CN211929893U - Crimping device for sintering semiconductor laser chip - Google Patents
Crimping device for sintering semiconductor laser chip Download PDFInfo
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- CN211929893U CN211929893U CN202022074973.3U CN202022074973U CN211929893U CN 211929893 U CN211929893 U CN 211929893U CN 202022074973 U CN202022074973 U CN 202022074973U CN 211929893 U CN211929893 U CN 211929893U
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- limiting plate
- crimping
- stud
- sintering
- laser chip
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Abstract
The utility model relates to a semiconductor laser chip sintering technical field especially relates to a crimping device that semiconductor laser chip sintering was used, including limiting plate and a plurality of crimping subassembly, the crimping subassembly sets up on the limiting plate, the crimping subassembly is including adjusting stud, guide stud, slider and depression bar, the guide stud runs through slider and can follow guide stud and slide from top to bottom, guide stud and limiting plate fixed connection, depression bar and slider fixed connection, adjusting stud is used for the distance that the control slider glided to make the depression bar with laser chip location crimping in the encapsulation casing. The utility model discloses in, adjusting stud control slider gliding distance, be the distance of pushing down of depression bar promptly, can effective control depression bar through the control distance of pushing down to the pressure of laser instrument chip, redesign a standard distance of pushing down, each crimping subassembly all according to standard distance adjustment depression bar, makes each laser instrument chip homoenergetic receive a same and stable pressure.
Description
Technical Field
The utility model relates to a semiconductor laser chip sintering technical field especially relates to a crimping device that semiconductor laser chip sintering was used.
Background
The semiconductor laser production process comprises a sintering process, and the sintering process has the main effects that a laser chip and a soldering lug are positioned and pressed at a specified position of a packaging shell; the processing quality of the semiconductor laser in the sintering process can directly affect the heat dissipation performance of the laser chip and the performance of the laser chip.
The sintering process usually adopts a sintering clamp, and the existing clamps are all designed with a crimping device to position and crimp the chip and the soldering lug together so as to complete the sintering process, but the existing crimping device is difficult to control the pressure between the chip and the soldering lug, if the pressure is too large, the chip is easy to damage, the pressure is too small, the sintering quality is poor, and the performance of the chip is influenced; in particular, there is a certain height difference when the laser chip is placed in the package housing, which makes it more difficult for the crimping device to control the pressure between the laser chip and the bonding pad.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a crimping device that semiconductor laser chip sintering was used.
The utility model adopts the following technical scheme: the utility model provides a crimping device that semiconductor laser chip sintering was used, includes limiting plate and a plurality of crimping subassembly, the crimping subassembly sets up on the limiting plate, the crimping subassembly includes adjusting screw, direction double-screw bolt, slider and depression bar, the direction double-screw bolt runs through slider and can follow the direction double-screw bolt and slide from top to bottom, direction double-screw bolt and limiting plate fixed connection, depression bar and slider fixed connection, adjusting screw is used for the distance of control slider gliding to make the depression bar with laser chip location crimping in the encapsulation casing.
Preferably, the guide stud is sleeved with a return spring, one end of the return spring is abutted to the limiting plate, and the other end of the return spring is abutted to the lower end of the sliding block.
Preferably, the lower end of the sliding block is provided with a clamping groove, and the clamping groove is matched with the return spring.
Preferably, the slider is provided with a first through hole, the adjusting stud penetrates through the first through hole, the limiting plate is provided with a second through hole, one end of the adjusting stud is embedded into the second through hole and is in threaded connection with the second through hole, and the adjusting stud can drive the slider to move downwards when moving downwards relative to the limiting plate.
Preferably, the adjusting stud comprises a clamping section, a guide section and a fixing section, the guide section is matched with the first through hole, the fixing section is provided with threads and matched with the second through hole, the clamping section is located at the upper end of the sliding block, and the diameters of the clamping section, the guide section and the fixing section are reduced in sequence.
Preferably, the upper end of joint section is provided with the adjustment tank, the structure and the screwdriver looks adaptation of adjustment tank.
Preferably, the slider is provided with a connecting column, the connecting column is positioned at the side end of the limiting plate, and the pressing rod is longitudinally arranged on the fixed connecting column.
Preferably, at least two pressure rods are arranged on the connecting column.
Preferably, the upper end of the limiting plate is provided with a plurality of bumps, the bumps are distributed in a step shape, the height difference between adjacent bumps is matched with the height difference between adjacent laser chips, and the crimping assemblies are respectively and correspondingly connected with the bumps.
Preferably, the two ends of the limiting plate are provided with positioning bolts, and the positioning bolts penetrate through the limiting plate and are connected with a workbench on which the packaging shell is placed.
The utility model discloses one of following beneficial effect has at least:
the utility model discloses in, adjust double-screw bolt control slider gliding distance, be the distance of pushing down of depression bar promptly, can effective control depression bar to the pressure of laser instrument chip through the control distance of pushing down, the distance of pushing down of the standard of redesign process test, each crimping subassembly all is according to standard distance adjustment depression bar, make each laser instrument chip homoenergetic receive a same appropriate and stable pressure, the sintering quality of each laser instrument chip has been guaranteed, a plurality of crimping subassemblies are worked simultaneously, also can effectively improve work efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
FIG. 2 is a schematic structural view of a crimping assembly in a preferred embodiment of the present invention;
fig. 3 is a schematic structural diagram of a limiting plate in the preferred embodiment of the present invention;
fig. 4 is a front view of a limiting plate according to a preferred embodiment of the present invention;
FIG. 5 is a schematic structural view of an adjusting stud according to a preferred embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a slider according to a preferred embodiment of the present invention;
FIG. 7 is a schematic view of the internal structure of the slider in the preferred embodiment of the present invention;
fig. 8 is a schematic structural view of a guide stud in a preferred embodiment of the present invention.
Description of reference numerals:
10 limiting plates, 11 second through holes, 12 convex blocks, 13 positioning bolts, 20 crimping assemblies, 21 adjusting studs, 211 clamping sections, 212 guide sections, 213 fixing sections, 214 adjusting grooves, 22 guide studs, 23 sliding blocks, 231 clamping grooves, 232 first through holes, 233 connecting columns, 24 pressing rods and 25 return springs.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center, longitudinal, transverse, length, width, thickness, upper, lower, front, rear, left, right, vertical, horizontal, top, bottom, inner, outer, clockwise, counterclockwise" and the like refer to the orientation or positional relationship as shown in the drawings, which is only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the present invention.
Referring to fig. 1 to 8, the utility model discloses a preferred embodiment, a crimping device that semiconductor laser chip sintering was used, including limiting plate 10 and a plurality of crimping subassembly 20, crimping subassembly 20 sets up on limiting plate 10, crimping subassembly 20 includes adjusting stud 21, guide stud 22, slider 23 and depression bar 24, guide stud 22 runs through slider 23 and can follow guide stud 22 and slide from top to bottom, guide stud 22 and limiting plate 10 fixed connection, depression bar 24 and slider 23 fixed connection, adjusting stud 21 is used for controlling the distance that slider 23 slided, thereby make depression bar 24 with laser chip location crimping in the encapsulation casing. The utility model discloses in, adjust the 23 gliding distances of double-screw bolt 21 control slide, be the distance of pushing down of depression bar 24 promptly, it can effective control depression bar 24 to the pressure of laser instrument chip to push down the distance through control, redesign a standard through experimental test distance of pushing down, each crimping subassembly 20 all according to standard distance adjustment depression bar 24, make each laser instrument chip homoenergetic receive a same appropriate and stable pressure, the sintering quality of each laser instrument chip has been guaranteed, a plurality of crimping subassemblies simultaneous working, also can effectively improve work efficiency.
As a preferred embodiment of the present invention, it may also have the following additional technical features:
the guide stud 22 is sleeved with a return spring 25, one end of the return spring 25 is abutted to the limiting plate 10, the other end of the return spring 25 is abutted to the lower end of the sliding block 23, the return spring 25 has a supporting effect on the sliding block 23, the sliding block 23 is prevented from directly sliding downwards to be abutted to the limiting plate 10 under the action of gravity, when the sliding block 23 slides downwards, the return spring 25 is subjected to extrusion force to generate upward force on the sliding block 23, and when the adjusting stud 21 rises, the sliding block 23 can automatically reset; in this embodiment, the sliding block 23 is provided with two through holes adapted to the guide studs 22, the single crimping assembly 20 is provided with two guide studs 22, the adjusting stud 21 is located between the two guide studs 22, so as to ensure the sliding stability of the sliding block 23, the guide studs 22 are in threaded connection with the limiting plate 10, and the top end of each guide stud 22 is provided with a groove adapted to a screwdriver.
The lower end of the sliding block 23 is provided with a clamping groove 231, the clamping groove 231 is matched with the return spring 25, and the clamping groove 231 has a clamping effect on the return spring 25 to ensure that the return spring 25 is stably abutted against the sliding block 23; in this embodiment, the detent groove 231 has a downward opening, and the diameter of the notch is larger than the diameter of the guide stud 22.
Be provided with first through-hole 232 on the slider 23, adjust the double-screw bolt 21 and run through first through-hole 232, be provided with second through-hole 11 on the limiting plate 10, the one end embedding second through-hole 11 of adjusting the double-screw bolt 21 and pass through threaded connection with second through-hole 11, can drive slider 23 downstream when adjusting the double-screw bolt 21 relative limiting plate 10 downstream, threaded connection conveniently adjusts the distance that double-screw bolt 21 control self embedding limiting plate 10 to the distance that conveniently controls slider 23 gliding.
The adjusting stud 21 comprises a clamping section 211, a guide section 212 and a fixing section 213, the guide section 212 is matched with the first through hole 232, the fixing section 213 is provided with threads and matched with the second through hole 11, the clamping section 211 is positioned at the upper end of the sliding block 23, the diameters of the clamping section 211, the guide section 212 and the fixing section 213 are sequentially reduced, the lower end surface of the clamping section 211 is abutted against the sliding block 23, when the fixing section 213 is slowly embedded into the limiting plate 10, the clamping section 211 drives the sliding block 23 to slide downwards along the guide stud 22, when the fixing section 213 is completely embedded into the limiting plate 10, the lower end surface of the guide section 212 is abutted against the limiting plate 10, and the adjusting stud 21 cannot move downwards any more; in this embodiment, the length of the fixing section 213 is determined through a test, and when the fixing section 213 is completely embedded into the limiting plate 10, the pressure of the pressure lever 24 on the laser chip is just suitable, and at this time, the fixing section 213 cannot continuously move downward, so that the pressure on each laser chip is consistent.
The upper end of the clamping section 211 is provided with an adjusting groove 214, the structure of the adjusting groove 214 is matched with a screwdriver, and the adjusting groove 214 is arranged to facilitate a worker to use the screwdriver to screw the adjusting stud 21 into the limiting plate 10, so that labor is saved and convenience is achieved.
The slider 23 is provided with a connecting column 233, the connecting column 233 is positioned at the side end of the limiting plate 10, the press rod 24 is longitudinally fixed on the connecting column 233, when the slider 23 slides downwards, the connecting column 233 also slides downwards, and because the connecting column 233 is positioned at the side end of the limiting plate 10, the press rod 24 cannot be influenced by the limiting plate 10 when being pressed downwards; in this embodiment, the slider 23 is composed of a square plate and an "L" shaped connecting post 233, the adjusting stud 21 and the guiding studs 22 both penetrate through the square plate, the adjusting stud 21 is located in the middle of the square plate, and the two guiding studs 22 are located on both sides thereof.
At least two pressure rods 24 are arranged on the connecting column 233, and the laser chip can be stably pressed and connected only by the at least two pressure rods 24, so that the laser chip is not easy to move, and the sintering quality is better; in this embodiment, four compression bars 24 are provided, and correspond to the four corners of the laser chip, the laser chip is stably positioned and pressed, and the compression bar 24 uses an elastic probe, so that a buffer force can be generated when the elastic probe is abutted to the laser chip, and the laser chip is prevented from being damaged due to too large instantaneous pressure.
The upper end of the limiting plate 10 is provided with a plurality of bumps 12, the bumps 12 are distributed in a step shape, the height difference between the adjacent bumps 12 is matched with the height difference between the adjacent laser chips, the crimping assemblies 20 are respectively and correspondingly connected with the bumps 12, a certain height difference is correspondingly formed between the crimping assemblies 20, but the lengths of the fixing sections 213 on the adjusting studs 21 are consistent, so that the pressing distances of the pressing rods 24 are consistent, the pressures on the laser chips with the height differences in the packaging shell are consistent, and the stable sintering quality is ensured; in this embodiment, six bumps 12 are provided, the number of the crimping assemblies 20 corresponds to that of the bumps, and the bumps 12 are located on the upper end surface of the limiting plate 10 and integrated with the limiting plate 10.
The both ends of limiting plate 10 are provided with location bolt 13, and location bolt 13 runs through limiting plate 10 and is connected with the workstation of placing the encapsulation casing, and location bolt 13 is fixed limiting plate 10, guarantees the stability of its work.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
The above is only the preferred embodiment of the present invention, as long as the technical solution of the purpose of the present invention is realized by the substantially same means, all belong to the protection scope of the present invention.
Claims (10)
1. The utility model provides a crimping device that semiconductor laser chip sintering was used, its characterized in that, includes limiting plate (10) and a plurality of crimping subassembly (20), crimping subassembly (20) set up on limiting plate (10), crimping subassembly (20) are including adjusting stud (21), guide stud (22), slider (23) and depression bar (24), guide stud (22) run through slider (23) and can follow guide stud (22) and slide from top to bottom, guide stud (22) and limiting plate (10) fixed connection, depression bar (24) and slider (23) fixed connection, adjust the distance that stud (21) are used for controlling slider (23) gliding to make depression bar (24) with laser instrument chip location crimping in the encapsulation casing.
2. The crimping device for sintering the semiconductor laser chip as claimed in claim 1, wherein a return spring (25) is sleeved on the guide stud (22), one end of the return spring (25) abuts against the limiting plate (10), and the other end abuts against the lower end of the sliding block (23).
3. The pressing connection device for sintering the semiconductor laser chip as claimed in claim 2, wherein the lower end of the slide block (23) is provided with a blocking groove (231), and the blocking groove (231) is matched with the return spring (25).
4. The crimping device for sintering the semiconductor laser chip according to claim 1, wherein a first through hole (232) is formed in the sliding block (23), the adjusting stud (21) penetrates through the first through hole (232), a second through hole (11) is formed in the limiting plate (10), one end of the adjusting stud (21) is embedded into the second through hole (11) and is connected with the second through hole (11) through threads, and the adjusting stud (21) can drive the sliding block (23) to move downwards when moving downwards relative to the limiting plate (10).
5. The crimping device for sintering the semiconductor laser chip as claimed in claim 4, wherein the adjusting stud (21) comprises a clamping section (211), a guide section (212) and a fixing section (213), the guide section (212) is matched with the first through hole (232), the fixing section (213) is provided with a thread and is matched with the second through hole (11), the clamping section (211) is located at the upper end of the slider (23), and the diameters of the clamping section (211), the guide section (212) and the fixing section (213) are sequentially reduced.
6. The pressing connection device for sintering the semiconductor laser chip as claimed in claim 5, wherein the upper end of the clamping section (211) is provided with an adjusting groove (214), and the structure of the adjusting groove (214) is adapted to a screwdriver.
7. The pressing connection device for sintering the semiconductor laser chip as claimed in claim 1, wherein the slider (23) is provided with a connection column (233), the connection column (233) is located at the side end of the limiting plate (10), and the pressing rod (24) is longitudinally fixed on the connection column (233).
8. The pressing connection device for sintering the semiconductor laser chip as claimed in claim 7, wherein at least two pressing rods (24) are arranged on the connection column (233).
9. The semiconductor laser chip sintering crimping device according to claim 1, wherein the upper end of the limiting plate (10) is provided with a plurality of bumps (12), the bumps (12) are distributed in a step shape, the height difference between adjacent bumps (12) is matched with the height difference between adjacent laser chips, and the crimping assemblies (20) are respectively connected with the bumps (12) correspondingly.
10. The crimping device for sintering the semiconductor laser chip according to claim 1, wherein positioning pins (13) are arranged at two ends of the limiting plate (10), and the positioning pins (13) penetrate through the limiting plate (10) and are connected with a workbench on which a packaging shell is placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022074973.3U CN211929893U (en) | 2020-09-21 | 2020-09-21 | Crimping device for sintering semiconductor laser chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022074973.3U CN211929893U (en) | 2020-09-21 | 2020-09-21 | Crimping device for sintering semiconductor laser chip |
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| Publication Number | Publication Date |
|---|---|
| CN211929893U true CN211929893U (en) | 2020-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022074973.3U Active CN211929893U (en) | 2020-09-21 | 2020-09-21 | Crimping device for sintering semiconductor laser chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735978A (en) * | 2020-12-16 | 2021-04-30 | 全球能源互联网研究院有限公司 | Crimping device and pressure sintering equipment |
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2020
- 2020-09-21 CN CN202022074973.3U patent/CN211929893U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735978A (en) * | 2020-12-16 | 2021-04-30 | 全球能源互联网研究院有限公司 | Crimping device and pressure sintering equipment |
| CN112735978B (en) * | 2020-12-16 | 2024-01-30 | 全球能源互联网研究院有限公司 | Crimping device and pressure sintering equipment |
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