan Kasun Circuit Board Co ltd
Priority date: 2019-06-13
Filing date: 2019-06-13
Publication date: 2020-04-14
Anticipated expiration: 2029-06-13

Abstract

The utility model discloses a novel high heat dissipating circuit board, its structure includes the mounting hole, the subassembly, circuit board main part, heat dissipation mechanism, the interface is arranged, the aluminium foil, chip and condenser, this novel high heat dissipating circuit board is through having set up heat dissipation mechanism, when using, the thermal diffusivity of circuit board main part is optimized, utilize the endothermic characteristic of aluminium foil, shift the heat, the structural reinforcing heat dissipation of heat dissipation mechanism, the absorptive heat of aluminium foil promptly gets into the aluminum sheet and handles upwards the conduction, get into the heat sink through the heat sink, dispel the heat by the copper sheet afterwards, the thermovent does benefit to and promotes the radiating effect on the copper sheet, and finally, the heat that circuit board main part produced is upwards guided by the heat dissipation layer, can rationally set up the aluminium foil thermal diffusivity according to the size of circuit board main part, the position.

Description

Novel high heat dissipating circuit board

Technical Field

The utility model relates to a circuit board technical field, concretely relates to novel high heat dissipating circuit board.

Background

The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, the PCB board, aluminium base board, the high frequency board, thick copper board, the impedance board, PCB, ultra-thin circuit board, printing (copper etching technique) circuit board etc., the circuit board makes the circuit miniaturation, it is direct-viewing, play an important role with electrical apparatus overall arrangement to fixed circuit's batch production and optimization, the circuit board can be called printed wiring board or printed circuit board, however, the thermal diffusivity of circuit board itself is relatively poor, need just can make the thermal diffusivity of circuit board obtain optimizing with the help of the heat dissipation, circuit board auxiliary member structure is comparatively complicated among the prior art, the thermal diffusivity is general, be difficult to optimize.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In order to overcome the prior art not enough, present a novel high heat dissipating circuit board, solved among the prior art circuit board auxiliary member structure comparatively complicated, the thermal diffusivity is general, is difficult to optimize the problem of circuit board thermal diffusivity, has reached the advantage that the thermal diffusivity is better, the practicality is strong.

(II) technical scheme

The utility model discloses a following technical scheme realizes: the utility model provides a novel high heat dissipation circuit board, which comprises a mounting hole, a subassembly, a circuit board main body, a heat dissipation mechanism, an interface row, an aluminum foil, a chip and a capacitor, wherein the mounting hole penetrates through four angular points of the circuit board main body, the bottom end of the subassembly is welded on the circuit board main body, the interface row is arranged at the top end of the circuit board main body, two ends of the back surface of the aluminum foil are bonded on the circuit board main body, the front surface of the circuit board main body is tightly attached to the back surface of the aluminum foil, the heat dissipation mechanism is clamped above the aluminum foil, the bottom end of the chip is welded with the top end of the circuit board main body, the capacitor is fixedly arranged at two sides of the chip, the heat dissipation mechanism comprises a top opening, a heat dissipation layer, a heat absorption layer, a bottom opening, a clamping pin, a copper sheet, a heat dissipation opening, an aluminum sheet, a, the aluminum foil is characterized in that heat dissipation ports are formed in the copper sheet, the number of the heat dissipation ports is larger than 6, heat absorption grooves are formed in the aluminum sheet, the aluminum sheet is arranged above the aluminum foil, the number of the heat absorption grooves is larger than 6, and the heat absorption ports are located at the bottom of the heat absorption grooves.

Furthermore, the heat dissipation opening is in a regular hexagon shape, and the heat absorption groove is in a cuboid structure.

Furthermore, the number of the clamping pins is 4.

Further, the mounting height of the chip is smaller than that of the interface row.

Furthermore, the outer surface of the copper sheet is fastened on the top opening, and the outer surface of the aluminum sheet is fastened on the bottom opening.

Further, the distance between the top opening and the bottom opening is 0.5 cm.

Furthermore, the total thickness of the heat dissipation layer and the heat absorption layer is 2 cm.

Furthermore, the aluminum foil is made of aluminum, so that the heat absorption effect is good.

Furthermore, the copper sheet is made of copper, so that the heat dissipation effect is good.

(III) advantageous effects

Compared with the prior art, the utility model, following beneficial effect has:

1) for solving among the prior art circuit board auxiliary member structure comparatively complicated, the thermal diffusivity is general, be difficult to optimize the problem of circuit board thermal diffusivity, through having set up heat dissipation mechanism, when using, the thermal diffusivity of circuit board main part is optimized, utilize the endothermic characteristic of aluminium foil, shift the heat, the structural reinforcing heat dissipation of heat dissipation mechanism, the heat that the aluminium foil absorbed promptly makes progress the conduction and gets into the aluminum sheet and handle, get into the heat absorption groove through the heat absorption mouth, dispel the heat by the copper sheet afterwards, the thermovent does benefit to and promotes the radiating effect on the copper sheet, finally, the heat that the circuit board main part produced is upwards guided by the heat dissipation layer, can be according to the reasonable-in-size setting aluminium foil of circuit board main part.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a schematic structural view of the heat dissipation mechanism of the present invention;

FIG. 4 is a schematic structural view of the copper sheet of the present invention;

fig. 5 is a schematic structural diagram of the aluminum sheet of the present invention.

In the figure: mounting hole-1, subassembly-2, circuit board main body-3, heat dissipation mechanism-4, interface row-5, aluminum foil-6, chip-7, capacitor-8, top opening-401, heat dissipation layer-402, heat absorption layer-403, bottom opening-404, clamping pin-405, copper sheet-406, heat dissipation opening-407, aluminum sheet-408, heat absorption groove-409 and heat absorption opening-410.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, the present invention provides a novel circuit board with high heat dissipation: the heat dissipation device comprises a mounting hole 1, a subassembly 2, a circuit board main body 3, a heat dissipation mechanism 4, an interface row 5, an aluminum foil 6, a chip 7 and a capacitor 8, wherein the mounting hole 1 penetrates through four corner points of the circuit board main body 3, the bottom end of the subassembly 2 is welded on the circuit board main body 3, the interface row 5 is arranged at the top end of the circuit board main body 3, two ends of the back surface of the aluminum foil 6 are bonded on the circuit board main body 3, the front surface of the circuit board main body 3 is tightly attached to the back surface of the aluminum foil 6, the heat dissipation mechanism 4 is clamped above the aluminum foil 6, the bottom end of the chip 7 is welded with the top end of the circuit board main body 3, the capacitor 8 is fixedly arranged at two sides of the chip 7, the heat dissipation mechanism 4 comprises a top opening 401, a heat dissipation layer 402, a heat absorption layer 403, a bottom opening 404, clamping feet 405, a copper sheet 406, a heat dissipation opening 407, the copper sheet 406 is provided with heat dissipation ports 407, the number of the heat dissipation ports 407 is greater than 6, the aluminum sheet 408 is provided with heat absorption grooves 409, the aluminum sheet 408 is mounted above the aluminum foil 6, the number of the heat absorption grooves 409 is greater than 6, and the heat absorption ports 410 are located at the bottoms of the heat absorption grooves 409.

The heat dissipation port 407 is a regular hexagon, so that the heat dissipation effect is better, and the heat absorption groove 409 is of a cuboid structure, so that the concentrated heat absorption is facilitated.

Wherein, the card foot 405 is equipped with 4 altogether, is convenient for install fixedly.

Wherein the mounting height of the chip 7 is smaller than that of the interface row 5.

Wherein, the outer surface of the copper sheet 406 is fastened on the top opening 401, and the outer surface of the aluminum sheet 408 is fastened on the bottom opening 404.

Wherein, the distance between the top port 401 and the bottom port 404 is set to be 0.5cm, so that the heat dissipation performance is good.

The total thickness of the heat dissipation layer 402 and the heat absorption layer 403 is 2cm, and the installation volume is reduced.

Wherein, the aluminum foil 6 is made of aluminum, and has good heat absorption effect.

The copper sheet 406 is made of copper, and the heat dissipation effect is good.

According to the table show, the utility model discloses copper sheet 406 adopts the copper to make, and the radiating effect is good.

The interface row 5 described in this patent is a component for connecting a circuit board to other components, and is usually made of plastic; the heat absorbing port 410 is an inlet for absorbing heat, and the number of inlets is generally large, thereby facilitating wide heat absorption.

The working principle is as follows: when using novel high heat dissipating circuit board, in order to promote the thermal diffusivity of circuit board main part 3, aluminium foil 6 has been set up, heat dissipation mechanism 4 is on circuit board main part 3 surface, utilize aluminium foil 6's heat absorption characteristic, shift the heat, heat dissipation mechanism 4 is structural to strengthen the heat dissipation, firstly, the card foot 405 card of 4 bottoms of heat dissipation mechanism is established and is installed on circuit board main part 3, secondly, the absorptive heat of aluminium foil 6 upwards conducts and gets into aluminum sheet 408 and handle, get into heat absorption groove 409 through heat absorption mouth 410, dispel the heat by copper sheet 406 afterwards, heat dissipation mouth 407 does benefit to on the copper sheet 406 and promotes the radiating effect, finally, the heat that circuit board main part 3 produced is upwards guided by heat dissipation layer 402, can rationally set up aluminium foil 6 according to circuit board main part 3's size, heat dissipation mechanism 4.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A novel circuit board with high heat dissipation performance comprises mounting holes (1), sub-assemblies (2), a circuit board main body (3), an interface row (5), an aluminum foil (6), a chip (7) and a capacitor (8), wherein the mounting holes (1) penetrate through four corner points of the circuit board main body (3), the bottom end of the sub-assemblies (2) is welded on the circuit board main body (3), the interface row (5) is arranged at the top end of the circuit board main body (3), two ends of the back face of the aluminum foil (6) are bonded on the circuit board main body (3), the front face of the circuit board main body (3) is tightly attached to the back face of the aluminum foil (6), a heat dissipation mechanism (4) is clamped above the aluminum foil (6), the bottom end of the chip (7) is welded with the top end of the circuit board main body (3), and the capacitor; the method is characterized in that: still include heat dissipation mechanism (4), heat dissipation mechanism (4) are including top mouth (401), heat dissipation layer (402), heat-absorbing layer (403), end mouth (404), card foot (405), copper sheet (406), thermovent (407), aluminum sheet (408), heat absorption groove (409) and heat absorption mouth (410), top mouth (401) run through heat dissipation layer (402) wholly, it has end mouth (404) to run through on heat absorption layer (403), heat absorption layer (403) bottom integrated into one piece has card foot (405), be equipped with thermovent (407) on copper sheet (406), the quantity of thermovent (407) is greater than 6, be equipped with heat absorption groove (409) on aluminum sheet (408), aluminum sheet (408) are installed in aluminum foil (6) top, the quantity of heat absorption groove (409) is greater than 6, heat absorption mouth (410) are located heat absorption groove (409) bottom.

2. The novel circuit board with high heat dissipation performance as claimed in claim 1, wherein: the heat dissipation port (407) is in a regular hexagon shape, and the heat absorption groove (409) is in a cuboid structure.

3. The novel circuit board with high heat dissipation performance as claimed in claim 1, wherein: the number of the clamping pins (405) is 4.

4. The novel circuit board with high heat dissipation performance as claimed in claim 1, wherein: the mounting height of the chip (7) is smaller than that of the interface row (5).

5. The novel circuit board with high heat dissipation performance as claimed in claim 1, wherein: the outer surface of the copper sheet (406) is fastened on the top opening (401), and the outer surface of the aluminum sheet (408) is fastened on the bottom opening (404).

6. The novel circuit board with high heat dissipation performance as claimed in claim 1, wherein: and the distance between the top opening (401) and the bottom opening (404) is 0.5 cm.

7. The novel circuit board with high heat dissipation performance as claimed in claim 1, wherein: the total thickness of the heat dissipation layer (402) and the heat absorption layer (403) is 2 cm.